KR19990074691A - Chip Direct Mount Liquid Crystal Display - Google Patents
Chip Direct Mount Liquid Crystal Display Download PDFInfo
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- KR19990074691A KR19990074691A KR1019980008467A KR19980008467A KR19990074691A KR 19990074691 A KR19990074691 A KR 19990074691A KR 1019980008467 A KR1019980008467 A KR 1019980008467A KR 19980008467 A KR19980008467 A KR 19980008467A KR 19990074691 A KR19990074691 A KR 19990074691A
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- printed circuit
- integrated circuit
- active region
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
Abstract
절연 기판 위에 활성 영역이 형성되어 있고, 활성 영역의 제1 측면을 따라 제1 구동 집적 회로군이 배치되어 있고, 활성 영역의 제1 측면과 인접한 제2 측면을 따라 제2 구동 집적 회로군이 배치되어 있으며, 구동 회로 기판으로부터 구동 집적 회로로 구동 신호를 전달하는 유연성 인쇄 회로가 제1 구동 집적 회로군을 따라 길게 배치되어 있고, 유연성 인쇄 회로에는 제1 구동 집적 회로군의 양쪽 말단 집적 회로의 측면에까지 연장되는 돌출부가 형성되어 있다. 여기서, 유연성 인쇄 회로는 제1 구동 집적 회로군의 인접한 집적 회로 사이에까지 연장되어 있는 돌출부를 더 가질 수도 있다.An active region is formed over the insulating substrate, the first group of driving integrated circuits is disposed along the first side of the active region, and the second group of driving integrated circuits is disposed along the second side adjacent to the first side of the active region. And a flexible printed circuit for transmitting a drive signal from the drive circuit board to the drive integrated circuit is arranged long along the first drive integrated circuit group, and the flexible printed circuit has side surfaces of both terminal integrated circuits of the first drive integrated circuit group. Protruding portion is formed to extend to. Here, the flexible printed circuit may further have protrusions extending between adjacent integrated circuits of the first group of drive integrated circuits.
또는 유연성 인쇄 회로를 제1 구동 집적 회로군의 집적 회로에 대하여는 각 집적 회로별로 개별적으로 배치하고, 제2 구동 집적 회로군에 대하여는 따로 하나를 배치한다. 여기서, 제1 구동 집적 회로군에 대한 유연성 인쇄 회로에는 제1 구동 집적 회로군의 양쪽 말단의 집적 회로의 측면에까지 연장되는 돌출부와 유연성 인쇄 회로 상호간을 연결하는 연결부가 더 형성될 수도 있고, 제1 구동 집적 회로군의 인접한 집적 회로 사이에까지 연장되는 돌출부가 더 형성될 수도 있다.Alternatively, the flexible printed circuit is individually disposed for each integrated circuit for the integrated circuit of the first driving integrated circuit group and one for the second driving integrated circuit group. Here, the flexible printed circuit for the first group of driving integrated circuits may further include a protrusion extending to the side of the integrated circuit at both ends of the first group of driving integrated circuits and a connection portion connecting the flexible printed circuits to each other. Protrusions may be further formed that extend between adjacent integrated circuits of the drive integrated circuit group.
Description
이 발명은 액정 표시 장치에 관한 것으로서, 더 자세하게는 COG(chip on glass)형 액정 표시 장치의 구동 회로의 입력 저항을 최소화할 수 있도록 유연성 인쇄 회로(FPC ; flexible printed circuit)를 배치한 COG형 액정 표시 장치에 관한 것이다.The present invention relates to a liquid crystal display device, and more particularly, to a COG type liquid crystal having a flexible printed circuit (FPC) disposed thereon to minimize input resistance of a driving circuit of a chip on glass (COG) type liquid crystal display device. It relates to a display device.
액정 표시 장치의 구동 집적 회로를 유리 기판 위에 직접 실장하는 COG(chip on glass)형 박막 트랜지스터 액정 표시 장치의 경우 TAB(tape automated bonding)형 패널에 비해 그 크기를 줄일 수 있고, 신뢰성이 우수한 장점을 지니고 있다.A COG (chip on glass) thin film transistor liquid crystal display device, in which a drive integrated circuit of a liquid crystal display device is directly mounted on a glass substrate, can be reduced in size and has excellent reliability compared to a tape automated bonding (TAB) panel. I have it.
