KR20010013579A - Capacitor and method of making - Google Patents

Abstract

An apparatus and process is disclosed for making a capacitor comprising the step of covering a first capacitor plate element (12) with a spacing material (30). The first capacitor plate element (12) and the spacing material (30) are encased within a second capacitor element (22). The second capacitor plate element (22) is drawn for reducing the outer diameter thereof. A multiplicity of the capacitor elements are inserted within a second capacitor plate connector (23). The second capacitor plate connector (23) is drawn for reducing the outer diameter of the metallic tube and for electrically interconnecting the multiplicity of the second capacitor plate elements (22) with the second capacitor plate connector (23) to form a second capacitor plate (20). The multiplicity of the first capacitor elements are interconnected with a first capacitor plate connector (13) to form a first capacitor plate (10). In one embodiment of the invention, the spacing material is a dielectric material (30) whereas in another embodiment of the invention, the spacing material is transformed into or replaced by a dielectric material.

Description

Capacitor and Manufacturing Method Thereof {CAPACITOR AND METHOD OF MAKING}

Over the years, the size of electronic components has been steadily and markedly reduced in the field of electrical and electronic technologies. In addition to the significant reduction in the size of such electrical components, the speed and complexity of the electronic components have actually increased in the field of electrical and electronic technologies. The reduction of the size of electronic components has been mainly made in the areas of semiconductors and resistive elements. However, the significant reduction in size has not affected the area of the electrical capacitors.

The capacitor is formed by two conductive plates separated by a dielectric interposed between the two conductive plates. The capacitance of the capacitor is directly proportional to the area of the conductive plate of the capacitor and inversely proportional to the separation of the conductive plate or the thickness of the dielectric. The dielectric of the capacitor should be thin enough to increase the capacitance of the capacitor while being thick enough to withstand the potential voltage difference between the conductive capacitor plates.

It can be seen that any reduction in capacitor size is limited by the physical shape of the capacitor, ie the total surface area of the conductive capacitor plates and the thickness of the dielectric insulator between the conductive plates of the capacitor. Thus, to reduce the physical dimensions of the capacitor while maintaining the same capacitance, any reduction in the total surface area of the conductive capacitor plates must be related to the corresponding reduction in the thickness of the dielectric or the spacing between the conductive capacitor plates.

Traditionally, capacitors of the prior art are molded by rolling first and second foils separated by a dielectric into a cylindrical roll. Some of the prior arts have attempted miniaturization of capacitors by incorporating thin sheet technology or the like. By using thin plate technology, the physical thickness of the conductive capacitor plates is reduced without reducing its surface area. The use of sheet metal technology helps to reduce the physical size of a given capacitance capacitor.

It is therefore an object of the present invention to provide an apparatus and method for the manufacture of capacitors with very large capacitances over a physical size not known by the prior art.

It is yet another object of the present invention to provide an apparatus and method for manufacturing capacitors which are very reliable and capable of high temperature operation.

Another object of the present invention is to provide an apparatus and method for manufacturing a capacitor using a plurality of coaxial capacitors connected in parallel.

It is another object of the present invention that each individual coaxial capacitor can be inspected for any defects prior to interconnection, eliminating the need to discard the capacitor due to a defective capacitor of one of the plurality of coaxial capacitors. It is to provide an apparatus and method for producing the same.

It is another object of the present invention to provide an apparatus and method for manufacturing a capacitor by drawing a coaxial conductor separated by a dielectric in a wire drawing process.

It is another object of the present invention to provide an apparatus and method for manufacturing capacitors by drawing multiple individual coaxial capacitors in a wire drawing process.

The above objects outline some of the more relevant objects of the present invention. These objects should be construed as merely describing some of the more salient features and applications of the present invention. Many other beneficial results can be achieved by applying the disclosed invention in different ways or by modifying the invention within the scope of the invention. Accordingly, other objects from a complete understanding of the invention may be obtained by reference to the following detailed description which describes preferred embodiments other than the scope of the invention as defined by the claims, in conjunction with the summary of the invention.

The present invention relates to capacitors for electrical and electronic circuits, and in particular to improved metal capacitors having high capacitance and low physical volume. The invention also relates to a method for producing an improved metal capacitor through a wire drawing process.

1 is an isometric view of a capacitor of the present invention.

2 is a cross-sectional view of the capacitor of FIG.

3 is a block diagram illustrating an improved method of manufacturing a capacitor.

4 is an isometric view of a first capacitor plate element shown as the wire mentioned in FIG.

4A is an end view of FIG. 4;

5 is an isometric view of the dielectric surrounding the first capacitor plate element of FIG.

Fig. 5A is an end view of Fig. 5;

Fig. 6 is an isometric view of a dielectric with a first capacitor plate element lying within the second capacitor plate element.

6A is an end view of FIG. 6;

Fig. 7 is an isometric view after drawing the second capacitor plate element together with the first capacitor plate element and the dielectric for shaping the capacitor element;

7A is an enlarged end view of FIG.

FIG. 8 is an isometric view illustrating assembly of multiple capacitor elements in a row; FIG.

8A is an end view of FIG. 8;

9 is an isometric view of a second capacitor plate connector surrounding a row of capacitor elements.

9A is an end view of FIG.

Figure 10 is an isometric view after drawing a second capacitor plate connector having a row of capacitor elements therein to electrically interconnect the second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate.

10A is an enlarged end view of FIG. 10;

Figure 11 is an isometric view after exposing a portion of each of the first capacitor plate elements in a row of capacitor elements.

Figure 11A is an enlarged end view of Figure 11;

12 is an isometric view of interconnecting multiple first capacitor elements to a first capacitor plate connector to form a first capacitor plate.

12A is an enlarged view of FIG.

FIG. 13 is an isometric view after packaging of the capacitor of FIG. 12; FIG.

13A is an enlarged view of FIG.

Figure 14 is a block diagram illustrating an improved first method of manufacturing a capacitor.

FIG. 15 is an isometric view of a first capacitor plate element shown as the wire mentioned in FIG.

Figure 15A is an end view of Figure 15;

Figure 16 is an isometric view of the dielectric surrounding the first capacitor plate element of Figure 15;

Figure 16A is an end view of Figure 16;

Figure 17 is an isometric view of the first capacitor plate element and the space bar material lying within the second capacitor plate element.

Figure 17A is an end view of Figure 17;

Fig. 18 is an isometric view after drawing the second capacitor plate element together with the first capacitor plate element and the spacing material for shaping the capacitor element;

18A is an enlarged end view of FIG. 18;

19 is an isometric view illustrating the assembly of multiple coaxial elements in parallel rows.

19A is an end view of FIG. 19;

20 is an isometric view of a second capacitor plate connector enclosing parallel rows of coaxial elements.

20A is an end view of FIG. 20;

Figure 21 is an isometric view after drawing a second capacitor plate connector having therein a parallel row of coaxial elements to electrically interconnect the second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate.

Figure 21A is an enlarged end view of Figure 21;

FIG. 22 is an isometric view after cutting parallel rows of the coaxial elements of FIG. 21 into multiple segments. FIG.

