KR0122311Y1 - Device for detecting the pressure of chamber - Google Patents

Device for detecting the pressure of chamber

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Publication number
KR0122311Y1
KR0122311Y1 KR2019950003749U KR19950003749U KR0122311Y1 KR 0122311 Y1 KR0122311 Y1 KR 0122311Y1 KR 2019950003749 U KR2019950003749 U KR 2019950003749U KR 19950003749 U KR19950003749 U KR 19950003749U KR 0122311 Y1 KR0122311 Y1 KR 0122311Y1
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KR
South Korea
Prior art keywords
pressure
lock chamber
load lock
atmospheric pressure
chamber
Prior art date
Application number
KR2019950003749U
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Korean (ko)
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KR960032727U (en
Inventor
조병길
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문정환
엘지반도체주식회사
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Priority to KR2019950003749U priority Critical patent/KR0122311Y1/en
Publication of KR960032727U publication Critical patent/KR960032727U/en
Application granted granted Critical
Publication of KR0122311Y1 publication Critical patent/KR0122311Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 고안은 반도체 제조장비에서 챔버의 내부압력을 감지하는 장치에 관한 것으로, 종래에는 상기 로드 록 챔버(2)의 대기압 상태로의 전환시 압력을 감지하는 압력센서(8)가 빈번하게 대기압을 정확하게 감지하지 못함으로써 대기압으로의 전환 후, 게이트밸브(4) 오픈시 순간적으로 역류가 발생되어 파티클이 유발되는 문제가 있었는 바, 본 고안에서는 카세트 핸들러(1)에서 웨이퍼가 이송되는 로드 록 챔버(2)의 대기압을 감지하는 수단으로서, 로드 록 챔버(2)의 압력이 대기압이 되면 개방되는 체크밸브(11)와, 상기 체크밸브(11)의 다음 단에 상기 체크밸브(11)에 유입되는 N2가스를 감지하여 로드 록 챔버(2)의 내부압력이 대기압임을 감지하는 플로우센서(12)를 로드 록 챔버(2)에 연결설치하여 로드 록 챔버의 대기압 상태 유무를 정확하게 감지할 수 있어 로드 록 챔버의 내부압이 대기압으로 전환된 후 게이트밸브 오픈시의 역류발생을 방지하여 파티클의 발생을 방지하도록 함으로써 기기의 성능을 향상시키도록 한것이다.The present invention relates to a device for detecting the internal pressure of the chamber in the semiconductor manufacturing equipment, conventionally the pressure sensor 8 for detecting the pressure when switching to the atmospheric pressure state of the load lock chamber (2) frequently accurately After switching to atmospheric pressure by not detecting, there was a problem that a back flow occurred momentarily when the gate valve 4 was opened, causing particles. In the present invention, the load lock chamber 2 in which the wafer is transferred from the cassette handler 1 is introduced. As a means for detecting the atmospheric pressure of (), the check valve 11 which is opened when the pressure of the load lock chamber 2 reaches the atmospheric pressure, and N flowing into the check valve 11 at the next stage of the check valve 11 sensing a second gas to the load lock chamber 2, the pressure inside the can and that the installation connections to the flow sensor 12 to detect the load-lock chamber (2) correctly detect the atmospheric pressure, the presence or absence of the load lock chamber at atmospheric pressure After the internal pressure of the load lock chamber is switched to the atmospheric pressure to prevent back flow occurs at the time of the gate valve opened by the hangeotyi to improve the performance of the device by so as to prevent the generation of particles.

Description

반도체 제조용 챔버의 압력감지장치Pressure Sensing Device for Semiconductor Manufacturing Chamber

제1도는 종래 챔버 압력감지센서가 설치된 챔버의 구성도.1 is a configuration diagram of a chamber in which a conventional chamber pressure sensor is installed.

제2도는 본 고안에 의한 챔버 압력감지장치가 설치된 챔버의 구성도.2 is a block diagram of a chamber in which the chamber pressure sensing device according to the present invention is installed.

