KR20000008367A - Exchangeable die for manufacturing a tap tape - Google Patents

Abstract

PURPOSE: An exchangeable die for fabricating a TAB(tape automated bonding) tape is provided to reduce manufacturing cost and time by using a partial die. CONSTITUTION: The exchangeable die comprises a rectangular shaped punching die(20) and a plurality of partial dies(22). In the punching die(20), a sprocket processing hole(21) formed at both sides of the TAB tape(10), an index processing hole(26) formed between a sprocket hole(11) and a device hole(14), and an exchangeable partial processing hole(28) formed at center portion of the TAB tape(10) are formed. The partial dies(22) include a device processing hole(24) for processing the device hole(14) and exactly inserted in the exchangeable processing hole(28) of the punching die(20).

Description

Compatible molds for tap tape production

FIELD OF THE INVENTION The present invention relates to tab tapes and, more particularly, to compatible molds for tab tape fabrication that can be used interchangeably by separating a portion of the mold for making tab tapes.

In a general semiconductor manufacturing method, a tape automated bonding (TAB) method is a method of bonding a bump through a protrusion pad when bumps are connected to an internal lead of a tape of an integrated circuit (IC) chip and a tape. Such a tab type package is mainly used to mount a liquid crystal display (LCD) driving IC chip. In other words, these LCDs are becoming larger and higher in size as consumers' demands diversify. In order to meet the demands of consumers, manufacturers of TAB-type packages try to respond to the demands of the sales market by supplying them quickly with reduced package assembly time. Doing.

In order to assemble the TAB package, a bump chip and a tape having different specifications made to bond the pad and the inner lead of the chip (Inner Lead Bonding (ILB)) are required. In other words, the package specification required by the consumer is not a standardized structure but has a different structure, so in order to develop a tape corresponding to the needs of each consumer, the raw and subsidiary materials used must be manufactured to meet the specification.

At this time, the most time-consuming process in the development of the tape can be said to be a process of forming a hole to meet the specifications desired by the consumer by pressing the tape (PRESS). Part of the process of forming a hole, in particular, a part that requires a lot of time can be referred to as a process for manufacturing a mold required for press work, and also a burden on the mold production cost.

Therefore, if a mold having a different structure for each specification can be manufactured and used interchangeably, it is most preferable in terms of time and cost reduction, but it is difficult to apply in reality. However, unlike the mold made according to the customer specification, the TAB tape produced to test the product has almost no change in specifications, and only the portion related to the device hole size on which the IC chip is mounted. Is changed. In addition, since the mold manufactured for evaluation is not for production, it is rarely used after one or two times for product evaluation, and thus, there is a problem that it consumes unnecessary time and cost.

The technical problem to be achieved by the present invention is to provide a compatible mold for the production of tab tape that can reduce the development time and development cost by making the mold structure for TAB tape manufacturing partially compatible.

1 is a view showing a hole structure of a general tab tape.

2 is a structural diagram for explaining a compatible mold for producing a tab tape according to the present invention.

In order to achieve the above object, a compatible mold for producing a tab tape according to the present invention, in a mold structure that is manufactured for processing holes of different uses and positions in a predetermined tab tape, a constant size on both sides of the tab tape And a sprocket processing hole for processing a sprocket hole formed while maintaining a gap, an index processing hole for processing an index hole formed between a predetermined device hole and a sprocket hole of a tab tape, and having a compatible size of a predetermined size in a central portion thereof. It is preferable that it consists of a plurality of partial dies having a rectangular punching die having a processing hole, and a device processing hole for processing device holes therein, and which are correctly inserted into the compatible partial processing holes of the punching die.

Hereinafter, with reference to the accompanying drawings with respect to a compatible mold for producing a tab tape according to the present invention will be described as follows.

1 is a view for explaining the hole structure of a general TAB tape, reference numeral 10 denotes a TAB tape, reference numeral 11 denotes a sprocket hole, reference numeral 14 denotes a device hole. , 16 denotes an index hole. Here, reference numeral 12 denotes a formation portion of the partial die insertion hole for manufacturing a compatible mold, and has a structure capable of variously changing the device hole 14 therein. For convenience of description, only the hole structure of the tab tape is shown as an example in the drawing shown in FIG. 1, and the chip to be mounted, the copper pattern, and the input / output lead are not shown.

Such TAB tapes generally have a three-layer structure. In terms of materials, one layer is a polyimide tape, two layers are adhesives, and three layers are formed of a copper pattern formed by etching copper. That is, the adhesive of the two layers is formed to bond the polyimide tape and the copper pattern. Here, the copper pattern is used to electrically connect the chip mounted in the device hole to the outside.