Figure 22A is an enlarged end view of Figure 22;

Figure 23 is an isometric view after exposing a portion of each of the first capacitor plate elements in a parallel row of capacitor elements.

FIG. 23A is an enlarged end view of FIG. 23; FIG.

Fig. 24 is an isometric view showing a process of replacing the spacer material with a dielectric to form parallel rows of capacitor elements.

Figure 24A is an enlarged end view of Figure 24;

Figure 25 is an isometric view of interconnecting multiple first capacitor elements to a first capacitor plate connector to form a first capacitor plate.

FIG. 25A is an enlarged view of FIG. 25;

Figure 26 is an isometric view after packaging of the capacitor of Figure 25;

FIG. 26A is an enlarged view of FIG.

Fig. 27 is a block diagram showing an improved method of manufacturing a capacitor.

FIG. 28 is an isometric view of a first capacitor plate element shown as the wire mentioned in FIG. 27; FIG.

FIG. 28A is an end view of FIG. 28;

Fig. 29 is an isometric view of a second capacitor plate element surrounding the first capacitor plate element.

FIG. 29A is an end view of FIG. 29; FIG.

30 is an isometric view after drawing the second capacitor plate element together with the first capacitor plate element to mold the capacitor element;

30A is an enlarged end view of FIG. 30;

Fig. 31 is an isometric view illustrating the assembly of multiple coaxial elements in parallel rows.

FIG. 31A is an end view of FIG. 31;

Figure 32 is an isometric view of a second capacitor plate connector enclosing parallel rows of coaxial elements.

32A is an end view of FIG. 32;

Figure 33 is an isometric view after drawing a second capacitor plate connector having a parallel row of coaxial elements therein for electrically interconnecting the second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate.

Figure 33A is an enlarged end view of Figure 33;

FIG. 34 is an isometric view after cutting parallel rows of the coaxial elements of FIG. 33 into multiple segments. FIG.

Figure 34A is an enlarged end view of Figure 34;

35 is an isometric view after exposing a portion of each of the first capacitor plate elements in a parallel row of capacitor elements.

Figure 35A is an enlarged end view of Figure 35;

Fig. 36 is an isometric view showing a process of forming a dielectric to form parallel rows of capacitor elements.

FIG. 36A is an enlarged end view of FIG. 36;

Figure 37 is an enlarged view of a portion of Figure 36A before forming the dielectric.

FIG. 37A is an enlarged view similar to FIG. 37 after molding of the dielectric; FIG.

The invention is defined by the appended claims, along with the specific embodiments shown in the accompanying drawings. For purposes of summarizing the invention, the present invention is directed to an improved capacitor comprising heat formed from multiple capacitor elements. Each of the multiple capacitor elements includes a first capacitor plate element surrounded by a second capacitor plate element with a dielectric interposed therebetween. The first capacitor plate connector interconnects each of the first capacitor plate elements of the multiple capacitor elements to form a first capacitor plate. The second capacitor plate connector interconnects each of the second capacitor plate elements of the multiple capacitor elements to form a second capacitor plate.

In one embodiment of the invention, the first capacitor plate element comprises a metal wire having an actual circular cross section. The dielectric may comprise an oxide on each of the first capacitor plate elements or a coating on each of the first capacitor plate elements.

In another embodiment of the invention, each second capacitor plate element comprises a metal tube and a dielectric in the form of a continuous metal tube around each of the first capacitor plate elements. The first capacitor plate connector includes respective first capacitor plate elements with exposed portions. The first capacitor plate connector interconnects each exposed portion of each of the multiple first capacitor elements to form a first capacitor plate. The second capacitor plate connector includes multiple capacitor elements disposed in and in electrical contact with the second metal tube.

The invention is also embodied in a first process for manufacturing a capacitor comprising covering the first capacitor plate elements with a gap material. The first capacitor plate element and the spacer material are encased in the second capacitor plate element. The second capacitor plate element with the first capacitor plate element and the gap material therein are drawn to reduce its outer diameter and form the capacitor element. Multiple capacitor elements are inserted in the second capacitor plate connector. A second capacitor plate connector having multiple capacitor elements therein is drawn to reduce its outer diameter and to electrically interconnect the multiple second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate. Multiple first capacitor elements are interconnected with a first capacitor plate connector to form a first capacitor plate.

The present invention is also embodied in a first process of manufacturing a capacitor comprising providing a first capacitor plate element. The first capacitor plate element is encased in the second capacitor plate element. The second capacitor plate element having the first capacitor plate element therein is drawn to reduce its outer diameter and form the capacitor element. Multiple capacitor elements are inserted in the second capacitor plate connector. A second capacitor plate connector having multiple capacitor elements therein is drawn to reduce its outer diameter and to electrically interconnect the multiple second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate. A dielectric is formed between each of the first and second capacitor plates. Multiple first capacitor elements are interconnected to the first capacitor plate connector to form a first capacitor plate.

The invention is also embodied in a first process for manufacturing a capacitor comprising providing a first capacitor plate element. The first capacitor plate element is encased in the second capacitor plate element. The second capacitor plate element having the first capacitor plate element therein is drawn to reduce its outer diameter and form the capacitor element. Multiple capacitor elements are inserted in the second capacitor plate connector. A second capacitor plate connector having multiple capacitor elements therein is drawn to reduce its outer diameter and to electrically interconnect the multiple second capacitor plate elements to the second capacitor plate connector to form a second capacitor plate. A dielectric is formed between each of the first and second capacitor plates. Multiple first capacitor elements are interconnected to the first capacitor plate connector to form a first capacitor plate.

The foregoing is a broader summary of the more relevant and important features of the present invention in order that the detailed description that follows may be better understood in order to better understand the contribution of the present invention to the art. Further features of the invention, which form the subject of the claims of the invention, will be described later. It will be appreciated that the described concepts and specific embodiments can be readily utilized based on modifications or designs of other structures for carrying out the same purposes of the present invention. It will also be apparent to those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the present invention as set forth in the appended claims.

For a more complete understanding of the nature and objects of the invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

Like reference numerals designate like parts throughout the several views.

1 is an isometric view of a capacitor 5 of the invention and FIG. 2 is a cross-sectional view of the capacitor 5 of FIG. The capacitor 5 comprises a row 6 of coaxial capacitor elements 8 shown in parallel rows in the physical direction interconnected by electrical parallel circuits.

Capacitor 5 includes a first capacitor plate 10 and a second capacitor plate 20 separated by dielectric 30. The first capacitor plate 10 includes multiple first capacitor elements 12 in which each of the multiple first capacitor elements 12 is shown as a wire having an outer diameter 12D.

The second capacitor plate 20 includes multiple second capacitor elements 22 surrounding the multiple first capacitor elements 12. Multiple dielectrics 30 are interposed between each multiple first capacitor element 12 and multiple second capacitor element 22.

As best shown in Fig. 2, each second capacitor element 22 forms an outer diameter 22D, while each multiple dielectric 30 forms an outer diameter 30D.

