KR0185305B1 - Solder paste having low melting point - Google Patents
Solder paste having low melting point Download PDFInfo
- Publication number
- KR0185305B1 KR0185305B1 KR1019950048697A KR19950048697A KR0185305B1 KR 0185305 B1 KR0185305 B1 KR 0185305B1 KR 1019950048697 A KR1019950048697 A KR 1019950048697A KR 19950048697 A KR19950048697 A KR 19950048697A KR 0185305 B1 KR0185305 B1 KR 0185305B1
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- KR
- South Korea
- Prior art keywords
- melting point
- solder paste
- low melting
- alloy
- ball
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 플럭스와; 합금볼과; 상기 합금볼보다 용융점이 높고, 지름이 큰 금속볼로 구성된 저융점 솔더 페이스트에 관한 것으로서, 낮은 온도에서 용융되기 때문에 내열성이 낮은 전자부품의 납땜을 가능하게 하고, 용융점이 높은 금속볼을 포함하기 때문에 납땜 강도 및 수명을 월등히 향상시킬 수 있는 잇점이 있다.The present invention is a flux; Alloy balls; The present invention relates to a low melting point solder paste composed of a metal ball having a higher melting point and a larger diameter than the alloy ball, and because it melts at a low temperature, it enables soldering of an electronic component having low heat resistance and includes a metal ball having a high melting point. This has the advantage of significantly improving soldering strength and lifetime.
Description
제1도는 종래의 저융점 솔더 페이스트의 구성을 나타내는 도면.1 is a view showing the configuration of a conventional low melting solder paste.
제2도는 종래의 저융점 솔더 페이스트를 이용한 납땜방법에 관한 것으로서, a도는 전자부품이 올려진 저융점 솔더 페이스트에 열을 가하는 상태를 도시한 도면, b도는 납땜 완료된 상태를 도시한 도면임.2 is related to a conventional soldering method using a low melting point solder paste. FIG. 2 is a view showing a state in which heat is applied to a low melting point solder paste on which an electronic component is placed, and FIG.
제3도는 본 발명의 저융점 솔더 페이스트의 구성을 나타내는 도면.3 is a diagram showing a configuration of a low melting solder paste of the present invention.
제4도는 본 발명의 저융점 솔더 페이스트를 이용한 납땜방법에 관한 것으로서, a도는 구리전극 위에 저융점 솔더 페이스트가 올려진 상태를 도시한 도면, b도는 a도의 저융점 솔더 페이스트 위에 전자부품이 올려진 상태를 도시한 도면, c도는 b도에 열을 가하는 상태를 도시한 도면, d도는 납땜 완료된 상태를 도시한 도면임.4 is a soldering method using the low melting point solder paste of the present invention, a is a view showing a low melting point solder paste on the copper electrode, b is a diagram showing the electronic components on the low melting point solder paste The figure which shows the state, FIG. C is a figure which shows the state which heats b degree, The d figure is a figure which shows the soldering state.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 플럭스 2 : 합금볼1: flux 2: alloy ball
3 : 구리볼 4 : 회로기판3: copper ball 4: circuit board
5 : 구리전극 6 : 전자부품5 copper electrode 6 electronic component
본 발명은 저융점 솔더 페이스트에 관한 것으로서, 특히 전자부품의 납땜 강도 및 수명을 향상시킬 수 있는 저융점 솔더 페이스트에 관한 것이다.TECHNICAL FIELD The present invention relates to a low melting point solder paste, and more particularly, to a low melting point solder paste capable of improving soldering strength and lifespan of an electronic component.
종래의 저융점 솔더 페이스트는 제1도에 도시된 바와 같이 송진, 활성제 및 알코올이 혼합되어 조성된 플럭스(11)와; 주석 46 중량%와, 납 46 중량%와, 비스무트 8 중량%가 혼합되어 조성된 합금으로 형성된 합금볼(12)로 구성된다.The conventional low melting point solder paste includes a flux 11 composed of a mixture of rosin, activator and alcohol as shown in FIG. 1; 46 wt% tin, 46 wt% lead, and 8 wt% bismuth are mixed to form an alloy ball 12 formed of an alloy.
상기와 같이 구성된 종래의 저융점 솔더 페이스트를 이용한 납땜방법은 다음과 같다.Soldering method using a conventional low melting point solder paste configured as described above is as follows.
