KR19990084809A - Carrier module of test tray for semiconductor device test - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module of a test tray for testing a semiconductor device, which is used to carry and transport a semiconductor device on a test tray during testing of the semiconductor device. The cavity 17 is formed in the center of the element 8 is loaded, the housing 16 is formed so that the receiving groove 18 is penetrated to both sides of the cavity, and the support shaft 22 in the receiving groove. A pair of rotatably provided links 21 and the other end of the link is hinged to the link shaft 24 and positioned in the cavity 17 or moving away from the cavity while moving up and down in accordance with the rotational movement of the link 21. The torsion spring 25 is installed to be supported between the locking lever 23 and the support shaft 22 and the link shaft 24 so that the horizontal distance between the shafts is as far as possible when no external force is applied. A button 27 having a sliding surface 27a which is installed in the housing 16 so as to be movable up and down and is horizontally moved in a state in which the link shaft 24 is connected according to the lifting movement, and a pair of buttons from the housing ( 27 is composed of the locking means provided in the housing 16 and the button 27 so as not to be separated from the shape or size of the locking lever 23 is different depending on the loading of the device (8) having a variety of sizes and shapes Even if the stroke of the linker (21) or the support shaft (22) and the link shaft (24) are varied without changing the stroke of the initially set pusher (30), the amount of opening of the locking lever (23) can be adjusted. Will be.

Description

Carrier module of test tray for semiconductor device test

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module of a test tray for testing a semiconductor device, which is used to carry and transport a semiconductor device on a test tray during testing of the semiconductor device. More specifically, it is to be suitable for the type of transferring the semiconductor element in the suspended state upside down to the carrier module.

In recent years, semiconductor devices (hereinafter referred to as "devices") are also gradually thinner and smaller in size, due to the trend toward thinner and shorter components. Among them, thinner small outline packages (TSOP) and micro-BGA (Micro) Ball Grid Array).

The TSOP or μBGA has a thickness of about 1 mm, and when the shock is applied to the upper or lower surface due to carelessness or the like between the test processes that are completed in the manufacturing process and inspects the performance, the characteristics of the device are deteriorated and the impact is severe. The molded chip is damaged during the process, so care must be taken not to impact the device during transfer or testing within the handler.

This TSOP or [mu] BGA is loaded on the metal test tray 1 as shown in FIG. 1 and transferred between the test processes.

The test tray 1 is formed in a quadrangular frame 2 with a plurality of flesh 3 parallel to each other at equal intervals and on both sides of the flesh and the sides 2a of the frame 2 facing the flesh ( Apparatuses 4 are projected at equal intervals in 2b), respectively, and approximately 64 carrier module accommodating portions are formed between the flesh 3 or the sides 2a and 2b and by the two apparatus pieces 4. (5) is provided in the test tray 1.

In each of the carrier module accommodating parts 5, a carrier module 6 on which an element is loaded is mounted in a floating state by the fastener 7.

Figure 2 is a perspective view showing an embodiment of a conventional carrier module and Figure 3 is a cross-sectional view taken along the line A-A of Figure 2, the cavity (Cavity) 9 is seated on the upper surface of the carrier module 6 (Cavity) (9) And long grooves 10 are formed on both sides of the cavity so that the lead 8a of the device is exposed downward, and the wing pieces 11 formed on both sides of the carrier module 6 Positioning groove 12 for determining the position of the carrier module at the time of loading (8), and fastening hole 13 for mounting the carrier module 6 to the test tray 1 as a fastener 7 is formed have.

Therefore, when the plurality of carrier modules 6 of the above structure are coupled to the test tray 1 and the test tray 1 is transferred to the loading position of the element 8 by the transfer means, the elements contained in the customer tray are separated. Element adsorption means is absorbed and transferred to the upper part of the test tray 1, and the element absorbed by the picker is released into the cavity 9 of the carrier module 6 by its own weight by releasing the element's attraction force. The lid 8a is exposed downward through the long groove 10 formed long on both sides of the cavity 9.

Then, the insulator (not shown) comes down from the top of the test tray while the test tray 1 is transferred to the test site by the transfer means, and presses the lead of the device, and at the same time, the contactor (not shown) When omitted) is raised through the long groove 10 is connected to the lead (8a) of the device, the lead (8a) and the contactor is electrically through the electrical properties of the device in the CPU (central processing unit) is tested.

