KR20000066442A - Electronic Parts for PCB and Process Method Thereof - Google Patents

Abstract

PURPOSE: A surface mount electronic component and a method for manufacturing the same are provided to reduce the mounting time by varying a circular plate type lead wire to a flat plate type lead wire. CONSTITUTION: A surface mount electronic component comprises a conductive cap body including a material body and a lead wire(22) arranged at both ends of the material body. The lead wire is formed wholly with a flat plate. A lower portion of the lead wire is formed with a £ shaped and a solder plate. A method for manufacturing the same comprises the steps of: processing a material body and coating a film thereon; adhering a conductive cap body at both ends of the material body and performing a cutting process for indicating a predetermined inductance or resistance value; assembling a lead wire at both ends of the cap body; performing a molding process and a painting process; bending the lead wire to a £ shaped and forming a solder face(24).

Description

Electronic components for PCB and Process Method Thereof

The present invention relates to a surface-mounted electronic component and a method for manufacturing the same, and in particular, the surface-mounted electronic component and its manufacture that can shorten the process and increase the productivity by allowing the soldering directly on the PCB by processing the lead wire flat It is about a method.

In general, electronic components, particularly electronic components such as resistors, diodes, and inductors, have a taping operation to be usefully used in each manufacturing process as shown in FIG. 1, and then move to the next process or are shipped as final products.

These electronic components are subjected to taping operations for easy mounting on a printed circuit board (PCB). Both ends of the electronic component 10 are welded with lead wires 20 to be soldered for conduction. This lead wire 20 is usually called an axial type because it is circular in cross section and welded to the center of the electronic component 10. The lead wire 20 is inserted into a solder hole (not shown) on the PCB. It will be soldered on the back.

On the other hand, a plurality of such electronic components are taped and wound in a roll shape on a supply reel, and are mounted and assembled on a surface mounter (part auto feeder). In FIG. 1, the code | symbol 30 is a tape.

However, in the conventional surface mount type electronic component having such a structure, since the lead wires 20 at both ends of the electronic component 10 have a circular cross section, soldering cannot be performed directly on the substrate. Therefore, a hole is now drilled at the position where the electronic component 10 is to be mounted on each substrate, and the lead wire 20 is passed through the hole and soldered on the back surface of the substrate.

As a result, such a manufacturing process requires a certain level of precision because the lead wire 20 must be inserted into the hole, which is very cumbersome and causes deterioration in actual productivity.

Accordingly, the present invention has been invented to solve the problem in view of the above-described conventional electronic components, and an object thereof is to change the shape of the lead wire into a flat shape so that soldering is possible directly on the substrate. By simplifying the manufacturing process and shortening the manufacturing process, the present invention provides a surface mounted electronic component that has lowered manufacturing cost and increased productivity.

1 is a plan view showing a taping state of a conventional surface-mount electronic component

2 is a perspective view showing a surface mount electronic component according to the present invention.

3 is a front view of FIG. 2

4 is a flowchart illustrating a surface mount electronic component in a molded state according to the present invention.

5 is a front view of FIG. 4

6 is a flow chart showing a manufacturing process of the surface mount electronic component of the present invention.

<Explanation of symbols for main parts in the drawing>

10: electronic component 12: molding material

20,22: lead wire 24: soldered surface

30: tape

Surface-mounted electronic component of the present invention for achieving the above object,

In a surface mount electronic component comprising a conductive cap body having at least a body and lead wires disposed at both ends of the body,

The lead wire is a flat cross section of the whole,

The lower part, which is bent in a 'c' shape, is made of a solder surface.

Moreover, the manufacturing method of the surface mount type electronic component of this invention,

Processing the body into a predetermined shape and depositing a film for conducting;

Attaching a conductive cap body to both ends of the body and cutting to show a predetermined inductance or resistance value;

Assembling lead wires at both ends of the cap body;

Molding and coating the molded electronic component surface showing characteristics or specifications as necessary;

The lead wire is compressed to be deformed into a flat lead wire and bent in a 'c' shape to form a solder surface.

Therefore, by changing the lead wire of the circular cross section into the lead wire of the flat section, the soldering surface can be directly soldered to the PCB when it is mounted on the PCB, thereby saving the mounting time and simplifying the soldering device, thereby reducing the cost of mounting the electronic components. It works.

Next, the surface mount electronic component of the present invention will be described with reference to the accompanying drawings. The same components as those of the conventional description will be described with the same reference numerals so as to avoid confusion in the description. 2 is a perspective view showing a surface mount electronic component according to the present invention, FIG. 3 is a front view of FIG. 2, FIG. 4 is a flow chart showing a surface mount electronic component in a molding state according to the present invention, and FIG. 6 is a flowchart illustrating a manufacturing process of the surface mount electronic component of the present invention.

A feature of the present invention is that the lead wires 20 attached to both ends of the electronic component 10 are formed in a flat cross section. Due to the formation of the flat surface, direct soldering to the substrate can be performed, and a manufacturing process for forming a hole in the substrate can be omitted, thereby improving productivity.

In these figures, reference numeral 22 denotes a lead wire of the present invention with a flat surface. The lead wire 22 is bent into a 'c' shape and has a solder surface 24.

4 and 5, these drawings are molded by the so-called electronic component 10, and are formed by molding components such as a body and a cap with a molding material 12. Also in this molded electronic component 10, the lead wire 22 is bent to form the solder surface 24. FIG.

The manufacturing process of the surface mount electronic component of this invention is demonstrated with reference to FIG. 6 is a flowchart illustrating a manufacturing process of the surface mount electronic component of the present invention.

First, the body is processed into a predetermined shape and a film is formed for conduction. A conductive cap body is attached to both ends of the body, and cut in order to exhibit a predetermined inductance or resistance value, and wires are assembled at both ends of the cap body.

Subsequently, epoxy molding is carried out and, if necessary, painting is performed on the surface of the molded electronic component showing characteristics or specifications.

Subsequently, the lead wire 22, which is a feature of the present invention, is crimped and deformed into a flat lead wire, and the solder wire 24 is formed by bending a 'C' shape with a predetermined bending device.

In the surface mount type electronic component of the present invention completed through such a manufacturing process, since the lead wire 22 has a solder surface 24, when the solder surface 24 itself is mounted on the substrate, the solder surface of the substrate is soldered. Soldered directly on the site.

Therefore, the hassle of forming a hole in the substrate and passing the circular lead wire 20 through the hole is eliminated from the soldering on the back surface of the substrate.

As described above, according to the surface mount electronic component of the present invention and a method of manufacturing the same, in the electronic component such as a resistor or a diode, the lead wire having a circular cross section is changed to a lead wire having a flat cross section so that the solder surface is used when the PCB is mounted on the PCB. Direct soldering saves mounting time and simplifies the soldering device, reducing the cost of mounting electronic components.

Claims (2)

In a surface mount electronic component comprising a conductive cap body having at least a body and lead wires disposed at both ends of the body, The lead wire is a flat cross section of the whole, Surface-mounted electronic component, characterized in that the lower portion is bent in the 'c' shape is formed of a solder surface. Processing the body into a predetermined shape and depositing a film for conducting; Attaching a conductive cap body to both ends of the body and cutting to show a predetermined inductance or resistance value; Assembling lead wires at both ends of the cap body; Molding and coating the molded electronic component surface showing characteristics or specifications as necessary; And compressing the lead wires to deform into flat lead wires and bending them into a 'c' shape to form a soldering surface.