*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

2:로드 록 챔버(Load Lock Chamber) 11:체크밸브(Check Valve)2: Load Lock Chamber 11: Check Valve

12:플로우센서(Flow Sensor)12: Flow Sensor

본 고안은 반도체 제조장비에서 챔버의 내부압력을 감지하는 장치에 관한 것으로, 특히 로드 록 챔버의 압력이 대기압이 되면 개방되는 체크밸브와, 상기 체크밸브의 다음 단에 상기 체크밸브에 유입되는 N2가스를 감지하여 로드 록 챔버의 내부압력이 대기압임을 감지하는 플로우센서를 설치하여 로드 록 챔버의 압력을 정확하게 감지하도록 한 반도체 제조용 챔버의 압력감지장치에 관한 것이다.The present invention relates to a device for sensing the internal pressure of the chamber in the semiconductor manufacturing equipment, in particular, a check valve that is opened when the pressure of the load lock chamber is at atmospheric pressure, and N 2 flowing into the check valve at the next stage of the check valve The present invention relates to a pressure sensing device of a semiconductor manufacturing chamber configured to accurately detect a pressure of a load lock chamber by installing a flow sensor that senses gas and detects that the internal pressure of the load lock chamber is atmospheric pressure.

종래의 반도체 제조공정에 이용되는 각종 챔버는 제1도에 도시한 바와 같이, 카세트 핸들러(Cassette Handler)(1)와, 로드 록 챔버(Load Lock Chamber)(2)와, 프로세스 챔버(Procedss Chamber)(3)가 서로 인접되게 설치되어 있고, 상기 각각의 챔버(2)(3)에는 챔버를 진공으로 만들어 주는 펌프가 연결설치되는 펌프라인(6)(7)이 연결되어 있으며, 상기 로드록 챔버(2)에는 대기상태로의 전환 및 챔버 내부의 청소를 위한 N2가스 공급라인(5)이 연결되어 있고, 상기 N2가스 공급라인(5)에는 챔버(2)의 압력을 측정할 수 있는 압력센서(8)가 설치되어 있다. 또한, 상기 각 챔버의 중간에는 게이트밸브(gate valve)(4)가 설치되어 있다.As shown in FIG. 1, various chambers used in the conventional semiconductor manufacturing process include a cassette handler 1, a load lock chamber 2, and a process chamber. (3) are installed adjacent to each other, and each of the chambers (2) and (3) is connected to a pump line (6) (7), which is connected to a pump for making the chamber into a vacuum, and the load lock chamber (2) is capable of measuring the pressure in the chamber (2) N 2 gas supply line (5) and are connected, the N 2 gas supply line (5) for switching and cleaning of the interior chamber to a stand-by state The pressure sensor 8 is provided. In addition, a gate valve 4 is provided in the middle of each chamber.

상기 카세트 핸들러(1)는 웨이퍼가 담긴 카세트가 수납되며, 대기상태를 유지하고 있다. 한편, 상기 로드 록 챔버(2) 및 프로세스 챔버(3)는 진공상태이다.The cassette handler 1 accommodates a cassette containing a wafer and maintains a standby state. On the other hand, the load lock chamber 2 and the process chamber 3 is in a vacuum state.

또한, 상기 N2가스 공급라인(5) 및 펌프라인(6)(7)에는 각각 이 라인들을 개폐시키는 밸브(10a)(10b)(10c)가 설치되어 있다.The N 2 gas supply line 5 and the pump line 6 and 7 are provided with valves 10a, 10b and 10c which open and close these lines, respectively.

