KR20010069694A - A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal. - Google Patents

A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal. Download PDF

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Publication number
KR20010069694A
KR20010069694A KR1020010023139A KR20010023139A KR20010069694A KR 20010069694 A KR20010069694 A KR 20010069694A KR 1020010023139 A KR1020010023139 A KR 1020010023139A KR 20010023139 A KR20010023139 A KR 20010023139A KR 20010069694 A KR20010069694 A KR 20010069694A
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KR
South Korea
Prior art keywords
manufacturing
printed circuit
flexible printed
circuit board
copper
Prior art date
Application number
KR1020010023139A
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Korean (ko)
Inventor
이언상
이기백
정병윤
Original Assignee
이언상
(주)세미전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 이언상, (주)세미전자 filed Critical 이언상
Priority to KR1020010023139A priority Critical patent/KR20010069694A/en
Publication of KR20010069694A publication Critical patent/KR20010069694A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Abstract

PURPOSE: A manufacturing method for flexible printed circuit board(PCB) used folder type personal communication assistants is provided to improve the flexibility and to remove the slope between the folder unit and the main body at the exposure process and to implement the infinitesimal pattern by forming the laminated copper film on the polyimide. CONSTITUTION: The manufacturing method for flexible PCB includes the steps of laminating the copper film(133) with the polyimide film(111) of the main body(bbb) and the folder unit(aaa) without using the glue, and patterning the copper thickness less than 10 micrometer. The main body(bbb) and the folder(aaa) has the same vertical cut end structure. The manufacturing method does not use a glue, which decreases the copper plating thickness on the via hole and weakens the brittleness of the copper thin film caused by the electro plating.

Description

폴더형 개인휴대 통신단말기에서 사용되는 연성 인쇄회로기판의 제작 방법. {omitted}A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal. {omitted}

도 1과 도 2는 종래의 기술로 제작되는 연성인쇄회로 기판의 수직단면도를나타낸 것으로서, 도 1의 경우, 폴리이미드(1) 위에 접착제(5)를 사용하여 접착된 동박판(3)으로 구성된 단면 베이스필름 두장을 사용하여 본체부(b)만 접착제(5)로 접착하고 폴더부(a)는 분리층(4)으로 분리시켜 제작된 연성인쇄회로기판의 수직단면도를 나타내었고, 도 2의 경우는 폴리이미드(11) 위에 접착제 없이 압착된 단면 베이스필름 두장을 이용하여 본체부(bb)만 접착제(5)로 접착하고 폴더부(aa)는 분리층(4)으로 분리시켜 양면에 회로를 연결하기 위해 동을 전기도금하여 제작된 연성인쇄회로기판의 수직단면도를 나타내었다.1 and 2 illustrate a vertical cross-sectional view of a flexible printed circuit board manufactured according to the prior art. In FIG. 1, the copper foil plate 3 is bonded to the polyimide 1 using an adhesive 5. Using two single-sided base films, only the main body portion (b) was bonded with an adhesive (5), and the folder portion (a) was shown in a vertical cross-sectional view of a flexible printed circuit board manufactured by separating the separation layer (4). In this case, by using two sheets of single-sided base film pressed without adhesive on the polyimide 11, only the body part bb is adhered with the adhesive 5, and the folder part aa is separated by the separating layer 4 so as to separate the circuit on both sides. The vertical cross-sectional view of a flexible printed circuit board manufactured by electroplating copper for connection is shown.

그러나 이러한 제조방법은 본체(b, bb) 부분이 두꺼워질 뿐만 아니라 제조공정이 복잡하고, 특히 회로를 형성하기 위한 노광공정에서 폴더부(a,aa)와 본체부(b,bb)의 회로 형성시 두께 단차로 인해 피치 150㎛이하의 미세한 회로배선을 형성하기가 어려울 뿐만 아니라 동도금시 도금두께의 증가로 인한 전해 동박의 브리틀(brittle)한 성질로 인해 폴더형 개인휴대단말기와 같이 굴곡성이 요구되는 제품의 수명 및 품질에 많은 문제점을 가지고 있었다.However, such a manufacturing method not only thickens the main body portions b and bb, but also complicated the manufacturing process, and in particular, circuit formation of the folder portions a and aa and the main body portions b and bb in an exposure process for forming a circuit. It is difficult to form fine circuit wiring of pitch less than 150㎛ because of thickness step, and the flexibility of electrolytic copper foil due to the increase of plating thickness during copper plating requires flexibility like a folding personal portable terminal. There were many problems with the life and quality of the product.

