KR20000007260A - Semiconductor vacuum equipment having back-flow prevention valve - Google Patents

Abstract

PURPOSE: A semiconductor vacuum equipment having a back-flow prevention valve is provided to suppress defective of a wafer and unnecessary cleaning of an vacuum equipment. CONSTITUTION: The equipment comprises a vacuum pump externally exhausting air in a process chamber through an exhausting hole, wherein the back-flow prevention valve preventing back-flow of external air is installed at the exhausting pipe of the vacuum pump and includes a supporting axis fixed to cross an internal path of the exhausting pipe, a left revolving wing blocking the internal path at the left of the supporting axis, a right revolving wing blocking the internal path at the right of the supporting axis, and a stopper fixed at a position wherein the right and the left revolving wings block the internal path during back-flow of the external air.

Description

Semiconductor vacuum equipment with backflow check valve

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor vacuum facility having a non-return valve, and more particularly, to a semiconductor vacuum facility having a non-return valve for preventing backflow of external air during a power failure.

In general, the semiconductor process is a process requiring ultra-precision, and the conditions of the equipment for this may include a degree of vacuum.

That is, vacuum equipment such as a semiconductor etching vacuum facility using plasma and a semiconductor diffusion vacuum facility for diffusing impurities onto a wafer are widely used.

In particular, such semiconductor vacuum facilities are equipped with various types of vacuum pumps for forming low vacuum, high vacuum, ultra-vacuum and the like, depending on the degree of vacuum degree required.

Here, the vacuum pump is to suck the internal air of the process chamber in which the process is performed and to force it to the outside, the most common conventional semiconductor vacuum equipment is shown in FIG.

As shown in FIG. 1, in the conventional semiconductor vacuum equipment, a vacuum pump 2 is connected to a process chamber 1 in which a semiconductor process is performed, and the vacuum pump 2 is air in the process chamber 1. It is configured to suck through the discharge pipe (3).

In addition, the connection valve 4 is installed between the vacuum pump 2 and the process chamber 1 to maintain a constant vacuum pressure between the vacuum pump 2 and the process chamber 1.

Therefore, the air inside the process chamber 1 is discharged to the outside through the discharge pipe 3 through the vacuum pump 2 to form a vacuum pressure of the process chamber 1.

However, when the electric power supplied to the vacuum pump 2 is cut off or when the power is cut off, a shutoff valve formed in the discharge pipe 3 (a valve for closing the discharge line when the power is interrupted, not shown) is cut off. During this time, a part of the external air flows backward through the discharge pipe 3 to contaminate the vacuum pump 2 and further contaminate the process chamber 1.

When the vacuum pump 2 and the process chamber 1 are contaminated in this way, defects of the wafer in the process are generated, as well as the vacuum pump 2 and the process chamber 1 must be washed again as a whole. There is a hassle of problems, such that the time taken to recover the vacuum pressure dropped inside the process chamber or the vacuum pump increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and an object thereof is to provide a semiconductor vacuum having a non-return valve for preventing wafer defects, preventing unnecessary cleaning of vacuum equipment, and shortening a recovery period of vacuum pressure. In providing equipment.

1 is a schematic view showing a conventional semiconductor vacuum facility.

Figure 2 is a schematic diagram showing a semiconductor vacuum equipment having a non-return valve in accordance with a preferred embodiment of the present invention.

※ Explanation of codes for main parts of drawing

1, 5: process chamber 2, 7: vacuum pump

3, 6: outlet pipe 4, 9: connecting valve

8: non-return valve 10: support shaft

11: left rotating wing 12: right rotating wing

13: Stopper 14: fitting

In order to achieve the above object, a semiconductor vacuum facility having a non-return valve according to the present invention includes a vacuum pump for discharging air inside a process chamber to an outside through a discharge pipe. It is characterized in that to install a non-return valve for preventing the back flow of external air to the discharge pipe.

In addition, the non-return valve, the support shaft is fixed to cross the inner passage of the discharge pipe; A left pivot wing having one side hinged to the left side with respect to the support shaft, the other side being rotated by air pressure when the external air flows back to block the inner passage on the left side of the support shaft, respectively; One side hinged to the right side around the support shaft, the other side is rotated to the right rotating blades respectively blocking the inner passage of the right side of the support shaft; And a stopper for allowing the left and right pivoting vanes to be fixed to a position blocking the inner passage when the external air flows back.

Here, the stopper may be provided with a packing member so as to be in close contact with the left and right rotating blades when the external air flows back.

