KR20010010129A - Equipment for washing of semiconducting chip package - Google Patents
Equipment for washing of semiconducting chip package Download PDFInfo
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- KR20010010129A KR20010010129A KR1019990028845A KR19990028845A KR20010010129A KR 20010010129 A KR20010010129 A KR 20010010129A KR 1019990028845 A KR1019990028845 A KR 1019990028845A KR 19990028845 A KR19990028845 A KR 19990028845A KR 20010010129 A KR20010010129 A KR 20010010129A
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- pure water
- semiconductor chip
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- chip package
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
본 발명은 반도체 칩 패키지의 세정설비에 관한 것으로, 더욱 상세하게는 볼 그리드 어레이 패키지로부터 플럭스를 제거하는 세정설비를 개조하여 볼 그리드 어레이 패키지와 세정설비가 직접적으로 접촉되는 것을 방지한 반도체 칩 패키지의 세정설비에 관한 것이다.The present invention relates to a cleaning device for a semiconductor chip package, and more particularly, to a semiconductor chip package in which the ball grid array package and the cleaning device are prevented from directly contacting by modifying the cleaning device for removing flux from the ball grid array package. It relates to a washing facility.
최근, 전자·정보기기의 메모리용량이 대용량화되어 감에 따라 DRAM 및 SRAM과 같은 반도체 칩이 고집적화되면서 반도체 칩의 사이즈가 점점 커지고 있다. 그럼에도 불구하고, 전자·정보기기의 소형화, 경량화에 추세에 따라 반도체 칩을 포장하는 패키지 기술은 경박단소화 및 고신뢰성이 요구되고 있는 실정이다.In recent years, as the memory capacity of electronic and information devices has increased, semiconductor chips such as DRAM and SRAM have been highly integrated, and the size of semiconductor chips has increased. Nevertheless, the package technology for packaging semiconductor chips is required to be light and small in size and high reliability in accordance with the trend toward miniaturization and light weight of electronic and information devices.
또한, 전자·정보기기의 고기능화에 따라 반도체 칩 패키지의 하이핀(high pin)화가 진행되면서, 최근에는 제조 원가가 낮고 반도체 칩의 크기의 120％에 근접하는 볼 그리드 어레이(Ball Grid Array; 이하 "BGA"라 함) 패키지가 개발되고 있다.In addition, as high pins of semiconductor chip packages have been developed in accordance with high functionalization of electronic and information devices, in recent years, a manufacturing cost is low and a ball grid array having a size close to 120% of the size of a semiconductor chip has been described. BGA "package is being developed.
이러한, BGA 패키지의 제조방법을 간단히 설명하면, 접착제를 개재하여 소정의 기판, 예를 들어 테이프의 일면에 반도체 칩을 부착하고, 캐필러리를 이용하여 테이프에 형성된 빔리드들과 본딩패드들을 열압착하여 반도체 칩과 테이프를 전기적으로 연결시킨다.In brief, the manufacturing method of the BGA package, a semiconductor chip is attached to a surface of a predetermined substrate, for example, a tape through an adhesive, and the beam leads and the bonding pads formed on the tape are opened using a capillary. It is compressed to electrically connect the semiconductor chip and the tape.
이후, 반도체 칩의 상부면이 외부로 노출되도록 반도체 칩의 상부면 가장자리에서부터 측면을 따라 테이프의 소정부분까지 에폭시 몰딩 컴파운드 수지로 봉지하여 반도체 칩을 외부환경으로부터 보호한다.Thereafter, the semiconductor chip is encapsulated with an epoxy molding compound resin from the edge of the upper surface of the semiconductor chip to a predetermined portion of the tape along the side surface so that the upper surface of the semiconductor chip is exposed to the outside, thereby protecting the semiconductor chip from the external environment.
이와 같이 에폭시 몰딩 컴파운드 수지에 의해 BGA 패키지의 외관이 형성되면, 플럭스 도팅 장치를 이용하여 점도가 있는 플럭스 액체를 솔더볼 패드들 각각에 도팅시키고, 플럭스가 도팅된 솔더볼 패드들의 상부면에 솔더볼들을 안착시킨다.When the appearance of the BGA package is formed by the epoxy molding compound resin, a viscous fluxing device is used to dope a viscous flux liquid to each of the solder ball pads, and the solder balls are seated on the upper surfaces of the flux-doped solder ball pads. .
