KR20000000707A - Different sort metal material bound having cube structure and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A different sort bound metal material varying a compounding and a compounding rate of various metals combining the mechanical, the magnetic, and the electrical characters of a combining material based on a purpose and having a {100}(100) collected construction on the surfaces of one side or both sides of the combining material and the manufacturing method thereof are provided. CONSTITUTION: A different sort bound metal material comprises:a silver/nickel heterogeneity bound material manufactured by powder metallurgy method using nickel powder having 99.99 % of purity and silver powder having 99.9 % of purity; a thin plate manufactured by cold rolling with the silver/nickel heterogeneity bound material having 93 % of a rolling rate; and heat treatment of the rolling silver/nickel heterogeneity bound material in a vacuum state at 400°C for four hours at 500°C per hour of heat rising speed.

Description

Heterogeneous metal having a (100) (001) and a method of manufacturing the same

The present invention relates to a double-bonded metal having a {100} (001) and a method for manufacturing the same, and more particularly, processing at a high rolling rate of 90% or more, and then heat treatment at a temperature higher than the recrystallization temperature under high vacuum, inert atmosphere or reducing atmosphere. Heterogeneous bonding of metals (nickel, copper, aluminum, silver) having a {100} (001) texture with other metals such as stainless steel, Hastelloy, and silver, followed by rolling and heat treatment It is also possible to change the combination and combination ratios of the various metals that bond the mechanical, magnetic and electrical properties of the bonding material, depending on the intended use, and at the same time, one or both surface layers of the bonding material may be assembled with {100} (001). It is a heterojunction metal which has a structure, and its manufacturing method.

In general, cubic metals such as nickel, copper, aluminum, and silver are known to have a {100} (001) texture after rolling and heat treatment. Using these metal matrixes having {100} (001) texture, epitaxial ceramic layers such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ) having {100} (001) texture were formed on these metal substrates. After deposition, it has {100} (001) texture (RE = rare earth metal) By epitaxially depositing a superconducting thin film, it is possible to produce a superconducting conductor having high critical current density (Jc) while being resistant to bending deformation.

At this time, the ceramic layer such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ) has a role of blocking the diffusion of metal elements from the metal base material into the superconducting thin film to prevent deterioration of the superconducting film properties. The metal matrix plays a role of causing a ceramic layer such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ) to have a {100} (001) texture through epitaxial growth.

At the same time, the metal base material is composed of ceramic layers such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ), which are highly brittle. (RE = rare earth metal) Enables bending deformation of superconducting thin films.

Therefore, as a property of the metal base material, the {100} (001) texture should be well developed and there should be no chemical reaction with ceramic layers such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ).

Recently, Oak Ridge National Laboratory in the United States epitaxially deposits ceramic layers such as cerium oxide (CeO ₂ ) and Yttrium stabilized zirconia (YSZ) on nickel with {100} (001) texture fabricated by rolling and heat treatment. It has a {100} (001) texture on the so-called RABiTS (Rolling Assisted Bi-axially Textured Substrate). (RE = rare earth metal) A superconducting thin film was epitaxially deposited to produce a superconducting conductor having a high critical current density (Jc) of Jc-1 × 10 ⁶ A / cm ² while resisting warpage.

However, nickel metal is a typical ferromagnetic material and is limited in application due to the disadvantage of magnetic hysteresis loss when used in an alternating current. In addition, nickel metal has a high mechanical strength in a cold-worked state, but the mechanical strength decreases after heat treatment, and thus the nickel metal has a disadvantage in that it is easily deformed by mechanical stress when machining into an actual power transmission line, distribution line, and coil.

