KR20000013175U - Air cylinder for semiconductor package transfer - Google Patents

Abstract

The present invention is an air cylinder for transporting a semiconductor package that can rotate a vacuum-absorbed semiconductor package, a cylinder body having an inner space sealed inside and a guide groove on the outside, and installed to penetrate the inside of the cylinder body, It is driven up and down by a vacuum suction shaft for vacuum suction of the semiconductor package, and a guide pin installed on one side of the outer peripheral surface of the vacuum suction shaft, the shaft pin is guided by the up and down movement of the shaft of the cylinder body It moves along the groove to rotate the vacuum-adsorbed semiconductor package.

Therefore, even if the arrangement of the vacuum-absorbed semiconductor package and the arrangement of the positions to be transported are different, the arrangement can be actively converted and transferred.

Description

Air cylinder for semiconductor package transfer

The present invention relates to a rotatable package conveying air cylinder, and more particularly, to a package conveying air cylinder capable of rotating a vacuum-adsorbed semiconductor package individually to a desired position.

Referring to Figure 1, the transfer of the semiconductor package using vacuum adsorption is as follows.

1 is a view for explaining a conventional semiconductor package transfer device. In the related art, a drive cylinder 2 is installed in a drive body 1 to transfer a semiconductor package, and is driven up and down by the drive cylinder 2. The transfer was carried out by connecting to the vacuum adsorption shaft 4 which vacuum-adsorbs a semiconductor package to the drive shaft 3 which becomes a vacuum.

That is, when the driving cylinder 2 drives the driving shaft 3 in the downward direction, the vacuum suction shaft 4 is driven in the downward direction to vacuum suction the semiconductor package positioned at a predetermined position.

When the vacuum suction shaft 4 vacuum-absorbs the semiconductor package, the driving cylinder 2 drives the driving shaft 3 upwards to drive the vacuum suction shaft 4 upwards to transfer the semiconductor package upwards. .

However, such a conventional semiconductor package transfer device uses multiple vacuum adsorption shafts to simultaneously adsorb and transfer multiple semiconductor packages.

In this process, when the vacuum absorbed semiconductor package is rotated and transferred to a predetermined position, the vacuum suction shaft cannot rotate by itself, thereby rotating the entire semiconductor package transfer apparatus.

However, when the vacuum suction shaft transports the package in a 2 × 3 arrangement by vacuum suction, if the portion to be transported and seated has a 3 × 2 arrangement, the arrangement of the packages does not correspond to each other and the transfer process is repeated several times. There is a problem to transfer through.

In addition, there is also a method of rotating the vacuum suction shaft individually by using a separate drive motor, but this requires a separate drive motor, the components of the transfer device is complicated, there is a problem that the volume of the device increases.

Accordingly, an object of the present invention is to provide an air cylinder for semiconductor manufacturing in which vacuum suction shafts are individually rotated to solve the problems of the conventional semiconductor package transfer device.

Therefore, in order to achieve the above object, the present invention is a air cylinder for semiconductor package transport for rotating the semiconductor package, a cylinder body having an inner space sealed inside and a guide groove to the outside, and penetrates through the cylinder body And a guide pin installed at one side of the outer circumferential surface of the shaft, the shaft pin being driven up and down by air pressure and driven up and down by air pressure. It moves along the guide groove of the to rotate the vacuum-adsorbed semiconductor package.

1 is a simplified diagram of a semiconductor package transfer apparatus for a conventional semiconductor package transfer,

2 is a perspective view of an air cylinder for transferring a semiconductor package according to the present invention,

3 is a cross-sectional view in the III-III direction of FIG.

4 is a view of an embodiment of an air cylinder for semiconductor package transfer according to the present invention.

Brief description of the main parts of the drawings

1: driving body 2: driving cylinder 3: driving shaft

4: Vacuum adsorption shaft

101: air cylinder 102: cylinder body 103: air line

104: vacuum suction shaft 105: guide pin 106: guide groove

107: O-ring 108: vacuum line 109: package

Hereinafter, an air cylinder for transferring a semiconductor package according to the present invention will be described with reference to the accompanying drawings.

FIG. 2 is a perspective view of the air cylinder for transferring a semiconductor package according to the present invention, and FIG. 3 is a cross-sectional view in the III-III direction of FIG. 2, wherein the air cylinder 101 for semiconductor manufacturing according to the present invention is sealed up and down inward. There is an inner space that has been treated and sealed, and a cylinder body 102 in which the guide groove 106 is dug outward.

