KR20010029282A - 반도체소자 제조를 위한 급속 열처리 시스템 - Google Patents
반도체소자 제조를 위한 급속 열처리 시스템 Download PDFInfo
- Publication number
- KR20010029282A KR20010029282A KR1019990042030A KR19990042030A KR20010029282A KR 20010029282 A KR20010029282 A KR 20010029282A KR 1019990042030 A KR1019990042030 A KR 1019990042030A KR 19990042030 A KR19990042030 A KR 19990042030A KR 20010029282 A KR20010029282 A KR 20010029282A
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- wafer
- stacked
- heat treatment
- cassette
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (2)
- 카세트가 안착되는 카세트 스테이지와, 상기 카세트에서 출고된 웨이퍼가 내부에 로딩되어 급속 열처리 공정을 진행하게 되는 챔버와, 상기 챔버 상·하부에 수개씩 설치되는 히터와, 상기 챔버에서 열처리된 웨이퍼를 냉각시키기 위한 쿨링 스테이지와, 상기 웨이퍼를 핸들링하여 공정 순서에 따라 각 장치에 웨이퍼를 로딩 및 언로딩하는 웨이퍼 핸들링 로봇을 구비한 열처리 시스템에 있어서;상기 챔버가 상하부로 스택됨과 더불어 스택된 챔버의 상하부 및 상기 스택된 챔버 사이에는 복수개의 히터가 일정간격 이격되도록 설치되고,상기 챔버 일측에는 스택된 챔버 수와 동일한 개수의 쿨링 스테이지가 구비됨을 특징으로 하는 반도체소자 제조를 위한 급속 열처리 시스템.
- 제 1 항에 있어서,상기 얼라이너의 수를 스택된 챔버의 수와 동일한 개수로 한 것을 특징으로 하는 반도체소자 제조를 위한 급속 열처리 시스템.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990042030A KR100331852B1 (ko) | 1999-09-30 | 1999-09-30 | 반도체 소자 제조를 위한 급속 열처리 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990042030A KR100331852B1 (ko) | 1999-09-30 | 1999-09-30 | 반도체 소자 제조를 위한 급속 열처리 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010029282A true KR20010029282A (ko) | 2001-04-06 |
KR100331852B1 KR100331852B1 (ko) | 2002-04-09 |
Family
ID=19613397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990042030A KR100331852B1 (ko) | 1999-09-30 | 1999-09-30 | 반도체 소자 제조를 위한 급속 열처리 시스템 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100331852B1 (ko) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970067673A (ko) * | 1996-03-27 | 1997-10-13 | 김광호 | 반도체 제조장치(A Semiconductor Fabrication Apparatus) |
JPH1064921A (ja) * | 1996-08-21 | 1998-03-06 | Kokusai Electric Co Ltd | 半導体製造装置の基板加熱装置 |
JP3256462B2 (ja) * | 1997-03-05 | 2002-02-12 | 東京エレクトロン株式会社 | レジスト処理方法及びレジスト処理システム |
US6051512A (en) * | 1997-04-11 | 2000-04-18 | Steag Rtp Systems | Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafers |
-
1999
- 1999-09-30 KR KR1019990042030A patent/KR100331852B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100331852B1 (ko) | 2002-04-09 |
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