Conventionally used techniques for producing metallic substrates having {100} (001) textures have been processed to high purity nickel, copper, aluminum, and silver at a high rolling rate of 90% or higher, and then to a high vacuum or inert gas atmosphere or reducing properties. {100} (001) texture was formed through a heat treatment process above the temperature at which the first recrystallization occurs in the atmosphere. However, in order to manufacture nickel, copper, aluminum, and silver having excellent {100} (001) texture by rolling and heat treatment, their purity must be higher than 99%, thereby changing the mechanical, electrical, and magnetic properties of wire rods. Alloying was limited. Therefore, it was difficult to change the mechanical, electrical and magnetic properties of the wire rod in the desired direction while maintaining a good {100} (001) texture.

The present invention has been made to solve the above problems, the mechanical, electrical and magnetic and thermal properties of the metal base material without sacrificing the degree of development of {100} (001) in the metal base material having the {100} (001) texture The purpose is to change the properties according to the purpose of use.

In order to achieve the above object, high purity nickel, copper, aluminum, and silver, which have a {100} (001) texture after rolling and heat treatment, are heterogeneously bonded to metals having different mechanical, electrical, and magnetic properties. It is possible to produce composites with excellent magnetic and electrical properties but with {100} (001) texture on the surface. In this case, it is to provide that the mechanical, magnetic, and electrical properties of the finished material can be changed according to the purpose of changing the combination and amount of the bonded metal.

1 is a schematic cross-sectional view of the present invention nickel / silver composite plate

2 is a (111) pole figure of a nickel surface in the inventive nickel / silver composite sheet

3 is a SEM EPMA chemical analysis on the cross section of the present invention nickel / silver composite plate

Component distribution of nickel and silver in the direction across the interface

Figure 4 is a schematic cross-sectional view of the present invention nickel / stainless steel composite plate

5 is an X-ray of the surface of nickel in the inventive nickel / stainless steel composite sheet

Diffraction Test Results

6 is a SEM EPMA in cross section of the inventive nickel / stainless steel composite sheet.

Component distribution of nickel and iron in the direction across the interface by chemical analysis

7 is a SEM EPMA in cross section of the inventive nickel / stainless steel composite sheet.

Components of nickel and chromium in the direction across the interface by chemical analysis

Distribution

8 is a schematic cross-sectional view of the present invention nickel / silver / stainless steel composite plate

9 is a view of the surface of nickel in the inventive nickel / silver / stainless steel composite sheet

(111) pole figure

10 is stainless steel / of the present invention nickel / silver / stainless steel composite sheet

Stainless steel / silver by SEM EPMA chemical analysis at silver interface

Component distribution of nickel and iron in the direction crossing the interface

11 is a SEM in cross section of the inventive nickel / silver / stainless steel composite plate

Of nickel and chromium across the interface by EPMA chemical analysis

Ingredient distribution

12 is a SEM in cross section of the inventive nickel / silver / stainless steel composite plate

Of nickel and silver across the interface by EPMA chemical analysis

Ingredient distribution

Figure 13 (a) is a schematic cross-sectional view of the present invention nickel / silver / nickel composite plate

(b) of the present invention nickel / silver / stainless steel / silver / nickel composite plate

Cross section

Figure 14 (a) is a schematic cross-sectional view of the present invention nickel / silver / nickel composite bar

(b) of the present invention nickel / silver / stainless steel / silver / nickel composite rod

Cross section

Referring to the configuration and operation of the present invention in detail based on the accompanying drawings as follows.

A silver / nickel heterojunction was prepared using powder metallurgy using nickel powder with a purity of 99.99% and silver powder with a purity of 99.9%, and cold rolled silver / nickel heterojunction at a rolling rate of 93% to produce a thin plate. Cold-rolled silver / nickel plate is heat-treated at 900 ° C. for 4 hours in a vacuum atmosphere, wherein the temperature rise rate is 500 ° C./h, and the production of heterojunction metals and metals having {100} (001) How and

When the metal (A) having the {100} (001) and the adjacent metal (B) having different mechanical, electrical, thermal, and magnetic properties are bonded to each other, diffusion of the adjacent metal (B) into the metal (A) results in the metal upon annealing. Not interfere with the development of (A) 's {100} (001),