이러한 반도체 제조장치의 동작은 웨이퍼가 담겨 있는 카세트를 카세트 핸들러(1)에 놓게 되면, 로드 록 챔버(2)에 연결된 펌프측 밸브를 잠그고 N2가스라인밸브(10a)를 열어 로드 록 챔버(2)의 내부압이 대기압(76CTorr)이 될 때까지 N2가스를 공급한다. 로드 록 챔버(2)가 대기압 상태가 되면, 카세트 핸들러(1)에 있는 웨이퍼 중 8매의 웨이퍼를 로드 록 챔버(2)로 이동시킨 후, 펌핑하여 진공상태로 만들어주고, 웨이퍼 1매씩 프로세스 챔버(3)로 이동시켜 공정을 진행하게 된다.In operation of the semiconductor manufacturing apparatus, when the cassette containing the wafer is placed in the cassette handler 1, the pump-side valve connected to the load lock chamber 2 is locked and the N 2 gas line valve 10a is opened to load the chamber 2. The N 2 gas is supplied until the internal pressure of) becomes atmospheric pressure (76 CTorr). When the load lock chamber 2 is at atmospheric pressure, eight wafers among the wafers in the cassette handler 1 are moved to the load lock chamber 2, and then pumped into a vacuum state, and the wafers are processed one by one. The process proceeds to (3).

웨이퍼 8매의 공정이 진행되면, 로드 록 챔버(2)는 대기압 상태로 전환되고, 웨이퍼는 카세트로 이동된다.When the process of eight wafers is in progress, the load lock chamber 2 is switched to the atmospheric pressure state, and the wafer is moved to the cassette.

그런데, 종래에는 상기 로드 록 챔버(2)의 대기압 상태로의 전환시 압력을 감지하는 압력센서(8)가 빈번하게 대기압을 정확하게 감지하지 못함으로써 대기압으로 전환 후, 게이트밸브(4) 오픈시 순간적으로 역류가 발생되어 파티클이 유발되는 문제가 있었다.However, in the related art, the pressure sensor 8 that detects the pressure when the load lock chamber 2 switches to the atmospheric pressure state frequently fails to accurately detect the atmospheric pressure, and then switches to the atmospheric pressure, and momentarily when the gate valve 4 is opened. There was a problem that caused the backflow caused particles.

본 고안은 상기한 바와 같은 문제점을 해소하는 것을 목적으로 하는 것으로, 이러한 목적을 달성하기 위하여, 로드 록 챔버의 압력이 대기압이 되면 개방되는 체크밸브와, 상기 체크밸브의 다음 단에 설치되어 상기 체크밸브에 유입되는 N2가스를 감지하여 로드 록 챔버의 내부 압력이 대기압임을 감지하는 플로우센서로 구성함을 특징으로 하는 반도체 제조용 챔버의 압력감지장치가 제공된다.The present invention aims to solve the above problems, and in order to achieve this object, a check valve is opened when the pressure of the load lock chamber reaches atmospheric pressure, and is installed at the next stage of the check valve to check Provided is a pressure sensing device of a chamber for manufacturing a semiconductor, characterized in that the flow sensor for sensing the N 2 gas flowing into the valve to detect that the internal pressure of the load lock chamber is atmospheric pressure.

이하에서는 본 고안을 첨부도면에 도시한 일실시례에 의거하여 보다 상세하게 설명하고자 한다.Hereinafter, the present invention will be described in more detail based on the embodiment shown in the accompanying drawings.

첨부도면 제2도는 본 고안에 의한 챔버 압력감지장치가 적용된 각각의 챔버의 구성도로서, 이에 도시한 바와 같이, 카세트 핸들러(1)에서 웨이퍼가 이송되는 로드 록 챔버(2)의 대기압을 감지하는 수단으로서, 로드 록 챔버(2)의 압력이 대기압이 되면 개방되는 체크밸브(11)와, 상기 체크밸브(11)의 다음 단에 상기 체크밸브(11)에 유입되는 N2가스를 감지하여 로드 록 챔버(2)의 내부압력이 대기압임을 감지하는 플로우센서(12)를 로드 록 챔버(2)에 연결설치한 것을 특징으로 한다.2 is a configuration diagram of each chamber to which the chamber pressure sensing device according to the present invention is applied. As shown in FIG. 2, the atmospheric pressure of the load lock chamber 2 in which the wafer is transferred from the cassette handler 1 is detected. As a means, a check valve 11 which is opened when the pressure of the load lock chamber 2 reaches atmospheric pressure and a N 2 gas flowing into the check valve 11 at the next stage of the check valve 11 are detected and loaded. It is characterized in that the flow sensor 12 for detecting that the internal pressure of the lock chamber 2 is atmospheric pressure is connected to the load lock chamber 2.

