KR20000054929A - Mutual Contact Device For Module Devices - Google Patents
Mutual Contact Device For Module Devices Download PDFInfo
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- KR20000054929A KR20000054929A KR1019990003281A KR19990003281A KR20000054929A KR 20000054929 A KR20000054929 A KR 20000054929A KR 1019990003281 A KR1019990003281 A KR 1019990003281A KR 19990003281 A KR19990003281 A KR 19990003281A KR 20000054929 A KR20000054929 A KR 20000054929A
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- South Korea
- Prior art keywords
- elastic arm
- module device
- elastic
- terminal
- circuit board
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
- H01R13/187—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member in the socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Connecting Device With Holders (AREA)
Abstract
Description
본 발명은 각종 회로소자들이 인쇄회로기판(Print Circuit Board; 이하 "PCB"라 함) 상에 실장되어진 모듈 디바이스와 PCB의 패턴단락(short)을 테스트하는 장치에 관한 것으로, 특히 모듈 디바이스의 입/출력단자와 테스트 회로보드의 입/출력단자를 상호 전기적으로 접속시키기 위한 상호 접속장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module device in which various circuit elements are mounted on a printed circuit board (hereinafter, referred to as a “PCB”) and an apparatus for testing a pattern short of a PCB. An interconnect device for electrically connecting an output terminal and an input / output terminal of a test circuit board to each other.
통상의 모듈 디바이스는 회로구성에 따른 배선이 PCB 상에 인쇄되어지고, 메모리 칩과 같은 집적회로 칩(Integated Circuit Chip : 이하 "IC 칩"이라 함)을 비롯한 각종 회로소자들이 땜납에 의해 PCB 상에 탑재되어진다. 이렇게 제조되어진 모듈 디바이스들 중에는 회로소자들이 정해진 위치에 탑재되지 않거나 또는 납땜의 불량 등으로 인하여 불량한 모듈 디바이스가 생길 수 있다. 이로 인하여, 모듈 디바이스의 모듈 디바이스의 불량 여부를 판단하기 위한 모듈 디바이스의 테스트 과정이 따르게 된다.In a typical module device, wiring according to a circuit configuration is printed on a PCB, and various circuit elements including an integrated circuit chip (hereinafter referred to as an "IC chip"), such as a memory chip, are printed on the PCB by soldering. It is mounted. Among the module devices manufactured as described above, a defective module device may be generated due to the failure of circuit elements to be mounted at a predetermined position or a poor soldering. As a result, a test process of the module device is followed to determine whether the module device of the module device is defective.
모듈 디바이스의 테스트는 모듈 디바이스에 패턴단락 또는 개방 등이 존재하게 되면 특정 신호를 발생하는 테스트 회로보드에 접속됨으로써 수행되어진다. 이에 따라, 모듈 디바이스의 입/출력단자와 테스트 회로보드의 입/출력단자를 상호 전기적으로 접속시키는 상호 접속장치가 필요하게 된다.The test of the module device is performed by connecting to a test circuit board which generates a specific signal when a pattern short or an open is present in the module device. Accordingly, there is a need for an interconnect device that electrically connects the input / output terminals of the module device and the input / output terminals of the test circuit board.
따라서, 본 발명의 목적은 모듈 디바이스의 입/출력단자와 테스트 회로보드의 입/출력단자를 상호 전기적으로 접속시키기에 적합하도록 한 상호 접속장치를 제공함에 있다.It is therefore an object of the present invention to provide an interconnection device adapted to electrically connect the input / output terminals of a module device and the input / output terminals of a test circuit board with each other.
본 발명의 다른 목적은 상호 접속장치가 장착되는 소켓장치를 제공함에 있다.Another object of the present invention is to provide a socket device to which the interconnect device is mounted.
도 1은 본 발명의 실시예에 따른 상호 접속장치가 장착되는 소켓을 나타내는 분해 사시도.1 is an exploded perspective view showing a socket to which an interconnect device according to an embodiment of the present invention is mounted;
도 2는 도 1에서 선 "A-A'"을 따라 절취하여 나타내는 종단면도.FIG. 2 is a longitudinal cross-sectional view taken along the line "A-A '" in FIG. 1; FIG.
