JPS60211345A - Terminal structure of ceramic substrate - Google Patents

Terminal structure of ceramic substrate

Info

Publication number
JPS60211345A
JPS60211345A JP59068895A JP6889584A JPS60211345A JP S60211345 A JPS60211345 A JP S60211345A JP 59068895 A JP59068895 A JP 59068895A JP 6889584 A JP6889584 A JP 6889584A JP S60211345 A JPS60211345 A JP S60211345A
Authority
JP
Japan
Prior art keywords
ceramic substrate
platinum
terminal structure
electrode wire
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59068895A
Other languages
Japanese (ja)
Other versions
JPH0479538B2 (en
Inventor
Akio Takami
高見 昭雄
Toshitaka Matsuura
松浦 利孝
Akira Nakano
中野 昭
Yoshiaki Kuroki
義昭 黒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Togyo KK
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Nippon Tokushu Togyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd, Nippon Tokushu Togyo KK filed Critical NGK Spark Plug Co Ltd
Priority to JP59068895A priority Critical patent/JPS60211345A/en
Publication of JPS60211345A publication Critical patent/JPS60211345A/en
Publication of JPH0479538B2 publication Critical patent/JPH0479538B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE:To constitute heat-resisting and vibration-resisting terminal structure by connecting a metallic wire consisting principally of platinum, etc., and a lead wire which is curved locally to a ceramic substrate, and protecting their connection parts with a glass material. CONSTITUTION:An electrode pattern is printed with platinum paste on a green sheet 40 consisting principally of alumina and baked. Then, platinum wires 48- 50 are arranged on the electrode pattern. Then, a green sheet 41 is laminated on the green sheet 40 and bonded by thermocompression. An opening part 51 is formed in part of the green sheet 41 and a detecting element 11 is provided. Then the platinum wires 48-50 are welded to metallic wires (plate) 51-53 of nickel, etc., to form a terminal part, and those metallic wires 51-53 are curved. The terminal part is sealed with the glass material to form a protection layer, thus constituting the ceramic substrate. Thus, the metallic wires 51-53 are curved and the terminal part is protected with the glass material, so the heat- resisting and vibration-resisting terminal structure is obtained and there is no stress concentration when the metallic wires are extended, so that the metallic wires increase in strength.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミック基板の端子構造に関するものである
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal structure for a ceramic substrate.

〔従来技術〕[Prior art]

従来より、セラミック材からなる基板上に金又は白金族
の貴金属を主体とした貴金属ペーストにテハターンを形
成し、焼結することによって、電子回路の小型化、計量
化を図るといったことが行なわれている。
Conventionally, electronic circuits have been miniaturized and weighed by forming a Tehaturn on a substrate made of ceramic material in a noble metal paste mainly made of gold or a precious metal of the platinum group and sintering it. There is.

ここで、この種のセラミック基板における信号を入・出
力するための端子構造としてlマ1例えば第1図に図示
する如く、基板1の端面に上記貴金属ペーストにて電極
パターン2を形成し、銅等からなる通常のリード線3を
半田付けAするようにしているもの、あるいは第2図に
示す如(、セラミック基板4に形成された上記貴金属ペ
ーストのパターン5上に、貴金属からなるリード線1例
えば白金リード線6を設け、その上からセラミック板7
を密着し、一体焼結させることによってこの白金リード
線6を端子とするものがある。
Here, as a terminal structure for inputting and outputting signals on this type of ceramic substrate, an electrode pattern 2 is formed on the end surface of the substrate 1 using the noble metal paste, as shown in FIG. Or, as shown in FIG. For example, a platinum lead wire 6 is provided, and a ceramic plate 7 is placed on top of the platinum lead wire 6.
There is a method in which this platinum lead wire 6 is used as a terminal by closely contacting the wires and sintering them together.