The multiple first capacitor elements 12 are connected by a first plate connector 13 to form a first capacitor plate 10. The first plate connector 13 is electrically connected in parallel with the multiple first capacitor elements 12. The first capacitor plate 10 is connected to the first connecting wire 15 via the first wire connector 14.

The multiple second capacitor elements 22 are connected by the second plate connector 23 to form the second capacitor plate 20. The second plate connector 23 is electrically connected in parallel with the multiple second capacitor elements 22. The second capacitor plate 20 is connected to the first connection wire 25 via the second wire connector 24.

The capacitor 5 is surrounded by an insulating cover 40 to insulate the first and second capacitor plates 10, 20 from the surroundings. The insulating cover 40 includes an outer insulator 42 and end insulators 44 and 46.

The capacitor 5 is shown with only a small number of coaxial capacitor elements 8 in the row 6 for clarity of illustration. When the capacitor 5 of FIGS. 1 and 2 is constructed in accordance with the process of the invention, preferably 500 to 1000 coaxial capacitor elements 8 are embedded in a row 6.

3 is a block diagram showing the first process 110 for manufacturing the capacitor 5. The improved process 110 of FIG. 3 includes providing a first capacitor plate element 12. 4 is an isometric view of the first capacitor plate element 12 mentioned in FIG. 3 and FIG. 4A is an end view of FIG. Preferably, the first capacitor plate element 12 is in the form of a metal wire having an actual circular cross section formed by the outer diameter 12D.

3 shows a process step 111 of covering the first capacitor plate element 12 with a dielectric 30. FIG. 5 is an isometric view of the dielectric 30 surrounding the first capacitor plate element 12 of FIG. 4 and FIG. 5A is an end view of FIG. Preferably, the dielectric 30 is applied to the first capacitor plate element 12 with a thickness of 0.005 cm to 0.05 cm to form the outer diameter 30D. Dielectric 30 is an insulating material having a dielectric strength in the range of 40 to 400 volts / mil and a dielectric constant in the range of 2 to 12,000.

The process of covering the first capacitor plate element 12 with the dielectric 30 can be accomplished in a variety of ways depending on the desired physical and electrical properties of the capacitor 5. In one example of the invention, the process of covering the first capacitor plate element 12 with the dielectric 30 includes forming an oxide on the first capacitor plate element 12. In another example of the invention, the process of covering the first capacitor plate element 12 with the dielectric 30 includes coating the first capacitor plate element 12 with the dielectric 30. The first capacitor plate element 12 may be coated with a flowable dielectric 30 that is cured on the first capacitor plate element 12. In another example, the process of covering the first capacitor plate element 12 with the dielectric 30 includes wrapping the first capacitor plate element 12 with the dielectric 30 in the form of a dielectric fabric.

FIG. 3 shows a process step 112 of wrapping the first capacitor plate element 12 and the dielectric 30 with the second capacitor plate element 22. FIG. 6 is an isometric view of the first capacitor plate element 12 and the dielectric 30 lying within the second capacitor plate element 22 and FIG. 6A is an end view of FIG. The second capacitor plate element 22 is formed by a preformed tube 26. The second capacitor plate element 22 surrounds the first capacitor plate element 12 and the dielectric 30 to have an actual circular cross section formed by the outer diameter 22D. Preferably, the second capacitor plate element 22 is in the form of a continuous metal tube having different chemical properties from the first capacitor plate element 12. Inserting the first capacitor plate element 12 and the dielectric 30 into the second capacitor plate element 22 inserts the first capacitor plate element 12 and the dielectric 30 into the second capacitor plate element 22. It includes a step.

Alternatively, the second capacitor plate element 22 may be a longitudinally extending sheet formed around the first capacitor plate element 12 and the dielectric 30 to have an actual circular cross section. In this case, the first capacitor plate element 12 having the dielectric 30 thereon extends the longitudinally extending sheet of the first capacitor plate element 12 and the second capacitor plate element 22 around the dielectric 30. It is put in by bending.

3 shows a process step of drawing a second capacitor plate element 22 having a first capacitor plate element 12 and a dielectric 30 therein to reduce its outer diameter 22D and form the coaxial capacitor element 8. 113 is shown.

FIG. 7 is an isometric view after drawing the first capacitor plate element 12 and the second capacitor plate element 22 having the dielectric 30 to form the coaxial capacitor element 8. 7A is an enlarged end view of FIG. Preferably, the process step 113 of drawing the second capacitor plate element 22 may include a second capacitor plate element having the first capacitor plate element 12 and the dielectric 30 therein to reduce its outer diameter 22D. A continuous drawing and annealing step of (22). The successive drawing and unwinding steps of the second capacitor plate element 22 may thereby be coupled to both sides of the dielectric 30 to form the coaxial capacitor element 8 and the first capacitor plate element 12 and the second capacitor. The plate element 22 is moved.

3 shows a process step 114 of assembling the multiple coaxial capacitor elements 8 into actual parallel rows 6. FIG. 8 is an isometric view of multiple coaxial capacitor elements 8 assembled into a row 6 and FIG. 8A is an end view of FIG. Preferably, 500 to 1000 coaxial capacitor elements 8 are arranged in actual parallel form to form a row 6.

3 shows a process step 115 of inserting a row 6 of multiple coaxial capacitor elements 8 into a second capacitor plate connector 23. FIG. 9 is an isometric view of a second capacitor plate connector 23 surrounding a row 6 of coaxial capacitor elements 8 and FIG. 9A is an end view of FIG. Preferably, the second capacitor plate connector 23 is in the form of a continuous metal tube having the same chemical properties as the second capacitor plate element 22. The second capacitor plate connector 23 surrounds the row 6 to have an actual circular cross section formed by the outer diameter 23D. Preferably, the step of inserting the rows 6 of the multiple coaxial capacitor elements 8 into the second capacitor plate connector 23 simultaneously inserts the rows 6 of the multiple coaxial capacitor elements 8 into the preformed second metal tube. It includes a step.

Alternatively, the second capacitor plate connector 23 may be a longitudinally extending sheet formed around the rows 6 of the multiple coaxial capacitor elements 8 to have a substantially circular cross section. In this case, the rows 6 of the multiple coaxial capacitor elements 8 are inserted by bending the longitudinally extending sheet of the second capacitor plate connector 23 around the rows 6 of the multiple coaxial capacitor elements 8. .

3 shows a drawing process step 116 of a second capacitor plate connector 23 having a row 6 of coaxial capacitor elements 8 therein. FIG. 10 shows a row 6 of coaxial capacitor elements 8 therein for electrically interconnecting the second capacitor plate elements 22 to the second capacitor plate connector 23 to form the second capacitor plate 20. FIG. 10A is an enlarged end view of FIG. 10 after drawing out of the second capacitor plate connector 23 having in FIG.

By drawing out the second capacitor plate connector 23 having the row 6 of the multiple coaxial capacitor elements 8 therein, the outer diameter 23D of the second capacitor plate connector 23 is reduced and the second capacitor plate 20 is reduced. The multiple second capacitor plate elements 22 are electrically interconnected to the second capacitor plate connector 23 so as to form the mold.

