KR0114547Y1 - Dambar of the semiconductor device - Google Patents
Dambar of the semiconductor device Download PDFInfo
- Publication number
- KR0114547Y1 KR0114547Y1 KR2019940015996U KR19940015996U KR0114547Y1 KR 0114547 Y1 KR0114547 Y1 KR 0114547Y1 KR 2019940015996 U KR2019940015996 U KR 2019940015996U KR 19940015996 U KR19940015996 U KR 19940015996U KR 0114547 Y1 KR0114547 Y1 KR 0114547Y1
- Authority
- KR
- South Korea
- Prior art keywords
- dam bar
- lead frame
- dambar
- relocator
- bottom die
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/7999—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto for disconnecting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 고안은 반도체의 댐바 작업을 위한 리로케이터 구조에 관한 것으로서 댐바장치(1)의 플로터레일(11)상에 구비된 보텀다이(2)의 중앙 4개소에 서로 대향되는 리로케이터(3)를 복수개 이상 상부로 형성하여 플로터레일(11)로 이송되는 리드프레임(4)의 외부리드(7) 사이에 상기 리로케이터(3)를 삽입하여 리드프레임(4)을 고정시킨 상태에서 댐바(8)를 제거할 수 있도록 하므로서 댐바의 제거를 용이하고 정확히 하여 작업성을 높이고 제품의 불량을 방지한 것이다.The present invention relates to a relocator structure for dambar operation of a semiconductor, and a plurality of relocators (3) opposed to each other at four centers of the bottom die (2) provided on the plotter rail (11) of the dambar device (1). The dam bar 8 is formed while the lead frame 4 is fixed by inserting the relocator 3 between the outer leads 7 of the lead frame 4 which is formed at the upper portion and is transferred to the plotter rail 11. By making it possible to remove, it is easy and accurate to remove the dam bar, thereby improving workability and preventing product defects.
Description
제1도는 본 고안의 반도체를 트리작업을 위한 댐바장치 전체 구성도.1 is an overall configuration diagram of a dam bar device for the tree operation of the present invention.
제2도는 본 고안의 리드프레임이 댐바장치의 보텀다이에 안치된 평면도.2 is a plan view in which the lead frame of the present invention is placed in the bottom die of the dam bar apparatus.
제3도는 종래의 구조도.3 is a conventional structural diagram.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 댐바장치 2 : 보텀다이1: Dam bar device 2: Bottom die
3 : 리로케이터 4 : 리드프레임3: relocator 4: leadframe
7 : 외부리드 8 : 댐바7: External lead 8: Dam bar
본 고안은 반도체의 댐바 작업을 위한 리로케이터 구조에 관한 것으로서, 특히 댐바 장치의 플로터 레일(FLOATOR RAIL)상에 구비된 보텀다이(BOTTOM DIE)의 중앙 4개소에 리로케이터를 복수개 이상 형성하여 리드프레임의 외부리드 사이에 설치하여 리드프레임을 고정시킨 후 댐바를 제거하도록한 반도체의 댐바 작업을 위한 리로케이터 구조에 관한 것이다.The present invention relates to a relocator structure for dambar work of a semiconductor, and in particular, a plurality of relocators are formed in four centers of a bottom die provided on a floater rail of a dambar device. The present invention relates to a relocator structure for dambar work of semiconductors, which is installed between outer leads of the lead frame to fix the lead frame and remove the dambar.
일반적으로 반도체 공정중 리드프레임에 패키지 몰드된 다음 외측으로 내부리드와 연결되어 소정의 기능을 할 수 있게 하기 위하여 리드의 연결부인 댐바를 제거하기 위하여 프레스를 이용 커팅하는 것으로서 종래에는 도시된 도면 제3도에서와 같이 댐바장치의 온 로더(ON LODER)부에서 공급된 리드프레임(L)이 보텀다이(B)에 안치된 상태에서 리드프레임(L)의 사이드 레일 형성된 구멍(H)에 삽입되어 고정시킨 후 톱 다이(T)에 구비된 커팅펀치(C)로 댐바를 제거하도록 하므로서 리드프레임(L)의 구멍(H)에 삽입된 로케이터(LO)와 구멍(H) 사이의 치수 공정 공차로 인하여 커팅펀치(C) 위치에 댐바(D)의 정위치가 부정확하여 댐바를 정확히 제거하지 못함에 따라 불량이 발생되는 문제점이 있었다.In general, a mold is packaged in a lead frame during a semiconductor process and then cut using a press to remove a dam bar, which is a connection part of a lead, to be connected to an inner lead to a predetermined function. As shown in the drawing, the lead frame L supplied from the ON loader part of the dam bar device is inserted into and fixed to the side rail formed hole H of the lead frame L in a state where the lead frame L is placed in the bottom die B. After removing the dam bar with the cutting punch (C) provided in the saw die (T), due to the dimensional process tolerance between the locator (LO) and the hole (H) inserted into the hole (H) of the lead frame (L) The exact position of the dam bar (D) at the position of the cutting punch (C) was incorrect, and there was a problem in that the defect was not generated correctly.
따라서 본 고안은 상기와 같은 종래의 문제점을 해결하기 위하여 보텀다이의 중앙 4개소에 상부로 돌출된 복수개 이상의 리드프레임을 형성하여 리드프레임의 리드 사이에 위치시키고 댐바 제거를 정확히 하여 작업성을 높이고 제품의 불량을 방지한 것을 목적으로 한다.Therefore, the present invention forms a plurality of lead frames protruding upward in four centers of the bottom die in order to solve the conventional problems as described above, located between the leads of the lead frame and precisely removing the dam bar to improve workability and product The purpose is to prevent poor quality.