이어, 리플로우(reflow)공정을 진행하여 솔더볼 패드와 솔더볼들을 완전히 접속시킨다.Next, a reflow process is performed to completely connect the solder ball pads and the solder balls.
상술한 공정이 완료되면 BGA 패키지는 스프로킷 휘일, 스프로킷 휘일에 감겨져 회전하며 BGA 패키지가 놓여지는 그물모양의 메쉬벨트, 메쉬벨트의 상부면과 하부면에 설치되어 순수를 공급하는 순수 공급관 및 순수 공급관에 연통되어 메쉬벨트에 놓인 BGA 패키지로 순수를 분사하는 분사노즐로 구성된 세정설비로 이송된다.When the above-described process is completed, the BGA package is wound around the sprocket wheel, the sprocket wheel, and rotated. It is communicated with the BGA package placed on the mesh belt and transferred to a cleaning facility composed of injection nozzles for spraying pure water.
BGA 패키지가 메쉬벨트에 놓이면 메쉬벨트의 상부면과 하부면에 설치된 분사노즐로부터 순수가 분사되고, 분사된 순수는 구멍이 뚫린 메쉬벨트를 통과해 BGA 패키지의 솔더볼에 묻어 있는 플럭스를 깨끗이 씻어 낸다.When the BGA package is placed on the mesh belt, pure water is sprayed from the spray nozzles installed on the upper and lower surfaces of the mesh belt, and the sprayed pure water passes through the perforated mesh belt to clean the flux on the solder ball of the BGA package.
그러나, 플럭스를 제거하는 공정에서 BGA 패키지의 반도체 칩이 금속재질의 메쉬벨트와 직접적으로 닿아 있어 메쉬벨트에 충격 또는 진동이 가해질 경우 BGA 패키지와 메쉬벨트의 마찰하여 몰딩물의 외부로 노출된 반도체 칩이 손상되거나 크랙이 발생된다.However, in the process of removing the flux, when the semiconductor chip of the BGA package is in direct contact with the metal mesh belt, when the shock or vibration is applied to the mesh belt, the semiconductor chip exposed to the outside of the molding by friction between the BGA package and the mesh belt is Damaged or cracked.
또한, 순수의 분사압력이 높기 때문에 BGA 패키지가 순수의 압력에 의해 상승 또는 하강하면서 세정공정이 진행되는 동안 계속적으로 메쉬벨트와 부딪침으로써 메쉬벨트와 직접 접촉되고 몰딩물의 외부로 노출되어 충격에 취약한 반도체 칩에 크랙이 발생되거나 파손되는 문제점이 발생된다.In addition, because the spray pressure of pure water is high, the BGA package is continuously raised or lowered by the pressure of pure water and continuously hits the mesh belt during the cleaning process, thereby directly contacting the mesh belt and exposed to the outside of the molding, thereby being susceptible to shocks. There is a problem of cracking or breaking the chip.
따라서, 본 발명의 목적은 상기와 같은 문제점을 감안하여 안출된 것으로써, 플럭스를 제거하는 세정공정 도중에 BGA 패키지와 이송장치가 접촉되어 충격이나 마찰로 인해 반도체 칩이 손상되는 것을 방지하는데 있다.Accordingly, an object of the present invention is to conceive in view of the above problems, to prevent damage to the semiconductor chip due to impact or friction due to contact between the BGA package and the transfer device during the cleaning process to remove the flux.
본 발명의 다른 목적은 다음의 상세한 설명과 첨부된 도면으로부터 보다 명확해 질 것이다.Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.
도 1은 본 발명에 의한 세정설비의 구조를 나타낸 사시도.1 is a perspective view showing the structure of the cleaning equipment according to the present invention.
도 2는 도 1을 Ⅱ-Ⅱ선으로 절단한 단면도.FIG. 2 is a cross-sectional view of FIG. 1 taken along line II-II.
도 3은 본 발명에 의한 분사노즐의 분사구를 도시한 사시도.Figure 3 is a perspective view of the injection port of the jet nozzle according to the present invention.
