KR200141174Y1 - Trim forming die of semiconductor manufacture - Google Patents

Trim forming die of semiconductor manufacture Download PDF

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Publication number
KR200141174Y1
KR200141174Y1 KR2019950038254U KR19950038254U KR200141174Y1 KR 200141174 Y1 KR200141174 Y1 KR 200141174Y1 KR 2019950038254 U KR2019950038254 U KR 2019950038254U KR 19950038254 U KR19950038254 U KR 19950038254U KR 200141174 Y1 KR200141174 Y1 KR 200141174Y1
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South Korea
Prior art keywords
package
cutting
cut
trim
die
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KR2019950038254U
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Korean (ko)
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KR970046998U (en
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이준섭
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문정환
엘지반도체주식회사
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Priority to KR2019950038254U priority Critical patent/KR200141174Y1/en
Publication of KR970046998U publication Critical patent/KR970046998U/en
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Publication of KR200141174Y1 publication Critical patent/KR200141174Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 고안은 반도체 제조장비의 트림/포밍 다이에 관한 것으로, 종래 기술에 의해 패키지와 사이드 레일의 절단을 위한 펀칭 작업은 몰드 오프 셋트(MOLD OFF SET) 발생시에는 패키지(1)의 크랙이 발생되어 수율이 감소하는 결함이 있고, 또한, 펀치(2)가 20㎛ 이상 마모된 상태에서는 패키지(1)에 오염(4)이 발생되는 문제가 있다. 이러한 패키지의 오염은 쉽게 제거되지 않으며, 작업자가 일일이 손으로 제거하게 됨에 따라 작업생산성이 저하되는 문제가 있다. 이에 시귤레이션 커팅 이전에 트림 다이(6')에서 게이트 커팅을 위해 스트리퍼(5')가 리드 프레임의 사이드 레일 에어 벤트 플래쉬(3)를 클램핑 할 때, 패키지(1)와 사이드 레일(1a)의 절단부분을 V-커팅하도록 한 것으로 즉, 스트리퍼(5') 및 커트 다이(6')의 상하면에 절단날(5'a)(6'a)을 각각 돌출되게 형성하여 패키지(1)와 사이드 레일(1a)의 연결부분의 상하면을 V-커팅하도록 구성한 것이다. 이러한 본 고안은 패키지의 오염발생으로 인한 불량을 방지하여 수율이 향상되고, 이에 따라 장비 가동율이 향상되며, 작업생산성이 향상되어 제조비용이 절감되도록 한 것이다.The present invention relates to a trim / forming die of a semiconductor manufacturing equipment. According to the prior art, the punching operation for cutting a package and a side rail is performed by a crack in the package 1 when a mold off set occurs. There is a decreasing defect, and there is a problem that contamination 4 is generated in the package 1 in a state in which the punch 2 is worn with 20 µm or more. Contamination of such a package is not easily removed, there is a problem that the productivity of work is reduced as the worker removes by hand. Thus, when the stripper 5 'clamps the side rail air vent flash 3 of the lead frame for gate cutting at the trim die 6' prior to the regulation cut, the package 1 and side rail 1a The cutting portion is V-cut, that is, cutting edges 5'a and 6'a are formed to protrude on the upper and lower surfaces of the stripper 5 'and the cutting die 6', respectively, so that the package 1 and the side are cut. The upper and lower surfaces of the connecting portion of the rail 1a are configured to V-cut. The present invention is to prevent the defects caused by the contamination of the package to improve the yield, thereby improving the equipment operation rate, work productivity is improved to reduce the manufacturing cost.

Description

반도체 제조장비의 트림/포밍 다이Trim / Forming Dies in Semiconductor Manufacturing Equipment

제1도는 종래 기술에 의한 반도체 제조장비의 트림/포밍 다이의 종단면도.1 is a longitudinal sectional view of a trim / forming die of a semiconductor manufacturing equipment according to the prior art.

제2도는 종래 기술에 의해 시귤레이션 펀치에 의해 패키지와 사이드 레일이 절단된 상태도.2 is a state in which a package and a side rail are cut by a regulation punch according to the prior art.

