KR20000021726A - Rotating dryer of wet station - Google Patents

Rotating dryer of wet station Download PDF

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Publication number
KR20000021726A
KR20000021726A KR1019980040975A KR19980040975A KR20000021726A KR 20000021726 A KR20000021726 A KR 20000021726A KR 1019980040975 A KR1019980040975 A KR 1019980040975A KR 19980040975 A KR19980040975 A KR 19980040975A KR 20000021726 A KR20000021726 A KR 20000021726A
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KR
South Korea
Prior art keywords
wafer
rotating plate
hot air
wet station
heater
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KR1019980040975A
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Korean (ko)
Inventor
김해기
Original Assignee
윤종용
삼성전자 주식회사
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Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019980040975A priority Critical patent/KR20000021726A/en
Publication of KR20000021726A publication Critical patent/KR20000021726A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Abstract

PURPOSE: A rotating dryer of a wet station is to inhibit the formation of a spot by a moisture resided on a wafer after a cleaning process is completed. CONSTITUTION: A rotating dryer of a wet station comprises a rotating plate(17a) for removing a moisture resided on a wafer by rotating the wafer, a lid(17b) covering the rotating plate to prevent the moisture, which is removed from the wafer by the rotation of the rotating plate, from being flowed outwardly. An interior of the lid is provided with a unit for supplying a heat air stream to the rotating plate, the unit comprising a heater for and heating an air and generating the heat air stream, a filter for filtering a mist mixed with the heat air stream, and a nozzle for applying the heat air stream toward the rotating plate.

Description

웨트 스테이션의 회전 건조기(Spin dryer of wet station)Spin dryer of wet station

본 발명은 웨트 스테이션(wet station)에 관한 것으로, 더욱 상세하게는 원심력과 열풍을 이용하여 웨이퍼를 건조하는 웨트 스테이션의 회전 건조기에 관한 것이다.The present invention relates to a wet station, and more particularly, to a rotary dryer of a wet station for drying a wafer using centrifugal force and hot air.

웨트 스테이션(wet station)은 웨이퍼 제조 공정에 필요한 식각 공정(etching step) 및 세정 공정(cleaning step)을 진행하기 위한 장치로서, 화학조(chemical bath)에 복수개의 웨이퍼가 적재된 웨이퍼 케리어(wafer carrier)를 집어넣고 식각 공정을 진행하고, 다음으로 웨이퍼 케리어를 세정조(rinse Bath) 에서 집어넣어 세정 공정을 진행한 이후에 웨이퍼를 회전 건조기(spin dryer)에 집어넣고 웨이퍼를 건조시키게 된다. 통상적인 회전 건조기는 회전판(spin plate)에 안착된 웨이퍼를 고속으로 회전시켜 웨이퍼 상에 남아 있는 물기를 제거하는 장치이다.The wet station is an apparatus for performing an etching step and a cleaning step required for a wafer manufacturing process, and a wafer carrier having a plurality of wafers loaded in a chemical bath. ), The etching process is performed, and then the wafer carrier is placed in a rinse bath, and then the wafer is placed in a spin dryer and the wafer is dried. Conventional rotary dryers are devices that spin off a wafer seated on a spin plate at high speed to remove moisture remaining on the wafer.

그러나, 종래의 회전 건조기는 회전력만을 이용하여 웨이퍼 상에 남아 있는 물기를 제거하기 때문에, 웨이퍼 상에 물반점이 생길 수도 있다. 물반점은 웨이퍼상에서 물이 마르면서 주위의 산소와 웨이퍼의 구성요소 예를 들면, 실리콘(Si), 알루미늄(Al)과 반응하여 만들어지는 산화막을 말한다.However, since the conventional rotary dryer removes water remaining on the wafer using only the rotational force, water spots may be generated on the wafer. The water spot refers to an oxide film formed by reacting with oxygen around the wafer and components of the wafer such as silicon (Si) and aluminum (Al) as water dries on the wafer.

