KR19990075429A - Manufacturing method of epoxy resin composition for semiconductor element sealing - Google Patents

Abstract

The present invention relates to a method for producing an epoxy resin composition for semiconductor element encapsulation, and in the case of using DCPD epoxy, a release agent is blended and mixed at low speed after kneading and pulverization in a method of increasing release property. Provides a method for improving release.

Description

Manufacturing method of epoxy resin composition for semiconductor element sealing

TECHNICAL FIELD This invention relates to the manufacturing method of the sealing epoxy resin composition for protecting a semiconductor element, More specifically, it is related with the manufacturing method which improves releasability in a new low viscosity resin.

Recently, the development trend of electronic products is in the trend of ultra-thin and ultra-miniaturized, so semiconductors also require ultra-thin technology. Therefore, the thickness of the encapsulant to protect it should also be thin, and thus, the encapsulant has a problem of lowering resistance to various conditions that can be received in the semiconductor assembly process. In order to solve the above problems, a new encapsulant having excellent mechanical strength, excellent adhesion and low hygroscopicity is required.

One of the epoxy resins widely used to meet these demands is DCPD epoxy, which is characterized by low viscosity, low hygroscopicity, and high adhesion and strength, which is an increasing demand in the industry. The structure is as follows:

here, And n is 3-7.

However, DCPD epoxy resins have problems due to their structure in application.

The problem is that saturated hydrocarbon matrix is more dispersed in the molecule than the general -OCN group or biphenyl epoxy resin, resulting in too high compatibility with the wax compound. The release agent does not come out easily to the surface, so the release property is not smooth during molding. To increase the workability, it is necessary to increase the amount of the release agent or to use a relatively poor release agent with DCPD epoxy. In the case of the former, if the wax usage is excessive, the surface of the package may not be clean after molding or adversely affect the IR reliability. In the latter case, it is often difficult to select a release agent having excellent release properties.

In the present invention, by reducing the contact with the epoxy resin by changing the treatment method of the release agent used in the prior art to facilitate the release property during the molding operation.

The method for producing an epoxy resin composition in the present invention does not take the order of kneading in a heating roll or kneader after mixing the release agent through dry blending or melt blending during preblending. In the final blending after kneading and pulverizing, a release agent is added to reduce the contact with the epoxy resin, thereby providing an epoxy resin composition having an increased release effect. If the release agent to be added is in the form of granules, a fine powder of less than 100 μm is used in a high speed mixer. Accordingly, the present invention provides a method for producing an epoxy resin composition comprising an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, an organic flame retardant, and an inorganic flame retardant, wherein the release agent is made into a powder having a particle size of less than 100 μm, kneaded and pulverized. After blending at low speed and mixed, it is a manufacturing method of the epoxy resin composition for sealing semiconductor elements.

The composition ratio of the composition of this invention is as follows.

ingredient Parts by weight (wt%) Epoxy resin 6-15 Hardener 3 to 10 Curing accelerator 0.1-1.0 Inorganic filler 70-90 Binder 0.3 to 1.0 Modifier 0.5 to 0.3 Organic flame retardant 0.8 to 5.0 Inorganic flame retardants 1.0 to 5.0 Release agent 0.2 to 0.8

When explaining each component used for the epoxy resin composition of this invention, it is as follows.

Generally, the epoxy resin uses an allocresol novolac epoxy resin, and an epoxy resin having a biphenyl or naphthalene group may be used. Phosphorus-type compounds, such as a phenyl novolak-type resin and a hardening accelerator, a triphenyl phosphine, tertiary amine, etc. can be used for a hardening | curing agent. In this invention, in order to accelerate reaction of an epoxy resin and a hardening | curing agent, it is preferable to mix | blend a hardening accelerator. Examples of the curing accelerator include imidazole compounds, cycloamine derivatives such as 1,8-diazabicyclo [5,4,0] undecene (DBU), derivatives such as triphenyl phosphine and methyldiphenyl phosphine, and tertiary amines. Can be used. As for the usage-amount of a hardening accelerator, it is preferable to use 0.01-1.0 weight part with respect to the epoxy resin composition total amount 100.

The binder may be a silane system having an epoxy group amine group or the like, and the modifier may be an epoxy, amine, phenol, carboxyl, modified silicone oil, silicone powder, carboxyl modified polybutadiene compound or the like.

The flame retardant includes an organic flame retardant and an inorganic flame retardant. An organic flame retardant is a bromine-substituted cresol novolac-type epoxy resin or a bisphenyl-based epoxy resin, and an appropriate amount of 0.7 to 5 parts by weight is suitable. The inorganic flame retardant uses antimony oxide, and the amount of the inorganic flame retardant is preferably blended within the range of 0.5 to 5 parts by weight based on the total amount of the organic flame retardant based on the total amount of the resin composition, and preferably having a particle size distribution within 1 to 15 μm. .