제3도는 본 고안에 의한 반도체 제조장비의 트림/포밍 다이의 종단면도.Figure 3 is a longitudinal cross-sectional view of the trim / forming die of the semiconductor manufacturing equipment according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 패키지1: package

3 : 몰드 에어 벤트 플래쉬(mold air vent flash)3: mold air vent flash

5' : 스트리퍼(stripper) 6' : 커트 다이(cut die)5 ': stripper 6': cut die

5'a, 6'a : 절단날5'a, 6'a: cutting edge

본 고안은 반도체 제조 공정 중 트림/포밍 공정에서 웨이퍼의 포밍 후 사이드 레일을 컷팅하는 과정에서 발생되는 오염을 방지하도록 한 것으로, 특히 패키지의 몰드 에어 벤트 플래쉬가 고정되는 커트 다이 및 스트리퍼의 상하면에 몰드 에어 벤트 플래쉬 클램핑시 v-커팅하는 절단날이 돌출형성된 반도체 제조장비의 트림/포밍 다이에 관한 것이다.The present invention is designed to prevent contamination generated during cutting of the side rails after forming the wafer in the trim / forming process of the semiconductor manufacturing process. Particularly, the upper and lower surfaces of the cut die and stripper to which the mold air vent flash of the package is fixed are fixed. The present invention relates to a trim / forming die of a semiconductor manufacturing equipment in which a cutting blade for v-cutting protrudes during air vent flash clamping.

통상적으로 반도체 패키지의 제조공정 중 몰딩이 끝난 패키지에 연결되어 있는 리드 프레임의 리드와 리드 사이의 잼 바(Dam Bar)를 절단하는 작업을 트리밍(Trimming)이라고 하며, 트리밍이 끝난 패키지의 리드를 휘어지게 하여 일정한 모양(form)을 형성하는 작업을 포밍(Forming)이라고 한다.In general, a process of cutting a jam bar between a lead of a lead frame and a lead connected to a molded package during a manufacturing process of a semiconductor package is called trimming, and the lead of the trimmed package is bent It is called forming to make a certain form by making it.

상기한 바와같은 트리밍과 포밍 공정이 수행된 후, 제1도에 도시한 바와 같이, 패키지(1)와 사이드 레일(1a)을 분리하는 시귤레이션 커팅(singulation cutting)시에는 패키지(1)와 시귤레이션 펀치(2)의 클리어런스(clearance)를 작게 하여 패키지(1)의 엔드 플래쉬(3)를 강제로 펀칭하여 작업을 수행하게 된다.After the trimming and forming process as described above is performed, as shown in FIG. 1, the package 1 and the tangerine are subjected to a regulation cutting for separating the package 1 and the side rails 1a. The clearance of the ration punch 2 is reduced to force punching of the end flash 3 of the package 1 to perform the operation.

그러나 상기의 종래 기술에 의한 펀칭 작업은 몰드 오프 셋트(MOLD OFF SET) 발생시에는 패키지(1)의 크랙이 발생되어 수율이 감소하는 결함이 있다.However, the above punching operation according to the prior art has a defect that a crack occurs in the package 1 when a mold off set occurs, so that a yield decreases.

또한, 펀치(2)가 20㎛ 이상 마모된 상태에서는 제2도에 도시한 바와 같이, 패키지(1)에 오염(4)이 발생되는 문제가 있다. 이러한 패키지의 오염은 쉽게 제거되지 않으며, 작업자가 일일이 손으로 제거하게 됨에 따라 작업생산성이 저하되는 문제가 있다.In addition, when the punch 2 is worn with a thickness of 20 µm or more, as shown in FIG. 2, there is a problem that contamination 4 is generated in the package 1. Contamination of such a package is not easily removed, there is a problem that the productivity of work is reduced as the worker removes by hand.

미설명 부호 5는 스트리퍼(stripper), 6은 컷트 다이(cut die), 7은 플로우 캐비티(flow caviry), 8은 플로우 캐비티 컷트 펀치(flow cavity cut punch)를 나타낸 것이다.Reference numeral 5 denotes a stripper, 6 a cut die, 7 a flow cavity, and 8 a flow cavity cut punch.

이와 같은 문제점에 착안하여 안출한 본 고안의 목적은 패키지와 사이드 레일을 절단하는 시귤레이션 커팅시 발생하는 패키지의 오염을 방지하려는 것이다.The object of the present invention devised in view of such a problem is to prevent contamination of the package generated during the regulation cutting to cut the package and the side rails.

이러한 본 고안의 목적을 달성하기 위하여, 패키지의 몰드 에어 벤트 플래쉬를 클램핑하는 커트 다이의 상면과 스트리퍼의 하면에 몰드 에어 벤트 플래쉬 클램핑 시 몰드 에어 벤트 플래쉬의 상하면을 V-커팅하는 절단날이 대향하여 돌출 형성된 것을 특징으로 하는 반도체 제조장비의 트림/포밍 다이가 제공된다.In order to achieve the object of the present invention, the cutting blade for V-cutting the upper and lower surfaces of the mold air vent flash when clamping the mold air vent flash on the upper surface of the cut die for clamping the mold air vent flash of the package and the lower surface of the stripper There is provided a trim / forming die of a semiconductor manufacturing equipment, characterized in that it is formed protruded.