이제, 도면을 참고하여 종래의 기술에 따른 COG형 액정 표시 장치 패널에 대하여 설명한다.Now, a COG type liquid crystal display panel according to the related art will be described with reference to the drawings.
도 1과 도 2는 종래의 기술에 따른 COG형 액정 표시 장치의 배치도이다.1 and 2 are layout views of a COG type liquid crystal display according to the related art.
도 1을 보면, 액정 표시 장치의 절연 기판(1) 위에 화소 전극(도시하지 않음) 및 화소 전극 구동 박막 트랜지스터(도시하지 않음)가 형성되어 있는 활성 영역(2)이 넓게 형성되어 있고, 활성 영역(2)의 하측면과 우측면에 인접하여 활성 영역을 구동하는 제1 내지 제3의 구동 집적 회로(31, 32, 33)가 배치되어 있다. 기판(1)의 우하단에는 기판(1)과는 분리되어 있는 인쇄 회로 기판(PCB ; printed circuit board)(5)으로부터 구동 집적 회로(31, 32, 33)로 전원을 공급하고 화상 정보를 전달하는 유연성 인쇄 회로(FPC ; flexible printed circuit)(4)가 배치되어 있다. 유연성 인쇄 회로(4)에는 다수의 도선이 포함되어 있다. 도면상에서 굵은 실선으로 표현된 것이 유연성 인쇄 회로(4)가 포함하고 있는 도선을 나타낸다. 유연성 인쇄 회로(4)는 기판(1)과 인쇄 회로 기판(5)을 연결하는 데에만 사용되고, 기판(1) 내에는 기판(1) 자체 배선이 형성되어 있다. 도면상에서 가는 실선으로 표현된 것이 기판(1) 자체 배선을 나타낸다. 기판(1) 자체 배선과 유연성 인쇄 회로(4)의 도선은 기판에 형성되어 있는 패드(pad)(도시하지 않음)를 통해 연결되어 있다.Referring to FIG. 1, an active region 2 in which a pixel electrode (not shown) and a pixel electrode driving thin film transistor (not shown) are formed on an insulating substrate 1 of a liquid crystal display device is wide, and an active region is formed. First to third drive integrated circuits 31, 32, and 33 which drive the active region are arranged adjacent to the lower side and the right side of (2). At the lower right end of the substrate 1, power is supplied from the printed circuit board (PCB) 5 separated from the substrate 1 to the driving integrated circuits 31, 32, and 33, and image information is transferred. Flexible printed circuit (FPC) 4 is arranged. The flexible printed circuit 4 includes a plurality of conductors. What is represented by a thick solid line in the figure shows the conducting wire which the flexible printed circuit 4 contains. The flexible printed circuit 4 is used only for connecting the board 1 and the printed circuit board 5, and the board 1 itself wiring is formed in the board 1. What is represented by a thin solid line in a figure shows the board | substrate 1 itself wiring. The wiring of the board | substrate 1 itself and the lead of the flexible printed circuit 4 are connected through the pad (not shown) formed in the board | substrate.
액정 표시 장치의 구동 집적 회로, 특히 전원 공급단의 입력 저항의 허용 범위는 수십 오옴(Ω) 미만으로 매우 작다. 그런데 도 1에 나타낸 형태의 COG형 액정 표시 장치의 경우 유연성 인쇄 회로(4) 도선의 내부 저항과 기판(1)의 자체 배선의 내부 저항을 합한 크기가 입력단 저항으로 나타나므로 입력단 저항이 허용 범위를 넘을 우려가 있어 적절한 배선을 통해 입력단 저항을 감소시킬 필요가 있다. 이러한 필요에서 도 2에 나타낸 바와 같은 COG형 액정 표시 장치가 마련되었다.The allowable range of the input resistance of the drive integrated circuit of the liquid crystal display, especially the power supply stage, is very small, less than tens of ohms. However, in the case of the COG type liquid crystal display of the type shown in FIG. It is necessary to reduce the input stage resistance through proper wiring because there is a risk of exceeding it. In this need, the COG type liquid crystal display device shown in FIG. 2 was provided.