The drawing process step 116 of the second capacitor plate connector 23 having a row 6 of coaxial capacitor elements 8 therein provides three effects. First, the process step 116 reduces the outer diameter 23D of the second capacitor plate connector 23. Secondly, the process step 116 reduces the corresponding outer diameter 8D of each of the coaxial capacitor elements 8 and the corresponding thickness of the dielectric 30. Third, the process step 116 allows the second capacitor plate element 22 to be adjacent to the second capacitor plate element 22 and the second capacitor plate connector 23 to form the second capacitor plate 20. Diffusion welding

Diffusion welding of the second capacitor plate element 22 adjacent to the second capacitor plate element 22 and the second capacitor plate connector 23 forms a single second capacitor plate 20. Multiple first capacitor elements 12 surrounded by dielectric 30 are embedded within a single second capacitor plate 20.

3 shows a process step 117 of interconnecting multiple first capacitor elements 12 to a first capacitor plate connector 13 to form a first capacitor plate 10. In one example of the invention, the step of interconnecting the multiple first capacitor elements 12 to the first capacitor plate connector 13 to form the first capacitor plate 10 comprises a row of coaxial capacitor elements 8. Exposing each portion 60 of the first capacitor plate element 12 of 6). Thereafter, each exposed portion 60 of the multiple first capacitor elements 12 is interconnected to the first capacitor plate connector 13.

11 is an isometric view after exposing a portion 60 of each of the first capacitor plate elements 12 in a row 6 of coaxial capacitor elements 8. FIG. 11A is an enlarged end view of FIG. In one process of the invention, the process of exposing each portion 60 of the first capacitor plate element 12 in the row 6 of the coaxial capacitor element 8 comprises a portion of the second capacitor plate element 22. And chemically removing a portion of the second capacitor plate connector 23. Preferably, the second capacitor plate element 22 and the second capacitor plate connector 23 are immersed into a mountain for disassembling a portion of the second capacitor plate element 22 and a portion of the second capacitor plate connector 23. .

The second capacitor plate connector 23 has the same chemical properties as the second capacitor plate element 22. Since the second capacitor plate element 22 and the second capacitor plate connector 23 have different chemical properties from those of the first capacitor plate element 12, a part of the second capacitor plate element 22 and the second capacitor plate connector A part of 23 can be chemically removed without removing the first capacitor plate element 12.

FIG. 12 is an isometric view illustrating the interconnection of multiple first capacitor elements 12 to first capacitor plate connector 13 to form a first capacitor plate 10. 12A is an enlarged view of FIG. 12. In one example of the invention, the exposed portion 60 of each of the multiple first capacitor elements 12 is interconnected to the first capacitor plate connector 13 by a soldering process. Alternatively, the exposed portion 60 of each of the multiple first capacitor elements 12 is interconnected to the first capacitor plate connector 13 by a welding process. The first capacitor plate 10 is connected to the first connecting wire 15 via the first wire connector 14. Those skilled in the art will appreciate that various methods may be used to electrically interconnect the multiple first capacitor elements 12.

3 shows a process step 118 of enclosing the capacitor 5 with an insulating cover 40. FIG. 13 is an isometric view of the capacitor 5 of FIG. 12 surrounded by an insulating cover 40. FIG. 13A is an enlarged view of FIG. The insulating cover 40 includes an outer insulator 42 and end insulators 44 and 46. Alternatively, insulation cover 40 may be applied in a single insulation by a potting process or the like.

Example 1

First Capacitor Plate Element 12

Material nickel

Initial diameter 0.05 cm

Second Capacitor Plate Element 22

Material copper

Wall thickness 0.025cm

Initial diameter 0.05 cm

Final diameter 0.024cm

Second capacitor plate connector (23)

Material copper

Wall thickness 0.025cm

Initial diameter 0.6cm

Final diameter 0.024cm

Insulator (30)

Material of aluminum oxide fabric

Initial thickness 0.01 cm

Final thickness 0.0001cm

Capacitor (5)

Final Physical Dimensions 0.024cm × 1cm

Number of coaxial capacitors 331

Capacitance 1.4㎌

Example 2

First Capacitor Plate Element 12

Material stainless steel 304L

Initial diameter 0.025cm

Second Capacitor Plate Element 22

Material Nickel Grade 201

Wall thickness 0.025cm

Initial diameter 0.08 cm

Final diameter 0.024cm

Second capacitor plate connector (23)

Material Nickel Grade 201

Wall thickness 0.025cm

Initial diameter 0.9cm

Final diameter 0.024cm

Insulator (30)

Material sodium silicate

Initial thickness 0.005cm

Final thickness 0.00005cm

Capacitor (5)

Final Physical Dimensions 0.024cm × 1cm

Number of coaxial capacitors 817

Capacitance 2.5㎌

14 is a block diagram illustrating a second process 210 for manufacturing a capacitor. The improved process 210 of FIG. 14 includes the provision of the first capacitor plate element 12. FIG. 15 is an isometric view of the first capacitor plate element 12 mentioned in FIG. 14, and FIG. 15A is an end view of FIG. Preferably, the first capacitor plate element 12 is in the form of a metal wire having an actual circular cross section formed by the outer diameter 12D.

FIG. 14 shows a process step 211 covering the first capacitor plate element 12 with a gap material 31. FIG. 16 is an isometric view of the spacing material 31 encased in the first capacitor plate element 12 of FIG. 15 and FIG. 16A is an end view of FIG. The spacer material 31 surrounds the first capacitor plate element 12 to have an actual circular cross section formed by the outer diameter 31D.

The process of covering the first capacitor plate element 12 with the spacer material 31 can be accomplished in a variety of ways depending on the desired physical and electrical properties of the capacitor 5. In one example of the invention, the process of covering the first capacitor plate element 12 with the spacing material 31 comprises placing the first capacitor plate element 12 in a preformed tube 26 made of the spacing material 31. Inserting. Alternatively, the process of covering the first capacitor plate element 12 with the spacer material 31 may include bending the longitudinally extending sheet of spacer material around the first capacitor plate element 12. In another example of the invention, the process of covering the first capacitor plate element 12 with the spacer material 31 includes coating the first capacitor plate element 12 with the spacer material 31. The first capacitor plate element 12 may be coated with a flowable spacer material 30 that is cured on the first capacitor plate element 12. The spacer material 31 is applied to the first capacitor plate element 12 with a thickness of 0.005 cm to 0.05 cm to form the outer diameter 31D. The spacer material 31 is preferably a material having high ductility and chemically different from the first capacitor plate element 12.