＜ 도면의 주요 부분에 대한 부호의 설명 ＞<Description of the code | symbol about the principal part of drawing>
1 : 콘택부재 2 : 제1 암1: contact member 2: 1st arm
3,5 : 돌출부 4 : 제2 암3,5: protrusion 4: second arm
6 : 후크부 7 : 단턱6: hook portion 7: step
10 : 하부 소켓하우징 12 : 슬롯10: lower socket housing 12: slot
14 : 격벽 15 : 돌기14: bulkhead 15: protrusion
20 : 상부 소켓하우징 22 : 삽입구20: upper socket housing 22: insertion hole
24 : 가이드슬롯 30 : 모듈 디바이스24: guide slot 30: module device
32 : 레버 34 : 힌지핀32: lever 34: hinge pin
36 : 가이드핀36: guide pin
상기 목적들을 달성하기 위하여, 본 발명의 모듈 디바이스용 상호 접속장치는 구부러지게 성형되어 탄성력에 의해 제1 터미널에 접속되는 제1 탄성암부재와, 제1 탄성암부재에 일체화됨과 아울러 구부러지게 성형되어 탄성력에 의해 제2 터미널에 접속되는 제2 탄성암부재를 구비한다.In order to achieve the above objects, the interconnection device for a module device of the present invention is formed to bend and to be integrally formed with the first elastic arm member and to be bent to be connected to the first terminal by elastic force. And a second elastic arm member connected to the second terminal by the elastic force.
본 발명의 소켓장치는 구부러지게 성형되어 탄성력에 의해 제1 터미널에 접속되는 제1 탄성암부재와, 제1 탄성암부재에 일체화됨과 아울러 구부러지게 성형되어 탄성력에 의해 제2 터미널에 접속되는 제2 탄성암부재와, 제1 및 제2 탄성암부재에 일체화됨과 아울러 구부러지게 성형되어 탄성력에 의해 소켓의 고정부에 구속되어 제1 및 제2 탄성암부재를 지지하는 후크부재를 포함하는 콘택부재를 구비한다.The socket device of the present invention is a first elastic arm member which is formed to be bent and connected to the first terminal by an elastic force, and a second elastic body which is integrated with the first elastic arm member and is bent and connected to the second terminal by an elastic force. A contact member including an elastic arm member and a hook member integrated with the first and second elastic arm members and molded to bend to restrain the fixed portion of the socket by an elastic force to support the first and second elastic arm members. Equipped.
상기 목적들 외에 본 발명의 다른 목적 및 특징들은 첨부한 도면들을 참조한 실시예들에 대한 설명을 통하여 명백하게 드러나게 될 것이다.Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.
이하, 도 1 및 도 2를 참조하여 본 발명의 바람직한 실시예에 대하여 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 1 and 2.
도 1은 본 발명의 실시예에 따른 상호 접속장치가 장착되는 모듈 디바이스용 소켓을 나타내는 분해 사시도이다.1 is an exploded perspective view showing a socket for a module device in which an interconnect device according to an embodiment of the present invention is mounted.
도 1을 참조하면, 본 발명의 모듈 디바이스용 가이드핀(Guide pin)(36)에 의해 결합되는 상부 소켓하우징(20) 및 하부 소켓하우징(10)과, 하부 소켓하우징(10)에 형성된 슬롯(12)을 사이에 두고 대향되게 설치되는 다수 개의 콘택부재(1)와, 하부 소켓하우징(10)에 고정되는 힌지핀(34)이 관통되어 하부 소켓하우징(10)에 선회 가능하게 설치되는 레버(32)를 구비한다.Referring to FIG. 1, an upper socket housing 20 and a lower socket housing 10 coupled by a guide pin 36 for a module device of the present invention, and a slot formed in the lower socket housing 10 A plurality of contact members 1 installed to face each other with the intervening portion 12 interposed therebetween and a hinge pin 34 fixed to the lower socket housing 10 to be pivotally installed in the lower socket housing 10 ( 32).