ところで上記前者の半田付けによる端子構造の場合、リ
ード線3に外力が加わったり基板自体が振動するような
場合には、電極パターン2と基板1との間が剥がれると
もζつた問題があり、また半田付けによる接続であるた
め高温での使用は不可能であった。一方上記後者の白金
リード線を用いてセラミック基板と一体成形した場合に
は、耐熱性は有するのであるが白金自体強度が小さいこ
とからリード線に外力が加わったり、振動するような場
所では使用することができなかった。
However, in the case of the former terminal structure by soldering, there is a problem that the electrode pattern 2 and the substrate 1 may peel off when an external force is applied to the lead wire 3 or the substrate itself vibrates. Since the connection was made by soldering, it was impossible to use it at high temperatures. On the other hand, if the latter type of platinum lead wire is used and integrally molded with a ceramic substrate, it has heat resistance, but platinum itself has low strength, so it cannot be used in places where external force is applied to the lead wire or where it vibrates. I couldn't.

〔発明の目的〕[Purpose of the invention]

そこで本発明は、耐熱性を有すると共に高強度のセラミ
ック基板の端子構造を提供することによって、セラミッ
ク基板を高温、高振動の場所に設置したような場合にも
充分に耐え得るようにすることを目的としている。
Therefore, the present invention aims to provide a terminal structure for a ceramic substrate that has heat resistance and high strength so that it can sufficiently withstand even when the ceramic substrate is installed in a place with high temperatures and high vibrations. The purpose is

〔発明の構成〕[Structure of the invention]

かかる目的を達するための本発明の構成は。 The structure of the present invention is to achieve this purpose.

セラミック基板に一体形成された導電部に接続され、焼
紳固噛された白金族を主成分とする第1の電極線と。
A first electrode wire whose main component is a platinum group metal which is connected to a conductive portion integrally formed on a ceramic substrate and is hard-fired.

上記第1の電極線と接合された一部わん曲された第2の
電極線と。
a partially curved second electrode wire joined to the first electrode wire;

上記第1の電極線と第2の電極線との接合部分及び上記
基板の一部を覆うガラス材からなる電極保護層と。
an electrode protective layer made of a glass material that covers a joint portion between the first electrode wire and the second electrode wire and a part of the substrate;

を有するセラミック基板の端子構造を要旨としている。The gist of this paper is the terminal structure of a ceramic substrate having the following characteristics.

ここで上記第1の電極線として白金族を主成分とするも
のとしたのは、セラミック基板の導電部と焼結晶固着す
る際に他の金属では酸化されてしまい使用できなくなる
からであって、この電極線は白金、イリジウム、パラジ
ウム、ルテニウム。
Here, the reason why the first electrode wire is made of a platinum group metal as a main component is that other metals will be oxidized and become unusable when the fired crystal is fixed to the conductive part of the ceramic substrate. This electrode wire is made of platinum, iridium, palladium, and ruthenium.

ロジウム、オスミウムの白金族のものであればよ(、特
に耐熱性と価格の点で白金を用いた方が望ましい。
It is preferable to use platinum group metals such as rhodium and osmium (platinum is particularly preferable in terms of heat resistance and cost).

また、上記第2の電極線はCu、 Fe 、 Ni又は
それらの合金が適しその理由はコスト強度、耐熱性の点
から適しているからである。このうちNi又はNi合金
が耐熱性もつとも適して・いるが、入電流を必要とする
場合はCuを使用する。
Moreover, Cu, Fe, Ni, or an alloy thereof is suitable for the second electrode wire because it is suitable from the viewpoint of cost strength and heat resistance. Among these, Ni or Ni alloy is suitable because of its heat resistance, but Cu is used when an input current is required.

更に第2の電極線を一部わん曲されたものとした理由は
、複数のリード線の場合、リード間に長さの違いが生じ
ると、リードを引っ張ったとき。
Furthermore, the reason why the second electrode wire is partially bent is that in the case of multiple lead wires, if there is a difference in length between the leads, when the leads are pulled.