FIG. 14 shows a process step 212 of inserting the first capacitor plate element 12 and the spacer material 31 into the second capacitor plate element 22. FIG. 17 is an isometric view of the first capacitor plate element 12 and the spacer material 31 encased in the second capacitor plate element 22 and FIG. 17A is an end view of FIG. The second capacitor plate element 22 is formed by the preform tube 26. The second capacitor plate element 22 surrounds the first capacitor plate element 12 and the spacer material 31 to have an actual circular cross section formed by the outer diameter 22D. The second capacitor plate element 22 is preferably in the form of a continuous metal tube having a different chemical characteristic from that of the first capacitor plate element 12. The step of inserting the first capacitor plate element 12 and the spacer material 31 into the second capacitor plate element 22 is performed by transferring the first capacitor plate element 12 and the spacer material 31 to the second capacitor plate element 22. Inserting within.

Alternatively, the second capacitor plate element 22 may be a longitudinally extending sheet formed around the first capacitor plate element 12 and the spacer material 31 to have an actual circular cross section. In this case, the first capacitor plate element 12 with the spacing material 30 has a longitudinal extension sheet of the second capacitor plate element 22 around the first capacitor plate element 12 and the spacer material 31. It is put in by bending. The second capacitor plate element 22 is preferably in the form of a continuous metal tube having different chemical properties from the spacer material 31.

FIG. 14 shows a second capacitor plate element 22 having a first capacitor plate element 12 and a spacer material 31 therein for reducing its outer diameter 22D and thereby forming the coaxial element 7. Drawing process step 213 is shown.

FIG. 18 is an isometric view after drawing of the first capacitor plate element 12 and the second capacitor plate element 22 having the spacer material 31. Preferably, the drawing process step 213 of the second capacitor plate element 22 includes a second capacitor plate element 12 having the first capacitor plate element 12 and the spacer material 31 therein to reduce the outer diameter 8D. The continuous drawing and unwinding step 22). The drawing step of the second capacitor plate element 22 moves to couple the first capacitor plate element 12 and the second capacitor plate element 22 to both sides of the spacer material 31 to form the coaxial element 7. Let's do it.

FIG. 14 shows a process step 214 of assembling rows 8 formed from multiple coaxial elements 7 in practical parallel form. 19 is an isometric view of multiple coaxial elements 7 assembled in parallel rows 6 and FIG. 19A is an end view of FIG. It is preferred that 500 to 1000 coaxial elements 7 are arranged in an actual parallel form to form parallel rows 6.

14 shows a process step 215 of inserting parallel rows 6 of multiple coaxial elements 7 into a second capacitor plate connector 23. FIG. 20 is an isometric view of a second capacitor plate connector 23 for inserting parallel rows 6 of coaxial elements 7 and FIG. 20A is an end view of FIG. The second capacitor plate connector 23 is preferably in the form of a continuous metal tube 56 having the same chemical properties as the second capacitor plate element 22.

The second capacitor plate connector 23 surrounds the row 6 to have an actual circular cross section formed by the outer diameter 23D. Preferably, inserting the rows 6 of the multiple coaxial elements 7 into the second capacitor plate connector 23 simultaneously inserts the rows 6 of the multiple coaxial elements 7 into the preformed second metal tube. It includes.

Alternatively, the second capacitor plate connector 23 can be a longitudinally extending sheet formed around the rows 6 of the multiple coaxial elements 7 to have an actual circular cross section. In this case, the rows 6 of the multiple coaxial elements 7 are inserted by bending the longitudinally extending sheet of the second capacitor plate connector 23 around the rows 6 of the multiple coaxial elements 7.

FIG. 14 shows the drawing process step 216 of the second capacitor plate connector 23 having a parallel row 6 of coaxial elements 7 therein. FIG. 21 shows a parallel row 6 of coaxial elements 7 for electrically interconnecting the second capacitor plate elements 22 to the second capacitor plate connector 23 to form the second capacitor plate 20. It is an isometric view after drawing out of the 2nd capacitor board connector 23 which has in the. FIG. 21A is an enlarged end view of FIG. By drawing the second capacitor plate connector 23 having the parallel rows 6 of the multiple coaxial elements 7 therein, the outer diameter 23D of the second capacitor plate connector 23 is reduced and the second capacitor plate 20 is reduced. The multiple second capacitor plate elements 22 are electrically interconnected to the second capacitor plate connector 23 so as to form the mold.

The drawing process step 216 of the second capacitor plate connector 23 having a parallel row 6 of coaxial elements 7 therein provides three effects. Firstly, process step 216 reduces the outer diameter 23D of the second capacitor plate connector 23. Secondly, process step 216 reduces the corresponding outer diameter 23D of each of the coaxial elements 7 and the corresponding thickness of the spacer material 31. Thirdly, process step 216 performs diffusion welding of the second capacitor plate elements 22 to the adjacent second capacitor plate element 22 and the second capacitor plate connector 23 to form the second capacitor plate 20. Let's do it.

Diffusion welding of the second capacitor plate elements 22 to the adjacent second capacitor plate element 22 and the second capacitor plate connector 23 will form a single second capacitor plate 20. Multiple first capacitor elements 12 surrounded by the spacer material 31 are embedded in a single second capacitor plate 20.

14 shows a cutting process step 217 of parallel rows 6 of coaxial elements 7. FIG. 22 is an isometric view after cutting the parallel rows 6 of the coaxial element 7 of FIG. 21 into a number of segments 61 to 64. 22A is an enlarged end view of FIG.

The parallel rows 6 of the coaxial element 7 are cut into segments having a length to enable the removal and exchange of the spacer material 31. More specifically, the coaxial element 7 is cut into segments that are long enough to achieve the desired capacitance of the capacitor 5 while being short enough to allow complete removal and replacement of the spacer material 31. . In one example of the invention, the coaxial elements 7 are cut into segments having a length of 1 cm. Process step 217 may include exposing a portion of each of the first capacitor plate elements 12 in parallel rows 6 of coaxial capacitor elements 8.

FIG. 23 is an isometric view after exposing a part of each of the first capacitor plate elements 12 in the parallel row 6 of the coaxial capacitor elements 8. FIG. 23A is an enlarged end view of FIG. In one process of the invention, exposing a portion 60 of each of the first capacitor plate elements 12 in a parallel row 6 of coaxial elements 7 comprises a portion of the second capacitor plate element 22 and Chemically removing a portion of the second capacitor plate connector 23. Preferably, the second capacitor plate element 22 and the second capacitor plate connector 23 are immersed in an acid for disassembling a part of the second capacitor plate element 22 and a part of the second capacitor plate connector 23. .

The second capacitor plate connector 23 has the same chemical properties as the second capacitor plate element 22. Since the second capacitor plate element 22 and the second capacitor plate connector 23 have different chemical properties from those of the first capacitor plate element 12, a part of the second capacitor plate element 22 and the second capacitor plate connector A part of 23 can be chemically removed without removing the first capacitor plate element 12.

FIG. 14 shows a process step 218 of removing the gap material 31 and a process step 219 of replacing the gap material 31 with the dielectric 30. FIG. 24 is an isometric view of complex processes 218 and 219 for removing the spacer material 31 and replacing the spacer material 31 with the dielectric 30. 24A is an enlarged end view of FIG.