이와 같은 목적을 달성하기 위해서 본 발명은 서로 대향되도록 설치되며 몸체와 몸체의 상부면에 형성되어 반도체 칩 패키지가 형성된 베이스 기판의 양단을 잡아주는 가이드 레일로 구성된 2개의 가이드부, 가이드부의 하부에 설치되어 베이스 기판을 소정 장소까지 이송시켜주는 이송장치 및 가이드부들 사이에 설치되며 가이드부를 중심으로 상부와 하부에 소정형상으로 배열되는 순수공급관과 순수공급관에 연통되며 반도체 칩 패키지에 묻어 있는 소정의 이물질을 제거하기 위해 순수를 분사하는 분사노즐로 구성된 순수 공급부로 구성된다.In order to achieve the above object, the present invention is installed to face each other and is formed on the body and the upper surface of the two guide parts consisting of guide rails that hold both ends of the base substrate on which the semiconductor chip package is formed, the lower part of the guide part It is installed between the transfer device and the guide parts for transferring the base substrate to a predetermined place, and communicates with the pure water supply pipe and the pure water supply pipe arranged in a predetermined shape at the top and the bottom with respect to the guide part, and removes any foreign matter from the semiconductor chip package. It consists of a pure water supply consisting of a spray nozzle for injecting pure water to remove.
바람직하게, 분사노즐들에 형성된 분사구는 적은 압력으로도 많은 양의 순수가 분사되도록 십자모양으로 형성된다.Preferably, the injection hole formed in the injection nozzles is formed in a cross shape so that a large amount of pure water is injected even at a low pressure.
일예로, 이송장치는 몸체의 길이방향 일단에 회전축에 의해 고정되고 회전축에는 구동모터가 설치되어 소정방향으로 회전하는 구동 롤러, 몸체의 길이방향 타단에 회전축에 의해 고정되고 소정의 연결 매개체에 의해 상기 구동롤러와 함께 회전하는 피동롤러, 구동롤러와 피동롤러의 외주면에 소정의 인장력을 가지고 걸쳐져 피동롤러를 회전시키는 벨트 및 벨트의 상부면에 서로 소정간격 이격되어 복수개 형성되고 벨트의 표면으로부터 베이스 기판이 놓여지는 위치까지 돌출되어 벨트의 회전방향으로 베이스 기판을 이송시켜 주는 이송핀들로 구성된다.For example, the conveying apparatus is fixed by a rotating shaft at one end in the longitudinal direction of the body and a driving motor is installed on the rotating shaft to be rotated in a predetermined direction, and is fixed by the rotating shaft at the other end of the body in the longitudinal direction, and the predetermined connecting medium is connected by the predetermined means. A plurality of driven rollers that rotate together with the drive rollers, the belts that rotate the driven rollers with a predetermined tensile force on the outer circumferential surfaces of the drive rollers and the driven rollers, and are spaced apart from each other by a predetermined distance from each other are formed at a predetermined distance from each other. Consists of the transfer pin to project to the position to move the base substrate in the rotational direction of the belt.
이하, 본 발명에 의한 반도체 칩 패키지의 세정설비의 구조를 첨부된 도면 도 1 내지 도 3을 참조하여 설명하면 다음과 같다.Hereinafter, the structure of the cleaning equipment for a semiconductor chip package according to the present invention will be described with reference to FIGS. 1 to 3.
도 1에 도시된 바와 같이 소정길이를 갖는 스트립 형태로 길이가 긴 테이프(10)에 복수개, 예를 들어 약 10개정도의 BGA 패키지들(20)이 형성되고, 테이프(10)의 가장자리에는 얇은 테이프(10)가 공정을 진행하는 동안 휘어지는 것을 방지하기 위한 금속재질의 프레임(30)이 접착제(35)에 의해 접착된다.As shown in FIG. 1, a plurality of BGA packages 20 are formed on a long tape 10 in a strip shape having a predetermined length, for example, about 10, and a thin edge is formed on the edge of the tape 10. The metal frame 30 is adhered by the adhesive 35 to prevent the tape 10 from bending during the process.
여기서, 스트립 형태의 테이프(10)에 형성된 각각의 BGA 패키지(20)는 도 2에 도시된 바와 같이 접착제를 개재하여 테이프(10)에 접착되고 빔리드(도시 안됨)와 본딩되는 반도체 칩(22), 반도체 칩(22)을 외부환경으로부터 보호하기 위해 반도체 칩(22)의 상부면 가장자리에서부터 측면을 따라 테이프(10) 소정부분까지 감싸는 몰딩물(24) 및 테이프(10) 중 반도체 칩(22)이 부착되지 않은 면에 형성된 솔더볼 패드(도시 안됨)에 접속되는 솔더볼들(26)을 포함한다.Here, each BGA package 20 formed on the tape 10 in the form of a strip is bonded to the tape 10 via an adhesive and bonded with a beam lead (not shown) as shown in FIG. 2. In order to protect the semiconductor chip 22 from the external environment, the moldings 24 and the semiconductor chip 22 of the tape 10 which wrap up from the edge of the upper surface of the semiconductor chip 22 to a predetermined portion of the tape 10 along the side surface thereof. The solder ball 26 is connected to a solder ball pad (not shown) formed on a surface to which is attached.