상부 소켓하우징(20)에는 길이방향으로 삽입구(22)가 형성되며, 삽입구(22) 양측단에는 모듈 디바이스(30)의 두께만큼의 폭을 가지는 가이드슬롯(24)이 형성된다. 가이드슬롯(24)은 하부 소켓하우징(10)에 형성된 슬롯(12)에 수직으로 대향되어 하부 소켓 하우징(10)의 슬롯(12)으로 모듈 디바이스(30)를 안내하게 된다.Insertion openings 22 are formed in the upper socket housing 20 in the longitudinal direction, and guide slots 24 having widths corresponding to the thickness of the module device 30 are formed at both ends of the insertion openings 22. The guide slot 24 is perpendicular to the slot 12 formed in the lower socket housing 10 to guide the module device 30 into the slot 12 of the lower socket housing 10.
하부 소켓하우징(10)에는 길이방향으로 슬롯(12)으로 형성되며 슬롯(12)을 사이에 두고 다수의 콘택부재들(1)이 서로 대향되게 설치된다. 슬롯(12)에는 콘택부재들(1)이 독립적으로 끼워지는 콘택부재 수납홀들이 슬롯(12)으로부터 하부 소켓하우징(10)의 폭방향으로 형성된다. 콘택부재 수납홀들 사이에는 슬리브가 위치하여 콘택부재들(1) 사이의 단락(short)을 방지하게 된다.The lower socket housing 10 is formed as a slot 12 in the longitudinal direction, and a plurality of contact members 1 are installed to face each other with the slot 12 therebetween. In the slot 12, contact member accommodating holes into which the contact members 1 are independently inserted are formed in the width direction of the lower socket housing 10 from the slot 12. A sleeve is positioned between the contact member accommodating holes to prevent a short between the contact members 1.
슬리브는 하부 소켓하우징(10)과 동일한 재료로서 하부 소켓하우징(10) 성형시 일체화되어 성형되어진다. 또한, 하부 소켓하우징(10)의 저면에는 콘택부재들(1)에 자신의 입/출력단자들이 전기적으로 접속되게 테스트 회로보드(도시하지 않음)가 고정된다.The sleeve is made of the same material as the lower socket housing 10 and integrally molded when forming the lower socket housing 10. In addition, a test circuit board (not shown) is fixed to the bottom of the lower socket housing 10 such that its input / output terminals are electrically connected to the contact members 1.
레버(32)는 도시하지 않은 구동장치에 의해 구동되어 모듈 디바이스(30)의 테스트가 종료된 후, 모듈 디바이스(30)를 슬롯(12)으로부터 모듈 디바이스(30)를 분리시키는 역할을 한다.The lever 32 is driven by a driving device (not shown) and serves to separate the module device 30 from the slot 12 after the test of the module device 30 ends.
콘택부재들(1)은 모듈 디바이스(30)의 입/출력단자와 하부 소켓하우징(10) 저면에 고정되는 테스트 회로보드의 입/출력단자를 전기적으로 접속시키는 역할을 하게 된다. 이 콘택부재들(1)에 대하여는 도 2를 결부하여 상세히 설명하기로 한다.The contact members 1 serve to electrically connect the input / output terminals of the module device 30 and the input / output terminals of the test circuit board fixed to the bottom of the lower socket housing 10. The contact members 1 will be described in detail with reference to FIG. 2.
도 2를 참조하면, 콘택부재(1)는 모듈 디바이스(30)에 탄성력으로 접속되는 제1 암(2)과, 제1 암(2)에 일체화된 제2 암(4) 및 후크부(6)를 구비한다. 콘택부재(1)는 전기적 전도특성이 우수한 금속재료로서 특히, 베릴륨구리(BeCu) 합금 "C1720"으로 이루어져 판형태로 성형되어진다.Referring to FIG. 2, the contact member 1 includes a first arm 2 elastically connected to the module device 30, a second arm 4 integrated with the first arm 2, and a hook portion 6. ). The contact member 1 is a metal material having excellent electrical conductivity, and is formed of a beryllium copper (BeCu) alloy "C1720" and formed into a plate shape.