In addition, a fitting protrusion may be formed between the left pivot blade and the right pivot blade to prevent the left pivot blade and the right pivot blade from being contacted with each other while the valve is opened.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 2, the semiconductor vacuum equipment having the non-return valve according to the present invention includes a vacuum pump 7 for discharging air inside the process chamber 5 to the outside through the discharge pipe 6. As a vacuum facility, a backflow preventing valve 8 is installed in the discharge pipe 6 of the vacuum pump 7 to prevent backflow of external air.

In addition, the connection valve 9 is installed between the vacuum pump 7 and the process chamber 5 to maintain a constant vacuum pressure between the vacuum pump 7 and the process chamber 5.

Here, the non-return valve 8, the support shaft 10 is fixed so as to cross the inner passage of the discharge pipe 6, one side is hinged to the left side around the support shaft 10, When the outside air flows back, the other side rotates by air pressure, and the left rotating wing 11 which respectively blocks the inner passage on the left side of the support shaft, and one side is hinged to the right side about the support shaft 10, the other side The rotating rotors 12 and the right and left pivoting blades 11 and 12 which respectively block the inner passage on the right side of the support shaft 10 block the inner passage when the external air flows back. It is a butterfly-shaped backflow check valve (8) having a stopper (13) to be fixed in position.

Therefore, when the vacuum pump 7 is normally operated, the air flow exiting through the discharge pipe 6 to the outside is not disturbed, as shown in FIG. External air flows back to (6), but the left and right pivot vanes (11) and (12) open up to the position of the stopper (13) by the air pressure of the external air flowing back, eventually blocking the discharge pipe (6). Will be.

The blockage phenomenon during the reverse flow is maintained as long as the air pressure of the external air flows back. If the vacuum pump is operated again after further actions by the operator, the left and right pivot vanes 11 and 12 are folded again. The discharge pipe is naturally open.

Therefore, while the shutoff valve (not shown) closing the discharge line when the power is interrupted (not shown) is cut off when the power supply to the vacuum pump 7 is interrupted or is interrupted. Prevents outside air flowing back through the discharge pipe 6 from contaminating the vacuum pump 7 and the process chamber 5, and a wafer generated by the contamination of the vacuum pump 7 and the process chamber 5. To prevent defects, to prevent unnecessary cleaning of the vacuum pump 7 and the process chamber 5, and to shorten the time taken to recover the vacuum pressure dropped in the process chamber 5, etc. will be.

On the other hand, by forming a ring-shaped packing member (not shown) in the stopper 13 so as to be in close contact with the left and right pivoting blades (11, 12) when the external air flows back to the more reliable check valve ( 8) enable sealing.

In addition, the left pivoting blade 11 and the right pivoting blade 12 are folded and the right pivoting blade 12 is prevented from being completely contacted while the backflow preventing valve 8 is opened. In order to form an inverted triangle fitting protrusion (14) between.

As described above, according to the semiconductor vacuum equipment having the non-return valve according to the present invention, it is possible to prevent wafer defects, to prevent unnecessary cleaning of the vacuum equipment, and to shorten the recovery period of the vacuum pressure.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (5)

In the semiconductor vacuum facility comprising a vacuum pump for discharging the air inside the process chamber to the outside through the discharge pipe, And a backflow prevention valve for preventing backflow of external air in a discharge pipe of the vacuum pump. The method of claim 1, The backflow prevention valve, A support shaft fixed to cross the inner passage of the discharge pipe; A left pivot wing having one side hinged to the left side with respect to the support shaft, the other side being rotated by air pressure when the external air flows back to block the inner passage on the left side of the support shaft, respectively; One side hinged to the right side around the support shaft, the other side is rotated to the right rotating blades respectively blocking the inner passage of the right side of the support shaft; And Stoppers for allowing the left and right pivoting vanes to be fixed to positions blocking the inner passage when the external air is flowed back; Semiconductor vacuum equipment having the backflow check valve, characterized in that comprises a. The method of claim 2, And said stopper is provided with a packing member so as to be in close contact with said left and right pivoting blades when said external air flows back. The method of claim 2, A semiconductor having the backflow preventing valve, characterized in that a fitting protrusion is formed between the left pivotal wing and the right pivotal wing to prevent the left pivotal wing and the right pivotal wing from being completely contacted while the valve is opened. Vacuum equipment. The method of claim 4, wherein The fitting projection is a semiconductor vacuum equipment having the reverse flow prevention valve, characterized in that the reverse triangle.