もつとも短い1本に応力が集中し、リード引張りの耐力
が低いが平形電極線を成形するとき1部にわん曲部を設
けることにより、1本のリードに応力が集中したとき、
このわん曲部が伸び複数のリードに均一に応力がかかり
応力の集中を防ぎ安定したリード強度を有するセンサー
を提供することができるからである。
However, when stress is concentrated on one lead, which is short and has low lead tensile strength, by providing a curved part in one part when forming a flat electrode wire, when stress is concentrated on one lead,
This is because the curved portion stretches and applies stress uniformly to the plurality of leads, thereby preventing concentration of stress and providing a sensor having stable lead strength.

次にガラス材としてはホウケイ酸ガラス、リン酸ガラス
、ホウ酸鉛ガラス等を用いることができ。
Next, as the glass material, borosilicate glass, phosphate glass, lead borate glass, etc. can be used.

そのうちでも特に低温でシーWIJしでき一金具の酸化
消耗が少なくなることからホウ酸鉛ガラスを用いること
が好ましい。
Among these, it is particularly preferable to use lead borate glass because it can be sealed at low temperatures and the oxidation wear and tear of the metal fittings is reduced.

〔実施例〕〔Example〕

以下1本発明の端子構造を有するセラミック基板をガス
成分又はその濃度を検出する検出部とし。
In the following, a ceramic substrate having a terminal structure according to the present invention will be used as a detection section for detecting a gas component or its concentration.

内燃機関の排気中の酸素濃度を検出する酸素センサに適
用した場合を例にとり説明する。
An example in which the present invention is applied to an oxygen sensor that detects the oxygen concentration in the exhaust gas of an internal combustion engine will be explained.

第3図は酸素センサの部分断面側面図である。FIG. 3 is a partially sectional side view of the oxygen sensor.

図において10はセラミック基板上に検出素子11を備
え、酸素濃度を検出するための検出部、12は検出部1
0を把持すると共に本センサを内燃機関に取り付けるた
めの筒状に形成された主体金具。
In the figure, reference numeral 10 is a detection unit that includes a detection element 11 on a ceramic substrate and detects oxygen concentration, and 12 is a detection unit 1.
A metal shell formed in a cylindrical shape for holding the sensor and attaching the sensor to an internal combustion engine.

13は主体金具12の内燃機関側先端部12aに取り付
けられ、検出部10を保護するためのプロテクタ、・1
4は主体金具12と共に検出部10を把持するための内
筒であり、検出部lOはスペーサ15、充填粉末16及
びガラスシール17を介して主体金具12及び内筒14
に把持されている。
13 is a protector attached to the internal combustion engine side tip 12a of the metal shell 12 to protect the detection section 10;
4 is an inner cylinder for holding the detection part 10 together with the metal shell 12;
is being held by.

また主体金具12の外周には内燃機関取付用のねじ部1
2bが刻設されて8す、内燃機関壁面当接部分には排気
が漏れないようガスケット18が設けられている。
Further, the outer periphery of the metal shell 12 has a threaded portion 1 for attaching the internal combustion engine.
A gasket 18 is provided at the portion where the internal combustion engine is in contact with the wall surface to prevent exhaust gas from leaking.

ここで充填粉末16は滑石及びガラスの1=1の混合粉
末からなり、検出部lOを内筒14内に固定するための
もの、ガラスシール17は低融点ガラスからなり、検出
ガスの漏れを防止すると共に検出部10の端子を保護す
るように、検出部lOの基板の一部及び後述する白金リ
ード線と端子との接続部を覆い・内筒14内に充填され
ている。
Here, the filling powder 16 is made of a mixed powder of talc and glass in a ratio of 1=1, and is used to fix the detection part 10 in the inner cylinder 14, and the glass seal 17 is made of low melting point glass to prevent leakage of the detection gas. At the same time, in order to protect the terminals of the detecting section 10, a part of the substrate of the detecting section 10 and a connecting portion between a platinum lead wire and the terminal, which will be described later, are covered and filled in the inner cylinder 14.

・尚、このガラスシール17は1本発明を構成する電極
v1.護層に相当する。
-This glass seal 17 is one electrode v1. which constitutes the present invention. Corresponds to the protective layer.