이와 같이 형성된 BGA 패키지(20)에서 솔더볼(26)에 묻어 있는 플럭스를 제거하는 세정설비(100)는 도 1에 도시된 바와 같이 테이프(10)의 길이방향 양단에 부착된 프레임(30)을 잡아주는 가이드부(110), 가이드부(110)의 하부면에 설치되어 테이프(10)를 소정 장소로 이송시켜주는 이송장치(130) 및 가이드부(110)를 중심으로 가이드부(110)의 상부와 하부에 각각 형성되어 플럭스를 제거하기 위한 순수(185)를 공급, 분사하는 순수 공급부(160)를 포함한다.The cleaning apparatus 100 for removing the flux from the solder ball 26 in the BGA package 20 formed as described above, holds the frame 30 attached to both ends of the tape 10 in the longitudinal direction as shown in FIG. 1. The upper part of the guide part 110 is mainly provided on the guide part 110 and the lower part of the guide part 110 to transfer the tape 10 to a predetermined place. And a pure water supply unit 160 formed at each of the lower portions and supplying and spraying the pure water 185 for removing the flux.
상술한 각 부재들 중 가이드부(110)는 테이프(10)의 길이방향 양단에 부착된 프레임(30)을 잡기 위해 서로 대향하여 2개가 형성되며, 각 가이드부들(110)은 몸체(115)와, 몸체(115)의 상부면에 "ㄷ"자 형성상의 홈이 형성되어 프레임(30)이 끼워져 지지되는 가이드 레일(120)로 구성된다.Of the above-described members, two guide parts 110 are formed to face each other in order to hold the frame 30 attached to both ends of the tape 10 in the longitudinal direction, and each guide part 110 is formed of the body 115. , The upper surface of the body 115 is formed with a "c" shaped groove is formed of a guide rail 120 is supported by the frame 30 is fitted.
또한, 이송장치(130)는 2개의 가이드부들(110) 중 어느 하나의 가이드부(110)의 몸체(115) 내측면에 설치된다.In addition, the transfer device 130 is installed on the inner surface of the body 115 of any one of the guide portion 110 of the two guide portion (110).
이송장치(130)는 몸체(115)의 길이방향 일단에 회전축(143)에 의해 고정되고 회전축(143)의 일단에는 구동모터(도시 안됨)가 설치되어 있어 소정방향으로 회전하는 구동 롤러(140), 구동롤러(140)와 마주보는 몸체(110)의 길이방향 타단에 회전축(147)에 의해 고정되며 소정의 연결 매개체에 의해 구동롤러(140)가 회전하는 방향으로 같이 회전하는 피동롤러(145), 구동롤러(140)와 피동롤러(145)의 외주면에 소정의 인장력을 가지고 걸쳐져 피동롤러(145)를 회전시키는 매개체로 사용되는 벨트(150) 및 벨트(150)의 상부면에 서로 소정간격 이격되어 복수개 형성되고 벨트(150)의 표면으로부터 테이프(10)가 놓여지는 위치까지 돌출되어 벨트(150)의 회전방향으로 테이프(10)를 이송시키는 이송핀들(155)로 구성된다.The conveying apparatus 130 is fixed by the rotation shaft 143 at one end in the longitudinal direction of the body 115 and a driving motor (not shown) is installed at one end of the rotation shaft 143 to rotate in a predetermined direction. The driven roller 145 is fixed to the other end in the longitudinal direction of the body 110 facing the driving roller 140 by the rotating shaft 147 and rotates together in the direction in which the driving roller 140 rotates by a predetermined connecting medium. The belt 150 and the belt 150 which are used as a medium for rotating the driven roller 145 by being applied to the outer circumferential surfaces of the driving roller 140 and the driven roller 145 are spaced apart from each other by a predetermined distance. And a plurality of feed pins 155 are formed to protrude from the surface of the belt 150 to the position where the tape 10 is placed to transfer the tape 10 in the rotational direction of the belt 150.
