KR20000050772A - Wafer holder of each wafer loading type semiconductor producing apparatus - Google Patents
Wafer holder of each wafer loading type semiconductor producing apparatus Download PDFInfo
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- KR20000050772A KR20000050772A KR1019990000855A KR19990000855A KR20000050772A KR 20000050772 A KR20000050772 A KR 20000050772A KR 1019990000855 A KR1019990000855 A KR 1019990000855A KR 19990000855 A KR19990000855 A KR 19990000855A KR 20000050772 A KR20000050772 A KR 20000050772A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 반도체 소자 제조장치 중 매엽식 반도체 제조장치에 관한 것으로, 상세하게는 장치내에 로딩된 웨이퍼가 안착되는 매엽식 반도체 제조장치의 웨이퍼 홀더에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet type semiconductor manufacturing apparatus among semiconductor device manufacturing apparatuses, and more particularly, to a wafer holder of a sheet type semiconductor manufacturing apparatus in which a wafer loaded in the apparatus is seated.
일반적으로 반도체 소자의 제조에는 다양한 제조공정을 거치게 되며, 그 중에서 폴리실리콘막, 질화막, 산화막 등을 웨이퍼 상에 증착시키는 데는 주로 화학기상증착(CVD: Chemical Vapor Deposition) 공정 또는 확산공정을 거치게 된다. 이러한 CVD 공정이나 확산공정을 수행하는 반도체 제조장치로는 하나의 웨이퍼를 처리하는 매엽방식의 장치와 복수의 웨이퍼를 동시에 처리하는 배치방식(Batch type)의 장치가 있다. 이중에서 매엽방식의 반도체 제조장치는 챔버내에 위치하는 서셉터 상에 웨이퍼를 하나씩 로딩한 후 공정을 진행하게 되며, 이에 따라 챔버내에 로딩된 웨이퍼를 지지하는 웨이퍼 홀더가 구비된다.In general, a semiconductor device is manufactured through various manufacturing processes, among which a polysilicon film, a nitride film, an oxide film, or the like is deposited on a wafer through a chemical vapor deposition (CVD) process or a diffusion process. As a semiconductor manufacturing apparatus for performing such a CVD process or a diffusion process, there is a sheet type apparatus for processing one wafer and a batch type apparatus for simultaneously processing a plurality of wafers. Among them, the single wafer type semiconductor manufacturing apparatus loads wafers one by one on a susceptor located in the chamber and proceeds with the process. Accordingly, a wafer holder supporting the wafer loaded in the chamber is provided.
도 1은 종래의 매엽식 반도체 제조장치의 요부 구성도이고, 도 2는 도 1에 도시된 종래의 웨이퍼 홀더를 도시한 사시도이다.FIG. 1 is a diagram illustrating a main part of a conventional sheet type semiconductor manufacturing apparatus, and FIG. 2 is a perspective view illustrating a conventional wafer holder illustrated in FIG. 1.
도 1과 도 2를 함께 참조하면, 종래의 매엽식 반도체 제조장치의 챔버 내에는 반도체 웨이퍼(10)가 그 상부에 로딩되는 서셉터(20)가 마련되어 있으며, 상기 서셉터(20)의 내부에는 상기 웨이퍼(10)를 소정 온도로 가열하기 위한 히터가 설치된다. 그리고, 상기 서셉터(20)의 상부에는 상기 챔버 내부로 로딩되는 웨이퍼(10)가 안착되는 웨이퍼 홀더가 위치한다.1 and 2 together, a susceptor 20 having a semiconductor wafer 10 loaded thereon is provided in a chamber of a conventional sheet type semiconductor manufacturing apparatus, and inside the susceptor 20. A heater for heating the wafer 10 to a predetermined temperature is provided. In addition, a wafer holder on which the wafer 10 loaded into the chamber is mounted is positioned on the susceptor 20.
