KR20000026371A - Vacuum line in etching device - Google Patents

Vacuum line in etching device Download PDF

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Publication number
KR20000026371A
KR20000026371A KR1019980043879A KR19980043879A KR20000026371A KR 20000026371 A KR20000026371 A KR 20000026371A KR 1019980043879 A KR1019980043879 A KR 1019980043879A KR 19980043879 A KR19980043879 A KR 19980043879A KR 20000026371 A KR20000026371 A KR 20000026371A
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KR
South Korea
Prior art keywords
line
vacuum
vacuum line
etching apparatus
sensor
Prior art date
Application number
KR1019980043879A
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Korean (ko)
Inventor
서기일
Original Assignee
윤종용
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019980043879A priority Critical patent/KR20000026371A/en
Publication of KR20000026371A publication Critical patent/KR20000026371A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: A vacuum line of a semiconductor etching device is provided to easily seal the vacuum line by easily disassembling or fabricating a bent line, because a lower part of the bent line is made with bellows. Therefore a pump of the etching device can have a long alternating period by avoiding overload. CONSTITUTION: A vacuum line of an etching device comprises a pressure sensor, a vacuum sensor, a leak detection port, a bent line(7), a throttle valve, an adjuster, and a fore valve. The pressure sensor and the vacuum sensor are connected from a chamber, and the leak detection port is connected at the bottom side of the pressure sensor and the vacuum sensor. The bent line is connected at the lower part of the leak detection port, and the throttle valve and the adjuster are on a back end of the bent line. The fore valve is connected to a back end of the throttle valve. Bellows(15) are formed on the lower part of the bent line.

Description

식각 장치의 진공 라인Vacuum Line of Etching Device

본 발명은 반도체 식각 장치에 관한 것으로, 보다 상세하게는 반도체 식각 장치의 진공 라인에 관한 것이다.The present invention relates to a semiconductor etching apparatus, and more particularly to a vacuum line of the semiconductor etching apparatus.

일반적으로, 반도체 소자를 제조하는 데 다양한 장치가 이용된다. 그 일예로, 막 형성 장치, 식각 장치, 사진 장치, 이온 주입 장치 등이 그것이다. 이중에서 식각 장치는 반도체 웨이퍼 상에 형성된 임의의 막질을 선택적으로 식각할 때 이용한다. 그런데, 상기 식각 장치는 임의의 막질을 신뢰성 있게 식각하기 위하여 주로 진공 상태에서 진행하므로, 식각 장치의 챔버를 진공으로 하기 위한 진공 라인이 매우 중요하다.Generally, various apparatuses are used to manufacture semiconductor devices. Examples thereof include a film forming apparatus, an etching apparatus, a photographic apparatus, an ion implantation apparatus, and the like. Among them, the etching apparatus is used to selectively etch any film quality formed on the semiconductor wafer. However, since the etching apparatus mainly proceeds in a vacuum state in order to reliably etch any film quality, a vacuum line for vacuuming the chamber of the etching apparatus is very important.

그런데, 종래의 식각 장치의 진공 라인은 도 1에 도시한 바와 같이 굴곡 라인(1)이 길고 굽어 있기 때문에 진공 라인을 분해 및 조립시 진공 라인의 실링(sealing)이 잘 되지 않는 문제점이 있다. 이렇게 진공 라인이 실링이 잘 되지 않으면 펌프에 과부하가 걸려 펌프를 오래 쓰는 못하게 된다.However, the vacuum line of the conventional etching apparatus has a problem that the sealing of the vacuum line is difficult when disassembling and assembling the vacuum line because the bending line 1 is long and curved as shown in FIG. 1. If the vacuum line is not sealed properly, the pump will be overloaded and prevent the pump from being used for a long time.

따라서, 본 발명이 이루고자 하는 기술적 과제는 상술한 문제점을 해결할 수 있는 식각 장치의 진공 라인을 제공하는 데 있다.Accordingly, an object of the present invention is to provide a vacuum line of an etching apparatus that can solve the above problems.