The spacer material 31 spaces each of the second capacitor plate elements 22 from each first capacitor plate element 12 in each coaxial element 7. When the spacer material 31 is replaced by the dielectric 30, the dielectric 30 causes each second capacitor plate element 22 to form a respective capacitor element 8 to each first capacitor plate element ( 12). When the spacer material 31 is replaced by the dielectric 30, the parallel rows 6 of the coaxial element 7 deform into parallel rows 6 of the capacitor element 8.

The spacer material 31 may be removed and replaced by the dielectric 30 in two separate different processes or may be combined within a single process. The spacer material 31 is preferably removed and replaced by the dielectric 30 in a chemical or electrochemical process. In one embodiment of the present invention, the spacer material 31 is a metal material selected to be decomposed by an acid that removes the spacer material 31. Subsequently, a chemical compound, such as an oxide, may be formed on one of the first and second capacitor plate elements 12, 22 to mold the dielectric 30.

In one example of the invention, the first capacitor element 12 is made of titanium and the spacer material 31 is formed from copper material coated on the first capacitor element 12. The second capacitor plate element 22 is made of aluminum material. The copper gap material 31 is decomposed in the aluminum anodizing tank by manufacturing the coaxial element 7 anode in the anodizing tank. During the aluminum anodization process, the copper gap material 31 is plated on the stainless steel cathode. The copper gap material 31 is decomposed in the anodizing bath while aluminum oxide is formed on the aluminum second capacitor plate element 22 to form the dielectric 30.

FIG. 14 shows a process step 220 of interconnecting multiple first capacitor plate elements 12 to first capacitor plate connector 13 to form a first capacitor plate 10. In one example of the invention, the step of interconnecting the multiple first capacitor plate elements 12 to the first capacitor plate connector 13 to form the first capacitor plate 10 is parallel to the coaxial capacitor element 8. Interconnecting the exposed portions 60 of each first capacitor plate element 12 in a row 6.

FIG. 25 is an isometric view illustrating the steps of interconnecting multiple first capacitor elements 12 to first capacitor plate connector 13 to form a first capacitor plate 10. 25A is an enlarged view of FIG. In one example of the invention, the exposed portions 60 of each of the multiple first capacitor elements 12 are interconnected to the first capacitor plate connector 13 by a soldering process. The first capacitor plate 10 is connected to the first connecting wire 15 via the first wire connector 14. Alternatively, the exposed portion 60 of each of the multiple first capacitor elements 12 is interconnected to the first capacitor plate connector 13 by a welding process.

FIG. 14 shows a process step 221 of enclosing the capacitor 5 of FIGS. 25 and 25A with an insulating sheath 40. FIG. 26 is an isometric view of the insulating cover 40 of the capacitor 5 of FIG. 25 and FIG. 26A is an enlarged view of FIG. The insulating cover 40 includes an outer insulator 42 and end insulators 44 and 46. Alternatively, the insulation cover 40 may be applied in a single insulation by a potting process or the like.

Example 3

First Capacitor Plate Element 12

Material titanium

Initial diameter 0.25 cm

Final diameter 0.025cm

Second Capacitor Plate Element 22

Material aluminum

Wall thickness 0.07cm

Initial diameter 0.4cm

Final diameter 0.025cm

Second capacitor plate connector (23)

Material aluminum

Wall thickness 0.07cm

Initial diameter 0.4cm

Final diameter 0.025cm

Spacer

Material copper

Thickness 0.0002cm

Insulator (30)

Material aluminum oxide

Thickness 0.000001cm

Capacitor (5)

Final Physical Dimensions 0.025cm × 1cm

Number of coaxial capacitors 300

Capacitance 1.1㎌

FIG. 27 is a block diagram illustrating a third process 310 for manufacturing a capacitor. The improved process 310 of FIG. 27 includes a process step 311 providing a first capacitor plate element 12. FIG. 28 is an isometric view of the first capacitor plate element 12 mentioned in FIG. 27 and FIG. 28A is an end view of FIG. The first capacitor plate element 12 is preferably in the form of a metal wire having an actual circular cross section formed by the outer diameter 12D.

FIG. 27 shows a process step 312 of placing the first capacitor plate element 12 into the second capacitor plate element 22. FIG. 29 is an isometric view of the second capacitor plate element 22 into which the first capacitor plate element 12 is placed and FIG. 29A is an end view of FIG. The second capacitor plate element 22 is formed by the preform tube 26. The second capacitor plate element 22 surrounds the first capacitor plate element 12 to have an actual circular cross section formed by the outer diameter 22D. The second capacitor plate element 22 is preferably in the form of a continuous metal tube having different chemical properties from the first capacitor plate element 12. The step of inserting the first capacitor plate element 12 into the second capacitor plate element 22 includes inserting the first capacitor plate element 12 into the second capacitor plate element 22.

Alternatively, the second capacitor plate element 22 may be a longitudinally extending sheet formed around the first capacitor plate element 12 to have an actual circular cross section. In this case, the first capacitor plate element 12 is inserted by bending the longitudinally extending sheet of the second capacitor plate element 22 around the first capacitor plate element 12. The second capacitor plate element 22 is preferably in the form of a continuous metal tube having a chemical property different from that of the first capacitor plate element 12.

A second important aspect of this embodiment of the present invention is to select the first capacitor plate 12 that is sensitive to permeate gas to form the dielectric 30. A second important aspect of this embodiment of the present invention is the selection of the second capacitor plate element 22 to have high gas permeability. For example, it is well known that silver has high oxygen permeability. U.S. Patent 5,472,527, issued on December 5, 1995 and entitled "High Pressure Oxidation of Precursor Alloys," discloses oxygen permeability of silver.

Figure 27 shows the drawing process step 313 of the second capacitor plate element 22 together with the first capacitor plate element 12 to reduce the outer diameter 22D and thereby form the coaxial element 7. will be.

30 is an isometric view after drawing out of the second capacitor plate element 22 together with the first capacitor plate element 12. 30A is an enlarged end view of FIG. 30; Preferably, the drawing process step 313 of the second capacitor plate element 22 is performed together with the first capacitor plate element 12 together with the first capacitor plate element 22 to reduce the outer diameter 7D of the coaxial element 7. Successive drawing and unwinding steps. Due to the drawing of the second capacitor plate element 22, the second capacitor plate element 22 is moved to engage the first capacitor plate element 12 to form the coaxial element 7.

Figure 27 shows a process step 314 of assembling the rows 8 formed from the multiple coaxial elements 7 in a substantially parallel form. FIG. 31 is an isometric view of multiple coaxial elements 7 assembled in parallel rows 6 and FIG. 31A is an end view of FIG. It is preferable to arrange 500 to 1000 coaxial elements 7 in a substantially parallel form to form parallel rows 6.