이와 같이 설치되는 본 고안 챔버 압력감지장치는 반도체 제조장비의 동작 중 로드 록 챔버(2)가 진공상태에서 대기압상태로 전환시 즉, 펌프측 밸브(10b)를 잠그고, N2가스라인밸브(10a)를 열어 로드 록 챔버(2)의 내부압이 대기압(700Torr)이 될 때까지 N2가스가 공급되어 N2가스의 공급이 완료됨으로써 로드 록 챔버(2)의 내부압력이 대기압이 되면 체크밸브(11)가 개방됨으로써 체크밸브(11)를 통해 플로우센서(12)로 N2가스가 흘러들어 상기 플로우센서(12)는 로드 록 챔버(2)의 내부압이 대기압으로 전환되었음을 정확하게 감지하게 된다. 로드 록 챔버(2) 내부압력의 전환을 감지한 플로우센서(12)에 의해 다음 공정이 이루어지게 된다.The chamber pressure sensing device of the present invention installed as described above locks the pump-side valve 10b when the load lock chamber 2 is switched from a vacuum state to an atmospheric pressure state during the operation of the semiconductor manufacturing equipment, and the N 2 gas line valve 10a. ), The N 2 gas is supplied until the internal pressure of the load lock chamber 2 reaches the atmospheric pressure (700 Torr), and the supply of the N 2 gas is completed, so when the internal pressure of the load lock chamber 2 reaches the atmospheric pressure, the check valve Opening of the 11 causes N 2 gas to flow into the flow sensor 12 through the check valve 11 so that the flow sensor 12 accurately senses that the internal pressure of the load lock chamber 2 has been converted to atmospheric pressure. . The next process is performed by the flow sensor 12 which detects the change of the internal pressure of the load lock chamber 2.

이상에서 설명한 바와 같이, 본 고안에 의한 챔버압력 감지장치는 로드 록 챔버의 대기압 상태 유무를 정확하게 감지할 수 있어 로드록 챔버의 내부압이 대기압으로 전환된 후 게이트밸브 오픈시의 역류발생을 방지하여 파티클의 발생을 방지하도록 함으로써 기기의 성능을 향상시키는 효과가 있다.As described above, the chamber pressure sensing device according to the present invention can accurately detect the presence or absence of the atmospheric pressure state of the load lock chamber to prevent the occurrence of backflow when the gate valve is opened after the internal pressure of the load lock chamber is converted to atmospheric pressure. By preventing the generation of particles, it is effective to improve the performance of the device.

Claims (1)

로드 록 챔버의 압력이 대기압이 되면 개방되는 체크밸브와, 상기 체크밸브의 다음 단에 설치되어 상기 체크밸브에 유입되는 N2가스를 감지하여 로드 록 챔버의 내부압력이 대기압임을 감지하는 플로우센서로 구성함을 특징으로 하는 반도체 제조용 챔버의 압력감지장치.When the pressure of the load lock chamber is at atmospheric pressure, the check valve is opened, and the flow sensor is installed at the next stage of the check valve to detect the N 2 gas flowing into the check valve to detect that the internal pressure of the load lock chamber is atmospheric pressure Pressure sensing device of a chamber for manufacturing a semiconductor, characterized in that the configuration.
KR2019950003749U 1995-03-04 1995-03-04 Device for detecting the pressure of chamber KR0122311Y1 (en)

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KR0122311Y1 true KR0122311Y1 (en) 1998-08-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100514256B1 (en) * 1999-11-30 2005-09-15 엘지.필립스 엘시디 주식회사 Method Of Preventing Particle In Chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100514256B1 (en) * 1999-11-30 2005-09-15 엘지.필립스 엘시디 주식회사 Method Of Preventing Particle In Chamber

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KR960032727U (en) 1996-10-24

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