Referring to FIG. 1, the sprocket hole 11 is formed on both sides of the tab tape while maintaining a constant size and spacing, and is used to move the tape 10. In addition, between the sprocket hole 11 and the sprocket hole 11, a device hole 14 for mounting the IC chip is formed to a predetermined standard. The index hole 16 is formed between both the sprocket hole 11 and the device hole 14 and is used to make the pitch necessary for product evaluation.

That is, in order to manufacture a TAB tape having a three-layer structure, first, a sprocket hole 11, a device hole 14, and an index hole 16 for evaluation are made by using a hole processing mold on the raw material of the polyimide tape coated with an adhesive. Holes are formed by punching. In addition, a copper pattern is adhered to the upper portion of the adhesive of the tape 10 in which the hole is formed by the above-described process. Tapes of various specifications are manufactured on the upper surface of the copper pattern of the tab tape 10 manufactured by the adhesive process by performing a process such as exposure, development, etching, etc. to form a pattern corresponding to the demand of the consumer.

As described above, the compatible mold according to the present invention is used to process the hole when manufacturing the TAB tape, even if manufactured in a different form according to the specifications of the hole basically required in the manufacturing process of the TAB tape, such as a sprocket hole It takes advantage of the feature that it is formed in almost similar locations regardless of the specification of the tape. In particular, in the case of the metal mold | die manufactured for evaluation, only the part of the device hole 14 has a different form in the position and size. With this characteristic, it is possible to fabricate a basic hole that is processed using the same mold, that is, the same punching die, and that only the device hole can be used partially compatible.

FIG. 2 is a diagram of a preferred embodiment for describing a compatible mold for tab tape fabrication in accordance with the present invention, including a punching die 20 and a partial die 22. Here, the sprocket machining hole 21, the indexing hole 26, and the compatible partial machining hole 28 for inserting the partial die are formed in the punching die 20, and the device is provided in the partial die 22. The processing hole 24 is formed. For convenience of explanation, each hole formed in the punching die for processing the sprocket hole 11, the index hole 16 and the device hole 14 shown in FIG. (26) and the device processing hole 24 are called. Also, although only one partial die 22 is shown in the mold structure of FIG. 2, a plurality of partial dies may actually be included.

Referring to Fig. 2, the sprocket processing hole 21 and the index processing hole 26 are used for the same purpose at the positions described above, and thus description thereof will be omitted. That is, by making the punching die, which is conventionally made of one connected structure, to be partially compatible, efficient mold making becomes possible.

In addition, a partial die 22 is inserted into the compatible partial machining hole 28 of FIG. 2, the size of which is determined in consideration of the maximum size of a device that can be inserted into the device hole 24 in the future. The predetermined interval is larger than the size. In other words, when implementing and using a plurality of partial dies 22, the size of the device holes 24 may be formed differently from the minimum size to the maximum size in order to meet the consumer specification for the TAB tape. However, in consideration of the maximum size of the device, the outer size of the partial die 22 may be compatible only if it is manufactured to a certain size so as to be inserted into the compatible partial machining hole 28 of the punching die 20 correctly.

That is, when using one punching die 20 and a plurality of partial dies 22, the outer dimensions of the partial dies 22 are all the same to be compatible.

Therefore, the sprocket processing hole 21 and the index processing hole 26 which hardly change the hole structure are formed in the same punching die 20, and internally using a plurality of partial dies 22 shown in FIG. By changing only the device hole 24, the mold structure shown in FIG. 2 can be used efficiently. In the embodiment shown in Figs. 1 and 2, the partial die is only used for device hole processing, but it is also possible to apply other hole processing.

According to the present invention, it is possible to produce a compatible mold by making a partial mold which can be partially separated during TAB tape hole processing in a TAB manufacturing process, using a mold serving as a main body, and inserting only a partial mold arbitrarily. Accordingly, there is an effect that can reduce the development time and development costs required for mold making.

Claims (3)

In a mold structure fabricated for processing holes of different uses and positions in a predetermined tab tape, A sprocket processing hole for processing a sprocket hole formed while maintaining a constant size and spacing on both sides of the tab tape; an index processing hole for processing an index hole formed between a predetermined device hole and the sprocket hole of the tab tape; A punching die having a rectangular structure having a compatible partial processing hole of a predetermined size in a central portion thereof; And And a plurality of partial dies having a device processing hole therein for machining the device holes, the plurality of partial dies being precisely inserted into the compatible partial processing holes of the punching die. The method of claim 1 wherein the plurality of partial dies, And the device processing hole size is variously formed so as to be insertable from the minimum size to the maximum size of predetermined devices mounted on the tab tape. The method of claim 1 wherein the plurality of partial dies, An outline size is set at a predetermined interval greater than a maximum size of the devices having different sizes mounted on the tab tape, and the outline sizes are all the same.