KR20010106327A - Capacitor Microphone Unit Structure - Google Patents

Capacitor Microphone Unit Structure Download PDF

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Publication number
KR20010106327A
KR20010106327A KR1020010063862A KR20010063862A KR20010106327A KR 20010106327 A KR20010106327 A KR 20010106327A KR 1020010063862 A KR1020010063862 A KR 1020010063862A KR 20010063862 A KR20010063862 A KR 20010063862A KR 20010106327 A KR20010106327 A KR 20010106327A
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KR
South Korea
Prior art keywords
capacitor microphone
microphone unit
pcb
metal
back electret
Prior art date
Application number
KR1020010063862A
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Korean (ko)
Inventor
이진효
이규홍
윤헌일
Original Assignee
이진효
(주) 알에프세미
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Publication date
Application filed by 이진효, (주) 알에프세미 filed Critical 이진효
Priority to KR1020010063862A priority Critical patent/KR20010106327A/en
Publication of KR20010106327A publication Critical patent/KR20010106327A/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

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  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

A silver catalyst for ethylene oxidation to ethylene oxide is provided containing a promoter combination consisting of an alkali metal component, a sulfur component, and a fluorine component, the catalyst being essentially free of rhenium and transition metal components.

Description

커패시터 마이크로폰 유닛 구조{ Capacitor Microphone Unit Structure }Capacitor Microphone Unit Structure

본 발명은 기존에 사용하고 있는 Capacitor Microphone Unit을 좀더 얇게 구현하고자 하는 것이다. 종래기술을 살펴보면 그림1 과 같이 PCB(10)위에 부착된의 Amplifer Chip(11)의 게이트 단자에 Metal Base(5)를 연결하여 구성하였다. 그리고 Metal Base(5)의 위에 Metal Back electret(4)을 연결하고 그 위에 Diaphragm(2)을 두었다. 여기서 Metal Back electret(4)과 Diaphragm(2)사이에 절연체(3)를 두어 두 층이 접촉하지 못하게 하였다. 이러한 구성의 Capacitor Microphone Unit은 최외각에 Case(7)를 두어 상기 층들이 움직이지 못하게 고정하였다. 이렇게 함으로써 음성신호가 Capacitor Microphone Unit에 유기되면 신호는 Diaphragm(2)을 움직이게 되고, Diaphragm(2)과 Metal Back electret(4)사이에 유기되어지는 전압의 변화는 Metal Base(5)를 통해 Amplifier Chip(11)의 입력 포트에 들어오게 된다. 이러한 방법으로 감지된 정전 용량의 변화는 Amplifier Chip(11)을 통해 전달되게 된다. 상기 구조의 Capacitor Microphone Unit의 구조는 기본적으로 두께를 낮추는데 한계가 있다. 따라서 그 기본 구조를 바꾸어 좀더 얇은 구조의 Capacitor Microphone Unit을 만들 수 있게 된다. PCB의 기판(10)에 구멍을 만들고 Amplifier Chip(11)을 그 구멍을 통하여 연결시켜서 종래의 Capacitor Microphone Unit보다 얇게 구현할 수 있게된다. 또한 상기 구조에서 PCB의 금속 패턴(6)을 Metal Back electret으로 사용하면 종래의 구조에서 보다 더욱 얇은 Capacitor Microphone Unit을 구현할 수 있게 된다.The present invention aims to implement a thinner capacitor microphone unit. Looking at the prior art as shown in Figure 1 was configured by connecting the Metal Base (5) to the gate terminal of the Amplifer Chip (11) attached to the PCB (10). And Metal Back electret (4) was connected on top of Metal Base (5) and Diaphragm (2) was placed on it. Here, an insulator (3) was placed between the metal back electret (4) and the diaphragm (2) to prevent the two layers from contacting each other. The Capacitor Microphone Unit of this configuration has a case (7) at the outermost to fix the layers. In this way, when the voice signal is induced in the capacitor microphone unit, the signal moves the diaphragm (2), and the change of the voltage induced between the diaphragm (2) and the metal back electret (4) is transmitted through the metal base (5). It enters the input port of (11). The change in capacitance sensed in this way is transmitted through the Amplifier Chip 11. The structure of the capacitor microphone unit of the above structure is basically limited in reducing the thickness. Therefore, the basic structure can be changed to create a thinner capacitor microphone unit. By making a hole in the PCB 10 of the PCB and connecting the amplifier chip 11 through the hole, it is possible to implement a thinner than the conventional capacitor microphone unit. In addition, by using the metal pattern 6 of the PCB in the structure as a metal back electret it is possible to implement a thinner capacitor microphone unit than in the conventional structure.