한편, 순수 공급부(160)는 가이드부들(110) 사이의 바닥면과 가이드부(110)의 상부에 소정형상으로 배열된 순순 공급배관(165)과, 순수 공급관(165)과 연통되어 테이프(10) 쪽으로 순수를 분사하는 분사노즐들(170,170a)로 구성된다.On the other hand, the pure water supply unit 160 is in communication with the pure water supply pipe 165 and the pure water supply pipe 165 arranged in a predetermined shape on the bottom surface between the guide portion 110 and the upper portion of the guide 110, the tape 10 It is composed of injection nozzles (170, 170a) for spraying pure water toward the ().
여기서, 가이드부(110)의 상부면에 설치된 분사노즐들(170a)과 하부면에 설치된 분사노즐들(170)은 도 2에 도시된 바와 같이 서로 엇갈리게 형성되며, 분사노즐(170,170a)에 형성된 분사구(175)는 적은 압력으로도 많은 양의 순수가 분사될 수 있도록 도 3에 도시된 바와 같이 십자모양으로 형성된다.Here, the injection nozzles 170a installed on the upper surface of the guide part 110 and the injection nozzles 170 installed on the lower surface are formed to be alternately formed as shown in FIG. 2 and formed on the injection nozzles 170 and 170a. The injection hole 175 is formed in a cross shape as shown in Figure 3 so that a large amount of pure water can be injected even at a low pressure.
이와 같이 구성된 세정설비를 이용하여 BGA 패키지의 플럭스 세정과정을 설명하면 다음과 같다.The flux cleaning process of the BGA package using the cleaning equipment configured as described above is as follows.
테이프(10)에 형성된 솔더볼 패드들에 플럭스를 도팅시키고, 솔더볼 패드들 각각에 솔더볼(26)을 안착시킨 후 테이프(10)에 열을 가하여 솔더볼(26)을 녹이므로 솔더볼 패드와 솔더볼(26)을 접속시키는 리플로우 공정이 완료되면, 솔더볼(26)에 묻어 있는 플럭스를 제거하기 위해서 BGA 패키지(20)가 복수개 형성된 테이프(10)를 세정설비(100)로 이송시킨다.The solder ball pads formed on the tape 10 are doped with flux, the solder ball 26 is seated on each of the solder ball pads, and the heat is applied to the tape 10 to melt the solder ball 26. When the reflow process of connecting the PGA is completed, the tape 10 having the plurality of BGA packages 20 formed thereon is transferred to the cleaning facility 100 in order to remove the flux from the solder balls 26.
여기서, 플럭스는 점성이 있어 솔더볼 패드들과 솔더볼(26)을 접착시키고, 솔더볼들(26)의 표면장력을 없애고 솔더볼(26)의 표면에 산화막이 형성되는 것을 방지한다.Here, the flux is viscous to bond the solder ball pads to the solder ball 26, to remove the surface tension of the solder balls 26 and to prevent the oxide film from being formed on the surface of the solder ball 26.
GBA 패키지(20)가 복수개 형성된 테이프(10)가 세정설비(100)로 이송되면, 소정설비에 의해서 테이프(10)의 길이방향 양단에 접착된 프레임(30)이 가이드 레일(120)에 삽입된다.When the tape 10 having a plurality of GBA packages 20 formed thereon is transferred to the cleaning facility 100, the frames 30 bonded to both ends of the tape 10 in the longitudinal direction by the predetermined facility are inserted into the guide rail 120. .
이후, 순수 공급관(165)에 순수가 유입되어 분사노즐들(170,175a)로부터 순수(180)가 분사되고, 분사된 순수(180)는 가이드부(110)에 의해 지지되어 있는 테이프(10)에 닿아 솔더볼(26)에 묻어 있는 플럭스를 깨끗이 씻어 낸다.Thereafter, the pure water is introduced into the pure water supply pipe 165, and the pure water 180 is injected from the injection nozzles 170 and 175a, and the injected pure water 180 is supplied to the tape 10 supported by the guide unit 110. Touch and wash off the flux on the solder ball (26).
여기서, 테이프(10)는 가이드 레일(120)에 삽입된 후 한곳에 멈춰 있는 것이 아니라 다음 공정이 진행될 소정의 장소까지 이송되며, 테이프(10)가 이송되는 동안 순수(180)는 계속적으로 분사되어 솔더볼(26)에 묻어 있는 플럭스를 씻어 냄으로써, 테이프(10)가 소정의 장소까지 이동되면 플럭스는 완전히 제거된다.Here, the tape 10 is inserted into the guide rail 120 and is not stopped at one place, but is transferred to a predetermined place where the next process is to proceed. The pure water 180 is continuously sprayed while the tape 10 is transferred to the solder ball. By flushing out the flux on 26, the flux is completely removed when the tape 10 is moved to a predetermined place.