제1 암(2)은 "∩"자 형상으로 형성되며, 그 끝단은 모듈 디바이스(30) 쪽으로 돌출되도록 절곡되는 돌출부(3)가 형성된다. 돌출부(3)는 모듈 디바이스(30)가 슬롯(12)에 끼워지게 되면 모듈 디바이스(1)의 입/출력단자에 탄성가압되어 전기적으로 접속된다.The first arm 2 is formed in a "∩" shape, the end of which is formed with a projection 3 which is bent to project toward the module device 30. The protrusion 3 is elastically pressed and electrically connected to the input / output terminal of the module device 1 when the module device 30 is fitted into the slot 12.
제2 암(4)은 "⊂ 또는 ⊃"자 형상으로 형성되며, 그 끝단은 테스트 회로보드 쪽으로 돌출되도록 절곡되는 돌출부(5)가 형성된다. 제2 암(4)의 돌출부(5)는 하부 소켓하우징(10)의 저면에 테스트 회로보드가 고정되므로 테스트 회로보드의 입/출력단자에 항상 전기적으로 접속된 상태를 유지하게 된다.The second arm 4 is formed in a “⊂” or “⊃” shape, the end of which is formed with a protrusion 5 which is bent to protrude toward the test circuit board. Since the test circuit board is fixed to the bottom of the lower socket housing 10, the protrusion 5 of the second arm 4 is always electrically connected to the input / output terminals of the test circuit board.
이들 제1 및 제2 암(2,4)은 탄성복원력에 의해 모듈 디바이스(30) 또는 테스트 회로보드의 입/출력단자에 접속되도록 소정 탄성력을 가지게 된다. 이로 인하여, 제1 및 제2 암(2,4)은 대략 400g±10g 정도의 탄성력을 가지게 된다.These first and second arms 2, 4 have a predetermined elastic force to be connected to the input / output terminals of the module device 30 or the test circuit board by the elastic restoring force. As a result, the first and second arms 2 and 4 have an elastic force of about 400 g ± 10 g.
후크부(6)는 제1 암(2)과 제2 암(4) 사이에서 "∩"자 형상으로 형성되며, 그 끝단은 제1 암(2) 쪽으로 돌출되도록 단턱진 단턱(7)이 형성된다. 이 후크부(6)는 콘택부재(1)를 하부 소켓하우징(10)에 고정시키는 역할을 한다. 한편, 하부 소켓하우징(10)에는 콘택부재들(1) 사이를 절연시키는 슬리브들을 상호 연결함과 아울러 콘택부재(1)의 제1 암(2)과 후크부(6) 사이에 위치하는 격벽(14)이 형성된다. 이 격벽(14)에는 후크부(6)의 단턱(7)과 맞물리는 돌기(14)가 형성된다.The hook portion 6 is formed in a “2” shape between the first arm 2 and the second arm 4, and a stepped step 7 is formed so that the end thereof protrudes toward the first arm 2. do. The hook portion 6 serves to fix the contact member 1 to the lower socket housing 10. Meanwhile, the lower socket housing 10 has a partition wall which is located between the first arm 2 and the hook portion 6 of the contact member 1 and interconnects sleeves insulated between the contact members 1. 14) is formed. The partition 14 is provided with protrusions 14 engaged with the step 7 of the hook portion 6.