As the inorganic filler used in the present invention, those commonly used in epoxy resins for semiconductor encapsulation may be used. Among them, fused silica powder and crystalline silica powder are most suitable in terms of economic efficiency, high density and linear expansion coefficient. The shape of each phase is appropriately used in consideration of fluidity, and in the case of each phase, 75 μm or more is limited to 0.5 parts by weight or less in order to prevent local stress on the semiconductor chip. Although the compounding quantity of a filler changes with kinds of epoxy resin, a hardening | curing agent, and an inorganic filler, in order to apply to a transfer molding process, it is suitable to use 60-90 weight part with respect to the whole composition. When 65 parts by weight or less is used, thermal expansion is increased, and physical properties such as heat resistance, crack resistance, and moisture resistance are reduced. When using more than 90 parts by weight, fluidity is remarkably decreased, so that bending of the bond wire connecting the semiconductor element and the lead frame, Cutting occurs and, in more severe cases, sealing is impossible.

Example

After kneading and pulverizing is finished according to the method of the present invention, the composition was improved by the release agent was added at the time of final blending, and the composition was improved by kneading in a heating roll or kneader after the release agent was added in the pre-blending step. By using the composition prepared in Comparative Example 1, Comparative Example 2 was prepared in the composition ratio shown in Table 2.

ingredient Compounding ratio (weight ratio) Comparative Example 1 Comparative Example 2 Example Epoxy Resin 1 90 Epoxy resin 2 90 90 Hardener 50 45 45 Curing accelerator 1.5 1.5 1.5 Inorganic fillers conception 600 600 600 Prize 200 200 200 Microspheres 50 50 50 Binder 2 2 2 Modifier 5 5 5 Organic flame retardant 10 10 10 Inorganic flame retardants 8 8 8 Release agent 2 2 2 coloring agent 2 2 2

Epoxy Resin 1: Epikote-180H65 (Yuka Shell, Softening Point: 65-72 ° C, EEW: 200-215 (g / eq.), Oxo Cresol Novolac Epoxy Resin)

Epoxy Resin 2: HP-7200 (Japanese gunpowder, softening point 55-80 ° C, EEW: 260-290 (g / eq.), DCPD epoxy resin)

Curing agent: PSM-4261 (Gunyeong Chemical, Softening Point: 81 ℃, Phenolic Novolak Resin)

Curing Accelerator: TPP

Inorganic filler: S-6200 (Shinil Iron Chemical, Spherical Fused Silica, 22μm)

NX-7 (Primary Silica, Longsam, 14μm)

SP-03 (fusosiltec, 0.1-0.5μm microspheres)

Binder: S-510 (Epoxy Silane Binder, Chisso)

Modifier: MSP-M1 (polymethyl siloxane, Nikko Fine)

Organic flame retardant: BREN-105 (Japanese gunpowder, bromine epoxy)

Inorganic flame retardant: RAC-1 (Samukyeon, Antimony trioxide)

Release Agent: S-Wax (Hoechst, Monanic acid)

Colorant: HS-100 (electrochemical, carbon black)

After mixing with enough composition and composition ratio (part by weight) as above, kneading in the kneader, crushing to a certain particle size, crushing and tableting to make a specimen in a heat transfer molding machine with a mold for mold release test, and the force required for mold release in the mold Was measured and the results are shown in Table 3.

Force (N) measurement count Comparative Example 1 Comparative Example 2 Example One 104 201 124 2 107 208 127 3 99 206 130 4 103 204 125 5 102 202 127 Average 103 204 127

As shown in Table 3 it can be seen that the releasability is significantly increased when the mixing method of the release agent is different.

The present invention was able to greatly improve the releasability of the epoxy resin encapsulant.

Claims (4)

In the method for producing an epoxy resin composition comprising an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, an organic flame retardant, an inorganic flame retardant, the release agent is made into a powder having a particle size of less than 100 μm and blended at low speed after kneading and grinding Mixing, The manufacturing method of the epoxy resin composition for sealing semiconductor elements. The method of claim 1, Epoxy resin is an epoxy resin composition for semiconductor element sealing whose allocresol novolak resin is. The method of claim 1, The epoxy resin composition for semiconductor element sealing whose epoxy resin is a biphenyl type epoxy resin. The method of claim 3, Epoxy resin composition for semiconductor element sealing whose epoxy resin is resin represented by following Formula: here, And n is 3-7.