19は内筒14を覆うように主体金具12に取り付けら
れる外筒、20はシリコンゴムからなるシール材であっ
て、一部わん曲51,52.53したリード線21ない
し23と、第4図に示すガラスシール17より突出され
た検出部10からの端子31ないし33との接続部を絶
縁保護するためのものである。またこのリード線21な
いし23と端子31ないし33との接続は、第5図に示
す如く、予め外筒19内にシール材20及びリード線2
1ないし23を収めると共に、各リード線21ないし2
3の先端に加締金具24ないし26を接続し、その後加
締金具24ないし26を端子31ないし33と加締接続
することによって行なわれる。尚、上記端子31ないし
33は本発明を構成する第2の電極線に相当する。
19 is an outer cylinder attached to the metal shell 12 so as to cover the inner cylinder 14, 20 is a sealing material made of silicone rubber, and lead wires 21 to 23 are partially curved 51, 52, 53; This is for insulating and protecting the connection portions from the detection unit 10 to the terminals 31 to 33 that protrude from the glass seal 17 shown in FIG. The connections between the lead wires 21 to 23 and the terminals 31 to 33 are made in advance by placing a sealing material 20 and the lead wires 20 in the outer cylinder 19, as shown in FIG.
1 to 23, and each lead wire 21 to 2.
This is done by connecting the crimping fittings 24 to 26 to the tips of the terminals 3, and then crimping the crimping fittings 24 to 26 to the terminals 31 to 33. Note that the terminals 31 to 33 correspond to the second electrode wires constituting the present invention.

次に検出部10は第6図ないし第9図に示す如き手順に
−って作成される。尚、第6図ないし第9図に示す(イ
)は検出部10の正面図を示し。
Next, the detection section 10 is created according to the procedure shown in FIGS. 6 to 9. Note that (A) shown in FIGS. 6 to 9 shows a front view of the detection unit 10.

(ロ)はA−A線断面図を示している。(b) shows a sectional view taken along line A-A.

ここで上記第6図ないし第9図の各図において。Here, in each of the above-mentioned figures 6 to 9.

40及び41は平均粒径1.5μ雇のA120392重
量% S so 24重量%、 CaO2重量%及びM
g02重量%からなる混合粉末100重量部に対してブ
チラール樹脂12重量部及びジブチルフタレート(DB
P)6重量部を添加し、有機溶剤中で混合してスラリー
とし、ドクターブレードを用いて形成されたグリーンシ
ートであり、グリーンシート40は厚さ1m++、グリ
ーンシート41は厚さ0.2閣に予め作成されたもので
ある。また42ないし47はPtに対し796のAl2
O3を添加した白金ペーストで厚膜印刷したパターンで
あって前述の導電部に相当し、42及び43は検出素子
11の電極となる電極パターン、14は検出素子11を
加熱するためのヒータとなる発熱抵抗体パターン、45
ないし47は発熱抵抗体パターン44や検出素子11に
電源を印加あるいは検出信号を抽出するための電極パタ
ーンである。
40 and 41 are A120392 weight% with an average particle size of 1.5μ, Sso 24 weight%, CaO2 weight% and M
12 parts by weight of butyral resin and dibutyl phthalate (DB
P) 6 parts by weight, mixed in an organic solvent to form a slurry, and formed using a doctor blade. Green sheet 40 has a thickness of 1 m++, and green sheet 41 has a thickness of 0.2 mm. It was created in advance. Also, 42 to 47 are 796 Al2 for Pt.
It is a pattern printed with a thick film using platinum paste added with O3, and corresponds to the above-mentioned conductive part, 42 and 43 are electrode patterns that serve as electrodes of the detection element 11, and 14 serves as a heater for heating the detection element 11. Heat generating resistor pattern, 45
47 are electrode patterns for applying power to the heating resistor pattern 44 and the detection element 11 or for extracting a detection signal.