후크부(6)를 이용하여 콘택부재(1)를 하부 소켓하우징(10)에 고정하기 위해서는 콘택부재(1)를 하부 소켓하우징(1) 아래에서 콘택부재 수납홀쪽으로 밀어넣게 된다. 그러면 후크부(6)는 격벽(14)의 돌기(15)에 의해 구부러진 다음, 콘택부재(1)가 콘택부재 수납홀 내로 완전히 수납되면 돌기(15)로부터의 구속이 해제되어 탄성복원력에 의해 격벽(14)에 밀착하게 된다. 이 때, 후크부(6)의 돌기(7)는 돌기(15)에 맞물려 구속되므로 콘택부재(1)는 콘택부재 수납홀 내에 고정된다.In order to fix the contact member 1 to the lower socket housing 10 using the hook 6, the contact member 1 is pushed under the lower socket housing 1 toward the contact member accommodation hole. Then, the hook portion 6 is bent by the protrusions 15 of the partition wall 14, and then, when the contact member 1 is completely received into the contact member receiving hole, the restraint from the protrusion 15 is released and the partition wall is separated by the elastic restoring force. It comes in close contact with (14). At this time, since the protrusion 7 of the hook portion 6 is engaged with the protrusion 15 and restrained, the contact member 1 is fixed in the contact member accommodation hole.
후크부(6)를 이용하여 콘택부재(1)를 하부 소켓하우징(10)으로부터 분리하기 위해서는 먼저, 상부 소켓하우징(20)을 하부 하우징(10)으로부터 분리하게 된다. 그러면 하부 소켓하우징(10)의 상면에서 후크부(6)가 노출된다. 이 때, 격벽(14)과 후크부(6) 사이에 존재하는 틈새에 기구물을 삽입하여 후크부(6)의 단턱(7)을 격벽(14)의 돌기(15)로부터 벗어나게 한 후, 콘택부재(1)를 아래로 밀게 되면 콘택부재(1)는 콘택부재 삽입홀로부터 분리된다.In order to separate the contact member 1 from the lower socket housing 10 using the hook 6, first, the upper socket housing 20 is separated from the lower housing 10. Then, the hook portion 6 is exposed on the upper surface of the lower socket housing 10. At this time, the contact member is inserted into the gap existing between the partition 14 and the hook 6 to release the step 7 of the hook 6 from the protrusion 15 of the partition 14, and then the contact member. When (1) is pushed down, the contact member 1 is separated from the contact member insertion hole.
모듈 디바이스(30)가 소켓에 장착되는 과정을 상세히 설명하면 다음과 같다.The process of mounting the module device 30 in the socket will now be described in detail.
모듈 디바이스(30)에는 PCB 상에 IC 칩을 비롯한 회로부품소자들이 탑재되어지고 입/출력단자로 사용되는 전극패드가 다수개 형성된다. 또한, 테스트 회로보드의 PCB 상에도 입/출력단자로 사용되는 전극패드가 다수개 형성된다. 모듈 디바이스(30)가 상부 소켓하우징(20)을 경유하여 하부 소켓하우징(10)의 슬롯(12) 쪽으로 끼워지게 되면 슬롯(12)에 진입되면서 모듈 디바이스(30)가 콘택부재(1)의 제1 암(2)을 밀게 된다. 그러면 제1 암(2)이 구부러지면서 탄성복원력이 발생하게 되며, 이 탄성복원력에 의해 제1 암(2)의 돌출부(3)가 모듈 디바이스(1)의 전극패드에 탄성가압되어 전기적으로 접속된다. 이에 따라, 제2 암(4)의 돌출부(5)는 항상 테스트 회로보드의 전극패드에 전기적으로 접촉된 상태를 유지하게 되므로 모듈 디바이스(30)와 테스트 회로보드 사이에는 콘택부재(1)를 경유하여 전류패스가 형성된다. 이 때, 운용자는 테스트 회로보드에 테스트 신호를 인가함으로써 모듈 디바이스(30)의 패턴단락 또는 개방 등을 테스트하여 모듈 디바이스의 양품을 판별하게 된다.In the module device 30, circuit component elements including IC chips are mounted on a PCB, and a plurality of electrode pads used as input / output terminals are formed. In addition, a plurality of electrode pads used as input / output terminals are also formed on the PCB of the test circuit board. When the module device 30 is fitted into the slot 12 of the lower socket housing 10 via the upper socket housing 20, the module device 30 enters the slot 12 and the module device 30 is formed of the contact member 1. 1 arm (2) is pushed. Then, the first arm 2 is bent to generate an elastic restoring force, and the elastic restoring force causes the protrusion 3 of the first arm 2 to be elastically pressed and electrically connected to the electrode pad of the module device 1. . Accordingly, since the protrusion 5 of the second arm 4 is always kept in electrical contact with the electrode pad of the test circuit board, the contact member 1 is interposed between the module device 30 and the test circuit board. Thus, a current path is formed. At this time, the operator determines the good quality of the module device by testing a pattern short or opening of the module device 30 by applying a test signal to the test circuit board.