However, because the longitudinal width of the cavity 9 formed in the carrier module 6 of this conventional test tray 1 is larger than the longitudinal width L of the device for easy loading of the device 8 When the adsorption means adsorbs the element 8 and free-falls the element from the top of the cavity 9 and loads it into the cavity 9, the element 8 is correctly loaded into the cavity 9 as shown in FIG. Not frequently occurred.

If the test is conducted by contacting the lead 8a of the element 8 to the contactor in such a state in this state, the contactor may not be connected to the lead correctly, thereby causing a fatal problem in that the good element is incorrectly judged as defective.

In addition, even when the device 8 is correctly loaded in the cavity 9, when the test tray is shocked due to vibration or the like during the transfer of the test tray 1, the device 8 is simply the cavity 9 of the carrier module 6. Since it is in the state of), the correct position of the device is off, thereby causing the problem as described above.

4A to 4D are perspective views showing another embodiment of the conventional carrier module, and have been developed to solve the problems of the carrier module 6 as in the above-described embodiment.

Looking at the configuration, a pair of latches 14 are integrally formed to move left and right from the cavity to both sides of the cavity 9 formed in the carrier module 6.

The latch 14 of this structure is integrally formed upward from the bottom of the cavity 9 to accommodate the element 8 in the cavity 9 by using the elastic force of the resin material of the carrier module 6, or in the cavity The element 8 is accommodated in the cavity while the two latches 14 are simultaneously opened to both sides by the latch release mechanism 15 which moves simultaneously with the element adsorption means for adsorbing the element 8 when taken out from the (9). The device stored in the cavity is taken out.

When the element 8 is loaded into the cavity 9 and the latch release mechanism 15 is released from the latch 14, the latch 14 is reduced to its initial state by its elastic force and the element 8 loaded on the carrier module is loaded. Since the upper surface of the) is pressed, the position of the element 8 loaded in the carrier module is not changed even when the test tray 1 is subjected to an impact during transfer between processes.

However, the carrier module 6 of this structure also has a drawback of very short life because the latch 14 is formed integrally with the resin body so that the restoring force of the latch is decreased when repeated use.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem in the related art, and an object thereof is to provide a carrier module in which a driving stroke of a locking lever that suppresses an element with respect to a predetermined external driving stroke for opening the locking lever is adjusted. To provide.

According to an aspect of the present invention for achieving the above object, a cavity in which the element is loaded in the center is formed, the housing formed in both sides of the cavity through the receiving groove, and rotatably installed around the support shaft in the receiving groove A pair of links and a hinge coupled to the other end of the link are positioned in the cavity while moving up and down in accordance with the rotational movement of the link, or are installed to be supported between the support shaft and the link shaft, and are supported by the support shaft and the link shaft. A torsion spring which allows the horizontal distance between the shafts to be as far as possible when it is not actuated, a button having a sliding surface which is installed in the housing so as to be liftable and horizontally moved in a state where the link shaft is connected according to the lifting and lowering movement, and from the housing. It consists of the locking means provided in the housing and the buttons so that the pair of buttons do not escape A carrier module of a test tray for testing a semiconductor device is provided.

1 is an exploded perspective view showing a test tray for testing a conventional semiconductor device

Figure 2 is a perspective view showing an embodiment of a conventional carrier module

3 is a cross-sectional view taken along the line A-A of FIG.

4a to 4d is a perspective view showing another embodiment of the conventional carrier module

5 is an exploded bottom perspective view of an embodiment of the present invention;

FIG. 6 is a bottom view of the coupled state of FIG. 5; FIG.

7A and 7B are cross-sectional views taken along the line BB of FIG. 6,

7A is a state in which the locking lever is located on the cavity

7B is a state in which the latch lever is out of the cavity

8 is a cross-sectional view taken along the line C-C of FIG.

9a and 9b is a perspective view of the main portion for explaining the sliding movement of the locking lever

Explanation of symbols for main parts of the drawings

16: housing 17: cavity

18: acceptance home 21: link

22: support shaft 23: locking lever

24: link shaft 25: torsion spring

27: button

Hereinafter, with reference to Figures 5 to 9 showing an embodiment of the present invention in more detail as follows.