When another metal (C) is bonded next to the metal (B) layer adjacent to the metal (A), the diffusion coefficient in the metal (B) of the metal (C) atom during the tissue annealing is low, so that the valence metal of the metal (C) The metal (B) layer prevents the diffusion into (A),

In the case of forming a multilayer metal composite, when another metal (C) is bonded again after the metal (B) layer adjacent to the metal (A), the melting point of the (B) layer metal is lower than that of the metal (A) and the metal (C). It is a multilayer structure consisting of,

In the case of making a multi-layered metal joint, when joining another metal (C) after the metal (B) layer adjacent to the metal (A), it is composed of a method of joining by diffusion bonding,

In making a multi-layer metal joint, if another metal (C) is joined again after the metal (B) layer adjacent to the metal (A), it is molded using the powder of metal (C) to form a multi-layer structure, which is then Sintering below the melting point of

The multi-layered composite is composed of being heated to a melting point of the metal (B) in a high vacuum or inert atmosphere and maintained for a predetermined time, and then cooled to be bonded between layers.

As a metal (A), using nickel, copper, aluminum, silver,

As a metal (B), using silver, gold, platinum, palladium, tantalum,

As the metal (C), a material having higher mechanical strength than the metal (A) or the metal (B), such as stainless steel and Hastelloy,

Reducing the thickness of the manufactured metal multilayer plate to a rolling rate of 80% or more through rolling;

Heat-treating the prepared thin multilayer plate at a temperature range of 300 ° C. to 1200 ° C. under a high vacuum or inert atmosphere to give a (100) (001) texture,

In the manufacture of composite metal, by changing the thickness of the metal (A) and the metal to be bonded to the metal (A), the combination ratio of the metal (A) and the bonding metal is changed so that the strength, electrical resistance, magnetic properties, It consists of the ability to change the thermal conductivity.

Example 1

A silver / nickel heterojunction was prepared using powder metallurgy using a nickel powder having a purity of 99.99% and a silver powder having a purity of 99.9% as shown in FIG. 1. The silver / nickel heterojunction of FIG. 1 was cold rolled at a rolling rate of 93% to form a thin plate. The cold rolled silver / nickel plate was heat-treated at 900 ° C. for 4 hours in a vacuum atmosphere, and the temperature increase rate was 500 ° C./h. The pole figure in the nickel plane of the silver / nickel plate thus manufactured is shown in Figure 2. It can be seen from the pole figure that the {100} (001) texture is well formed on the nickel surface of the silver / nickel plate.

Figure 3 is a SEM EPMA component analysis of the silver / nickel interface portion of the silver / nickel heterojunction sample subjected to vacuum heat treatment at 900 ℃ 4 hours.

It can be seen from FIG. 3 that diffusion of silver into nickel hardly occurred. It can also be seen that almost no diffusion of nickel into silver occurred.

Example 2

An SS 304 / nickel heterojunction having the structure of FIG. 4 was prepared by plating nickel with a purity of 99.99% on a surface of 2 mm thick 304 stainless steel (hereinafter referred to as SS304). The SS304 / nickel heterojunction of FIG. 4 was heat-treated at 900 ° C. for 4 hours in a vacuum atmosphere, and then cold rolled at a rolling rate of 93% to prepare a thin plate. The cold rolled SS304 / nickel plate was heat-treated at 900 ° C. for 4 hours in a vacuum atmosphere, and the temperature increase rate was 500 ° C./h. The X-ray diffraction test results of the nickel surface on the heat treated SS304 / nickel plate are shown in FIG. 5. From the observation of diffraction lines due to the (200), (111), (220), and (311) crystallographic aspects of nickel in the X-ray diffraction pattern, it was found that the {100} (001) texture was not well formed. Can be.

6 and 7 are SEM EPMA component analysis results of SS304 / nickel interface of SS304 / nickel heterojunction sample subjected to vacuum heat treatment at 900 ° C. for 4 hours.

From SS304 it can be seen that iron chromium significantly diffused into nickel. It can also be seen that the diffusion of nickel into SS304 also occurred significantly.