상기 웨이퍼 홀더에는 웨이퍼(10)의 가장자리부를 3개소에서 지지하는 세 개의 홀더(110)가 구비되어 있고, 상기 세 개의 홀더(110)는 반원 형상의 프레임(120)과 한몸체로 형성되어 있다. 상기 세 개의 홀더(110) 각각의 일단부에는 웨이퍼(10)의 가장자리부가 안착되는 웨이퍼 안착부(111)가 마련되어 있고, 각각의 타단부에는 스크루 삽입홀(112)이 마련되어 있다. 상기 웨이퍼 홀더의 하부에는 이를 지지하기 위한 세 개의 홀더지지봉(30)이 설치되어 있으며, 상기 홀더지지봉(30)의 상단부에는 스크루 체결홀(31)이 마련되어 스크루(60)에 의해 상기 웨이퍼 홀더를 상기 홀더지지봉(30)의 상단부에 결합할 수 있게 된다.The wafer holder is provided with three holders 110 for supporting the edge portions of the wafer 10 at three locations, and the three holders 110 are formed in a semicircular frame 120 and one body. One end of each of the three holders 110 is provided with a wafer seating portion 111 on which an edge portion of the wafer 10 is seated, and a screw insertion hole 112 is provided at each other end. Three holder supporting rods 30 are installed at the lower portion of the wafer holder, and screw fastening holes 31 are provided at an upper end of the holder supporting rods 30 so that the wafer holder is held by screws 60. It can be coupled to the upper end of the holder support rod (30).
상기 웨이퍼 홀더는 상술한 바와 같이 세 개의 홀더지지봉(30)의 상단부에 결합되고, 상기 홀더지지봉(30)은 브라켓(40)에 의해 지지된다. 상기 브라켓(40)의 중심부에는 소정의 구동수단에 의해 승강하는 승강로드(50)가 결합되어 있다. 따라서, 챔버 내부로 로딩된 웨이퍼(10)는 상기 웨이퍼 홀더에 안착된 후, 상기 승강로드(50)에 의해 상기 웨이퍼 홀더가 하강함에 따라 상기 서셉터(20)의 상면에 근접하게 된다.The wafer holder is coupled to the upper ends of the three holder support rods 30 as described above, and the holder support rods 30 are supported by the bracket 40. A lifting rod 50 which is lifted by a predetermined driving means is coupled to the center of the bracket 40. Therefore, after the wafer 10 loaded into the chamber is seated on the wafer holder, the wafer holder is lowered by the lifting rod 50 to approach the upper surface of the susceptor 20.
한편, 상기 매엽식 반도체 제조장치는 주기적으로 챔버 내부를 세척하게 되는데, 이때 상기 웨이퍼 홀더를 홀더지지봉(30)으로부터 분리하게 된다. 그런데, 상기 웨이퍼 홀더와 홀더지지봉(30)의 결합부위에 챔버내에 주입되는 반응 가스가 부착되어 상기 스크루(60)가 상기 홀더(110)의 스크루 삽입홀(112)에 붙어버리는 현상이 발생하게 된다. 이와 같은 경우에 스크루(60)의 해체시 홀더(110)가 쉽게 파손되는 문제점이 자주 발생한다. 특히, 상기 웨이퍼 홀더와 스크루(60)는 주로 압축성형된 흑연(Graphite)으로 되어 있으므로 취약하여 쉽게 파손된다.Meanwhile, the sheet type semiconductor manufacturing apparatus periodically cleans the inside of the chamber, and the wafer holder is separated from the holder support rod 30. However, a reaction gas injected into the chamber is attached to the coupling portion between the wafer holder and the holder support rod 30 so that the screw 60 is stuck to the screw insertion hole 112 of the holder 110. . In such a case, the holder 110 is easily broken when the screw 60 is dismantled. In particular, since the wafer holder and the screw 60 are mainly composed of compression molded graphite, they are fragile and easily broken.