本検出部10の製造は、第6図に示す如(、まずグリー
ンシート40上に上記42ないし47の各パターンを白
金ペーストで厚膜印刷することにより始められ1次いで
第7図に示す如(、電極パターン45ないし47上に直
径0.2 wsの白金リード線48ないし50が夫々配
設される。
The manufacturing of the present detection unit 10 is started by thick-film printing the patterns 42 to 47 on a green sheet 40 using platinum paste, as shown in FIG. 6, and then as shown in FIG. , platinum lead wires 48 to 50 having a diameter of 0.2 ws are disposed on the electrode patterns 45 to 47, respectively.

次に第8図から明らかな如く、グリーンシート41にM
極パターン42及び43の先端部が露出するよう打ち抜
きによって開口51が形成され。
Next, as is clear from FIG.
Openings 51 are formed by punching so that the tips of the pole patterns 42 and 43 are exposed.

電極パターン42及び43の先端部を除(全てのパター
ンを覆うべく、グリーンシート40上にグリーンシート
41が積層熱圧着される。ここで上記白金リード線48
ないし50は1本発明を構成する第1の電極線に相当し
、積層熱圧着後もその一部は外部に突出される。
A green sheet 41 is laminated and thermocompressed onto the green sheet 40 to cover all the patterns except for the tips of the electrode patterns 42 and 43.
Reference numerals 50 to 50 correspond to the first electrode wires constituting the present invention, and even after the lamination and thermocompression bonding, a portion thereof is projected to the outside.

このようにして、白金リード線48ないし50の一部が
突出され、電極パターン42及び43の先端部が露出さ
れた積層板が作成されると、今度はこの積層板1500
℃の大気中に2時間放置することによって、セラミック
基板が焼成される。
In this way, a laminated plate in which a portion of the platinum lead wires 48 to 50 are protruded and the tips of the electrode patterns 42 and 43 are exposed is created, and this laminated plate 1500
The ceramic substrate is fired by leaving it in the atmosphere at .degree. C. for 2 hours.

次に第9図に示す如く、上記焼成されたセラミック基板
の開口51に検出素子11を設けることとなるのである
が、この検出素子11は平均粒径1.2μmのTiO粉
末100モル部に対し1モル部の白金ブラックを添加し
、更に全粉末に対して3重量%のエチルセルロースを添
加しブチルカルピトール(2−(2−ブトキシエトキシ
)エタノールの商品名)中で混合し300ボイズに粘度
調整したTiO□ペーストを、開口49を充塞しかつ電
極パターン42及び43の先端に被着するよう厚膜印刷
した後、1200℃の大気中に1時間放置して焼き付け
ることによって形成される。
Next, as shown in FIG. 9, a detection element 11 is provided in the opening 51 of the fired ceramic substrate. Add 1 mole part of platinum black, and further add 3% by weight of ethyl cellulose based on the total powder, mix in butylcarpitol (trade name of 2-(2-butoxyethoxy)ethanol) and adjust the viscosity to 300 voids. The TiO□ paste is printed as a thick film so as to fill the opening 49 and adhere to the tips of the electrode patterns 42 and 43, and then left in the atmosphere at 1200° C. for 1 hour and baked.

このようにして作成された検出部10の、外部に突出さ
れた白金リード線48ないし50と端子31ないし33
との接続は第1O図に示す如(行なわれる。尚1図にお
いて(イ)は正面図、(ロ)ハ右側面図を示゛している
The platinum lead wires 48 to 50 and the terminals 31 to 33 protruding to the outside of the detection unit 10 thus created
The connection is made as shown in FIG. 1O. In FIG. 1, (a) shows a front view and (b) shows a right side view.

第10図に示す如(、端子31ないし33は予め厚さ0
.3 rtasのニッケル板にエツチング加工によって
一体形成されており、各端子を白金リード線48ないし
50に夫々配設し、その部分をスボッ条溶接することに
よって端子の接合が行なわれる。
As shown in FIG.
.. The terminals are integrally formed by etching on a nickel plate of 3 RTAS, and the terminals are joined by placing each terminal on the platinum lead wires 48 to 50, respectively, and welding the parts with a strip weld.