FIG. 5 is an exploded bottom perspective view showing an embodiment of the present invention, FIG. 6 is a bottom view showing the coupled state of FIG. 5, and FIG. 8 is a cross-sectional view taken along line C-C of FIG. The cavity 17 in which the element 8 is loaded is formed in the center, and the receiving groove 18 is formed through both sides of the cavity.

The cavity 17 is provided with an element receiving surface 19 where the upper surface of the loaded element 8 abuts, and a lead seating surface 20 where the lead 8a of the element 8 abuts when an external force is applied during the test. have.

In the receiving groove 18 formed to penetrate both sides of the cavity 17, a pair of links 21 are rotatably installed about the support shaft 22, and the other end of the link 21 is a link 21. The locking lever 23 located in the cavity 17 or moving away from the cavity is hinged to the link shaft 24 while the lifting and lowering movement is performed according to the rotational movement of the support shaft 22 and between the support shaft 22 and the link shaft 24. When the external force is not applied to the link, the torsion spring 25 is installed to support the horizontal distance between the shafts as far as possible.

The width of the receiving groove 18 formed on both sides of the cavity 17 is designed so that the locking lever 23 does not flow left and right when the linear lifting and lowering movement is performed.

In addition, the torsion spring 25 is fitted to the support shaft 22, as shown in Figure 9a, one end is supported on the side wall 26 of the receiving groove 19, the other end is supported on the link shaft 24, A locking groove 24a is formed in the link shaft 24 on which one end of the torsion spring 25 is supported so that the torsion spring 25 does not flow during the compression and relaxation operation of the torsion spring.

And the button 27 is installed in the receiving groove 18 of the housing 16 so as to be connected to each of the link shaft 24, the lower surface of the button 27 in accordance with the lifting movement of the button shaft link shaft The sliding surface 27a which moves horizontally with 24 is connected is provided.

The sliding surface 27a may be formed to extend the protruding piece 27b to one side of the button 27 according to the left and right movement amounts of the locking lever 23.

This is because the link 21 is installed on the housing 16 so as to be pivotable about the support shaft 22, thereby preventing the interference between the support shaft 22 and the support shaft 22 during the lifting movement of the button 27. This is to minimize the

The pair of buttons 27 installed on the housing 16 so as to be lifted and lowered are not separated from the housing by the locking means provided in the housing 16 and the button 27.

In one embodiment of the present invention, the locking means has a pair of hooks 28 formed to oppose each other on both sides of the housing 16, and the locking jaw so that the hook 27 is not released from the housing 16. It consists of the button 27 in which 27c) was formed.

Referring to the operation of the present invention configured as described above is as follows.

First, a plurality of carrier modules having the above-described structure are mounted on a frame of a test tray (not shown) by using fastening holes 13 formed to face the housing 16 (about 64).

In the present invention, a process of loading and unloading the device 8 in a state in which the carrier module is mounted on the frame such that the cavity 17 faces downward is described, but is not necessarily limited thereto.

The reason for this is that loading and unloading of the element 8 can be performed even in a state in which the cavity 17 faces upwards, which will be described later.

7A and 7B are cross-sectional views taken along line B-B of FIG. 6 for explaining the operation of the present invention, in which a test tray equipped with a plurality of carrier modules is moved to a loading and unloading position of the device. 8) When the aligner 29 containing the element is loaded under the test tray to vertically coincide with the cavity 17 formed in the housing 16 to load the cavity 17 into the cavity 17 formed in the carrier module. Will stop.

As shown in FIG. 7A, when the aligner 29 is moved downward of the test tray to coincide with one row of carrier modules in a state where the pair of locking levers 23 are located in the cavity 17, the pushers 30 are lowered and the pair is lowered. Since the button 27 is pressed downwards simultaneously, the link shaft 24 which is in contact with the sliding surface 27a of the button 27 is pressed.

When the link shaft 24 is pressed by the button 27 as described above, the locking lever 23 fitted to the link shaft 24 is lowered together with the button 27. However, the link shaft 24 is shown in FIG. As shown in FIG. 7B, the locking lever 23 is inserted into the one end of the link 21 and the locking lever 23, and the locking lever 23 is vertically lowered about the support shaft 22 to escape from the receiving groove 18. 17) out of the way.