본 발명은 기존에 사용하고 있는 Capacitor Microphone Unit을 좀더 얇게 구현하고자 하는 것이다. 종래의 기술로 구현된 Capacitor Microphone Unit은 좀더 얇은 두께를 원하는 현 추세에 대응하지 못하고 그 사용처가 점점 좁아지게 된다.The present invention aims to implement a thinner capacitor microphone unit. Capacitor Microphone Units implemented in the prior art do not respond to the current trend for a thinner thickness, and their use becomes narrower.

그러나 PCB기판에 구멍을 만들어 사용하게 되는 구조는 좀더 얇은 두께의 Capacirot Microphone Unit을 구현할 수 있게 된다. 더우기 PCB기판의 Metal 패턴을 Back electret대신 사용하는 구조의 겨우 더욱 얇은 Capacitor Microphone Unit을 제작할 수 있게 된다. 이와 같이 Capacitor Microphone Unit을 구현하게 되면 두께에서 뿐만 아니라 제조 기술면에서도 좀더 간단히 구현하게되어 제조비의 절감과 신뢰성을 향상 시킬 수 있게 된다.However, the structure used to make a hole in the PCB substrate can realize a thinner Capacirot Microphone Unit. In addition, it is possible to manufacture a thinner capacitor microphone unit that uses a metal pattern of PCB substrate instead of back electret. Implementing the Capacitor Microphone Unit in this way makes it simpler to implement not only in thickness but also in manufacturing technology, thereby reducing manufacturing costs and improving reliability.

도 1은 기존의 Capacitor Microphone Unit의 단면도1 is a cross-sectional view of a conventional capacitor microphone unit

도 2는 도 1의 Capacitor Microphone Unit의FIG. 2 is a view of the capacitor microphone unit of FIG.

도 3은 새로운 형태의 Capacitor Microphone Unit의 단면도3 is a cross-sectional view of a new type of capacitor microphone unit

<도면의 주요 부분에 대한 부호설명><Code Description of Main Parts of Drawing>

1:Capacitor Microphone Unit의 금속판1: Metal Plate of Capacitor Microphone Unit

2:Diaphragm2: Diaphragm

3:절연체3: insulator

4:Metal Back electret4: Metal Back electret

5:Amplifier Chip의 입력 포트에 연결하기 위한 Metal Base5: Metal base for connecting to input port of amplifier chip

6:Amplifier Chip의 입력 포트와 Metal 기둥을 연결하기 위한 PCB 금속 패턴6: PCB metal pattern for connecting the input port of the amplifier chip to the metal pillar

7:Capacitor Microphone Unit의 금속 Case7: Metal Case of Capacitor Microphone Unit

8:Amplifier Chip의 소스 단자8: Source terminal of Amplifier Chip

9:Amplifier Chip의 드레인 단자9: Drain terminal of amplifier chip

10:PCB(Printed Circuit Board)10: PCB (Printed Circuit Board)

11:Amplifier Chip11: Amplifier Chip

12:Metal Back electret대신 사용되며 Amplifier Chip의 입력 포트와 연결되는 PCB 금속 패턴12: PCB metal pattern used instead of Metal Back electret and connected to input port of Amplifier Chip

13:정전용량을 늘리기 위해 사용된 Metal Back electret13: Metal Back electret used to increase capacitance

상기 기술한 바와 같이 종래의 Capacitor Microphone Unit에서 약간의 구조를 바꿈으로써, Capacitor Microphone Unit의 두께를 감소 시킬 수 있게 된다. 기존에 사용되던 Metal Back electret(4)과 Metal Base(5)를 제거하고도 종래와 같은 기능을 수행할 수 있게 되어 좀더 간단하게 Capacitor Microphone Unit을 제조할 수 있다.As described above, the thickness of the capacitor microphone unit can be reduced by changing the structure of the conventional capacitor microphone unit. Capacitor Microphone Unit can be manufactured more simply by removing the metal back electret (4) and the metal base (5) used in the related art.