도 2를 보면, 절연 기판(11) 위에 활성 영역(12)이 넓게 형성되어 있고, 활성 영역(12)의 하측면과 우측면에 인접하여 제1 내지 제3의 구동 집적 회로(131, 132, 133)가 배치되어 있다. 기판(11) 하부에는 제1 및 제2 집적 회로(131, 132)의 하측면에 인접하여 유연성 인쇄 회로(14)가 부착되어 있는데, 이 유연성 인쇄 회로(14)는 기판(11)의 우하단에서 구부러져 기판(11)과는 분리되어 있는 인쇄 회로 기판(15)에까지 연장되어 있다. 유연성 인쇄 회로(14)는 직선형의 띠로 기판(11)의 하부에만 배치되어 있고, 유연성 인쇄 회로(14)가 배치되어 있지 않은 부분에는 기판(11) 자체 배선이 형성되어 있어서 유연성 인쇄 회로(14)의 도선과 집적 회로(131, 132, 133)를 연결하고 있다.Referring to FIG. 2, the active region 12 is widely formed on the insulating substrate 11, and the first to third driving integrated circuits 131, 132, and 133 are adjacent to the lower side and the right side of the active region 12. ) Is arranged. A flexible printed circuit 14 is attached to a lower portion of the substrate 11 adjacent to lower surfaces of the first and second integrated circuits 131 and 132, and the flexible printed circuit 14 has a lower right end of the substrate 11. It extends to the printed circuit board 15 which is bent at and separated from the substrate 11. The flexible printed circuit 14 is disposed in the lower portion of the substrate 11 in a straight strip, and the wiring of the substrate 11 itself is formed in a portion where the flexible printed circuit 14 is not disposed, so that the flexible printed circuit 14 Are connected to the integrated circuits 131, 132, and 133.
그러나 도 2에 나타낸 형태의 COG형 액정 표시 장치는 비교적 많은 면적을 차지하는 유연성 인쇄 회로(14)가 기판(11) 하부에 배치됨으로 인해 패널 소형화라는 COG형 액정 표시 장치의 장점이 저해됨은 물론 입력 저항을 줄이는 데에도 한계가 있다.However, in the COG type liquid crystal display of FIG. 2, since the flexible printed circuit 14, which occupies a relatively large area, is disposed under the substrate 11, the advantages of the COG type liquid crystal display, such as panel miniaturization, are hampered. There is also a limit to the reduction.
본 발명이 이루고자 하는 기술적 과제는 패널의 크기를 증가시키지 않으면서 COG형 액정 표시 장치의 구동 회로의 입력 저항을 줄이는 것이다.An object of the present invention is to reduce the input resistance of the driving circuit of the COG type liquid crystal display without increasing the size of the panel.
도 1과 도 2는 종래 기술에 따른 COG형 액정 표시 장치의 배치도이고,1 and 2 is a layout view of a COG type liquid crystal display device according to the prior art,
도 3은 본 발명의 제1 실시예에 따른 COG형 액정 표시 장치의 배치도이고,3 is a layout view of a COG type liquid crystal display device according to a first embodiment of the present invention;
도 4는 본 발명의 제2 실시예에 따른 COG형 액정 표시 장치의 배치도이다.4 is a layout view of a COG type liquid crystal display according to a second exemplary embodiment of the present invention.
위와 같은 과제를 해결하기 위하여 본 발명에서는 다음과 같은 구조의 COG형 액정 표시 장치를 마련한다.In order to solve the above problems, the present invention provides a COG type liquid crystal display device having the following structure.
절연 기판 위에 활성 영역이 형성되어 있고, 활성 영역의 제1 측면을 따라 제1 구동 집적 회로군이 배치되어 있고, 활성 영역의 제1 측면과 인접한 제2 측면을 따라 제2 구동 집적 회로군이 배치되어 있으며, 구동 회로 기판으로부터 구동 집적 회로로 구동 신호를 전달하는 유연성 인쇄 회로가 제1 구동 집적 회로군을 따라 길게 배치되어 있고, 유연성 인쇄 회로에는 제1 구동 집적 회로군의 양쪽 가장자리를 따라 연장되는 제1 돌출부가 형성되어 있다.An active region is formed over the insulating substrate, the first group of driving integrated circuits is disposed along the first side of the active region, and the second group of driving integrated circuits is disposed along the second side adjacent to the first side of the active region. And a flexible printed circuit for transmitting a drive signal from the drive circuit board to the drive integrated circuit is elongated along the first drive integrated circuit group, and the flexible printed circuit extends along both edges of the first drive integrated circuit group. The first protrusion is formed.