본 발명의 실시예에서는 모듈 디바이스 테스트용 소켓에 적용되는 것을 나타내었지만, 모듈 디바이스 테스트용뿐만 아니라 전극패드가 형성된 인쇄회로보드가 장착되는 어떠한 소켓에도 적용될 수 있다.Although the embodiment of the present invention has been shown to be applied to the socket for module device test, it can be applied to any socket to which a printed circuit board having an electrode pad is formed as well as for the module device test.
상술한 바와 같이, 본 발명에 따른 모듈 디바이스용 상호 접속장치는 전도성이 우수한 금속판 형태로 제작되며 각각 탄성력에 의해 모듈 디바이스의 입/출력단자와 테스트 회로보드의 입/출력단자 사이를 전기적으로 접속시키는 제1 암과 제2 암이 형성됨과 아울러, 탄성력에 의해 고정부에 고정되는 후크부가 형성되는 콘택부재를 구비함으로써 모듈 디바이스의 입/출력단자와 테스트 회로보드의 입/출력단자를 상호 전기적으로 접속시키기에 적합하게 된다.As described above, the interconnection device for the module device according to the present invention is manufactured in the form of a metal plate having excellent conductivity, and electrically connects the input / output terminal of the module device with the input / output terminal of the test circuit board by elastic force, respectively. A first arm and a second arm are formed, and a contact member having a hook portion fixed to the fixed portion by elastic force is provided to electrically connect the input / output terminals of the module device and the input / output terminals of the test circuit board to each other. It is suitable to make.
이상 설명한 내용을 통해 당업자라면 본 발명의 기술사상을 일탈하지 아니하는 범위에서 다양한 변경 및 수정이 가능함을 알 수 있을 것이다. 따라서, 본 발명의 기술적 범위는 명세서의 상세한 설명에 기재된 내용으로 한정되는 것이 아니라 특허 청구의 범위에 의해 정하여 져야만 할 것이다.Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990003281A KR100324007B1 (en) | 1999-02-01 | 1999-02-01 | Mutual Contact Device For Module Devices |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990003281A KR100324007B1 (en) | 1999-02-01 | 1999-02-01 | Mutual Contact Device For Module Devices |
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| Publication Number | Publication Date |
|---|---|
| KR20000054929A true KR20000054929A (en) | 2000-09-05 |
| KR100324007B1 KR100324007B1 (en) | 2002-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019990003281A KR100324007B1 (en) | 1999-02-01 | 1999-02-01 | Mutual Contact Device For Module Devices |
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| KR (1) | KR100324007B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020072110A (en) * | 2001-03-09 | 2002-09-14 | 주식회사 글로텍 | Socket structure for multiple line grid |
| KR100673614B1 (en) * | 2006-01-26 | 2007-01-24 | (주)마이크로컨텍솔루션 | Memory socket device for testing |
| KR101015901B1 (en) * | 2008-04-25 | 2011-02-23 | 주식회사 유니세트 | Test socket for pcb module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100970898B1 (en) | 2007-12-28 | 2010-07-16 | 리노공업주식회사 | test socket for memory module |
-
1999
- 1999-02-01 KR KR1019990003281A patent/KR100324007B1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020072110A (en) * | 2001-03-09 | 2002-09-14 | 주식회사 글로텍 | Socket structure for multiple line grid |
| KR100673614B1 (en) * | 2006-01-26 | 2007-01-24 | (주)마이크로컨텍솔루션 | Memory socket device for testing |
| KR101015901B1 (en) * | 2008-04-25 | 2011-02-23 | 주식회사 유니세트 | Test socket for pcb module |
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| Publication number | Publication date |
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| KR100324007B1 (en) | 2002-02-19 |
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