Example 3

1mm thick silver plate (purity 99.9%) is placed on 2mm thick SS304 plate, 1mm thick nickel plate (purity 99.99%) is placed on it, and heat treated in high vacuum at a temperature of 980 ° C. Heteroconjugates of silver / nickel were prepared.

The SS304 / silver / nickel heterojunction of FIG. 8 was cold rolled at a rolling rate of 97% to prepare a thin plate. The cold rolled SS304 / silver / nickel plate was heat-treated at 900 ° C. for 4 hours in a vacuum atmosphere, and the temperature rising rate was 500 ° C./h. 9 shows that the {100} (001) texture of nickel is well formed as an X-ray pole figure of the nickel surface in the heat treated SS304 / silver / nickel plate.

10 and 11 are SEM EPMA component analysis results at SS304 / silver interface portions of SS304 / silver / nickel heterojunction samples subjected to vacuum heat treatment at 900 ° C. for 4 hours.

It can be seen that almost no diffusion of iron and chromium from SS304 into silver occurred. It can also be seen that diffusion of silver into SS304 hardly occurred.

12 is a SEM EPMA component analysis result at the nickel / silver interface of the SS304 / silver / nickel heterojunction sample subjected to vacuum heat treatment at 900 ℃ 4 hours.

It can be seen that almost no diffusion of silver into nickel occurred. It can also be seen that almost no diffusion of nickel into silver occurred.

10, 11, and 12, the SS304 / silver / nickel heterojunction sample, unlike the SS304 / nickel heterojunction sample, did not cause iron, chromium diffusion of SS304 into nickel or diffusion of nickel into SS304. This is because the silver present between SS304 and nickel acts as a diffusion barrier to block the diffusion of the components of these two metals.

Modifications of the Invention, Application Examples

(1) In the embodiment, a multilayer plate having a {100} (001) structure on only one side was manufactured using a metal plate, but the multilayer plate had a symmetrical structure so that both sides of the plate had {100} (001) (Fig. 13).

(2) The starting sample can be started in a circle using rods and tubes rather than plates (see Figure 14).

(3) The metal having {100} (001) prepared through the present invention may be made of ceria, YSZ, (RE = rare earth metal) thin films are deposited under appropriate conditions to maintain {100} (001) on the surface of the metal composite and to produce ceria, YSZ, (RE = rare earth metal) Hetero-epitaxial growth in which a thin film is deposited results in bi-axially structure. So manufactured (RE = rare earth metal) The thin film has a high critical current density similar to that of a single crystal because of its excellent orientation and can be used to make superconducting composite conductors (wires, plates, cylindrical materials, etc.) with a large conduction current.

Therefore the invention is nickel and mechanical. Electrical. Thermal. Metals with different magnetic properties were bonded together to create a multilayered composite with the outermost nickel metal and the inner metal. The multi-layered composite plate thus prepared was mechanically bonded to other metals joined together with the properties of nickel metal, indicating {100} (001) of the metal matrix surface. Electrical. Thermal. It has a combination of magnetic properties. Therefore, the properties of the entire multilayer thin plate can be adjusted according to the desired use depending on the properties of the metal to be bonded.

In addition, the metal having the {100} (001) prepared through the present invention is made of ceria (ceria), YSZ, (RE = rare earth metal) thin films are deposited under appropriate conditions to maintain {100} (001) on the surface of the metal composite and to produce ceria, YSZ, (RE = rare earth metal) Hetero-epitaxial growth in which a thin film is deposited results in bi-axially organization. So manufactured (RE = rare earth metal) Thin films have high critical current density similar to single crystal because of their excellent orientation and can be used to make superconducting composite conductors (wires, plates, cylindrical materials, etc.) with a large conduction current. At this time, the superconducting composite wire produced was mechanically different from that of other metals joined together, compared with the pure nickel metal base material. Electrical. Thermal. It is a combination of magnetic properties.