제2도의 (a)에 도시된 바와 같이 회로기판(13)에 인쇄된 구리전극(14)위에 제1도에 도시된 저융점 솔더 페이스트를 올리고, 상기 저융점 솔더 페이스트 위에 전자부품(15)을 올린 다음 적정온도의 열을 가하면 상기 저융점 솔더 페이스트가 용융되어 제2도의 (b)에 도시된 바와 같이 전자부품(15)이 회로기판(13)상에 납땜된다.As shown in FIG. 2A, the low melting point solder paste shown in FIG. 1 is placed on the copper electrode 14 printed on the circuit board 13, and the electronic component 15 is placed on the low melting point solder paste. After raising, the low melting point solder paste is melted and the electronic component 15 is soldered onto the circuit board 13 as shown in FIG.
그러나, 상기와 같이 구성된 종래의 저융점 솔더 페이스트는 납땜 강도가 약하고, 납땜 수명이 짧기 때문에 종래에는 상기 저융점 솔더 페이스트대신 공정솔더를 주로 이용하였다.However, the conventional low melting solder paste having the above-described low melting point solder paste has a low soldering strength and a short soldering life, and thus, conventionally, a process solder is used instead of the low melting point solder paste.
상기 공정솔더는 도면에 도시된 바는 없으나 주석 63 중량%와 납 37 중량%가 혼합되어 조성되고 용융점이 183℃인 합금으로 형성된 합금볼과, 플럭스로 구성된다.Although not shown in the drawing, the process solder is composed of an alloy ball formed of an alloy having 63 wt% tin and 37 wt% lead and formed of an alloy having a melting point of 183 ° C., and a flux.
그러나, 상기와 같이 공정솔더는 183℃의 용융점을 가지는 합금이 포함되어 있어 전자부품의 납땜시 220~230℃의 높은 열이 가해지고, 그로 인해 상기 전자부품은 사전에 내열성을 가지도록 제작되어야 하기 때문에 상기 전자부품의 제작비용 상승을 초래하는 문제점이 있었다.However, as described above, the process solder includes an alloy having a melting point of 183 ° C., so that a high heat of 220-230 ° C. is applied when soldering the electronic part, and thus the electronic part should be manufactured to have heat resistance in advance. Therefore, there has been a problem that increases the manufacturing cost of the electronic component.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 납땜 강도 및 수명을 보완하기 위해 금속볼을 추가함으로써 낮은 온도에서 납땜을 가능하게 하는 동시에 납땜 강도 및 수명이 월등히 향상된 저융점 솔더 페이스트를 제공함에 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a low melting point solder paste that enables soldering at low temperatures by adding metal balls to compensate for the soldering strength and service life, and at the same time, the soldering strength and service life are significantly improved. Has its purpose.
상기와 같은 목적을 달성하기 위한 본 발명에 의한 저융점 솔더 페이스트는 플럭스와; 합금볼과; 상기 합금볼보다 용융점이 높고, 지름이 큰 금속볼로 구성된다.Low melting solder paste according to the present invention for achieving the above object is a flux; Alloy balls; It is composed of a metal ball having a higher melting point and a larger diameter than the alloy ball.
이하, 본 발명에 의한 저융점 솔더 페이스트의 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the low melting point solder paste according to the present invention will be described in detail with reference to the accompanying drawings.
본 발명의 저융점 솔더 페이스트는 제3도에 도시된 바와 같이 송진, 활성제 및 알코올이 혼합되어 조성된 플럭스(1)와; 용융점이 165~175℃인 합금볼(2)과; 상기 합금볼(2)보다 용융점이 높고, 지름이 큰 구리볼(3)로 구성된다.The low melting solder paste of the present invention comprises a flux (1) composed of a mixture of rosin, activator and alcohol as shown in FIG. An alloy ball 2 having a melting point of 165 to 175 ° C; It is composed of a copper ball 3 having a higher melting point and a larger diameter than the alloy ball 2.
상기 구리볼(3)의 지름은 20~50㎛이며, 상기 합금볼(2)은 일 실시예로 주석 46 중량%와, 납 46 중량%와, 비스무트 8 중량%가 혼합되어 조성된 합금으로 형성된다.The copper ball 3 has a diameter of 20 to 50 μm, and the alloy ball 2 is formed of an alloy in which 46% by weight of tin, 46% by weight of lead, and 8% by weight of bismuth are mixed. do.