여기서, 유연성 인쇄 회로는 제1 구동 집적 회로군의 인접한 집적 회로 사이로 연장되어 있는 제2 돌출부를 더 가질 수도 있다.Here, the flexible printed circuit may further have a second protrusion extending between adjacent integrated circuits of the first group of drive integrated circuits.
또는 유연성 인쇄 회로를 제1 구동 집적 회로군의 집적 회로에 대하여는 각 집적 회로별로 개별적으로 배치하고, 제2 구동 집적 회로군에 대하여는 따로 하나를 배치할 수도 있다.Alternatively, the flexible printed circuit may be individually disposed for each integrated circuit of the integrated circuit of the first driving integrated circuit group, and one of the flexible printed circuits may be disposed separately for the second drive integrated circuit group.
여기서, 제1 구동 집적 회로군에 대한 유연성 인쇄 회로에는 제1 구동 집적 회로군의 양쪽 가장자리를 따라 연장되는 제1 돌출부와 유연성 인쇄 회로 상호간을 연결하는 연결부가 더 형성될 수도 있고, 제1 구동 집적 회로군의 인접한 집적 회로 사이로 연장되는 제2 돌출부가 더 형성될 수도 있다.Here, the flexible printed circuit for the first group of driving integrated circuits may further include a first protrusion extending along both edges of the first group of driving integrated circuits and a connection portion connecting the flexible printed circuits to each other. Second protrusions extending between adjacent integrated circuits of the circuit group may be further formed.
이제 첨부한 도면을 참고로 하여, 본 발명의 실시예에 대하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 3은 본 발명의 제1 실시예에 따른 COG형 액정 표시 장치의 배치도이다.3 is a layout view of a COG type liquid crystal display device according to a first embodiment of the present invention.
액정 표시 장치의 절연 기판(110) 위에 화소 전극(도시하지 않음) 및 화소 전극 구동 박막 트랜지스터(도시하지 않음)가 형성되어 있는 활성 영역(120)이 넓게 형성되어 있고, 활성 영역(120)의 하측면과 우측면에 인접하여 활성 영역을 구동하는 제1 내지 제3의 구동 집적 회로(1310, 1320, 1330)가 배치되어 있다. 여기서, 구동 집적 회로는 필요에 따라 더 많이 배치될 수도 있다. 기판(110) 하부에는 가로로 길게 유연성 인쇄 회로(FPC ; flexible printed circuit)(140)가 부착되어 있는데, 이 유연성 인쇄 회로(140)는 기판(110)의 오른쪽 아래에서 구부러져 기판(110)과는 분리되어 있는 인쇄 회로 기판(PCB ; printed circuit board)(150)에까지 연장되어 있고, 가로로 길게 형성되어 있는 유연성 인쇄 회로(140) 본체로부터 뻗어 나온 유연성 인쇄 회로 돌출부(141, 142, 143)가 제1 및 제2 구동 집적 회로(1310, 1320)의 좌우 측면의 빈 공간에까지 연장되어 있다.An active region 120 in which a pixel electrode (not shown) and a pixel electrode driving thin film transistor (not shown) are formed on the insulating substrate 110 of the liquid crystal display device is wide, and the lower portion of the active region 120 is formed. First to third driving integrated circuits 1310, 1320, and 1330 driving the active region are disposed adjacent to the side surfaces and the right side surfaces. Here, more driving integrated circuits may be disposed as necessary. A flexible printed circuit (FPC) 140 is attached to the lower portion of the substrate 110 in a horizontal direction, and the flexible printed circuit 140 is bent from the lower right of the substrate 110 to be different from the substrate 110. Flexible printed circuit protrusions (141, 142, 143) extending from the separated printed circuit board (PCB) 150 and extending from the main body of the flexible printed circuit 140, which are formed horizontally, are formed. It extends to empty spaces on the left and right sides of the first and second driving integrated circuits 1310 and 1320.
