KR20000029099A - Board having strip conductor on both sides - Google Patents

Board having strip conductor on both sides Download PDF

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Publication number
KR20000029099A
KR20000029099A KR1019990044691A KR19990044691A KR20000029099A KR 20000029099 A KR20000029099 A KR 20000029099A KR 1019990044691 A KR1019990044691 A KR 1019990044691A KR 19990044691 A KR19990044691 A KR 19990044691A KR 20000029099 A KR20000029099 A KR 20000029099A
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South Korea
Prior art keywords
board
guide member
containing layer
glass
region
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KR1019990044691A
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Korean (ko)
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KR100893418B1 (en
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칼바이트게르하르트
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요한 요트너,헤르베르트 코네감프
만네스만 파우데오 아게
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Publication of KR20000029099A publication Critical patent/KR20000029099A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
  • Level Indicators Using A Float (AREA)
  • Glass Compositions (AREA)

Abstract

PURPOSE: A board having strip conductor arranged at both sides is provided to be sealed off from permeation of gas or fluid by covering at least one side region of the board and a guide member with a layer containing glass. CONSTITUTION: Strip conductors(3,4) arranged at both sides of a board(2), are connected with each other in a hole region(5) through a guide member(6). A guide member region in the outer of a housing(1) and a board region closing by the guide member region, are coated with a layer containing glass(9), thereby eternally sealing a gap(11) between the hole region(5) and the guide member(6). A dielectric paste layer(10) is arranged between the layer containing glass(9), the guide member(6), and a board region closing by the guide member.

Description

양측면에 스트립 도체가 배치된 보오드 {BOARD HAVING STRIP CONDUCTOR ON BOTH SIDES}Board with strip conductors on both sides {BOARD HAVING STRIP CONDUCTOR ON BOTH SIDES}

본 발명은 양측면에 배치된 스트립 도체, 및 상기 스트립 도체를 연결시키며 홀내의 보오드를 관통하는 가이드 부재를 포함하며, 보오드가 밀봉된 하우징의 일부로서 특히 자동차 연료 탱크내에서 연료의 레벨을 검출하기 위한 자기 패시브 위치 센서에 제공되는, 보오드에 관한 것이다.The present invention includes strip conductors disposed on both sides, and a guide member connecting the strip conductors and penetrating the board in the hole, the board being part of a sealed housing, particularly for detecting the level of fuel in an automotive fuel tank. A board is provided, which is provided to a magnetic passive position sensor.

이러한 보오드는 예컨대 독일 특허 공개 제 196 48 539 A1호에 자기 패시브 위치 센서용 하우징의 측벽으로 공지되어 있다. 여기서, 보오드는 세라믹 기판으로 형성된다. 가이드 부재는 예컨대 니벳일 수 있고 홀내로 용융된 납땜 물질로 이루어지며 하우징에 배치된 저항 회로망의 신호를 하우징의 외부에 배치된 접속 콘택으로 전달하기 위해 사용된다. 공지된 보오드에서 저항 회로망 및 접속 콘택은 스트립 도체에 접속된다. 가이드 부재는 대개 강제 끼워맞춤으로 홀내로 삽입된다. 위치 센서의 지속적인 기능을 위해, 적어도 하우징의 외부면에 배치된 스트립 도체가 화학적 영향으로부터 보호되어야 한다. 따라서, 스트립 도체는 대개 은-팔라듐-합금으로 제조된다.Such boards are known, for example, as sidewalls of housings for magnetic passive position sensors in German Patent Publication No. 196 48 539 A1. Here, the board is formed of a ceramic substrate. The guide member may, for example, be a nivet and consists of a brazing material melted into the hole and is used to transmit a signal of a resistance network arranged in the housing to a connection contact arranged outside of the housing. In known boards the resistive network and connecting contacts are connected to the strip conductor. The guide member is usually inserted into the hole by a forced fit. For the continuous functioning of the position sensor, at least strip conductors arranged on the outer surface of the housing must be protected from chemical influences. Thus, strip conductors are usually made of silver-palladium-alloy.

공지된 보오드의 단점은 홀 영역이 확실하게 밀봉되지 않는다는 것이다. 특히, 온도 변동시 및 그로 인해 야기되는 보오드 및 가이드 부재의 상이한 팽창시, 갭이 생기고, 상기 갭을 통해 기체 및 액체가 하우징내로 침투할 수 있다.A disadvantage of the known boards is that the hole area is not tightly sealed. In particular, with temperature fluctuations and with the resulting expansion of the board and the guide member, gaps are created, through which the gas and liquid can penetrate into the housing.