따라서, 본 발명의 목적은 세정 공정이 완료된 이후에 웨이퍼 상에 남아 있는 물기에 의한 물반점의 형성을 억제할 수 있는 웨트 스테이션의 회전 건조기를 제공하는 데 있다.Accordingly, it is an object of the present invention to provide a rotary dryer of the wet station which can suppress the formation of water spots by the water remaining on the wafer after the cleaning process is completed.

도 1은 본 발명에 따른 회전 건조기를 갖는 웨트 스테이션을 나타내는 개략도,1 is a schematic representation of a wet station having a tumble dryer in accordance with the present invention;

도 2의 도 1의 회전 건조기로서, 열풍을 분사하는 노즐이 설치된 상태를 나타내는 도면이다.It is a figure which shows the state which the nozzle which blows hot air is provided as the rotary dryer of FIG.

* 도면의 주요 부분에 대한 설명 *Description of the main parts of the drawing

10 : 웨트 스테이션 11 : 공급부10: wet station 11: supply unit

12 : 히터 13 : 화학조12 heater 13 chemical bath

14 : 여과기 15 : 세정조14 filter 15 washing tank

16 : 노즐 17 : 회전 건조기16: nozzle 17: rotary dryer

19 : 수납부19: storage

상기 목적을 달성하기 위하여, 본 발명은 세정 공정이 완료된 웨이퍼 상의 물기를 건조시키는 웨트 스테이션의 회전 건조기로서, 웨이퍼가 안착되며, 안착된 웨이퍼를 회전시켜 웨이퍼 상에 남아 있는 물기를 제거하는 회전판과; 회전판을 덮어 회전판의 회전에 의해 웨이퍼 상에서 제거되는 물기가 외부로 나가는 것을 방지하는 덮개와; 공기를 가열하여 열풍을 형성하는 히터; 및 덮개의 안쪽에 설치되어 회전판쪽으로 히터에서 형성된 열풍을 공급받아 분사하는 노즐;을 포함하며, 회전판의 회전과 노즐에서 분사되는 열풍에 의해 회전판에 안착된 웨이퍼 상에 남아 있는 물기를 건조시키는 것을 특징으로 하는 웨트 스테이션의 회전 건조기를 제공한다.In order to achieve the above object, the present invention is a rotary dryer of the wet station for drying the dry water on the wafer, the cleaning process is completed, the wafer is seated, rotating the seated wafer to remove the water remaining on the wafer; A cover which covers the rotating plate and prevents water from being removed on the wafer by the rotation of the rotating plate from going out; A heater that heats air to form hot air; And a nozzle installed inside the cover to supply and blow hot air formed from the heater toward the rotating plate, and to dry the water remaining on the wafer seated on the rotating plate by the rotation of the rotating plate and the hot air injected from the nozzle. It provides a rotary dryer of the wet station.

본 발명에 따른 히터와 노즐 사이에 히터에서 형성된 열풍에 섞여 있는 찌꺼기를 걸러줄 수 있는 여과기를 설치하는 것이 바람직하다.Between the heater and the nozzle according to the invention it is preferable to install a filter that can filter the debris mixed in the hot air formed in the heater.

이하, 첨부 도면을 참조하여 본 발명의 실시예를 보다 상세하게 설명하고자 한다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

도 1은 본 발명에 따른 회전 건조기를 갖는 웨트 스테이션을 나타내는 개략도이다. 도 2의 도 1의 회전 건조기로서, 열풍을 분사하는 노즐이 설치된 상태를 나타내는 도면이다.1 is a schematic representation of a wet station having a tumble dryer in accordance with the present invention. It is a figure which shows the state which the nozzle which blows hot air is provided as the rotary dryer of FIG.