FIG. 27 shows a process step 315 of inserting parallel rows 6 of multiple coaxial elements 7 into a second capacitor plate connector 23. 32 is an isometric view of a second capacitor plate connector 23 for inserting parallel rows 6 of coaxial elements 7 and FIG. 32A is an end view of FIG. The second capacitor plate connector 23 is preferably in the form of a continuous metal tube having the same chemical properties as the second capacitor plate element 22. The second capacitor plate connector 23 surrounds the row 6 to have an actual circular cross section formed by the outer diameter 23D. Preferably, the step of inserting the rows 6 of the multiple coaxial elements 7 into the second capacitor plate connector 23 simultaneously inserts the rows 6 of the multiple coaxial elements 7 into the preformed second metal tube. Steps.

Alternatively, the second capacitor plate connector 23 can be a longitudinally extending sheet formed around the rows 6 of the multiple coaxial elements 7 to have an actual circular cross section. In this case, the rows 6 of the multiple coaxial elements 7 are inserted by bending the longitudinally extending sheet of the second capacitor plate connector 23 around the rows 6 of the multiple coaxial elements 7.

FIG. 27 shows the drawing process step 316 of the second capacitor plate connector 23 having a parallel row 6 of coaxial elements 7 therein. 33 shows a parallel row 6 of coaxial elements 7 for electrically interconnecting the second capacitor plate elements 22 to the second capacitor plate connector 23 to form the second capacitor plate 20. It is an isometric view after drawing out of the 2nd capacitor board connector 23 which has in the. 33A is an enlarged end view of FIG. The drawing of the second capacitor plate connector 23 having the parallel row 6 of multiple coaxial elements 7 therein makes it possible to reduce the outer diameter 23D of the second capacitor plate connector 23 and to reduce the second capacitor plate. Multiple second capacitor plate elements 22 are electrically interconnected to the second capacitor plate connector 23 to form 20. The drawing process step 316 of the second capacitor plate connector 23 having a parallel row 6 of coaxial elements 7 therein provides three effects as described above.

FIG. 27 shows the cutting process step 317 of the parallel rows 6 of the coaxial element 7. FIG. 34 is an isometric view after cutting the parallel rows 6 of the coaxial element 7 of FIG. 22 into a number of segments 61 to 64. 34A is an enlarged end view of FIG.

The parallel rows 6 of the coaxial element 7 are cut into segments having a length to enable the molding of the dielectric 30 between the respective first and second capacitor plates 12, 22. More specifically, the coaxial element 7 is cut into segments having a length short enough to allow gas to penetrate into the parallel rows 6 of the coaxial element 7 to enable molding of the dielectric 30. . In addition, the coaxial element 7 is cut into segments having a length large enough to obtain a predetermined capacitance of the capacitor 5. In one example of the invention, the coaxial elements 7 are cut into segments having a length of 1 cm. Process step 317 may include exposing a portion of each of the first capacitor plate elements 12 in parallel rows 6 of coaxial capacitor elements 8.

35 is an isometric view after exposing a portion 60 of each of the first capacitor plate elements 12 in a parallel row 6 of coaxial capacitor elements 8. 35A is an enlarged end view of FIG. 35. FIG. In one process of the invention, the process of exposing a portion 60 of each of the first capacitor plate elements 12 in the parallel row 6 of the coaxial element 7 comprises a portion of the second capacitor plate element 22 and Chemically removing a portion of the second capacitor plate connector 23. Preferably, the second capacitor plate element 22 and the second capacitor plate connector 23 are immersed in an acid for disassembling a part of the second capacitor plate element 22 and a part of the second capacitor plate connector 23. .

The second capacitor plate connector 23 has the same chemical properties as the second capacitor plate element 22. Since the second capacitor plate element 22 and the second capacitor plate connector 23 have different chemical properties from those of the first capacitor plate element 12, a part of the second capacitor plate element 22 and the second capacitor plate connector A part of 23 can be chemically removed without removing the first capacitor plate element 12.

FIG. 27 shows a process step 318 of forming a dielectric 30 between each of the first and second capacitor plate elements 12, 22 in each coaxial element 7. FIG. 36 is an isometric view of process step 318 for forming dielectric 30 between each of first and second capacitor plate elements 12, 22. FIG. 36A is an enlarged end view of FIG. 36;

The forming process step 318 of the dielectric 30 includes passing gas through the second capacitor plate element 22 and the second capacitor plate connector 23. The gas passes through the second capacitor plate element 22 and the second capacitor plate connector 23 to react with the first capacitor plate 12 to form the dielectric 30. When the dielectric 30 is formed, the parallel rows 6 of the coaxial element 7 deform into parallel rows 6 of the capacitor element 8.

FIG. 37 is an enlarged view of a portion of FIG. 36A before forming the dielectric 30. FIG. The first capacitor plate 12 is coupled to the second capacitor plate element 22. The first capacitor plate 12 is selected to react with the permeate gas to form the dielectric 30. The second capacitor plate element 22 and the second capacitor plate connector 23 are selected to have high gas permeability.

FIG. 37A is an enlarged view similar to FIG. 37 after forming the dielectric 30. FIG. The gas penetrates through the second capacitor plate element 22 and the second capacitor plate connector 23 to react with the first capacitor plate 12. The reaction of the first capacitor plate 12 and the gas forms a dielectric 30 between the first capacitor plate 12 and the second capacitor plate element 22.

In one example of the present invention, oxygen passes through the second capacitor plate element 22 and the second capacitor plate connector 23 to oxidize the surface of the first capacitor plate 12. The oxidized surface of the first plate 12 will form an oxide layer to produce the dielectric 30.

When dielectric 30 is formed between first capacitor plate 12 and second capacitor plate element 22, dielectric 30 forms each second capacitor plate element to shape respective coaxial capacitor elements 8. (22) is spaced apart from each first capacitor plate element (12).

In one example of the invention, the first capacitor element 12 is made of titanium (Ti). The second capacitor plate element 22 and the second capacitor plate connector 23 are made of silver. Oxygen gas transmitted through the second capacitor plate element 22 and the second capacitor plate connector 23 made of silver forms titanium 2 on the first capacitor element 12 made of titanium to form the dielectric 30. An oxide (TiO ₂ ) layer is formed.

In another example of the invention, the first capacitor element 12 is made of aluminum. The second capacitor plate element 22 and the second capacitor plate connector 23 are made of silver. Oxygen gas transmitted through the second capacitor plate element 22 and the second capacitor plate connector 23 made of silver is aluminum oxide on the first capacitor element 12 made of aluminum to form the dielectric 30. The (AlO) layer is formed.

FIG. 27 shows a process step 320 of interconnecting multiple first capacitor elements 12 to first capacitor plate connector 13 to form a first capacitor plate 10. Process step 320 is similar to process step 220 described above with reference to FIGS. 25 and 25A.

FIG. 27 shows a process step 321 of enclosing the capacitor 5 of FIGS. 36 and 36A with an insulating sheath 40. Process step 321 is similar to process step 221 described above with reference to FIGS. 26 and 26A.