본 발명의 목적은 기체 또는 액체의 침투로부터 확실하게 밀봉되도록 보오드를 형성하는 것이다.It is an object of the present invention to form a board so as to be reliably sealed from the penetration of gas or liquid.

상기 목적은 가이드 부재에 인접한, 보오드의 적어도 한 측면 영역 및 가이드 부재가 유리 함유층으로 커버링됨으로써 달성된다.This object is achieved by covering at least one side region of the board and the guide member adjacent to the guide member with a glass containing layer.

이러한 보오드의 실시예에 의해, 가이드 부재와 홀 사이의 갭이 누설을 야기시키지 않는데, 그 이유는 갭이 유리 함유층에 의해 밀봉되기 때문이다. 따라서, 보오드가 주변 매체에 대해 밀봉된 하우징의 측벽으로 적합하다. 유리 함유층의 제조를 위해, 예컨대 유리 분말, 수지 및 유기 용매를 함유하는 페이스트가 보오드상에 도포될 수 있다. 그리고 나서, 페이스트가 용매 및/또는 수지가 증발할 때까지 가열된다. 세라믹으로 제조된 보오드에서는 페이스트가 홀이 유리층에 의해 코팅될 때까지 가열될 수도 있다. 페이스트의 조성 및 가열 공정에 따라 보오드가 거의 임의의 매체에 대해 확실하게 밀봉될 수 있다.By this embodiment of the board, the gap between the guide member and the hole does not cause leakage, since the gap is sealed by the glass containing layer. Thus, the board is suitable as a side wall of the housing sealed to the surrounding medium. For the preparation of the glass containing layer, for example, a paste containing glass powder, resin and organic solvent can be applied on the board. The paste is then heated until the solvent and / or resin evaporates. In a board made of ceramic, the paste may be heated until the holes are coated by the glass layer. Depending on the composition of the paste and the heating process, the board can be reliably sealed to almost any medium.

유리 함유층이 금속 산화물을 포함하면, 본 발명에 따른 보오드의 밀봉이 보다 개선된다. 또한, 금속 산화물은 가열시 페이스트의 유동 특성을 개선시킨다.If the glass containing layer comprises a metal oxide, the sealing of the board according to the invention is further improved. In addition, metal oxides improve the flow characteristics of the paste upon heating.

예컨대, 정전 방전에 의한 전자 부품의 손상을 막기 위해, 보오드의 스트립 도체가 종종 유전체 페이스트로 코팅된다. 유리 함유층이 전류를 통과시키지 않기 때문에, 유전체 페이스트에 의한 코팅이 생략될 수 있다. 그러나, 가이드 부재와 유리 함유층 사이에 유전체 페이스트층이 배치되면, 전자 부품이 제조 공정 동안 유리 함유층의 가열 전에 정전 방전으로부터 확실하게 보호된다.For example, to prevent damage to electronic components by electrostatic discharge, strip conductors of boards are often coated with a dielectric paste. Since the glass containing layer does not pass current, the coating with the dielectric paste can be omitted. However, if a dielectric paste layer is disposed between the guide member and the glass containing layer, the electronic component is reliably protected from electrostatic discharge before heating of the glass containing layer during the manufacturing process.

유리 함유층은 예컨대 완전히 용융된 유리로 이루어질 수 있다. 본 발명의 다른 바람직한 실시예에 따라, 유리 함유층이 수지 결합제를 포함하면 그것이 특히 확실한 접착 특성을 갖는다. 또한, 유리 함유층의 수지가 탄성을 주기 때문에, 온도 변동이 유리 함유층의 균열을 일으킬 수 없다. 상기 실시예의 다른 장점은 수지에 의해 유리 함유층의 가열 온도가 감소될 수 있다는 것이다.The glass containing layer may for example consist of completely molten glass. According to another preferred embodiment of the invention, if the glass containing layer comprises a resin binder, it has particularly certain adhesive properties. In addition, since the resin of the glass-containing layer gives elasticity, temperature fluctuations cannot cause cracking of the glass-containing layer. Another advantage of this embodiment is that the heating temperature of the glass containing layer can be reduced by the resin.

