KR20000050288A - Wafer having a projecting part - Google Patents

Wafer having a projecting part Download PDF

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Publication number
KR20000050288A
KR20000050288A KR1019990000021A KR19990000021A KR20000050288A KR 20000050288 A KR20000050288 A KR 20000050288A KR 1019990000021 A KR1019990000021 A KR 1019990000021A KR 19990000021 A KR19990000021 A KR 19990000021A KR 20000050288 A KR20000050288 A KR 20000050288A
Authority
KR
South Korea
Prior art keywords
wafer
center
protruding parts
protrusions
projecting part
Prior art date
Application number
KR1019990000021A
Other languages
Korean (ko)
Inventor
한은수
Original Assignee
윤종용
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019990000021A priority Critical patent/KR20000050288A/en
Publication of KR20000050288A publication Critical patent/KR20000050288A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02035—Shaping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer having a protruding part is provided to improve a yield of a wafer and to secure a coating uniformity in a revolving process, by having at least two protruding parts in a corner portion. CONSTITUTION: A wafer(110) has at least two protruding parts(300) in a corner portion. The protruding parts have different semi diameters for differentiating an upper part of the wafer from a flat zone. And the protruding parts are disposed symmetrical to the center of the wafer.

Description

돌출부를 갖는 웨이퍼 {Wafer having a projecting part}Wafer having a projecting part

본 발명은 웨이퍼의 형태에 관한 것이다.The present invention relates to the shape of a wafer.

현재 웨이퍼의 모양은 플랫 존(flat zone)이 있는 웨이퍼와 노치(notch)가 있는 웨이퍼 두가지가 있다. 웨이퍼에 플랫 존이나 노치를 형성하기 위하여, 웨이퍼의 많은 부분을 잘라내야 한다. 그 결과, 동일반경의 웨이퍼에서 수개의 칩을 손해볼 수 있으며, 플랫 존 부위의 칩들이 웨이퍼의 모서리부분과 가까움으로 인하여 수율이 감소되는 문제점이 있다. 또한, 웨이퍼의 무게중심이 웨이퍼의 중심과 일치하지 않음으로 인하여 회전할 때 진동발생을 유발하여 코팅의 균일성(coating uniformity)에 나쁜 영향을 미친다.Currently, there are two types of wafers: wafers with flat zones and wafers with notches. In order to form flat zones or notches in the wafer, a large portion of the wafer must be cut out. As a result, several chips may be lost in the wafer having the same radius, and the yield of the chips may be reduced due to the proximity of the edges of the wafers to the chips in the flat zone. In addition, the center of gravity of the wafer does not coincide with the center of the wafer, causing vibrations when rotating, which adversely affects the coating uniformity.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 돌출부를 갖는 웨이퍼를 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and an object thereof is to provide a wafer having protrusions.

도 1은 본 발명에 의한 돌출부를 갖는 웨이퍼를 도시한 평면도이다.1 is a plan view showing a wafer having a protrusion according to the present invention.

상기 목적을 달성하기 위한 본 발명의 웨이퍼는 웨이퍼의 모서리 부분에 적어도 둘 이상의 돌출부들을 구비한다.The wafer of the present invention for achieving the above object is provided with at least two protrusions in the corner portion of the wafer.

이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세히 설명한다. 하지만, 본발명은 상술하는 실시예에 한정되는 것은 아니다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the above-described embodiment.

도 1은 본 발명의 실시예에 의해 형성된 웨이퍼의 평면도이다. 도 1을 참조하면, 웨이퍼(110)의 모서리 부분에 돌출부(300)가 형성되어 있으며, 돌출부(300)는 웨이퍼(110)의 중심에 대하여 대칭적으로 배치되어 있다. 따라서, 웨이퍼(110)의 중심은 웨이퍼의 무게 중심과 일치하게 된다. 또한, 돌출부(300)는 둘 이상으로 형성될 수 있으며, 바람직하게는 세 개의 돌출부를 형성하는 것이다. 각 돌출부는 원형으로 형성되는 바람직하며, 이때 각 돌출부의 반경을 달리하여 웨이퍼의 상단부 및 플랫존을 구별할 수 있도록 하는 것이 바람직하다.1 is a plan view of a wafer formed by an embodiment of the invention. Referring to FIG. 1, a protrusion 300 is formed at an edge portion of the wafer 110, and the protrusion 300 is symmetrically disposed with respect to the center of the wafer 110. Thus, the center of the wafer 110 coincides with the center of gravity of the wafer. In addition, the protrusions 300 may be formed in two or more, preferably three protrusions. Each protrusion is preferably formed in a circular shape, and in this case, it is preferable to change the radius of each protrusion so that the top end of the wafer and the flat zone can be distinguished.

이상에서 살펴본 바와 같이 본 발명에 따른 웨이퍼는, 웨이퍼의 전면을 모두 사용할 수 있다. 또한, 종래의 플랫 존을 갖는 웨이퍼보다 수율을 향상시킬수 있다. 또한, 웨이퍼의 중심이 웨이퍼의 무게중심과 일치함으로써 회전할 때의 진동이 플랫 존을 갖는 웨이퍼보다 적고, 그 결과 균일성(uniformity)과 신너 어택(attack)등의 문제가 발생하는 회전이 있는 공정에서 매우 유리할 수 있다.As described above, the wafer according to the present invention may use all the front surfaces of the wafer. In addition, the yield can be improved compared to a wafer having a conventional flat zone. In addition, when the center of the wafer coincides with the center of gravity of the wafer, vibration when rotating is less than that of a wafer with a flat zone, and as a result, a process with rotation that causes problems such as uniformity and thinner attack Can be very advantageous in

Claims (1)

웨이퍼의 모서리 부분에 적어도 둘 이상의 돌출부들을 구비하고, 상기 돌출부는 상기 웨이퍼의 상단부와 플랫 존을 구별하기 위하여 반경을 서로 달리하며, 상기 돌출부들은 상기 웨이퍼의 중심에 대하여 서로 대칭되게 배치되는 것을 특징으로 하는 웨이퍼.At least two protrusions are provided at an edge portion of the wafer, and the protrusions have different radii to distinguish the upper end portion and the flat zone of the wafer, and the protrusions are arranged symmetrically with respect to the center of the wafer. Wafer.
KR1019990000021A 1999-01-02 1999-01-02 Wafer having a projecting part KR20000050288A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019990000021A KR20000050288A (en) 1999-01-02 1999-01-02 Wafer having a projecting part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990000021A KR20000050288A (en) 1999-01-02 1999-01-02 Wafer having a projecting part

Publications (1)

Publication Number Publication Date
KR20000050288A true KR20000050288A (en) 2000-08-05

Family

ID=19570687

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990000021A KR20000050288A (en) 1999-01-02 1999-01-02 Wafer having a projecting part

Country Status (1)

Country Link
KR (1) KR20000050288A (en)

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