KR200160561Y1 - Conduction test equipment of semiconductor wafer - Google Patents

Conduction test equipment of semiconductor wafer Download PDF

Info

Publication number
KR200160561Y1
KR200160561Y1 KR2019960056799U KR19960056799U KR200160561Y1 KR 200160561 Y1 KR200160561 Y1 KR 200160561Y1 KR 2019960056799 U KR2019960056799 U KR 2019960056799U KR 19960056799 U KR19960056799 U KR 19960056799U KR 200160561 Y1 KR200160561 Y1 KR 200160561Y1
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
test equipment
conduction test
conduction
equipment
Prior art date
Application number
KR2019960056799U
Other languages
Korean (ko)
Other versions
KR19980043677U (en
Inventor
Jun-Ho Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR2019960056799U priority Critical patent/KR200160561Y1/en
Publication of KR19980043677U publication Critical patent/KR19980043677U/en
Application granted granted Critical
Publication of KR200160561Y1 publication Critical patent/KR200160561Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR2019960056799U 1996-12-26 1996-12-26 Conduction test equipment of semiconductor wafer KR200160561Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960056799U KR200160561Y1 (en) 1996-12-26 1996-12-26 Conduction test equipment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960056799U KR200160561Y1 (en) 1996-12-26 1996-12-26 Conduction test equipment of semiconductor wafer

Publications (2)

Publication Number Publication Date
KR19980043677U KR19980043677U (en) 1998-09-25
KR200160561Y1 true KR200160561Y1 (en) 1999-11-15

Family

ID=19483277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960056799U KR200160561Y1 (en) 1996-12-26 1996-12-26 Conduction test equipment of semiconductor wafer

Country Status (1)

Country Link
KR (1) KR200160561Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020096135A (en) * 2001-06-18 2002-12-31 주식회사 프로벡스 Apparatus for controlling angle of wafer prober

Also Published As

Publication number Publication date
KR19980043677U (en) 1998-09-25

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