도 1은 하우징(1)의 측벽으로 사용되는 본 발명에 따른 보오드(2)의 단면도이다.1 is a cross-sectional view of a board 2 according to the invention used as a side wall of the housing 1.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1: 하우징 2: 보오드1: housing 2: board

3, 4: 스트립 도체 5: 홀3, 4: strip conductor 5: hole

6: 가이드 부재 7: 저항 스트립6: guide member 7: resistance strip

8: 전기 라인 9: 유리 함유층8: electric line 9: glass containing layer

10: 유전체 페이스트층 11: 갭10: dielectric paste layer 11: gap

본 발명은 다양한 실시예가 가능하다. 그 중 한 실시예가 도시된 도면을 참고로 본 발명을 구체적으로 설명한다. 도 1은 하우징(1)의 측벽으로 사용되는 본 발명에 따른 보오드(2)의 단면도이다. 보오드(2)는 예컨대 자기 패시브 위치 센서의 일부일 수 있고 자동차 연료 탱크내의 레벨 센서에 사용될 수 있다.The present invention is capable of various embodiments. One embodiment of the present invention will be described in detail with reference to the drawings. 1 is a cross-sectional view of a board 2 according to the invention used as a side wall of the housing 1. The board 2 may be part of a magnetic passive position sensor, for example, and may be used for a level sensor in an automobile fuel tank.

보오드(2)는 세라믹으로 제조되며 양측면에 각각 스트립 도체(3, 4)를 포함한다. 스트립 도체(3, 4)는 홀(5) 영역에서 가이드 부재(6)를 통해 서로 연결된다. 가이드 부재(6)는 예컨대 니벳이거나 또는 납땜 물질로 이루어질 수 있다. 하우징(1)의 내부면에 배치된 스트립 도체(3)는 저항 스트립(7)에 접속된다. 하우징(1)의 외부면에 배치된 스트립 도체(4)는 전기 라인(8)을 접속하기 위해 사용된다. 연료 탱크용 레벨 센서의 일부로 사용되는 보오드(2)에서 하우징(1)의 외부면이 연료와 접촉하기 때문에, 스트립 도체(4)가 연료에 대해 내성을 갖는 재료, 예컨대 은-팔라듐-합금으로 제조된다.The board 2 is made of ceramic and comprises strip conductors 3 and 4 on both sides, respectively. The strip conductors 3, 4 are connected to each other via a guide member 6 in the region of the hole 5. The guide member 6 may be for example nivet or made of a brazing material. The strip conductor 3 arranged on the inner surface of the housing 1 is connected to the resistance strip 7. Strip conductors 4 arranged on the outer surface of the housing 1 are used to connect the electrical lines 8. In the board 2 used as part of the level sensor for the fuel tank, since the outer surface of the housing 1 is in contact with the fuel, the strip conductor 4 is made of a material which is resistant to fuel, such as silver-palladium-alloy do.

하우징(1)의 외부에 있는 가이드 부재(6) 영역 및 이것에 인접한 보오드(2) 영역은 유리 함유층(9)으로 코팅된다. 유리 함유층(9) 및 가이드 부재(6) 및 이것에 인접한 보오드(2) 영역 사이에는 유전체 페이스트층(10)이 배치된다. 상기 층(10)은 제조 공정 동안 하우징(1)의 내부에 있는 도시되지 않은 전자 부품을 보호하기 위해 사용된다. 유리 함유층(9)은 가이드 부재(6), 및 유전체 페이스트층(10)에 의해 커버링된 보오드(2) 영역을 커버링한다. 이로 인해, 홀(5)과 가이드 부재(6) 사이에 있는 갭(11)이 영구적으로 밀봉된다.The region of the guide member 6 on the outside of the housing 1 and the region of the board 2 adjacent thereto are coated with a glass containing layer 9. The dielectric paste layer 10 is disposed between the glass containing layer 9 and the guide member 6 and the area of the board 2 adjacent thereto. The layer 10 is used to protect electronic components not shown in the interior of the housing 1 during the manufacturing process. The glass containing layer 9 covers the region of the board 2 covered by the guide member 6 and the dielectric paste layer 10. This permanently seals the gap 11 between the hole 5 and the guide member 6.