그런데, 종래의 웨이퍼 홀더에 있어서는 상술한 바와 같이 하나의 홀더가 파손되면 이와 일체로 형성된 나머지 홀더도 사용할 수 없게 되어 그 전체를 교체하여야 하므로 비용이 증가하는 문제점이 있다.However, in the conventional wafer holder, as described above, when one holder is damaged, the remaining holder formed integrally with the wafer holder may not be used, and thus, the entire holder needs to be replaced.
본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위하여 안출된 것으로, 특히 하나의 홀더가 파손되더라도 나머지 홀더는 계속 사용할 수 있도록 각각의 홀더가 서로 분리된 구조를 갖는 매엽식 반도체 제조장치의 웨이퍼 홀더를 제공하는데 목적이 있다.The present invention has been made to solve the above problems of the prior art, in particular, the wafer holder of the single-leaf semiconductor manufacturing apparatus having a structure in which each holder is separated from each other so that the remaining holder can continue to use even if one holder is broken The purpose is to provide.
도 1은 종래의 매엽식 반도체 제조장치의 요부 구성도,1 is a main configuration diagram of a conventional sheet type semiconductor manufacturing apparatus;
도 2는 도 1에 도시된 종래의 웨이퍼 홀더를 도시한 사시도,2 is a perspective view showing a conventional wafer holder shown in FIG.
도 3은 본 발명에 따른 매엽식 반도체 제조장치의 웨이퍼 홀더를 도시한 사시도,3 is a perspective view showing a wafer holder of a sheet type semiconductor manufacturing apparatus according to the present invention;
도 4는 도 3에 도시된 훌더와 홀더지지봉의 결합 상태를 도시한 단면도.Figure 4 is a cross-sectional view showing a coupling state of the holder and the holder support rod shown in FIG.
＜도면의 주요 부분에 대한 부호의 설명＞<Description of the code | symbol about the principal part of drawing>
10...웨이퍼20...서셉터10 ... wafer 20 ... susceptor
30...홀더지지봉40...브라켓30 Holder holder 40 Bracket
50...승강로드60...스크루50 ... lifting rod 60 ... screw
110,310...홀더111,311...웨이퍼 안착부110,310 ... holders 111,311 ... wafer seat
112,312...스크루 삽입홀120...프레임112,312 ... screw insertion hole 120 ... frame
313...돌기313 ... Turn
상기 목적을 달성하기 위하여 본 발명에 따른 매엽식 반도체 제조장치의 웨이퍼 홀더는: 매엽식 반도체 제조장치의 챔버 내부에 마련된 서셉터의 상부에 위치하도록 설치되며, 소정의 승강장치에 의해 승강하는 홀더지지봉에 결합되어 상기 챔버 내부로 로딩되는 웨이퍼를 지지하는 매엽식 반도체 제조장치의 웨이퍼 홀더에 있어서; 일단부에는 상기 웨이퍼의 가장자리부가 안착되는 웨이퍼 안착부가 마련되고, 타단부에는 상기 홀더지지봉에 고정시키기 위한 스크루 삽입홀이 마련되는 적어도 세 개의 홀더를 구비하며, 상기 세 개의 홀더는 서로 분리된 것을 특징으로 한다.In order to achieve the above object, the wafer holder of the sheet type semiconductor manufacturing apparatus according to the present invention is installed to be positioned above the susceptor provided inside the chamber of the sheet type semiconductor manufacturing apparatus, and is supported by a predetermined lifting device. A wafer holder of a sheet type semiconductor manufacturing apparatus coupled to and supporting a wafer loaded into the chamber; One end is provided with a wafer seating portion is seated on the edge of the wafer, the other end is provided with at least three holders are provided with a screw insertion hole for fixing to the holder support rod, the three holders are separated from each other It is done.
그리고, 상기 홀더 각각의 타단부 저면에는 돌기가 형성되며, 상기 돌기는 상기 홀더지지봉의 상단부에 형성되는 홈에 삽입됨으로써, 상기 홀더의 웨이퍼 안착부가 좌,우로 움직이는 것을 방지할 수 있도록 된 것이 바람직하다.In addition, a protrusion is formed at a bottom of the other end of each holder, and the protrusion is inserted into a groove formed at an upper end of the holder support rod, so that the wafer seating portion of the holder can be prevented from moving left and right. .