본 발명은 Capacitor Microphone Unit을 좀 더 얇게 만들어서 유무선 통신 단말기 및 사용 application의 범위를 넓히게 되고 제조에 있어서도 종래의 Capacitor Microphone Unit보다 가격 경쟁력 및 신뢰성에서 향상된 성능을 보이게 된다.The present invention broadens the range of wired / wireless communication terminals and applications by making the capacitor microphone unit thinner, and also exhibits improved performance in price competitiveness and reliability compared to conventional capacitor microphone units in manufacturing.

Claims (6)

Amplifer Chip, Diagphragm, Metal Back electret, Metal Base 그리고 PCB로 구성된 Capacitor Microphone 장치에서,In Capacitor Microphone device consisting of Amplifer Chip, Diagphragm, Metal Back electret, Metal Base and PCB, Amplifier Chip이 PCB기판에 매립되어 있는것을 특징으로 하는 Capacitor Microphone 장치.Capacitor microphone device characterized in that the amplifier chip is embedded in the PCB board. 제 1항에 있어서, PCB의 한쪽면을 Metal Back electret으로 사용한 Capacitor Microphone 장치.The device of claim 1, wherein one side of the PCB is used as a metal back electret. 제 1항에 있어서, PCB 기판의 메탈 패턴 위에 Metal Back electret를 붙여서 구현한 Capacitor Microphone 장치According to claim 1, Capacitor Microphone device implemented by attaching a metal back electret on the metal pattern of the PCB substrate 제 1항에 있어서, Amplifier Chip이 매립된 PCB기판이 외부와 개방된 구조의 Capacitor Microphone 장치.2. The capacitor microphone device of claim 1, wherein the PCB substrate in which the amplifier chip is embedded is open to the outside. 제 4항에 있어서, PCB의 한쪽면을 Metal Back electret으로 사용한 Capacitor Microphone 장치5. The capacitor microphone device of claim 4, wherein one side of the PCB is used as a metal back electret. 제 4항에 있어서, PCB 기판의 메탈 패턴 위에 Metal Back electret를 붙여서 구현한 Capacitor Microphone 장치5. The capacitor microphone device of claim 4, wherein a metal back electret is formed on a metal pattern of a PCB substrate.
KR1020010063862A 2001-10-17 2001-10-17 Capacitor Microphone Unit Structure KR20010106327A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486868B1 (en) * 2002-07-30 2005-05-03 주식회사 비에스이 Condenser microphone using a built-in-gain AMP
KR100486870B1 (en) * 2002-07-30 2005-05-03 주식회사 비에스이 Self electret condenser microphone
KR100502171B1 (en) * 2002-07-30 2005-07-22 주식회사 비에스이 An external bias type condenser microphone
KR100506591B1 (en) * 2002-11-27 2005-08-08 전자부품연구원 Method of manufacturing electret microphone
KR100513424B1 (en) * 2002-11-27 2005-09-09 전자부품연구원 Method for manufacturing acoustic transducer
KR100540712B1 (en) * 2002-07-30 2006-01-16 주식회사 비에스이 A subminiature Si microphone
KR20060091541A (en) * 2005-02-15 2006-08-21 구자봉 The micro-phone using sound sensor and making method of micro-phone
KR101241588B1 (en) * 2011-11-30 2013-03-11 이오스 재팬, 인코포레이티드 Condenser microphone

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486868B1 (en) * 2002-07-30 2005-05-03 주식회사 비에스이 Condenser microphone using a built-in-gain AMP
KR100486870B1 (en) * 2002-07-30 2005-05-03 주식회사 비에스이 Self electret condenser microphone
KR100502171B1 (en) * 2002-07-30 2005-07-22 주식회사 비에스이 An external bias type condenser microphone
KR100540712B1 (en) * 2002-07-30 2006-01-16 주식회사 비에스이 A subminiature Si microphone
KR100506591B1 (en) * 2002-11-27 2005-08-08 전자부품연구원 Method of manufacturing electret microphone
KR100513424B1 (en) * 2002-11-27 2005-09-09 전자부품연구원 Method for manufacturing acoustic transducer
KR20060091541A (en) * 2005-02-15 2006-08-21 구자봉 The micro-phone using sound sensor and making method of micro-phone
KR101241588B1 (en) * 2011-11-30 2013-03-11 이오스 재팬, 인코포레이티드 Condenser microphone

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