보오드의 밀봉을 위해, 가이드 부재(6)를 홀(5)내로 삽입한 후에 유전체 페이스트 층(10)이 주어진 장소에 가압된다. 그리고 나서, 상기 층(10)이 가열된다. 보오드(2)의 냉각 후에, 유리 분말, 금속 산화물 및 용매 중에 용해된 수지로 이루어진 페이스트가 유리 함유층(9)으로 코팅되어야 하는 영역에 도포된 다음, 가열된다. 이로 인해 형성된 층(9)의 상태는 가열 온도 및 가열 지속 시간 그리고 페이스트의 조성에 의해 세팅될 수 있다. 유전체 페이스트 및 유리 분말 페이스트의 도포는 예컨대 실크 스크리닝 방법에 의해 이루어질 수 있다.For sealing of the board, the dielectric paste layer 10 is pressed to a given place after inserting the guide member 6 into the hole 5. Then, the layer 10 is heated. After cooling of the board 2, a paste made of a glass powder, a metal oxide and a resin dissolved in a solvent is applied to the area to be coated with the glass containing layer 9 and then heated. The state of the layer 9 thus formed can be set by the heating temperature and the heating duration and the composition of the paste. Application of the dielectric paste and the glass powder paste can be made by, for example, a silk screening method.

본 발명에 의해 기체 또는 액체의 침투로부터 확실하게 밀봉되는 보오드가 형성된다.The present invention forms a board that is securely sealed from the penetration of gas or liquid.

Claims (4)

양측면에 배치된 스트립 도체, 및 상기 스트립 도체를 연결시키며 홀내의 보오드를 관통하는 가이드 부재를 포함하며, 보오드가 밀봉된 하우징의 일부로서 특히 자동차 연료 탱크내에서 연료의 레벨을 검출하기 위한 자기 패시브 위치 센서에 제공되는, 보오드에 있어서, 가이드 부재(6)에 인접한, 보오드(2)의 적어도 한 측면 영역 및 가이드 부재(6)가 유리 함유층(9)으로 커버링되는 것을 특징으로 하는 보오드.A magnetic passive position for detecting the level of fuel, in particular in an automotive fuel tank, as part of a housing in which the board is sealed, comprising a strip conductor disposed on both sides, and a guide member connecting the strip conductor and penetrating the board in the hole. The board, provided in the sensor, characterized in that at least one side region of the board (2) and the guide member (6), which are adjacent to the guide member (6), are covered with a glass-containing layer (9). 제 1항에 있어서, 유리 함유층(9)이 금속 산화물을 포함하는 것을 특징으로 하는 보오드.The board according to claim 1, wherein the glass-containing layer (9) comprises a metal oxide. 제 1항 또는 2항에 있어서, 가이드 부재(6) 및 유리 함유층(9) 사이에 유전체 페이스트층(10)이 배치되는 것을 특징으로 하는 보오드.The board according to claim 1 or 2, characterized in that a dielectric paste layer (10) is arranged between the guide member (6) and the glass containing layer (9). 제 1항 또는 제 2항에 있어서, 유리 함유층(10)이 수지 결합제를 포함하는 것을 특징으로 하는 보오드.The board according to claim 1 or 2, wherein the glass-containing layer (10) comprises a resin binder.
KR1019990044691A 1998-10-15 1999-10-15 Board having strip conductor on both sides KR100893418B1 (en)

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DE19847537A DE19847537A1 (en) 1998-10-15 1998-10-15 Circuit board with conductor tracks arranged on both sides

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US4050621A (en) * 1976-11-03 1977-09-27 Bunker Ramo Corporation Method and apparatus for soldering electric terminals to double-sided circuit boards
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JPH069307B2 (en) * 1987-07-23 1994-02-02 松下電器産業株式会社 Method for manufacturing composite circuit board
GB8823706D0 (en) * 1988-10-10 1988-11-16 Alcan Int Ltd Microfilter device
US5234970A (en) * 1991-07-16 1993-08-10 W. R. Grace & Co.-Conn. Dual curing composition based on isocyanate trimer and use thereof
US5252858A (en) * 1991-11-18 1993-10-12 Delco Electronics Corporation Refractory covercoat for semiconductor devices
DE4318339A1 (en) * 1993-06-02 1994-12-08 Philips Patentverwaltung Sealed via for a ceramic substrate of a thick-film circuit and a method for producing the same
DE4338744A1 (en) * 1993-11-12 1995-05-18 Bosch Gmbh Robert Printed circuit board with conduction paths
KR0144634B1 (en) * 1994-12-30 1998-07-01 김준성 Field emission display with double sealing structure and manufacturing method thereof
DE19648539C2 (en) * 1996-11-25 2000-04-13 Mannesmann Vdo Ag Passive magnetic position sensor
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DE19847537A1 (en) 2000-05-04
EP0996320B1 (en) 2003-01-22

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