이하, 첨부된 도면을 참조하면서 본 발명에 따른 매엽식 반도체 제조장치의 웨이퍼 홀더의 바람직한 실시예를 상세히 설명한다.Hereinafter, a preferred embodiment of a wafer holder of a sheet type semiconductor manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
도 3은 본 발명에 따른 매엽식 반도체 제조장치의 웨이퍼 홀더를 도시한 사시도이고, 도 4는 도 3에 도시된 홀더와 홀더지지봉의 결합 상태를 도시한 단면도이다.Figure 3 is a perspective view showing a wafer holder of the sheet type semiconductor manufacturing apparatus according to the present invention, Figure 4 is a cross-sectional view showing a coupling state of the holder and the holder support rod shown in FIG.
도 3과 도 4를 함께 참조하면, 본 발명에 따른 웨이퍼 홀더는 매엽식 반도체 제조장치의 챔버 내부에 마련된 서셉터(도 1의 20 참조)의 상부에 위치하도록 설치되며, 상기 챔버 내부로 로딩되는 웨이퍼(10)를 지지하는 것으로, 서로 분리된 적어도 세 개의 홀더(310)를 구비한다.3 and 4 together, the wafer holder according to the present invention is installed to be located above the susceptor (see 20 in FIG. 1) provided in the chamber of the single wafer semiconductor manufacturing apparatus, and is loaded into the chamber. The wafer 10 is supported, and has at least three holders 310 separated from each other.
상기 세 개의 홀더(310)는 상기 웨이퍼(10)의 가장자리부를 3개소에서 지지하기 위해 소정의 간격을 갖도록 서로 분리되어 배치되며, 각각의 일단부에는 웨이퍼(10)의 가장자리부가 안착되는 웨이퍼 안착부(311)가 마련되고, 각각의 타단부에는 스크루 삽입홀(312)이 마련된다. 즉, 본 발명에 따른 웨이퍼 홀더에서는 종래의 웨이퍼 홀더와 달리 세 개의 홀더(310)가 일체로 형성되지 않고 각각 분리되어 제작된다.The three holders 310 are separated from each other to have a predetermined interval to support the edges of the wafer 10 at three locations, and a wafer seating portion in which the edges of the wafer 10 are seated at each end thereof. 311 is provided, and the screw insertion hole 312 is provided in each other end part. That is, in the wafer holder according to the present invention, unlike the conventional wafer holder, the three holders 310 are not formed integrally, but are separately manufactured.
그리고, 상기 세 개의 홀더(310) 각각의 하부에는 이를 지지하기 위한 세 개의 홀더지지봉(30)이 설치되며, 상기 홀더지지봉(30)의 상단부에는 스크루 체결홀(31)이 마련되어 스크루(60)에 의해 상기 세 개의 홀더(310) 각각을 상기 홀더지지봉(30) 각각의 상단부에 결합하게 된다. 상기 홀더지지봉(30)은 브라켓(40)에 의해 지지되며, 상기 브라켓(40)의 중심부에는 소정의 구동수단에 의해 승강하는 승강로드(50)가 결합된다.In addition, three holder support rods 30 are installed at lower portions of the three holders 310, and screw fastening holes 31 are provided at the upper end of the holder support rods 30. By doing so, each of the three holders 310 is coupled to an upper end of each of the holder supporting rods 30. The holder support rod 30 is supported by the bracket 40, and the lifting rod 50 which is lifted by a predetermined driving means is coupled to the center of the bracket 40.
