KR200142996Y1 - An electric connector - Google Patents
An electric connector Download PDFInfo
- Publication number
- KR200142996Y1 KR200142996Y1 KR2019940024921U KR19940024921U KR200142996Y1 KR 200142996 Y1 KR200142996 Y1 KR 200142996Y1 KR 2019940024921 U KR2019940024921 U KR 2019940024921U KR 19940024921 U KR19940024921 U KR 19940024921U KR 200142996 Y1 KR200142996 Y1 KR 200142996Y1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- solder
- circuit board
- connection structure
- present
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Abstract
본 고안은 회로기판의 동박 단부 접속구조에 대해 개시한다.The present invention discloses a copper foil end connection structure of a circuit board.
종래에는 절연판상에 소정패턴으로 입혀진 동박 단부 및 그 주위를 가열하여 가열된 열로 인해 땜납을 용융시켜 납땜하였으나 표면장력이 매우 강한 땜납이 동박에 잘 융착되지 않고 떨어져 나가게 되는 문제가 있었다.Conventionally, although the solder is melted and soldered by heating the end of the copper foil coated in a predetermined pattern on the insulating plate and the surroundings thereof, the solder having a very high surface tension does not adhere well to the copper foil and has a problem of falling off.
본 고안은 동박면에 스크래치홈 및 그에 따른 버어를 형성하며, 땜납의 표면장력을 분산시킴으로써 땜납이 동박에 견고히 융착되도록 하였다.The present invention forms a scratch groove and a corresponding burr on the copper foil surface, so that the solder is firmly fused to the copper foil by dispersing the surface tension of the solder.
Description
제1도는 종래의 회로기판과 동박 단부 접속구조를 보인 단면도로서,1 is a cross-sectional view showing a conventional circuit board and the copper foil end connection structure,
(a)는 납땜되기 전의 상태를 보인 부분 단면도,(a) is a partial cross-sectional view showing the state before soldering,
(b)는 납땜된 상태를 보인 부분 단면도,(b) is a partial cross-sectional view showing the soldered state,
제2도는 본 고안에 따른 회로기판의 동박 단부 접속구조를 보인 부분 단면도,2 is a partial cross-sectional view showing the copper foil end connection structure of the circuit board according to the present invention,
제3도는 본 고안의 다른 실시예를 보인 부분 평면도이다.3 is a partial plan view showing another embodiment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
P : 절연판(絶緣板) C : 동박(銅箔)P: Insulation plate C: Copper foil
E : 에나멜(enamel) H : 관통구멍(through hole)E: Enamel H: Through Hole
S : 땜납(solder) G : 스크래치홈(scratch groove)S: Solder G: Scratch groove
B : 버어(burr)B: burr
본 고안은 회로기판(printed circuit board)에 관한 것으로, 특히 리이드(lead)나 칩(chip)을 동박 단부에 접속시키기 위한 접속구조(接續構造)에 관한 것이다.The present invention relates to a printed circuit board, and more particularly, to a connection structure for connecting leads or chips to copper foil ends.
일반적으로 널리 사용되는 각종 가전기기나 사무용품에는 외부로 부터 인가되는 전원을 공급받아 구동되는 기계장치와, 이 기계장치를 회로적으로 조작하여 제어하는 회로기판이 구비된다.In general, various home appliances or office supplies that are widely used are provided with a mechanical device driven by a power source applied from the outside, and a circuit board for controlling and controlling the mechanical device.