도 1은 종래 식각 장치의 진공 라인의 굴곡 라인을 도시한 도면이다.1 is a diagram illustrating a bending line of a vacuum line of a conventional etching apparatus.

도 2는 본 발명의 식각 장치의 진공라인을 도시한 도면이다.2 is a view showing a vacuum line of the etching apparatus of the present invention.

도 3은 도 2의 굴곡 라인을 도시한 도면이다.3 is a view illustrating the bending line of FIG. 2.

상기 기술적 과제를 달성하기 위하여, 본 발명은 챔버쪽으로부터 대기 압력 센서 및 진공 센서가 연결되어 있고, 상기 대기 압력 센서 및 진공 센서 밑으로 리크 검출 포트가 연결되며, 상기 리크 검출 포트의 하부에는 굴곡지게 굴곡 라인이 연결되어 있으며, 상기 굴곡라인의 뒷단으로는 트로틀 밸브 및 조절기가 있으며, 상기 트로틀 밸브의 뒷단으로는 포어 밸브가 연결되어 있는 식각 장치의 진공 라인에 있어서, 상기 굴곡 라인의 하단부에는 벨로우즈가 형성되어 있어 실링을 용이하게 할 수 있게 한 것을 특징으로 하는 식각 장치의 진공라인를 제공한다.In order to achieve the above technical problem, the present invention is connected to the atmospheric pressure sensor and the vacuum sensor from the chamber side, the leak detection port is connected to the atmospheric pressure sensor and the vacuum sensor below, the lower portion of the leak detection port is bent In the vacuum line of the etching apparatus is connected to the bending line, the rear end of the bending line is a throttle valve and a regulator, the fore valve is connected to the rear end of the throttle valve, the lower end of the bending line bellows It is formed to provide a vacuum line of the etching apparatus, characterized in that to facilitate the sealing.

이상과 같이 본 발명은 하단부가 벨로우즈로 되어 있어 상기 굴곡 라인을 용이하게 분해 및 조립할 수 있기 때문에 진공 라인의 실링을 쉽게 할 수 있다.As described above, in the present invention, since the lower end portion is made of bellows, the bending line can be easily disassembled and assembled, so that the sealing of the vacuum line can be easily performed.

이하, 첨부 도면을 참조하여 본 발명의 실시예를 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2은 본 발명에 의한 식각 장치의 진공 라인을 설명하기 위하여 도시한 도면이고, 도 3는 도 2의 굴곡 라인의 개략도이다.2 is a view for explaining a vacuum line of the etching apparatus according to the present invention, Figure 3 is a schematic diagram of the bending line of FIG.

구체적으로, 본 발명의 식각 장치의 진공 라인은 챔버쪽으로부터 대기 압력 센서(1) 및 진공 센서(3)가 연결되어 있고, 상기 대기 압력 센서(1) 및 진공 센서 (3) 밑으로 리크 검출 포트(5)가 연결되며, 상기 리크 검출 포트(5)의 하부에는 굴곡지게 굴곡 라인(7)이 있으며, 상기 굴곡 라인(7)의 뒷단으로는 트로틀 밸브(9: throttle valve) 및 조절기(11)가 있으며, 상기 트로틀 밸브(9)의 뒷단으로는 포어 밸브(13, fore valve)가 있고, 상기 포오 밸브(13)의 하단은 펌프에 연결된다.Specifically, the vacuum line of the etching apparatus of the present invention is connected to the atmospheric pressure sensor 1 and the vacuum sensor 3 from the chamber side, and the leak detection port under the atmospheric pressure sensor 1 and the vacuum sensor 3. (5) is connected, and the lower portion of the leak detection port (5) has a bent line (7) to bend, the rear end of the bent line (7) a throttle valve (9) and regulator (11) At the rear end of the throttle valve (9) is a fore valve (13, fore valve), the lower end of the pore valve 13 is connected to the pump.