이렇게 하면, 굵은 실선으로 표현된 유연성 인쇄 회로(140)의 도선이 돌출부(141, 142, 143)에까지 연장 형성되고, 이에 따라 가는 실선으로 표현된 기판(110)의 자체 배선은 그만큼 짧아진다. 그런데, 기판(110)의 자체 배선은 두께가 수천 옹스트롬(Å)에 폭이 수십 마이크로미터(㎛) 정도임에 비해 유연성 인쇄 회로의 도선은 두께가 수십 마이크로미터에 폭이 수백 마이크로미터 정도여서, 같은 길이의 기판(110) 자체 배선과 유연성 인쇄 회로(140)의 도선을 비교할 때, 유연성 인쇄 회로(140)의 도선의 저항이 기판(110) 자체 배선의 저항보다 10 내지 100배 정도 작다. 따라서, 기판(110) 자체 배선을 유연성 인쇄 회로(140) 도선으로 대체한 만큼 입력 저항이 감소하게 된다.In this way, the conducting wire of the flexible printed circuit 140 represented by the thick solid line is extended to the protrusions 141, 142, and 143, whereby the self-wiring of the substrate 110 represented by the thin solid line becomes shorter. However, the self-wiring of the substrate 110 has a thickness of several thousand angstroms and a width of several tens of micrometers (μm), whereas the conductor of a flexible printed circuit has a thickness of several tens of micrometers and a few hundred micrometers of width. When comparing the conductors of the same length of the substrate 110 and the lead of the flexible printed circuit 140, the resistance of the lead of the flexible printed circuit 140 is about 10 to 100 times smaller than that of the substrate 110 itself. Therefore, the input resistance decreases as the substrate 110 itself is replaced with the flexible printed circuit 140 lead.
또한, 제2 구동 집적 회로(1320)의 우측면으로 유입되는 유연성 인쇄 회로(140)의 도선이 유연성 인쇄 회로(140)의 가장 오른쪽 돌출부(143)에 형성됨으로써 기판(110) 하부를 가로지르는 유연성 인쇄 회로(140) 본체의 폭이 감소된다. 따라서 기판(110)의 크기를 작게 할 수 있다.In addition, a conductive line of the flexible printed circuit 140 flowing into the right side surface of the second driving integrated circuit 1320 is formed in the rightmost protrusion 143 of the flexible printed circuit 140, so that the flexible printed material crosses the lower portion of the substrate 110. The width of the circuit 140 body is reduced. Therefore, the size of the substrate 110 can be reduced.
도 4는 본 발명의 제2 실시예에 따른 COG형 액정 표시 장치의 배치도이다.4 is a layout view of a COG type liquid crystal display according to a second exemplary embodiment of the present invention.
절연 기판(210)에 활성 영역(220)이 형성되어 있고, 활성 영역(220)의 하측면과 우측면에 인접하여 제1 내지 제3 구동 집적 회로(2310, 2320, 2330)가 배치되어 있다. 절연 기판(210)의 하측면에는 인쇄 회로 기판(250)이 절연 기판(210)의 아래변을 따라 길게 배치되어 있다. 절연 기판(210)의 오른쪽 아래에는 제3 구동 집적 회로(2330)와 인쇄 회로 기판(250)을 연결하는 유연성 인쇄 회로(243)가 따로 배치되어 제3 구동 집적 회로(2330)의 바로 아래까지 연장되어 있다. 또, 절연 기판(210)과 인쇄 회로 기판(250) 사이에는 제1 및 제2 구동 집적 회로(2310, 2320)와 인쇄 회로 기판(250)을 연결하기 위한 유연성 인쇄 회로 본체(241, 242)가 배치되어 있고, 제1 구동 집적 회로(2310)의 좌측과 제2 구동 집적 회로(2320)의 우측에는 유연성 인쇄 회로 본체(241, 242)로부터 뻗어 나온 유연성 인쇄 회로 돌출부(244, 245)가 배치되어 있으며, 두 유연성 인쇄 회로 본체(241, 242)를 연결하는 연결부(243)가 형성되어 있다. 여기서, 두 유연성 인쇄 회로 본체(241, 242)는 분리될 수도 있고, 제1 및 제2 구동 집적 회로(2310, 2320)의 사이에도 유연성 인쇄 회로 돌출부가 형성될 수도 있다.The active region 220 is formed on the insulating substrate 210, and the first to third driving integrated circuits 2310, 2320, and 2330 are disposed adjacent to the lower side and the right side of the active region 220. On the lower side of the insulating substrate 210, a printed circuit board 250 is disposed along the lower side of the insulating substrate 210. A flexible printed circuit 243 connecting the third driving integrated circuit 2330 and the printed circuit board 250 is disposed under the right side of the insulating substrate 210 to extend directly below the third driving integrated circuit 2330. It is. In addition, a flexible printed circuit body 241 or 242 for connecting the first and second driving integrated circuits 2310 and 2320 and the printed circuit board 250 may be provided between the insulating substrate 210 and the printed circuit board 250. The flexible printed circuit protrusions 244 and 245 extending from the flexible printed circuit bodies 241 and 242 are disposed on the left side of the first driving integrated circuit 2310 and the right side of the second driving integrated circuit 2320. And a connecting portion 243 connecting the two flexible printed circuit bodies 241 and 242. Here, the two flexible printed circuit bodies 241 and 242 may be separated, and the flexible printed circuit protrusion may be formed between the first and second driving integrated circuits 2310 and 2320.