도 1 및 도 2를 참조하면, 웨트 스테이션(10)은 웨이퍼를 공급하는 공급부(11)와, 공급부(11)에서 공급된 웨이퍼에 대한 식각 공정이 진행되는 복수개의 화학조(13)와, 화학조(13)에서 식각 공정이 완료된 웨이퍼에 대한 세정 공정이 진행되는 복수개의 세정조(15)와, 세정조(15)에서의 세정 공정이 완료된 이후에 웨이퍼 상에 남아 있는 물기를 제거하는 회전 건조기(17) 및 건조 공정이 완료된 웨이퍼가 수납되는 수납부(19)로 구성된다. 한편, 복수개의 화학조(13), 세정조(15) 및 회전 건조기(17)는 일렬로 소정의 간격을 두고 설치되며, 공급부(11)에 적재된 웨이퍼는 로더(도시안됨)에 의해 화학조(13)와, 세정조(15) 및 회전 건조기(17)로 로딩되며, 건조 공정이 완료된 웨이퍼는 언로더(도시안됨)에 의해 수납부(19)로 수납된다.1 and 2, the wet station 10 includes a supply unit 11 for supplying a wafer, a plurality of chemical tanks 13 in which an etching process for the wafer supplied from the supply unit 11 is performed, and a chemical A plurality of cleaning tanks 15 in which the cleaning process is performed on the wafer on which the etching process is completed in the tank 13 and a rotary dryer for removing water remaining on the wafer after the cleaning process in the cleaning tank 15 is completed. (17) and a housing portion 19 in which the wafer on which the drying process is completed is stored. On the other hand, the plurality of chemical tanks 13, the cleaning tank 15 and the rotary dryer 17 is installed at a predetermined interval in a row, the wafer loaded in the supply unit 11 is chemical tank by the loader (not shown) The wafer 13 loaded with the cleaning tank 15 and the rotary dryer 17, and the drying process is completed, is stored in the storage unit 19 by an unloader (not shown).

한편, 본 발명의 실시예에 따른 회전 건조기(17)는 기본적으로 웨이퍼가 안착되며, 안착된 웨이퍼를 회전시켜 웨이퍼 상에 남아 있는 물기를 날려 제거하는 회전판(17a)과, 회전판(17a)을 덮어 회전판(17a)의 회전에 의해 웨이퍼에서 제거되는 물기가 외부로 나가는 것을 방지하는 덮개(17b)로 구성된다. 그리고, 덮개(17b)의 안쪽에서 회전판(17a)쪽으로 열풍을 공급하기 수단이 설치되는데, 공기를 가열하여 열풍을 형성하는 히터(12; heater)와, 히터(12)에서 형성된 열풍에 섞여 있는 먼지와 같은 찌꺼기를 걸러주는 여과기(14; filter) 및 여과기(14)를 통과한 열풍을 덮개(17b)의 안쪽에서 회전판(17a)쪽으로 분사하는 노즐(16; nozzle)로 구성된다.On the other hand, the rotary dryer 17 according to the embodiment of the present invention basically the wafer is seated, and rotates the seated wafer to cover the rotating plate (17a) to blow off the water remaining on the wafer, and covers the rotating plate (17a) It consists of a cover 17b which prevents the water which is removed from a wafer by the rotation of the rotating plate 17a from going out. In addition, a means for supplying hot air from the inside of the cover 17b to the rotating plate 17a is provided, and a heater 12 that heats air to form hot air and dust mixed with the hot air formed in the heater 12. It consists of a filter (14) for filtering the debris, such as a nozzle and a nozzle (16) for injecting the hot air passing through the filter 14 toward the rotating plate (17a) from the inside of the cover (17b).