이와 같이, 본 발명에 따른 웨이퍼 홀더에 있어서는 웨이퍼를 지지하는 세 개의 홀더(310)가 서로 분리되어 있으므로, 챔버 내부의 주기적 세척 작업을 위한 홀더(310)의 해체시 전술한 문제점에 의해 어느 하나의 홀더가 파손되더라도 나머지 홀더는 계속 사용할 수 있게 된다. 따라서, 파손된 어느 하나의 홀더만 교체하면 되므로 홀더 교체 비용이 감소하고 그 작업 시간이 단축된다.As described above, in the wafer holder according to the present invention, since the three holders 310 supporting the wafers are separated from each other, any one of the above-mentioned problems may be caused by the above-mentioned problem when dismantling the holder 310 for the periodic cleaning operation in the chamber. Even if the holder is broken, the remaining holders can still be used. Therefore, since only one damaged holder needs to be replaced, the cost of holder replacement is reduced and the working time thereof is shortened.
한편, 상기 홀더(310) 각각의 타단부 저면에는 상기 스크루 삽입홀(312)과 인접하여 돌기(313)가 마련되고, 상기 홀더지지봉(30)의 상단부에는 상기 돌기(313)가 삽입되는 홈(32)이 형성된다. 이에 따라 상기 홀더(310)를 상기 홀더지지봉(30)의 상단부에 결합하게 되면 상기 돌기(313)가 상기 홈(32)에 끼이게 되어 상기 홀더(310)의 웨이퍼 안착부(311)가 좌,우로 움직이지 못하게 되므로, 보다 안정되게 웨이퍼(10)를 지지할 수 있게 된다.On the other hand, the bottom of the other end of each of the holder 310 is provided with a projection 313 adjacent to the screw insertion hole 312, the groove (3) is inserted into the upper end of the holder support rod (30) 32) is formed. Accordingly, when the holder 310 is coupled to the upper end of the holder support rod 30, the protrusion 313 is caught in the groove 32 so that the wafer seating portion 311 of the holder 310 is left, Since it does not move to the right, it is possible to support the wafer 10 more stably.
본 발명은 개시된 실시예를 참고로 설명되었으나, 이는 예시적인 것에 불과하며, 당해 분야에서 통상적 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호 범위는 첨부된 특허청구범위에 의해서 정해져야 할 것이다.Although the present invention has been described with reference to the disclosed embodiments, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.
이상에서 설명한 바와 같이, 본 발명에 따른 매엽식 반도체 제조장치의 웨이퍼 홀더는 서로 분리된 세 개의 홀더를 구비한다. 따라서, 어느 하나의 홀더가 파손되더라도 나머지 홀더는 사용가능하게 되어 홀더 교체 비용이 감소되고, 또한 장치 보전 및 수리 시간이 단축되는 효과가 있다.As described above, the wafer holder of the sheet type semiconductor manufacturing apparatus according to the present invention includes three holders separated from each other. Therefore, even if any one of the holders is broken, the remaining holders can be used, thereby reducing the cost of holder replacement and also shortening the device maintenance and repair time.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990000855A KR20000050772A (en) | 1999-01-14 | 1999-01-14 | Wafer holder of each wafer loading type semiconductor producing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990000855A KR20000050772A (en) | 1999-01-14 | 1999-01-14 | Wafer holder of each wafer loading type semiconductor producing apparatus |
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| Publication Number | Publication Date |
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| KR20000050772A true KR20000050772A (en) | 2000-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019990000855A KR20000050772A (en) | 1999-01-14 | 1999-01-14 | Wafer holder of each wafer loading type semiconductor producing apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100672937B1 (en) * | 2004-07-19 | 2007-01-24 | 삼성전자주식회사 | Apparatus for treating semiconductor substrates |
| KR101016800B1 (en) * | 2009-02-11 | 2011-02-25 | 주식회사 고산 | Radiator cover Fixing jig for silicon sticking system |
-
1999
- 1999-01-14 KR KR1019990000855A patent/KR20000050772A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100672937B1 (en) * | 2004-07-19 | 2007-01-24 | 삼성전자주식회사 | Apparatus for treating semiconductor substrates |
| KR101016800B1 (en) * | 2009-02-11 | 2011-02-25 | 주식회사 고산 | Radiator cover Fixing jig for silicon sticking system |
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