이하, 상기한 바와 같은 본 고안을 첨부도면에 의거하여 보다 상세하게 설명한다.Hereinafter, the present invention as described above will be described in more detail based on the accompanying drawings.

첨부도면 제3도는 본 고안에 의한 반도체 제조장비의 트림/포밍 다이의 종단면도로서, 이에 도시한 바와 같이, 본 고안은 패키(지1)와 사이드 레일(1a)을 분리하는 시귤레이션 커팅 이전에 트림 다이(6')에서 게이트 커팅을 위해 스트리퍼(5')가 리드 프레임의 사이드 레일 에어 벤트 플래쉬(3)를 클램핑 할 때, 패키지(1)와 사이드 레일 (1a)의 절단부분을 V-컹팅하도록 한 것이다.FIG. 3 is a longitudinal cross-sectional view of a trim / forming die of a semiconductor manufacturing apparatus according to the present invention. As shown in the drawing, the present invention is provided before the regulation cutting for separating the package and the side rail 1a. When the stripper 5 'clamps the side rail air vent flash 3 of the lead frame for gate cutting at the trim die 6', V-fitting the cuts of the package 1 and side rail 1a. I did it.

즉, 스트리퍼(5') 및 커트 다이(6')의 상하면에 절단날(5'a)(6'a)을 각각 돌출되게 형성하여 패키지(1)와 사이드 레일(1a)의 연결부분의 상하면 모두를 V-커팅하도록 구성한 것이다.That is, cutting edges 5'a and 6'a are formed to protrude from the upper and lower surfaces of the stripper 5 'and the cut die 6', respectively, so that the upper and lower surfaces of the connecting portion of the package 1 and the side rail 1a are formed. All are configured to V-cut.

이와 같이 본 고안에 의한 반도체 제조장비의 트림/포밍 다이는 V-커팅이 가능한 절단날(5'a)(6'a)이 형성되어 있어 이러한 절단날(5'a)(6'a)이 에어 벤트 플래쉬(3)를 V-커팅하도록 함으로써 시귤레이션 커팅시 패키지(1)에서의 오염을 방지하게 된다.As described above, the trim / forming die of the semiconductor manufacturing apparatus according to the present invention is provided with cutting edges 5'a and 6'a capable of V-cutting such that the cutting edges 5'a and 6'a are formed. The V-cutting of the air vent flash 3 prevents contamination in the package 1 during regulation cutting.

이상과 같은 본 고안에 의한 반도체 제조장비의 트림/포밍 다이에 의하면 패키지의 오염발생으로 인한 불량을 방지하여 수율이 향상되고, 이에 따라 장비 가동율이 향상되며, 작업생산성이 향상되어 제조비용이 절감되는 등의 효과가 있다.According to the trim / forming die of the semiconductor manufacturing equipment according to the present invention as described above, the yield is improved by preventing defects caused by contamination of the package, and thus the equipment operation rate is improved and the work productivity is improved, thereby reducing the manufacturing cost. There is an effect such as.

Claims (1)

패키지의 몰드 에어 벤트 플래쉬를 클램칭하는 커트 다이의 상면과 스트리퍼의 하면에 몰드 에어 벤트 플래쉬 클램핑 시 몰드 에어 벤트 플래쉬의 상하면을 V-커팅하는 절단날이 대향하여 돌출 형성된 것을 특징으로 하는 반도체 제조장비의 트림/포밍 다이.In the semiconductor manufacturing equipment, characterized in that the cutting edge for V-cutting the upper and lower surfaces of the mold air vent flash when the mold air vent flash clamping the upper surface of the cut die for clamping the mold air vent flash of the package and the lower surface of the stripper. Trim / forming die.
KR2019950038254U 1995-12-05 1995-12-05 Trim forming die of semiconductor manufacture KR200141174Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950038254U KR200141174Y1 (en) 1995-12-05 1995-12-05 Trim forming die of semiconductor manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950038254U KR200141174Y1 (en) 1995-12-05 1995-12-05 Trim forming die of semiconductor manufacture

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Publication Number Publication Date
KR970046998U KR970046998U (en) 1997-07-31
KR200141174Y1 true KR200141174Y1 (en) 1999-03-20

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100444171B1 (en) * 2001-12-28 2004-08-11 동부전자 주식회사 one form trim apparatus

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