이러한 회로기판은 제1도의 (a)에 도시된 바와 같이 절연판(絶緣板; P)상에 동박(銅箔; C)이 입혀진 형태로 시판되고 있어 제품을 생산할 생산자가 이를 구입하여 생산할 제품에 알맞게 동박(C)을 소정패턴으로 에칭(etching)하도록 되어 있다. 이와 같이 소정패턴으로 에칭된 동박(C) 단부에 리이드나 칩등(도시 않됨)이 삽입되도록 드릴(drill)등으로 관통 구멍(hole; H)을 형성시키게 되고, 외부로 부터 동박 패턴을 보호하기 위해 동박 및 절연판 전체를 에나멜(enamel ; E)로 코팅하고 있다. 이와 같이 형성된 관통 구멍(H)에 리이드를 끼운다음(b)와 같이 납땜하여 리이드를 고정시키게 되는바, 인두로 동박(C)패턴을 충분히 가열하고 그 가열된 부분에 땜납(S)을 밀착시키면 그 열에 의해 코팅된 에나멜(E)이 타면서 땜납(S)이 녹아 동박(C)에 융착된다.These circuit boards are commercially available in the form of copper foil (C) coated on an insulating plate (P) as shown in FIG. 1A, so that the producer who will produce the product is suitable for the product to be purchased and produced. The copper foil C is etched in a predetermined pattern. In this way, through holes (H) are formed by a drill or the like to insert a lead or a chip (not shown) into the copper foil C etched in a predetermined pattern, and to protect the copper foil pattern from the outside. The whole copper foil and the insulation board are coated with enamel (E). The lead is inserted into the through hole H formed as described above, and the lead is fixed by soldering as shown in (b). When the copper foil (C) pattern is sufficiently heated with the iron, the solder (S) is brought into close contact with the heated portion. The enamel (E) coated by the heat burns and the solder (S) melts and fuses to the copper foil (C).
그런데 에나멜(E)이 타면서 발생되는 재나 이물질등으로 땜납(S)과 동박사이에 갭(gap)이 발생되어 땜납(S)이 동박(C)에 잘 융착되지 않아 납땜 불량이 발생되었다. 또한 땜납(S)은 표면장력이 매우 강하기 때문에 동박(S) 패턴을 충분히 가열하지 않을 경우에 용융된 땜납(S)이 원형을 이루어 동박(C)과 잘 융착되지 않게 되어 납땜불량이 발생되고, 이에 따라 동박(C)을 과도히 가열하게 되면 동박(C)이 파손되는 문제가 있었다.However, a gap was generated between the solder (S) and the copper foil due to ash or foreign matter generated by burning the enamel (E), so that the solder (S) was not fused to the copper foil (C) well, resulting in poor soldering. In addition, since the solder (S) has a very strong surface tension, when the copper foil (S) pattern is not sufficiently heated, the molten solder (S) forms a circular shape, so that the solder (S) is hardly fused to the copper foil (C). Accordingly, when the copper foil (C) is excessively heated, there was a problem that the copper foil (C) is broken.
이와 같은 문제를 감안하여 본 고안은 납땜된 땜납이 동박으로부터 떨어져 나가지 않도록 할 수 있는 회로기판의 동박단부 접속구조를 제공하는 것을 목적으로 한다.In view of such a problem, the present invention aims to provide a copper foil end connection structure of a circuit board which can prevent the soldered solder from falling off from the copper foil.
이와 같은 목적을 달성하기 위한 회로기판의 동박 단부 접속구조는 동박 단부에 리이드등을 납땜하여 접속하기 위한 회로기판의 동박 단부 접속구조에 있어서, 상기 동박 단부에 흠집이 형성되는 것을 특징으로 한다.The copper foil end connection structure of the circuit board for achieving such an object is characterized in that a scratch is formed on the copper foil end connection structure of the copper foil end connection structure of the circuit board for soldering and connecting a lead or the like to the copper foil end.
본 고안의 한 바람직한 특징에 의하면, 흠집이, 동박 단부에 형성된 스크래치홈과, 이 스크래치홈이 형성됨에 따라 그 양측에 형성되는 버어(burr)로 이루어지는 것에 그 특징이 있다.According to one preferred feature of the present invention, the scratch is characterized by a scratch groove formed at the copper foil end portion, and a burr formed on both sides thereof as the scratch groove is formed.
본 고안의 다른 바람직한 특징에 의하면, 흠집이 동박 단부에 방사상(放射狀)으로 다수 형성된다.According to another preferable feature of the present invention, a large number of scratches are formed radially at the copper foil end portion.
본 고안에 따른 회로기판의 동박 단부 접속구조의 이점 및 특징은 첨부된 도면을 참조한 이하의 바람직한 실시예의 설명으로 더욱 명확해질 것이다.Advantages and features of the copper foil end connection structure of the circuit board according to the present invention will become more apparent from the following description of the preferred embodiments with reference to the accompanying drawings.