ここでこの白金リード線と端子との接合は熱や撮動によ
って外れることがなければどのような接続方法であって
もよく、また端子31ないし33が一体形成されたニッ
ケル板は検出部lOが主体金具12に固定され、その後
検出部10の基板の一部及び白金リード線48ないし5
0と端子31ないし33との接合部分がガラスシール1
°7によって保護さね、内筒14内lと固定された後に
所定の長さに切断される。
Any connection method may be used to connect the platinum lead wire and the terminal as long as it does not come off due to heat or photography, and the nickel plate on which the terminals 31 to 33 are integrally formed has a detection part lO. It is fixed to the metal shell 12, and then a part of the substrate of the detection unit 10 and the platinum lead wires 48 to 5 are fixed to the metal shell 12.
The joint between 0 and terminals 31 to 33 is glass seal 1.
After being secured to the inside of the inner cylinder 14 by the protective ring 7, it is cut to a predetermined length.

そして端子31及び端子33間に加熱用の電源を印加す
ることによって発熱抵抗体パターン44を加熱し、検出
素子11を活性化させ、端子32及び端子33間の抵抗
値の変化を検出することによって、酸素濃度を検知する
ことができるようになる。
Then, by applying a heating power source between the terminals 31 and 33, the heating resistor pattern 44 is heated, the detection element 11 is activated, and a change in the resistance value between the terminals 32 and 33 is detected. , it becomes possible to detect oxygen concentration.

以上本実施例の酸素センサにおけるセラミック基板の端
子構造は、セラミック基板と一体形成された白金リード
線と、ニッケル板からなる端子とを、スポット溶接によ
って接合し、更にその接合部分をセラミック基板と共に
円筒内に低融点ガラスを用いて固定し保護するようにし
ている。従って白金リード線と端子との接合部分は熱に
よって外れることがな(、また白金リード線も低融点ガ
ラスにて補強されることとなるので振動にも強(。
As described above, the terminal structure of the ceramic substrate in the oxygen sensor of this embodiment is such that a platinum lead wire integrally formed with the ceramic substrate and a terminal made of a nickel plate are joined by spot welding, and the joined part is formed into a cylindrical shape together with the ceramic substrate. It is fixed and protected using low-melting glass inside. Therefore, the joint between the platinum lead wire and the terminal will not come off due to heat (and since the platinum lead wire is also reinforced with low-melting glass, it is resistant to vibrations).

さらに端子に一部わん曲したニッケル板を使用している
ので端子自体が劣化するといったことも防止できる。更
に電極線を一部わん曲されたものとしたためリード間に
長さの違いがあっても、リードを引張ったときもつとも
短い1本のわん曲部か伸び複数のリードに均一に応力が
か−り、応力の集中を防ぎ安定した+3−)/強度を有
するもあである。これを確めるために、引張り切断強度
を測定したところ、切断強度が直線のものは平均38k
y。
Furthermore, since the terminal uses a partially curved nickel plate, it is possible to prevent the terminal itself from deteriorating. Furthermore, because the electrode wires are partially bent, even if there are differences in length between the leads, when the leads are pulled, one short curved part will stretch or the stress will be applied uniformly to the multiple leads. This material prevents stress concentration and has stable +3-)/strength. To confirm this, we measured the tensile cutting strength and found that the straight cutting strength was 38k on average.
y.

最低で17kgであるのに対しわん曲したものは平均4
0ky最低35kyで、特に最低強度の高い効果があっ
た。このため本酸素センサは耐熱性、耐振性及び耐久性
を有するものとなり、内燃機関のような高温でかつ高振
動の場所にでも充分に耐え得るようになる。
The minimum weight is 17 kg, while the curved one weighs an average of 4.
There was a particularly high effect of minimum strength at 0ky and minimum of 35ky. Therefore, the present oxygen sensor has heat resistance, vibration resistance, and durability, and can sufficiently withstand even high-temperature and high-vibration locations such as internal combustion engines.