Claims (14)

A silver / nickel heterojunction was prepared using powder metallurgy using nickel powder with a purity of 99.99% and silver powder with a purity of 99.9%, and cold rolled silver / nickel heterojunction at a rolling rate of 93% to produce a thin plate. The cold-rolled silver / nickel plate is heat treated at 900 ° C. for 4 hours in a vacuum atmosphere, wherein the temperature rise rate is 500 ° C./h, wherein the heterojunction metal having {100} (001) is made. A silver / nickel heterojunction was prepared using powder metallurgy using nickel powder with a purity of 99.99% and silver powder with a purity of 99.9%, and cold rolled silver / nickel heterojunction at a rolling rate of 93% to produce a thin plate. The cold rolled silver / nickel plate is heat treated at 900 ° C. for 4 hours in a vacuum atmosphere, wherein the temperature increase rate is 500 ° C./h. The method of claim 2; When the metal (A) having {100} (001) and the adjacent metal (B) having different mechanical, electrical, thermal, and magnetic properties are joined, the diffusion of the adjacent metal (B) into the metal (A) causes the metal to undergo annealing. A method for producing a heterojunction metal having a {100} (001), characterized in that it does not interfere with the development of {100} (001) in (A). The method of claim 2; When another metal (C) is bonded next to the metal (B) layer adjacent to the metal (A), the diffusion coefficient in the metal (B) of the metal (C) atom during the tissue annealing is low, so that the valence metal of the metal (C) Method for producing a heterojunction metal having a {100} (001), characterized in that the metal (B) layer serves to prevent the diffusion to (A). The method of claim 2; When forming a multi-layered metal composite, joining another metal (C) next to the metal (B) layer adjacent to the metal (A) again, layer B consists of metals with melting points lower than metal (A) and metal (C) Method for producing a heterojunction metal having a {100} (001), characterized in that it has a multi-layer structure. The method of claim 2; In the case of forming a multi-layer metal joint, when the metal (B) layer adjacent to the metal (A) is joined to another metal (C) again, it is composed of a method of joining by diffusion bonding. 001) manufacturing method of heterojunction metal. The method of claim 2; In making a multi-layer metal joint, if another metal (C) is joined again after the metal (B) layer adjacent to the metal (A), it is molded using the powder of metal (C) to form a multi-layer structure, which is then A method for producing a heterojunction metal having a {100} (001), characterized by sintering below a melting point of) to form a multilayer junction. The method of claim 2; Heterogeneous having {100} (001), characterized in that the multi-layered composite is constructed to be heated at a melting point of the metal (B) or higher in a high vacuum or inert atmosphere to maintain a predetermined time, and then cooled and bonded to the layers. Joining metal manufacturing method. The method of claim 2; A method for producing a heterojunction metal having a {100} (001), characterized by using nickel, copper, aluminum, and silver as the metal A. The method of claim 2; A metal B manufacturing method of a heterojunction metal having a {100} (001) comprising silver, gold, platinum, palladium, and tantalum. The method of claim 4; A method for producing a heterojunction metal having a {100} (001) comprising a material having higher mechanical strength than that of the metal (A) or the metal (B), such as stainless steel and Hastelloy. The method of claim 6; Method for producing a heterojunction metal having a {100} (001), characterized in that the thickness of the metal multi-layer plate produced by rolling to reduce the thickness to more than 80%. The method of claim 12; Heterojunction with {100} (001) characterized in that the thin multilayer plate is heat-treated in a high vacuum or inert atmosphere in a temperature range of 300 ° C. to 1200 ° C. to have a (100) (001) texture. Metal manufacturing method. The method of claim 2; In the manufacture of composite metal, by changing the thickness of the metal (A) and the metal to be bonded to the metal (A), the combination ratio of the metal (A) and the bonding metal is changed so that the strength, electrical resistance, magnetic properties, A method for producing a heterojunction metal having a {100} (001), characterized by a method of changing the thermal conductivity.