Example 4

First Capacitor Plate Element 12

Material aluminum

Initial diameter 0.25 cm

Final diameter 0.025cm

Second Capacitor Plate Element 22

Material silver

Wall thickness 0.025cm

Initial diameter 0.3cm

Final diameter 0.025cm

Second capacitor plate connector (23)

Material silver

Wall thickness 0.025cm

Initial diameter 0.3cm

Final diameter 0.025cm

Insulator (30)

Material aluminum oxide

Thickness 0.000001cm

Capacitor (5)

Final Physical Dimensions 0.025cm × 1cm

Number of coaxial capacitors 300

Capacitance 2.0㎌

The invention is intended to include the contents of the appended claims as well as the preceding description. Although the present invention has been described in any particular preferred form, the teachings of the preferred form of the invention have been made by way of example only and numerous modifications of the details of construction, combination and arrangement of parts have been departed from the spirit and scope of the invention. It will be appreciated that it can be done without.

Claims (29)

A row of multiple capacitor elements, Each of the multiple capacitor plate elements comprising a first capacitor plate element surrounded by a second capacitor plate element and having a dielectric interposed therebetween, A first capacitor plate connector interconnecting each of the first capacitor plate elements of the multiple capacitor elements to form a first capacitor plate; And a second capacitor plate connector interconnecting each of the second capacitor plate elements of the multiple capacitor elements to form a second capacitor plate. The capacitor of claim 1, wherein each of the first capacitor plate elements comprises a metal wire having a circular cross section. The capacitor of claim 1 wherein the dielectric comprises an oxide on each of the first capacitor plate elements. The capacitor of claim 1 wherein the dielectric comprises a coating disposed on each of the first capacitor plate elements. 2. The capacitor of claim 1 wherein each second capacitor plate element comprises a continuous metal tube and a dielectric disposed around each of the first capacitor plate elements. 2. The apparatus of claim 1, wherein the first capacitor plate connector includes respective first capacitor plate elements having exposed portions, wherein the first capacitor plate connector each of each of the plurality of first capacitor elements to form a first capacitor plate. A capacitor, characterized in that to interconnect the exposed portion of the. 2. The capacitor of claim 1 wherein the second capacitor plate connector comprises multiple capacitor elements disposed in and in electrical contact with the second metal tube. 2. The capacitor of claim 1 including an insulation cover surrounding the capacitor to insulate the capacitor from the surroundings. Providing a first capacitor plate element, Covering the first capacitor plate element with a gap material; Inserting the first capacitor plate element and the spacer material into the second capacitor plate element, A drawing step of the second capacitor plate element having the first capacitor plate element and the spacer material therein to reduce the outer diameter and to form the capacitor element, Inserting the multiple capacitor elements into the second capacitor plate connector, Drawing out of a second capacitor plate connector having multiple capacitor elements therein to reduce its outer diameter to form a second capacitor plate and electrically interconnect the multiple second capacitor plate elements to the second capacitor plate connector; Interconnecting the multiple first capacitor elements to the first capacitor plate connector to form the first capacitor plate. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material comprises forming an insulating oxide on the first capacitor plate element. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material comprises coating the first capacitor plate element with a dielectric. 10. The method of claim 9, wherein placing the first capacitor plate element and the spacing material into the second capacitor element comprises placing the first capacitor plate element and the spacing material into the preformed first metal tube. Manufacturing method. 10. The method of claim 9, wherein the step of placing the first capacitor plate element and the spacer material into the second capacitor element comprises forming a continuous tube and the spacer material around the first capacitor plate element. . 10. The method of claim 9 including enclosing the spacer material with a metal foil material. 10. The method of claim 9, wherein inserting the multiple capacitor elements into the second capacitor plate connector comprises inserting the multiple capacitor elements into a second preformed metal tube. 10. The method of claim 9, wherein inserting the multiple capacitor elements into the second capacitor plate connector comprises forming a continuous tube around the multiple capacitor elements. 10. The method of claim 9, wherein the drawing step of the second capacitor plate connector for electrically interconnecting multiple second capacitor plate elements to the second capacitor plate connector comprises forming the second capacitor plate elements to form a single material. Drawing a second capacitor plate connector to diffusion weld to the connector. 10. The method of claim 9, wherein interconnecting the multiple first capacitor elements to the first capacitor plate connector to form a first capacitor plate comprises exposing a portion of each of the first capacitor plate elements in a row of capacitor elements; Interconnecting each exposed portion of the first capacitor elements to the first capacitor plate connector. 10. The method of claim 9, wherein interconnecting the multiple first capacitor elements to the first capacitor plate connector to form the first capacitor plate comprises: removing the capacitor by chemically removing the second capacitor plate elements and a portion of the second capacitor plate connector. Exposing a portion of each of the first capacitor plate elements in a row of elements and interconnecting each exposed portion of the multiple first capacitor elements to the first capacitor plate connector. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material comprises selecting a spacer material suitable for conversion to a dielectric. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material comprises forming an oxide on the spacer material to provide a capacitor dielectric between each of the first and second capacitor plate elements to each of the multiple capacitor elements. Method of manufacturing a capacitor comprising a. 10. The method of claim 9, wherein covering the first capacitor plate element with a gap material comprises selecting one of the first and second capacitor plate elements to permeate oxygen, and between the first and second capacitor plate elements. Forming an oxide on the spacer material to provide a capacitor dielectric to each of the multiple capacitor elements. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material comprises selecting a spacer material suitable for replacement by the dielectric. 10. The method of claim 9, wherein covering the first capacitor plate element with the spacer material comprises chemically replacing the spacer material with a dielectric. 10. The method of claim 9, wherein covering the first capacitor plate element with a spacer material selected for forming the capacitor dielectric chemically removes the spacer material from between the first and second capacitor plate elements, and each of the first And chemically forming a dielectric between the second capacitor plate elements. 10. The method of claim 9, wherein removing the spacer material and shaping the insulator simultaneously chemically remove the spacer material to provide a capacitor dielectric between each of the first and second capacitor plate elements to each of the multiple capacitor elements. And forming an oxide on one of the first and second capacitor plate elements of each of the multiple capacitor elements. Providing a first capacitor plate element, Inserting the first capacitor plate element into the second capacitor plate element, A drawing step of the second capacitor plate element having the first capacitor plate element therein to reduce the outer diameter and to form the capacitor element, Inserting the multiple capacitor elements into the second capacitor plate connector, Drawing out of a second capacitor plate connector having multiple capacitor elements therein to reduce its outer diameter to form a second capacitor plate and electrically interconnect the multiple second capacitor plate elements to the second capacitor plate connector; Forming a dielectric between each of the first and second capacitor plates; Interconnecting the multiple first capacitor elements to the first capacitor plate connector to form the first capacitor plate. 29. The method of claim 27, wherein forming a dielectric between each of the first and second capacitor plates comprises providing a capacitor dielectric between the first and second capacitor plate elements to each of the multiple capacitor elements. Forming an oxide on one of the first and second capacitor plate elements, respectively. 28. The device of claim 27, wherein one of the first and second capacitor plate elements is selected to infiltrate oxygen, and wherein the first and second capacitor plate elements are provided with a capacitor dielectric between each of the first and second capacitor plate elements. And forming an oxide on one of the second capacitor plate elements.