KR20000059568A - A device for formation via hall in a bga tape - Google Patents

Abstract

PURPOSE: An apparatus for forming a via-hole in a micro BGA(Ball Grid Array) substrate is provided to ensure productivity of high quality BGA substrate by forming via-holes and slits via punching by a metal mold in a micro BGA substrate. CONSTITUTION: An upper mold(1) functions to form via-holes in a BGA substrate(3) when pressed downward. The upper mold(1) is connected to the upper side of a guide post(6) which is connected to a base panel(5). An upper panel(7) is connected to the upper side of the guide post(6) and provided in the lower side a pin securing holder(8) and a stripper(9). A punching pin(10) and a guide pin(16) are integrally connected to the pin securing holder(8). A lower mold(2) is connected with first space(13) which is formed with a punching hole(12) in a side of a die plate(11) to be expansively slanted. The die plate(11) is secured in the upper side of the base panel(5) so that the punching pin(10) may be inserted thereinto. The first space(9) is connected with second space in the lower surface, which prevents upward movement of a scrap. A pin is formed in a side of the die plat(11).

Description

A via hole forming apparatus for a micro-visual substrate {A DEVICE FOR FORMATION VIA HALL IN A BGA TAPE}

In the present invention, a micro ball grid array substrate for a package formed by using a flexible material, punching a mold through a VIA HALL and a slit formed in a B substrate. The present invention relates to a micro hole substrate via hole forming apparatus that can be processed by work to ensure mass production of a B substrate and also to obtain a high quality B substrate.

In more detail, the upper and lower molds are transported up and down by guide posts connected to the base plate, and a plurality of punching pins are integrally protruded from the lower side, and the punching pins are inserted into one side of the die plate. A punching hole is formed and is formed of a lower mold which is integrally connected to a first space portion extending downwards on the bottom thereof and a second space portion connected to the first space portion, so that high quality via holes and slits are formed on the micro BG substrate. It characterized in that to form.

In the conventional known packaging substrate, a microball grid array (μBGA) package substrate, which is a form of a package, is frequently used in accordance with the trend of personal portability, light weight, and shortening of electronic products. To form a plurality of via holes or slots for mounting parts on the side, the via holes or slots play an important role in the performance and reliability of the product.

The conventional via hole and slot forming apparatus related to this technique is formed by chemical etching, or processed by a laser drill, and as shown in FIG. 1, the upper mold to which the punching pin 51 is integrally fixed. The die plate 52 is connected to the guide post 54 which is installed on the base plate 53 to move up and down, and the punching pin 51 of the upper mold 52 is formed with the guide groove 55 therethrough. 56 is fixed to the upper side of the base plate 53, the via hole (slit hole) in the BGA substrate 57 by the punching pin 51 is inserted into the guide groove 55 when the upper mold 52 is lowered It consists of a configuration to form (58).

In the via hole forming apparatus as described above, in the case of chemical etching, the etching operation is difficult with conventional materials, and of course, the via hole forming apparatus is provided with a dedicated facility for etching.

In addition, in the case of via hole formation using a laser drill, each via hole is formed by irradiating a laser.

In the case of forming the via hole using the punching, as shown in FIG. 2, when the upper mold 52 descends the BGA substrate 57 placed on the upper side of the die plate 56, the guide hole 55 is formed. As the punching pin 51 to be penetrated into the penetrating penetrating penetrating penetrating penetrating penetrating penetrating penetrating penetrating hole, the penetrating pin 51 penetrates the penetrating pin 51 to form a bio hole or slit.

However, the via hole forming apparatus as described above requires special materials and special equipment because it is impossible to work with existing materials in the case of chemical etching, and in the case of via hole formation using a laser drill, the product cost increases due to an increase in manufacturing cost. Of course, foreign substances are generated and contaminate the product.

In addition, when the via hole is formed by punching by the coordinating mold, bending of the punching pin 51 is frequently generated, and the punching pin 51 is broken during operation, and the guide hole 55 may occur. It is formed in this vertical line, so that the ejection of the strap (STRAP) is not easy, there are many problems such as the punching pin 51 is pinched or damaged in the guide hole (55).

The present invention is to solve the various problems as described above, the object is to form a via hole and a slit by the punching operation by a mold, so that mass production is simple, to reduce the manufacturing cost, to prevent the occurrence of foreign matter The present invention provides a via-hole forming apparatus for a micro-BI board that improves the quality of a product and facilitates the ejection of scrap, thereby preventing pin breakage.

1 is a schematic view showing a mold for forming a general via hole and slit

Figure 2 is a cross-sectional view showing the main structure of the conventional via hole and the slit forming mold

3 is a schematic view showing a via hole and a slit forming mold according to the present invention;

4 is a structural diagram of main parts of a via hole and a slit forming mold according to the present invention;

Explanation of symbols on the main parts of the drawings

1 ... upper mold 2 ... bottom mold

3 ... BGA board 4 ... Beer hole

6.Guide Post 8 ... Pin Holder

10 ... punching pin 11 ... die plate

12 ... punching hole 13 ... 1st space part

14 ... 2nd space part 16 ... guide pin

As a technical configuration for achieving the above object, the present invention, the upper plate is connected to the upper end of the guide post that is installed in the upper plate, the high feed, pin fixing holder fixed a plurality of punching pins on the bottom of the upper plate And upper molds each having a stripper installed to prevent the product from rising during punching and

A punching hole is formed at one side of the die plate so that the punching pin is inserted into a lower mold which is integrally connected to a first space part which is extended downward and a second space part connected to the first space part. By providing a via hole forming apparatus of a micro B substrate to easily form high quality via holes and slits in the busy substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a schematic diagram showing a via hole and a slit forming mold according to the present invention, Figure 4 is a main structural view of the mold for forming a via hole and slit according to the present invention the present invention is the upper mold (1) and the lower mold ( It is made of 2).