테이프(10)를 다음 공정이 진행될 소정장소까지 이송시키기 위해서 구동롤러(140)의 회전축에 설치된 구동모터가 구동하여 구동롤러(140)를 시계방향으로 회전시키면, 벨트(150) 및 피동롤러(145)도 시계방향으로 회전하게 된다.In order to transfer the tape 10 to a predetermined place where the next process is to proceed, when the driving motor installed on the rotating shaft of the driving roller 140 is driven to rotate the driving roller 140 clockwise, the belt 150 and the driven roller 145 are rotated. ) Will also rotate clockwise.
이때, 벨트(150)의 상부면에 형성되고 단부가 프레임(30)에 접촉된 이송핀(155)이 벨트(150))의 회전에 의해 이동되면서 프레임(30)을 소정방향으로 밀고 나가게 된다. 그러므로 테이프(10)는 이송핀(155)에 의해 소정의 장소까지 이송된다.At this time, the transfer pin 155 formed on the upper surface of the belt 150 and the end is in contact with the frame 30 is moved by the rotation of the belt 150 to push the frame 30 in a predetermined direction. Therefore, the tape 10 is transferred to the predetermined place by the transfer pin 155.
이상에서 설명한 바와 같이 가이드부가 테이프의 양단을 잡아 지지하고 이송장치가 테이프와 접착된 프레임을 밀어 테이프를 이송시키면, 테이프에 형성된 BGA 패키지들과 세정설비가 직접적으로 접촉되지 않음으로써, 몰딩물의 외부로 노출된 반도체 칩이 세정설비에 의해 손상되는 것을 방지할 수 있어 제품의 신뢰성이 향상되는 효과가 있다.As described above, when the guide unit is held by both ends of the tape and the conveying device pushes the frame bonded to the tape to transfer the tape, the BGA packages formed on the tape and the cleaning equipment do not directly contact each other, thereby leaving the molding. The exposed semiconductor chip can be prevented from being damaged by the cleaning facility, thereby improving the reliability of the product.
또한, 분사노즐에서 분사구의 면적이 넓어 낮은 압력으로도 많은 양의 순수를 분사할 수 있어 순수의 분사압력에 의해 반도체 칩이 손상되는 것을 방지할 수 있다.In addition, since the area of the injection hole in the injection nozzle is large, a large amount of pure water can be injected even at a low pressure, thereby preventing the semiconductor chip from being damaged by the pure water injection pressure.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1999-0028845A KR100531681B1 (en) | 1999-07-16 | 1999-07-16 | Equipment for washing of semiconducting chip package |
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-1999-0028845A KR100531681B1 (en) | 1999-07-16 | 1999-07-16 | Equipment for washing of semiconducting chip package |
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| KR20010010129A true KR20010010129A (en) | 2001-02-05 |
| KR100531681B1 KR100531681B1 (en) | 2005-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802661B1 (en) * | 2007-02-15 | 2008-02-13 | 주식회사 탑 엔지니어링 | Tape feeding guider |
| KR100839876B1 (en) * | 2005-09-29 | 2008-06-19 | 아라까와 가가꾸 고교 가부시끼가이샤 | Apparatus and method for cleaning of thin substrate |
| CN112951747A (en) * | 2021-03-21 | 2021-06-11 | 新恒通(江苏)科技有限公司 | Combined appliance of chip burr etching machine |
-
1999
- 1999-07-16 KR KR10-1999-0028845A patent/KR100531681B1/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100839876B1 (en) * | 2005-09-29 | 2008-06-19 | 아라까와 가가꾸 고교 가부시끼가이샤 | Apparatus and method for cleaning of thin substrate |
| KR100802661B1 (en) * | 2007-02-15 | 2008-02-13 | 주식회사 탑 엔지니어링 | Tape feeding guider |
| CN112951747A (en) * | 2021-03-21 | 2021-06-11 | 新恒通(江苏)科技有限公司 | Combined appliance of chip burr etching machine |
| CN112951747B (en) * | 2021-03-21 | 2024-05-14 | 新恒通(江苏)科技有限公司 | Combined device of chip burr etching machine |
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| KR100531681B1 (en) | 2005-11-29 |
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