In addition, first and second air supply lines 103a and 103b for supplying air to the left and right sides of the outer upper end portion of the cylinder body 102 are respectively installed, and the first air supply of the air supply lines is provided. Line 103a is to supply air to the upper end of the inner space of the cylinder body 102, another second air supply line 103b to supply air to the lower end of the inner space of the cylinder body (102).

In addition, the guide groove 106 dug out of the cylinder body 102 is inclined in an oblique direction to form a constant movement path.

The vacuum suction shaft 104 is formed to penetrate the inside of the cylinder body 102 and the vacuum suction line 108 is installed to vacuum suction the semiconductor package. A guide pin 105 is disposed at one outer circumference of the shaft 104. ) Is installed so that the tip portion protrudes in the guide groove 106 of the cylinder body 102, and the O-ring for sealing at a distance separated by a predetermined distance up and down based on the guide pin 105. 107a and 107b are provided on the shaft 104, respectively.

Therefore, the inner space of the cylinder body 102 has a separate sealed space divided into upper and lower by the usual O-rings (107a, 107b).

When the air cylinder 101 for semiconductor package transfer according to the present invention is supplied to the closed space above the cylinder body 102 by the first air supply line 103a, the shaft 104 moves downward by the pressure of the air. Descends.

When the shaft 104 is lowered by the pressure of air, the guide pin 105 attached to the outer circumferential side of the shaft 104 is moved along the guide groove 106 of the cylinder body 102 and the guide pin 105 The shaft 104 rotates at a constant angle by the distance moved along the guide groove 106.

In addition, when air is supplied to the closed space at the bottom of the cylinder body 102 by the second air supply line 103b, the shaft 104 rises upward by the pressure of the air, and is opposed to the lowering of the shaft 104. The guide pin 105 of the shaft 104 is moved along the guide groove 106 of the cylinder body 102 in a path to which the shaft 104 is rotated back to its original position.

5 is a view for explaining an embodiment of the package conveying air cylinder of the present invention, the package conveying air cylinder is a drive shaft of the drive cylinder (2) installed on the drive body (1) of the package conveying apparatus ( 3) is connected and installed.

In more detail, when the driving cylinder 2 drives the driving shaft 3 downward, the air cylinder 101 for transporting the package connected to the driving shaft 3 is also driven in the downward direction so as to be positioned at a predetermined position. The vacuum suction shaft 104 of the air cylinder 101 vacuum sucks the semiconductor package 109.

When the shaft 104 sucks the semiconductor package 109, the driving cylinder 2 drives the driving shaft 3 upwards to move the air cylinder 101 upwards to vacuum the suction of the semiconductor package 109. The semiconductor package 109 is moved upward.

At this time, in order to rotate the vacuum-absorbed semiconductor package 109, the first air supply line 103a supplies air to the sealed space on the upper end of the cylinder body 102, and guide pins of the shaft 104 by the supplied air. 105 moves along the guide groove 106 of the cylinder body 102.

As the guide pin 105 moves along the guide groove 106, the shaft 104 rotates in association with each other, and the vacuum packaged semiconductor package 109 rotates by the rotation angle of the rotated shaft 104.

To restore the rotated shaft 104 to its original position, when air is supplied from the second air cylinder 103b, the guide pin 105 of the shaft 104 moves upward along the guide groove 106 of the cylinder body 102. Reverse movement, and in conjunction with this, the shaft 104 is rotated in the reverse direction to return to its original position.

As described above, the plurality of air cylinders for transferring semiconductor packages according to the present invention are positioned in the form of 2 × 3 arrays, and the shafts 104 are individually rotated to transfer the packages to the package transfer positions in the form of 3 × 2 arrays. The vacuum-absorbed package is easily converted into a 3 × 2 arrangement.

As described above, the air cylinder for transferring a semiconductor package of the present invention is capable of individual rotation, thereby rotating the vacuum-adsorbed package by a desired angle so that the arrangement of the vacuum-packed semiconductor package and the arrangement of positions to be transferred Even if it is different, you can actively convert the array form.

In addition, there is no need for a separate driving device for rotation, thereby reducing the volume of the package conveying device and having the advantage of simplifying the configuration.

Claims (1)

An air cylinder for transferring a semiconductor package for rotating a semiconductor package, A cylinder body having an inner space enclosed inward and a guide groove outward; A vacuum suction shaft installed to penetrate the inside of the cylinder body and driven up and down by air pressure to vacuum suck the semiconductor package; Consists of a guide pin installed on one side of the outer peripheral surface of the shaft, The shaft pin is moved along the guide groove of the cylinder body in accordance with the up and down movement of the shaft to rotate the semiconductor package transport air cylinder, characterized in that for rotating the vacuum package.