그런데, 본 발명의 식각 장치의 진공라인에 있어서, 굴곡라인(7)이 도 1과 다르에 하단부가 벨로우즈(15:bellows)가 형성되어 있다. 이렇게 되면, 진공 라인에 상기 굴곡 라인을 용이하게 분해 및 조립할 수 있어 진공 라인의 실링을 쉽게 할 수 있다. 이에 따라, 본 발명의 식각 장치의 펌프는 과부하가 걸리지 않아 교체 주기를 길게 가져 갈 수 있다.By the way, in the vacuum line of the etching apparatus of this invention, the bending line 7 differs from FIG. 1, and the bellows 15 is formed in the lower end part. In this case, the bending line can be easily disassembled and assembled in the vacuum line, so that the sealing of the vacuum line can be easily performed. Accordingly, the pump of the etching apparatus of the present invention can take a long replacement cycle without being overloaded.

이상, 실시예를 통하여 본 발명을 구체적으로 설명하였지만, 본 발명은 이에 한정되는 것이 아니고, 본 발명의 기술적 사상 내에서 당 분야에서 통상의 지식으로 그 변형이나 개량이 가능하다.As mentioned above, although this invention was demonstrated concretely through the Example, this invention is not limited to this, A deformation | transformation and improvement are possible with the conventional knowledge in the art within the technical idea of this invention.

상술한 바와 같이 본 발명의 식각 장치의 진공라인에 있어서, 굴곡라인의 하단부가 벨로우즈로 되어 있어 상기 굴곡 라인을 용이하게 분해 및 조립할 수 있기 때문에 진공 라인의 실링을 쉽게 할 수 있다. 이에 따라, 본 발명의 식각 장치의 펌프는 과부하가 걸리지 않아 교체 주기를 길게 가져 갈 수 있다.As described above, in the vacuum line of the etching apparatus of the present invention, since the lower end of the bending line is bellows, the bending line can be easily disassembled and assembled, so that the sealing of the vacuum line can be easily performed. Accordingly, the pump of the etching apparatus of the present invention can take a long replacement cycle without being overloaded.

Claims (1)

챔버쪽으로부터 대기 압력 센서 및 진공 센서가 연결되어 있고, 상기 대기 압력 센서 및 진공 센서 밑으로 리크 검출 포트가 연결되며, 상기 리크 검출 포트의 하부에는 굴곡지게 굴곡 라인이 연결되어 있으며, 상기 굴곡 라인의 뒷단으로는 트로틀 밸브 및 조절기가 있으며, 상기 트로틀 밸브의 뒷단으로는 포어 밸브가 연결되어 있는 식각 장치의 진공 라인에 있어서,An atmospheric pressure sensor and a vacuum sensor are connected from the chamber side, a leak detection port is connected under the atmospheric pressure sensor and the vacuum sensor, and a bend line is bent at the lower portion of the leak detection port. In the rear end of the throttle valve and the regulator, the rear end of the throttle valve in the vacuum line of the etching apparatus connected to the fore valve, 상기 굴곡 라인의 하단부에는 벨로우즈가 형성되어 있어 실링을 용이하게 할 수 있게 한 것을 특징으로 하는 식각 장치의 진공라인.Bellows are formed on the lower end of the bending line to facilitate the sealing vacuum line of the etching apparatus characterized in that.
KR1019980043879A 1998-10-20 1998-10-20 Vacuum line in etching device KR20000026371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019980043879A KR20000026371A (en) 1998-10-20 1998-10-20 Vacuum line in etching device

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KR1019980043879A KR20000026371A (en) 1998-10-20 1998-10-20 Vacuum line in etching device

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KR20000026371A true KR20000026371A (en) 2000-05-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108896239A (en) * 2018-04-24 2018-11-27 武汉华星光电技术有限公司 Pressure gauge component and vacuum Drycorrosion apparatus
GB2597503A (en) * 2020-07-24 2022-02-02 Edwards Ltd A modular foreline system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108896239A (en) * 2018-04-24 2018-11-27 武汉华星光电技术有限公司 Pressure gauge component and vacuum Drycorrosion apparatus
GB2597503A (en) * 2020-07-24 2022-02-02 Edwards Ltd A modular foreline system

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