본 발명은 개인휴대 통신단말기 등에 응용되는 연성 인쇄회로기판을 제조하는 방법에 있어서 폴더형 통신 단말기와 같이 폴더부에서의 굴곡성이 단말기의 수명과 직접적인 관계를 갖고 있는 제품에 있어서, 굴곡성을 향상시키고, 노광공정에서 폴더부와 본체부의 단차를 없애 줌으로서 폴더부에서의 미세한 회로배선을 형성하기 위해서, 기존의 폴리이미드 위에 접착된 동박판으로 구성된 단면 베이스필름 두장을 사용하는 대신에, 접착제가 없이 동박판을 양면으로 압착(Laminating)하여폴리이미드 위에 형성시킨 양면 베이스필름 한장을 사용하여 굴곡성을 향상시키고, 또한 미세패턴을 구현할 수 있도록 하는 것을 특정으로 하는 폴더형 개인휴대단말기에 응용되는 연성인쇄회로 기판의 제조방법이다.The present invention provides a method for manufacturing a flexible printed circuit board applied to a personal mobile communication terminal and the like in a product in which the flexibility in the folder portion has a direct relationship with the life of the terminal, such as a folding communication terminal, Instead of using two single-sided base films made of copper foil bonded onto the existing polyimide to form fine circuit wiring in the folder by eliminating the step between the folder and the body in the exposure process, Flexible printed circuit board applied to foldable personal handheld terminal, which is characterized in that it is possible to improve flexibility by using single-sided base film formed on polyimide by laminating thin plate on both sides. It is a manufacturing method of.

도 1은 접착제를 사용한 단면 베이스필름을 이용한 단면 합지 형태의 폴더형 연성 인쇄회로기판의 수직단면도1 is a vertical cross-sectional view of a foldable flexible printed circuit board in the form of a single-side lamination using a single-side base film using an adhesive

도 2는 접착제 없이 라미네이팅에 의해 제작된 단면 베이스필름을 이용한 단면합지 형태의 폴더형 연성 인쇄회로기판의 수직단면도Figure 2 is a vertical cross-sectional view of a foldable flexible printed circuit board in the form of a cross-section using a single-sided base film produced by laminating without adhesive.

도 3은 접착제 없이 라미네이팅에 의해 제작된 양면 베이스필름을 이용한 폴더형 연성 인쇄회로기판의 수직단면도Figure 3 is a vertical cross-sectional view of a foldable flexible printed circuit board using a double-sided base film produced by laminating without adhesive

＜도면의 주요부분에 대한 부호의 설명＞<Description of the code | symbol about the principal part of drawing>

(a),(aa),(aaa) : 폴더부 (b),(bb),(bbb) : 본체부(a), (aa), (aaa): Folder part (b), (bb), (bbb): Main body part

1,11,111 : 폴리이미드(Polyimide) 2,12,122 : COVERLAYER1,11,111: Polyimide 2,12,122: COVERLAYER

3,13,133 : 동(Copper)박판 4,14 : 분리층3,13,133: Copper foil 4,14: Separation layer

5,15 : 접착제5,15: adhesive

이하 첨부된 도면에 의해 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings as follows.

도 3은 본 발명에 의해 제작되는 폴더형 개인휴대 통신단말기에 사용되는 연성 인쇄회로기판의 수직단면도로서, 기존의 제조방법과는 달리 본체부(bbb)와 폴더부(aa) 모두 폴리이미드 필름(111) 위에 접착제가 없이 동박판(133)을 양면으로 압착(Laminating)하여 형성시킨 양면 베이스필름을 사용함으로서, 본체부(bbb) 및 폴더부(aaa)가 동일한 수직 단면 구조를 갖고 있으며, 접착제가 없기 때문에 양면 회로 형성시, 비아홀(via hole)의 동도금 두께를 줄일 수 있도록 하여, 전해도금으로 인한 동박판의 브리틀(brittle)한 성질을 줄여 굴곡성을 향상시킬 수 있도록 하였으며, 또한 폴더부(aaa)와 본체부(bbb)가 동일한 수직단면 구조로서 단차가 없기 때문에 미세패턴 형성이 가능하다.3 is a vertical cross-sectional view of a flexible printed circuit board used in a folding personal portable communication terminal manufactured by the present invention, unlike the conventional manufacturing method, both the body portion (bbb) and the folder portion (aa) are polyimide films ( By using the double-sided base film formed by laminating the copper foil 133 on both sides without adhesive on the 111, the body portion bbb and the folder portion aa have the same vertical cross-sectional structure, and the adhesive When the double-sided circuit is formed, the copper plating thickness of the via hole can be reduced, thereby reducing the brittleness of the copper sheet due to the electroplating, thereby improving the bendability. ) And the body portion bbb are the same vertical cross-sectional structure, and there is no step, so that a fine pattern can be formed.