제2도에서, 절연판(P) 상에 소정패턴으로 입혀지고 이를 보호하기 위해 에나멜(E)로 코팅되어 있는 동박(C)은 절연판과 함께 드릴등에 의해 관통구멍(H)이 형성되어 리이드등이 끼워지도록 되어 있다. 이 동박(C) 단부에는 본 고안의 특징에 따라 흠집이 형성되는데, 이는 동박(C)상에 용융된 땜납(S)의 표면장력을 분산시키게 된다. 이 흠집은 여러가지 혀애와 방법으로 구성될 수 있는데, 바람직하기로는 동박(C)의 단부를 그 관통구멍(H)을 중심으로 하여 송곳등으로 긁어 형성되는 스크래치홈(scratch groove; G)과, 이의 양측으로 돌출되는 버어(burr; B)로 구성된다. 더욱 바람직하기로는 흠집이 동박(C)의 관통구멍(H)을 중심으로 방사상(放射狀)으로 다수 형성된다.In FIG. 2, the copper foil C coated with a predetermined pattern on the insulating plate P and coated with enamel E to protect it is formed with a through hole H by a drill or the like along with the insulating plate and leads such as lead and the like. It is supposed to fit. At the end of the copper foil C, scratches are formed according to the characteristics of the present invention, which disperse the surface tension of the molten solder S on the copper foil C. The scratch may be composed of various tongues and methods, and preferably, a scratch groove G formed by scraping an end portion of the copper foil C with an awl or the like around the through hole H thereof, It is composed of burrs (B) protruding on both sides. More preferably, a plurality of scratches are formed radially around the through hole H of the copper foil C.
이와 같이 구성된 동박(C)의 관통구멍(H)에 리이드등이 끼워지면 동박(C) 및 그 주위를 인두로 가열하여 가열된 열에 의해 땜납(S)을 용융시켜 납땜하게 된다. 이때, 용융된 땜납(S)은 그 일부가 본 고안 스크래치홈(G) 및 버어(B)에 의해 표면장력이 적절히 분산되게 되므로 동박(C)에 견고히 융착고정된다. 즉 땜납(S)이 흠집을 중심으로 응집(凝集)되어 동박(C)으로 부터 떨어져 나가지 않게 되는 것이다. 이에따라 땜납(S)이 용융될 정도만 동박(C)을 가열하여도 충분한 땜납이 이뤄지게 된다.When a lead or the like is inserted into the through hole H of the copper foil C configured as described above, the solder S is melted and soldered by heating the copper foil C and its surroundings with the iron. At this time, the molten solder (S) is part of the surface of the present invention by the scratch groove (G) and burr (B) is properly dispersed, so that the copper foil (C) is firmly fusion-fixed. In other words, the solder (S) is agglomerated around the scratches so as not to fall off from the copper foil (C). Accordingly, even if the copper foil C is heated to the extent that the solder S is melted, sufficient solder is achieved.
그러므로 종래와 같이 동박(C)을 과도하게 가열함에 따른 동박(C)의 파손이 근본적으로 방지되게 된다.Therefore, breakage of the copper foil C due to excessive heating of the copper foil C as in the prior art is essentially prevented.
이상에서 살펴본 바와 같이 본 고안에 의하면, 동박의 흠집에 의해 땜납의 표면장력이 분산되므로 땜납을 동박에 견고히 융착시킬 수 있으며, 그 가열정도를 현저히 낮출 수 있다.As described above, according to the present invention, since the surface tension of the solder is dispersed by the scratches of the copper foil, the solder can be firmly fused to the copper foil, and the degree of heating thereof can be significantly lowered.
이에 따라 본 고안은 납땜불량이 발생되지 않아 제품이 불량률 감소와 신뢰성 향상등에 큰 효과가 있다.Accordingly, the present invention does not generate a soldering defect, the product has a great effect in reducing the defective rate and improved reliability.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940024921U KR200142996Y1 (en) | 1994-09-28 | 1994-09-28 | An electric connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940024921U KR200142996Y1 (en) | 1994-09-28 | 1994-09-28 | An electric connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960012705U KR960012705U (en) | 1996-04-17 |
| KR200142996Y1 true KR200142996Y1 (en) | 1999-06-01 |
Family
ID=19394050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940024921U KR200142996Y1 (en) | 1994-09-28 | 1994-09-28 | An electric connector |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200142996Y1 (en) |
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1994
- 1994-09-28 KR KR2019940024921U patent/KR200142996Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960012705U (en) | 1996-04-17 |
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