상기 합금볼(2)은 또 다른 실시예로 주석 43 중량%와, 납 43 중량%와, 비스무트 14 중량%가 혼합되어 조성된 합금으로 형성되거나; 주석 46 중량%와, 납 40 중량%와, 비스무트 14 중량%가 혼합되어 조성된 합금으로 형성되거나; 주석 45 중량%와, 납 40 중량%와, 비스무트 15 중량%가 혼합되어 조성된 합금으로 형성된다.In another embodiment, the alloy ball 2 is formed of an alloy composed of 43 wt% tin, 43 wt% lead, and 14 wt% bismuth; 46 wt% tin, 40 wt% lead, and 14 wt% bismuth are mixed to form an alloy composed of; 45 wt% tin, 40 wt% lead and 15 wt% bismuth are mixed to form an alloy.
상기와 같이 구성된 본 발명의 저융점 솔더 페이스트를 이용한 납땜방법은 다음과 같다.A soldering method using the low melting solder paste of the present invention configured as described above is as follows.
제4도의 (a)에 도시된 바와 같이 회로기판(4)에 인쇄된 구리전극(5)위에 제3도에 도시된 저융점 솔더 페이스트를 올리고, 상기 제4도의 (b)에 도시된 바와 같이 상기 저융점 솔더 페이스트 위에 전자부품(6)을 올린 다음 제4도의 (c)에 도시된 바와 같이 165~175℃의 열을 가하면 상기 저융점 솔더 페이스트에 포함된 합금볼(2)은 용융되고, 상기 합금볼(2)보다 용융점이 높은 구리볼(3)은 용융되지 않아 제4도의 (d)에 도시된 바와 같이 용융되지 않은 상기 구리볼(3)에 의해 전자부품(6)과 구리전극(5) 사이의 접속이 보완된다.As shown in FIG. 4A, a low melting point solder paste shown in FIG. 3 is placed on the copper electrode 5 printed on the circuit board 4, and as shown in FIG. 4B. When the electronic component 6 is placed on the low melting point solder paste and then heat is applied at 165 to 175 ° C as shown in (c) of FIG. 4, the alloy balls 2 included in the low melting point solder paste are melted. The copper ball 3 having a higher melting point than the alloy ball 2 is not melted, and thus the electronic component 6 and the copper electrode 3 are formed by the copper ball 3 which is not melted, as shown in FIG. 5) The connection between is complemented.
따라서, 상기 전자부품(6)은 상기 회로기판 (4)상에 견고하게 납땜된다.Thus, the electronic component 6 is firmly soldered onto the circuit board 4.
이와 같이 본 발명의 저융점 솔더 페이스트는 낮은 온도에서 용융되기 때문에 내열성이 낮은 전자부품의 납땜을 가능하게 하고, 용융점이 높은 금속볼을 포함하기 때문에 납땜 강도 및 수명을 월등히 향상시킬 수 있는 잇점이 있다.As described above, the low melting point solder paste of the present invention enables the soldering of electronic components having low heat resistance because it is melted at a low temperature, and has the advantage of significantly improving soldering strength and lifespan because it includes metal balls having a high melting point. .
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950048697A KR0185305B1 (en) | 1995-12-12 | 1995-12-12 | Solder paste having low melting point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950048697A KR0185305B1 (en) | 1995-12-12 | 1995-12-12 | Solder paste having low melting point |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970058427A KR970058427A (en) | 1997-07-31 |
| KR0185305B1 true KR0185305B1 (en) | 1999-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950048697A KR0185305B1 (en) | 1995-12-12 | 1995-12-12 | Solder paste having low melting point |
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| Country | Link |
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| KR (1) | KR0185305B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100629298B1 (en) * | 2002-03-08 | 2006-09-29 | 가부시키가이샤 히타치세이사쿠쇼 | Electronic device |
-
1995
- 1995-12-12 KR KR1019950048697A patent/KR0185305B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100629298B1 (en) * | 2002-03-08 | 2006-09-29 | 가부시키가이샤 히타치세이사쿠쇼 | Electronic device |
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| Publication number | Publication date |
|---|---|
| KR970058427A (en) | 1997-07-31 |
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