〔発明の効果〕〔Effect of the invention〕

以上詳述した如(1本発明のセラミック基板の端子構造
においては、セラミック基板に焼成固着された白金族の
電極線と、ニッケル又はニッケル合金からなる電極線と
を接合し、更にセラミック基板の一部を含む接合部をガ
ラス材からなる保護層により1呆護するようにしている
。従って熱や振動に強(、セラミック基板を高温でかつ
振動する場所に設置した場合にも充分耐え得る端子構造
とすることができ、耐久性のある端子構造を提供するこ
とができるようになる。
As detailed above (1) In the terminal structure of the ceramic substrate of the present invention, a platinum group electrode wire baked and fixed to the ceramic substrate and an electrode wire made of nickel or nickel alloy are bonded, and The joints, including the parts, are protected by a protective layer made of glass material.Therefore, the terminal structure is resistant to heat and vibration (and has a terminal structure that can withstand even when the ceramic board is installed in a high-temperature and vibrating place). This makes it possible to provide a durable terminal structure.

尚本実施例ではニッケル線を用いたが1本発明はこれに
こだわることな(C,u、 Feや又はNiとの合金を
用いることもできる。
Although a nickel wire is used in this embodiment, the present invention is not limited to this; alloys with C, u, Fe, or Ni may also be used.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は従来のセラミック基板の端子構造を
示す斜視図、第3図ないし第10図は本発明の端子構造
を酸素センサに適用した実施例を示し、第3図ないし第
5図は本センサの構造を示す部分断面図、第6図ないし
第9図は検出部10の組み立て工程を示す正面図(イ)
及びA−A線断面図(ロ)、第1O図は電極線と端子と
の接続を示す正面図(イ)及び右側面図(ロ)である。 10・・・検出部 17・・・ガラスシール 31.32.33・・・端子 48.49.50・・・白金リード線 51.52.53・・・わん曲部 III図 第2図 II3図 9 第4図 1!5図 第6図 @7図 (イ) (イ) (ロ) (ロ) 第8図 第9図 (イ) (イ) 第10図 (イ) (ロ)
1 and 2 are perspective views showing the terminal structure of a conventional ceramic substrate, FIGS. 3 to 10 show an embodiment in which the terminal structure of the present invention is applied to an oxygen sensor, and FIGS. The figure is a partial sectional view showing the structure of this sensor, and Figures 6 to 9 are front views (A) showing the assembly process of the detection unit 10.
10 is a front view (a) and a right side view (b) showing the connection between the electrode wire and the terminal. 10...Detection part 17...Glass seal 31.32.33...Terminal 48.49.50...Platinum lead wire 51.52.53...Curved part III Figure 2 Figure II 3 9 Figure 4 Figure 1!5 Figure 6 @ Figure 7 (A) (A) (B) (B) Figure 8 Figure 9 (A) (A) Figure 10 (A) (B)

Claims (1)

【特許請求の範囲】 ■ セラミック基板に一体形成された導電部に接続され
、焼結固着された白金族を主成分とする第1の電極線と
。 上記第1の電極線と接合された一部わん曲された第2の
電極線と。 上記第1の電極線と第2の電極線との接合部分及び上記
基板の一部を覆うガラス材からなる1[也保護層と。 を有するセラミック基板の端子構造。 ■ 第1の電極線が白金を主成分とする電極線である特
許請求の範囲第1項記載のセラミック基板の端子構造。 ■ 第2の電極線がニッケル又はニッケル合金である特
許請求の範囲第1項記載のセラミック基板の端子構造。
[Claims] (1) A first electrode wire mainly composed of a platinum group metal, which is connected to a conductive portion integrally formed on a ceramic substrate and sintered and fixed. a partially curved second electrode wire joined to the first electrode wire; and a protective layer made of a glass material that covers a joint between the first electrode wire and the second electrode wire and a part of the substrate. Ceramic substrate terminal structure with (2) A terminal structure for a ceramic substrate according to claim 1, wherein the first electrode wire is an electrode wire containing platinum as a main component. (2) A terminal structure for a ceramic substrate according to claim 1, wherein the second electrode wire is made of nickel or a nickel alloy.
JP59068895A 1984-04-06 1984-04-06 Terminal structure of ceramic substrate Granted JPS60211345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59068895A JPS60211345A (en) 1984-04-06 1984-04-06 Terminal structure of ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59068895A JPS60211345A (en) 1984-04-06 1984-04-06 Terminal structure of ceramic substrate