The upper mold 1 for forming the via hole (slit) 4 in the BGA substrate 3 in the downward direction is connected to the upper side of the guide post 6 which is connected to the base plate 5 and fixed up and down. The upper plate 7 is connected to the upper side of the guide post 6, and a pin fixing holder 8 and a stripper 9 are installed at a bottom thereof, and a punching pin 10 is attached to the pin fixing holder 8. Guide pin 16 is integrally connected.

The lower mold 2 in which the punching pin 10 of the upper mold 1 is formed to be inserted therethrough is formed of the die plate 11 in which the punching pin 10 is fixed to the upper side of the base plate 5. A punching hole 12 is formed at one side thereof, and a first space portion 13 which is inclined in the direction of 35 ° to 50 ° is connected to the bottom surface thereof, and a scrap is formed on the bottom surface of the first space portion 9. The second space 14 to prevent upward is integrally connected, the pin guide groove 15 is formed on one side of the die plate (11).

Referring to the operation of the present invention made of such a configuration as follows.

As shown in Figures 3 and 4, the upper mold (1) connected to the upper side of the guide post 6 fixed to the base plate (5) when the upper side and the lower side are integrally up and down, wherein the above The upper mold 1 is provided with an upper plate 7 for adjusting the center of the press and the center of the mold, and a pin fixing holder 8 to which the punching pin 10 is fixed to the bottom thereof is integrally installed to provide a guide post ( In case of 6) up and down, it becomes up and down integrally.

Subsequently, the stripper 9 installed on the bottom surface of the pin fixing holder 8 prevents the product from being bitten upward by the punching pin 10 when the punching pin 10 is upward. It is installed on the bottom to prevent the product from going up.

In addition, the die plate 11 through which the punching pin 10 is inserted through the upper mold 1 in a downward direction is fixed to an upper side of the base plate 3 so that a via hole (slit) 4 is provided on the upper side thereof. The product to be formed is lifted, and when the punching pin 10 is downwardly penetrated through the punching hole 12 of the die plate 11, shear force is generated to form the via hole 4.

In addition, when the upper mold 1 is moved upward and downward, the pin pin groove 15 formed in the die plate 11 has a guide pin 16 connected to the upper mold 1 so as to be moved upward and downward at an accurate position. Inserted so that it is constantly up and down.

In addition, the first space portion 13 formed on the bottom surface of the punching hole 12 of the die plate 11 is formed to be inclined downwardly toward the lower side in the direction of 35 ° to 50 ° so that the scrap ejection of the BGA substrate 3 is ejected. The second space portion 14 which is smoothly performed and connected to the bottom of the first space portion 13 prevents the scrap from rising so that the scrap discharged through the first space portion 13 can be smoothly discharged. do.

Subsequently, when the inclination angle is 35 ° or less, the ejection of scrap is easily vulnerable to the punching hole 12 portion of the die plate 11, and a high quality via hole cannot be obtained. When the inclination angle is 50 ° or more, the punching hole 12 The strength of the part is reinforced, but the scrap is not easily discharged, so the punching pin 10 is frequently damaged.

On the other hand, the first space portion 9 is formed to extend to the bottom of the die plate 11 without forming a separate second space portion 14 on the lower side is to smoothly discharge the scrap.

As described above, according to the via hole forming apparatus of the micro busy substrate according to the present invention, via holes and slits are formed by punching by a mold, so that mass production is possible, thereby significantly reducing the manufacturing cost, and scrapping of the BGA substrate. It is easily discharged to prevent the occurrence of foreign matters in advance, thereby improving the quality of the product, and smoothly ejecting the scraps by the first and second space parts to prevent the damage of the punching pin in advance. There is.

Claims (4)

It is connected to the upper side of the guide post (6) which is connected to the base plate (5) to be fixed up and down, the upper plate (7) is connected to the upper side of the guide post (6) pin fixing holder (8) And a stripper 9, an upper mold 1 to which a punching pin 10 and a guide pin 16 are integrally connected to the pin fixing holder 8, A first hole 13 is formed in one side of the die plate 11 on which the punching pin 10 is inserted to be inserted into the base plate 5 so that the punching pin 10 is inclined downwardly. And a lower mold (2) having upper and lower ends formed on the bottom of the first space (9) and having a second space (14) connected at an angle to the bottom of the first space (13) and the die plate (11). Via hole forming apparatus of the micro busy A substrate, characterized in that consisting of The via of claim 1, wherein the first space portion (13) connected to the bottom surface of the punching hole (12) has an inclination angle extending in a direction of 35 degrees to 50 degrees. Hole forming device The via hole of the micro-visual substrate according to claim 1, wherein the first space portion (13) has an inclined surface formed at the bottom of the punching hole (12) extending to the end of the die plate (11). Forming device The via hole forming apparatus of claim 1, wherein the punching pin 10 penetrating the punching hole 12 is formed to protrude only a predetermined amount from the bottom of the punching hole 12.