본 발명의 효과는 지금까지 폴더형 개인 휴대단말기에서 야기되는 굴곡성 및 미세회로 패턴 형성의 문제점을 해결할 수 있는 새로운 폴더형 연성 인쇄회로기판의 제조방법에 관한 것으로서 폴더부에서 지금까지 접근하지 못한 150마이크론(Micron)이하 피치의 미세패턴을 형성할 수 있도록 하면서 굴곡성을 보장할 수 있게 하는 발명으로서 향후 통신 휴대단말기 등과 같은 연성 인쇄회로기판이 응용되는 기기의 소형화, 칼라화, 다기능화에 대응하기 위한 폴더형 통신단말기의 연성 인쇄회로기판의 생산에서 일대 전환점을 가져올 수 있을 것이라 기대한다.The effect of the present invention relates to a manufacturing method of a novel clamshell flexible printed circuit board that can solve the problems of flexural and microcircuit pattern formation caused by the clamshell personal portable terminal so far. (Micron) is an invention to ensure the flexibility while forming a fine pattern of pitch or less as a folder for miniaturization, colorization, and multifunction of devices to which flexible printed circuit boards such as communication portable terminals are applied in the future. It is expected to bring about a turning point in the production of flexible printed circuit boards for telecommunication terminals.

Claims (2)

(a)굴곡성이 요구되는 폴더형 개인휴대단말기의 연성 인쇄회로기판(Flexible Printed Circuit Board)을 제작하는 공정에 있어서 접착제 없이 압착된 양면 베이스필름을 사용하여 폴더형 연성인쇄회로 기판을 제작하는 방법 및 구조(a) a method of manufacturing a foldable flexible printed circuit board using a double-sided base film pressed without adhesive in a process of manufacturing a flexible printed circuit board of a foldable personal portable terminal requiring flexibility; and rescue (b)(a)방법으로 형성된 구조에 양면 회로 배선 연결을 위해 동도금 두께를 10㎛이하로 하여 굴곡성을 향상시키는 방법 및 구조(b) Method and structure to improve bendability with copper plating thickness less than 10㎛ for connecting double-sided circuit wiring to structure formed by method (a) 굴곡성이 요구되는 폴더형 개인휴대단말기의 연성 인쇄회로기판(Flexible Printed Circuit Board)을 제작하는 공정에 있어서 접착제 없이 단면으로 압착된 단면 베이스필름을 사용하여 폴더형 연성인쇄회로 기판을 제작하는 방법 및 구조Method and structure for fabricating a foldable flexible printed circuit board using a single-sided base film pressed into a cross section without adhesive in the process of manufacturing a flexible printed circuit board of a foldable personal portable terminal requiring flexibility
KR1020010023139A 2001-04-27 2001-04-27 A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal. KR20010069694A (en)

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Application Number Priority Date Filing Date Title
KR1020010023139A KR20010069694A (en) 2001-04-27 2001-04-27 A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal.

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KR1020010023139A KR20010069694A (en) 2001-04-27 2001-04-27 A method of manufacturing a flexible printed circuit board used in a folding personal portable communication terminal.

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100696076B1 (en) * 2005-09-14 2007-03-19 (주)아이디에스 one side flexible printed circuit abled to do two sides SMT
KR101308931B1 (en) * 2013-08-07 2013-09-23 (주)드림텍 Main board for mobile terminal having integral type release film
KR101324595B1 (en) * 2013-08-07 2013-11-01 (주)드림텍 Main board for mobil terminal with excellent assembling and mobility

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100696076B1 (en) * 2005-09-14 2007-03-19 (주)아이디에스 one side flexible printed circuit abled to do two sides SMT
KR101308931B1 (en) * 2013-08-07 2013-09-23 (주)드림텍 Main board for mobile terminal having integral type release film
KR101324595B1 (en) * 2013-08-07 2013-11-01 (주)드림텍 Main board for mobil terminal with excellent assembling and mobility

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