Publications (2)

Publication Number Publication Date
JPS60211345A true JPS60211345A (en) 1985-10-23
JPH0479538B2 JPH0479538B2 (en) 1992-12-16

Family

ID=13386844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59068895A Granted JPS60211345A (en) 1984-04-06 1984-04-06 Terminal structure of ceramic substrate

Country Status (1)

Country Link
JP (1) JPS60211345A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03276053A (en) * 1990-03-27 1991-12-06 Okazaki Seisakusho:Kk Liquid-gas sensor
US5228975A (en) * 1989-11-25 1993-07-20 Ngk Spark Plug Co., Ltd. Gas sensor having hermetic and electrically insulating seal in housing
JP2001281206A (en) * 2000-03-29 2001-10-10 Kyocera Corp Detecting element
US6418777B1 (en) 1997-12-26 2002-07-16 Ngk Spark Plug Co., Ltd. Gas sensor
US6550309B1 (en) 1997-12-26 2003-04-22 Ngk Spark Plug Co., Ltd. Gas sensor with multiple mechanical and thermal shock cushion layers
KR100893418B1 (en) * 1998-10-15 2009-04-17 만네스만 파우데오 아게 Board having strip conductor on both sides
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228975A (en) * 1989-11-25 1993-07-20 Ngk Spark Plug Co., Ltd. Gas sensor having hermetic and electrically insulating seal in housing
JPH03276053A (en) * 1990-03-27 1991-12-06 Okazaki Seisakusho:Kk Liquid-gas sensor
US6418777B1 (en) 1997-12-26 2002-07-16 Ngk Spark Plug Co., Ltd. Gas sensor
US6550309B1 (en) 1997-12-26 2003-04-22 Ngk Spark Plug Co., Ltd. Gas sensor with multiple mechanical and thermal shock cushion layers
KR100893418B1 (en) * 1998-10-15 2009-04-17 만네스만 파우데오 아게 Board having strip conductor on both sides
JP2001281206A (en) * 2000-03-29 2001-10-10 Kyocera Corp Detecting element
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly

Also Published As

Publication number Publication date
JPH0479538B2 (en) 1992-12-16

Similar Documents

Publication Publication Date Title
US4952903A (en) Ceramic heater having portions connecting heat-generating portion and lead portions
KR910006223B1 (en) Gas sensor and method for production thereof
JP2000268944A (en) Ceramic heater, its manufacture, and gas sensor
KR100426939B1 (en) Gas sensor
JPS60211345A (en) Terminal structure of ceramic substrate
JP4036933B2 (en) Resistance / temperature fuse and manufacturing method thereof
JP3652647B2 (en) High temperature detector and manufacturing method thereof
JP2868272B2 (en) Sensor assembly structure
JPS60227158A (en) Gas sensor
JPH1140403A (en) Temp. sensor element
KR19980018524A (en) Method for manufacturing substrates with at least one metal-laminate and printed boards and their application
JPH024993B2 (en)
JPS60158346A (en) Gas sensor
JP4791834B2 (en) Gas sensor
JPH0410586B2 (en)
JPH0351069B2 (en)
JPS6124178A (en) Method of contacting conductor with conductive strip or conductive layer in thermal resistant manner
JPH052848Y2 (en)
JPH0473871A (en) Terminal structure of ceramic substrate
JP2868269B2 (en) Sensor structure
JP2663935B2 (en) Plate-shaped ceramic heater and method of manufacturing the same
JPS60225050A (en) Gas component detector
US20050217889A1 (en) High temperature electrical connection
JPS625166A (en) Gas sensitive element
JP3072068B2 (en) Ceramic heater for oxygen sensor