That is, as the button 27 is pressed by the pusher 30, the link shaft 24 moves along the trajectory indicated by the dashed-dotted line in FIG. 7A along the sliding surface 27a formed on the bottom of the button 27. Since 9b, the locking lever 23 is vertically lowered.

Since the position of the link shaft 24 is changed during the operation as described above, the distance between the support shaft 22 is narrowed, so that the torsion spring 25 supported on the side wall of the link shaft 24 and the receiving groove 18 is provided. Is subjected to compression.

In this way, after the pair of locking levers 23 are opened to both sides to escape the cavity 17 into which the element 8 is loaded, the element 8 in the aligner 29 rises in a state where it is placed on the element mounting block. Is located in 17).

According to the above operation, the upper surface of the element is connected to the element receiving surface 19 and the lead 8a is placed on the lead seating surface 20.

After that, when the pusher 30 lowered to hold the element 8 positioned in the cavity 17 ascends, the external force applied to the button 27 is removed so that the torsion spring 25 which is under compression is in an initial state. The link shaft 24 is pushed out while being reduced to, and thus the link shaft 24 which has been horizontally moved along the sliding surface 27a is returned to its initial state as shown in FIGS. 7A and 9A and the locking lever 23 is vertical. As it is raised, the locking lever 23 holds the bottom of both sides of the element 8 that has been loaded into the cavity 17.

After the elements are loaded in the plurality of rows of carrier modules in a repeating operation, the test tray is moved to a test site side by a transfer means while the test tray is held in a horizontal or vertical state, and then the test tray is moved to a test contactor (not shown). In the state of being connected to the lead of the device is pushed to the side of the device to check the electrical characteristics of the device for a set time, the result according to the characteristics of the device is notified to the central processing unit.

Hereinafter, a process of unloading the device 8 loaded in the cavity 17 after the test is completed will be described briefly.

In order to unload the element 8 suspended from the carrier module while the test tray is located at the unloading position, as in the case of loading, the aligner 29 is transferred to the lower side of the test tray to form a cavity ( 17) should be vertically aligned.

However, unlike when the device 8 is loaded, the aligner 29 is not mounted with the device.

As such, the aligner 29 is transferred directly below the cavity 17 loaded with the element 8, and then the pusher 30 descends while the element seating block is raised to reach the bottom of the element, thereby pushing the button 27. When pressed, the pair of locking levers 23 supporting the device are opened to both sides, and thus the holding state of the device is released.

As a result, the element located in the cavity 17 is seated in the aligner 29 by the lowering of the element mounting block.

Up to now, the state in which the element 8 is loaded and unloaded while the element 8 is suspended to the carrier module by the latch lever 23 while the cavity 17 is facing downward has been described, but the cavity 17 of the carrier module is upward. It is to be understood that the loading and unloading operations of the device can be performed by the same operation as described above even in the state of facing.

As described above, according to the present invention, even if the shape or size of the locking lever 23 varies depending on the loading of the element 8 having various sizes and shapes, the link ( Since the installation angle of the 21 or the distance between the support shaft 22 and the link shaft 24 can be varied, the amount of opening of the locking lever 23 can be adjusted, thereby maximizing the operation rate of the expensive equipment and the tester. .

Claims (3)

A cavity is formed in the center of the device is formed, the housing is formed through the receiving groove through both sides of the cavity, a pair of links rotatably installed around the support shaft in the receiving groove, the link shaft at the other end of the link It is hinged to be positioned in the cavity while moving up and down according to the rotational movement of the link, or is installed between the support lever and the link shaft and the latch lever away from the cavity, so that the horizontal distance between the axes as far as possible when no external force is applied. A button having a torsion spring, a button mounted on the housing so as to move up and down and horizontally moving in a state in which the link shaft is connected according to the lifting motion, and a pair of buttons provided on the housing and the button so that the pair of buttons are not separated from the housing. Carrier module of test tray for testing semiconductor devices Module. The method of claim 1, The locking means is a carrier module of a test tray for a semiconductor device test, characterized in that the pair of hooks formed opposite to each other on both sides of the housing and the hook is formed so that the hook is caught so that the button is not separated from the housing. The method of claim 1, The cavity has a carrier module of a test tray for testing a semiconductor device, the device receiving surface is in contact with the upper surface of the device and the lead seating surface is in contact with the lead of the device.