이하 첨부된 도면에 의하여 본 고안을 상세하게 설명하면 리드프레임(4)에 패키지 몰드된 반도체의 트림공정 중 보텀다이(2)에 안치되어 이송되는 리드프레임(4)의 내부리드(6)와 외부리드(7) 사이에 형성된 댐바(8)를 제거한 댐바장치(1)에 있어서, 상기 댐바장치(1)의 플로터레일(11)상에 구비된 보텀다이(2)의 중앙 4개소에 서로 대향되는 리로케이터(Re-Locator)(3)를 복수개 이상 상부로 형성하여 플로터레일(11)로 이송되는 리드프레임(4)의 외부리드(7) 사이에 상기 리로케이터(3)를 삽입하여 리드프레임(4)를 고정시킨 상태에서 댐바(8)를 제거할 수 있도록 한 것이다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The inner lead 6 and the outside of the lead frame 4 that is placed and transferred to the bottom die 2 during the trimming process of the semiconductor packaged in the lead frame 4 is carried out. In the dam bar apparatus 1 from which the dam bar 8 formed between the lids 7 was removed, the center of the bottom die 2 provided on the plotter rail 11 of the said dam bar apparatus 1 opposes each other. A plurality of re-locators (3) are formed in the upper portion, and the relocator (3) is inserted between the outer leads (7) of the lead frame (4) to be transferred to the plotter rail (11). 4) It is to be able to remove the dam bar (8) in a fixed state.
미설명 부호 : 10은 댐바장치(1)의 인라인공정의 온로더부로 리드프레임을 공급시킬 수 있게 한 것이고, 12는 댐바가 제거된 리드프레임(4)을 수납하는 오프로더부이다.Reference numeral 10 denotes that the lead frame can be supplied to the on-loader portion of the in-line process of the dam bar apparatus 1, and 12 is an off-loader portion for accommodating the lead frame 4 from which the dam bar has been removed.
이와 같이 구성된 본 고안의 작용 및 효과를 설명하면 패키지(5)가 성형된 리드프레임(4)을 댐바장치(1)의 온 로더부(10)에서 공급시켜 플로터 레일(11)을 따라 이송된 보텀다이(2)에 위치하게 된다.Referring to the operation and effects of the present invention configured as described above, the lead frame 4 in which the package 5 is formed is supplied from the on-loader portion 10 of the dam bar device 1, and is transferred along the plotter rail 11. It is located in the die (2).
보텀다이(2)에 위치한 리드프레임(4)은 보텀다이(2)의 중앙 4개소에 상부로 복수개 이상 형성된 리로케이터(3)가 외부리드(7) 사이에 각각 삽입되어 리드프레임(4)을 고정시킨 상태에서 보텀(Buttom)다이(2)에 구비된 커팅툴(도면에 도시되지 않음)에 의하여 댐바(8)가 제거되도록 한 것이다.The lead frame 4 located in the bottom die 2 has a plurality of relocators 3 formed in a plurality of upper portions at four centers of the bottom die 2 between the outer leads 7 so that the lead frame 4 is opened. In the fixed state, the dam bar 8 is removed by a cutting tool (not shown) provided in the bottom die 2.
이렇게 제거되는 댐바(8)는 외부리드(7) 사이에 삽입된 리로케이터(3)가 리드프레임(4)을 4방향의 4개소를 지지고정함에 따라 댐바(8)의 위치가 톱다이(9)의 커팅툴 하부에 정위치 상태가 되므로서 댐바(8)를 정확하게 제거하여 댐바(8) 이외의 각 리드를 침범하여 절단되는 것을 방지한 것이다.The dam bar 8 removed in this way has the position of the dam bar 8 as the relocator 3 inserted between the outer leads 7 holds the lead frame 4 in four directions in four directions. The bottom of the cutting tool is a state in which it is in place to accurately remove the dam bar (8) to prevent cutting by invading each lead other than the dam bar (8).
따라서 댐바장치(1)에서 플로터 레일(11)을 따라 이송되어지는 리드프레임(4)의 댐바(8)를 순차적으로 정확히 제거하여 반도체의 댐바 불량을 방지한 것이다.Therefore, the dam bar 8 of the lead frame 4, which is transferred along the plotter rail 11 in the dam bar device 1, is correctly removed in order to prevent dam bar defects of the semiconductor.
이상에서와 같이 보텀다이의 중앙 4개소에 복수개 이상의 리드프레임을 형성하여 외부리드 사이에 삽입시키므로서 리드프레임을 4방향 4개소를 지지고정함에 따라 톱다이의 위치에 댐바를 정위치시켜 댐바의 제거를 정확히 하여 작업성을 높이고 제품의 불량을 방지한 효과가 있다.As described above, a plurality of lead frames are formed at four centers of the bottom die and inserted between the outer leads, thereby fixing the lead frames in four directions in four directions. It is effective to increase workability and prevent product defects.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940015996U KR0114547Y1 (en) | 1994-06-30 | 1994-06-30 | Dambar of the semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940015996U KR0114547Y1 (en) | 1994-06-30 | 1994-06-30 | Dambar of the semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960003130U KR960003130U (en) | 1996-01-22 |
| KR0114547Y1 true KR0114547Y1 (en) | 1998-04-15 |
Family
ID=19387273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940015996U KR0114547Y1 (en) | 1994-06-30 | 1994-06-30 | Dambar of the semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0114547Y1 (en) |
-
1994
- 1994-06-30 KR KR2019940015996U patent/KR0114547Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960003130U (en) | 1996-01-22 |
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