본 발명에 따른 회전 건조기(17)의 동작은 덮개(17b)를 개방한 상태에서 세정 공정이 완료된 웨이퍼를 회전판(17a)에 안착시키고 덮개(17b)를 덮는다. 그리고, 회전판(17a)을 고속으로 회전시키는 동시에 덮개(17b)의 안쪽에 설치된 노즐(16)을 통하여 열풍을 회전판(17a)쪽으로 분사하여 웨이퍼 상에 남아 있는 물기를 건조시키게 된다. 즉, 종래에는 회전판의 회전력만을 이용하여 웨이퍼 상에 남아 있는 물기를 건조시켰지만, 본 발명의 실시예에서는 회전판(17a)의 회전력과, 노즐(16)에서 분사되는 열풍을 활용하여 웨이퍼 상에 남아 있는 물기를 건조시게 된다. 따라서, 종래의 회전 건조기의 공정 시간에 비하여 본 발명에 따른 회전 건조기(17)의 공정 시간이 짧아지며, 웨이퍼 상에 남아 있는 물기를 효과적으로 건조시킬 수 있다.The operation of the rotary dryer 17 according to the present invention seats the wafer on which the cleaning process is completed in the state in which the lid 17b is opened on the rotary plate 17a and covers the lid 17b. At the same time, the rotary plate 17a is rotated at a high speed, and hot air is blown to the rotary plate 17a through the nozzle 16 provided inside the lid 17b to dry the water remaining on the wafer. That is, in the prior art, the moisture remaining on the wafer was dried using only the rotational force of the rotating plate, but in the embodiment of the present invention, the rotating force of the rotating plate 17a and the hot air injected from the nozzle 16 remain on the wafer. It will dry out. Therefore, the process time of the rotary dryer 17 according to the present invention is shorter than that of the conventional rotary dryer, and the moisture remaining on the wafer can be effectively dried.

따라서, 본 발명의 구조를 따르면 회전력과 열풍을 이용하여 웨이퍼 상에 남아 있는 물기를 건조하기 때문에, 종래에 비하여 짧은 시간에 웨이퍼를 건조하여 웨이퍼 상에 물반점이 생기는 것을 억제할 수 있다.Therefore, according to the structure of the present invention, since the moisture remaining on the wafer is dried using rotational force and hot air, it is possible to suppress the occurrence of water spots on the wafer by drying the wafer in a shorter time than in the related art.

Claims (2)

세정 공정이 완료된 웨이퍼 상의 물기를 건조시키는 웨트 스테이션의 회전 건조기로서,A wet station rotary dryer for drying water on a wafer on which a cleaning process is completed, 상기 웨이퍼가 안착되며, 안착된 상기 웨이퍼를 회전시켜 상기 웨이퍼 상에 남아 있는 물기를 제거하는 회전판과;A rotating plate on which the wafer is seated and which rotates the seated wafer to remove moisture remaining on the wafer; 상기 회전판을 덮어 상기 회전판의 회전에 의해 상기 웨이퍼 상에서 제거되는 물기가 외부로 나가는 것을 방지하는 덮개와;A cover for covering the rotating plate to prevent water from being removed on the wafer by the rotation of the rotating plate from going out; 공기를 가열하여 열풍을 형성하는 히터; 및A heater that heats air to form hot air; And 상기 덮개의 안쪽에 설치되어 상기 회전판쪽으로 상기 히터에서 형성된 열풍을 공급받아 분사하는 노즐;을 포함하며,And a nozzle installed inside the cover to receive and spray hot air formed from the heater toward the rotating plate. 상기 회전판의 회전과 상기 노즐에 의한 열풍을 공급하여 상기 회전판에 안착된 상기 웨이퍼 상에 남아 있는 물기를 건조시키는 것을 특징으로 하는 웨트 스테이션의 회전 건조기.The rotary dryer of the wet station is supplied with the rotation of the rotating plate and the hot air by the nozzle to dry the water remaining on the wafer seated on the rotating plate. 제 1항에 있어서, 상기 히터와 노즐 사이에 상기 히터에서 형성된 열풍에 섞여 있는 찌꺼기를 걸러주는 여과기가 설치된 것을 특징으로 하는 웨트 스테이션의 회전 건조기.2. The rotary dryer of claim 1, wherein a filter is disposed between the heater and the nozzle to filter out the debris mixed with the hot air generated by the heater.
KR1019980040975A 1998-09-30 1998-09-30 Rotating dryer of wet station KR20000021726A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100757849B1 (en) * 2006-06-21 2007-09-11 세메스 주식회사 A method for treating substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100757849B1 (en) * 2006-06-21 2007-09-11 세메스 주식회사 A method for treating substrates

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