이렇게 하면, 구동 회로의 입력 저항을 크게 감소시킬 수 있음은 물론 절연 기판(210)의 크기도 줄일 수 있다.In this way, the input resistance of the driving circuit can be greatly reduced, and the size of the insulating substrate 210 can be reduced.
본 발명의 실시예에서와 같이, 유연성 인쇄 회로에 돌출부를 형성하여 액정 표시 장치 기판의 자체 배선의 길이를 줄임으로써 구동 회로의 입력 저항을 감소시킬 수 있고, 동시에 유연성 인쇄 회로가 차지하는 기판의 면적을 줄임으로써 액정 표시 장치를 소형화할 수 있다.As in the embodiment of the present invention, it is possible to reduce the input resistance of the driving circuit by forming protrusions in the flexible printed circuit to reduce the length of the wiring of the liquid crystal display substrate, and at the same time reduce the area of the substrate occupied by the flexible printed circuit. By reducing, the liquid crystal display device can be miniaturized.
또, 유연성 인쇄 회로를 각 구동 집적 회로별로 따로 배치하는 것으로도 구동 회로의 입력 저항의 감소와 액정 표시 장치의 소형화를 이룰 수 있다.In addition, by arranging the flexible printed circuit separately for each driving integrated circuit, the input resistance of the driving circuit can be reduced and the liquid crystal display can be miniaturized.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980008467A KR100560977B1 (en) | 1998-03-13 | 1998-03-13 | Chip Direct Mount Liquid Crystal Display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980008467A KR100560977B1 (en) | 1998-03-13 | 1998-03-13 | Chip Direct Mount Liquid Crystal Display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990074691A true KR19990074691A (en) | 1999-10-05 |
| KR100560977B1 KR100560977B1 (en) | 2006-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980008467A KR100560977B1 (en) | 1998-03-13 | 1998-03-13 | Chip Direct Mount Liquid Crystal Display |
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| KR (1) | KR100560977B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100763407B1 (en) * | 2001-08-14 | 2007-10-04 | 엘지.필립스 엘시디 주식회사 | array panel for liquid crystal display devices |
| KR100763408B1 (en) * | 2001-08-21 | 2007-10-04 | 엘지.필립스 엘시디 주식회사 | liquid crystal display devices |
| KR100861273B1 (en) * | 2002-06-26 | 2008-10-01 | 엘지디스플레이 주식회사 | Liquid crystal dispaly apparatus of line on glass type |
| US7477230B2 (en) | 2004-03-15 | 2009-01-13 | Sharp Kabushiki Kaisha | Display device and glass substrate therefor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3254230B2 (en) * | 1991-10-15 | 2002-02-04 | シャープ株式会社 | LCD Display Panel Wiring Structure |
| JPH075487A (en) * | 1993-06-18 | 1995-01-10 | Fujitsu Ltd | Hybrid circuit board |
| JPH08146449A (en) * | 1994-11-24 | 1996-06-07 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
| JP3565998B2 (en) * | 1996-09-19 | 2004-09-15 | 株式会社 日立ディスプレイズ | Liquid crystal display |
-
1998
- 1998-03-13 KR KR1019980008467A patent/KR100560977B1/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100763407B1 (en) * | 2001-08-14 | 2007-10-04 | 엘지.필립스 엘시디 주식회사 | array panel for liquid crystal display devices |
| KR100763408B1 (en) * | 2001-08-21 | 2007-10-04 | 엘지.필립스 엘시디 주식회사 | liquid crystal display devices |
| KR100861273B1 (en) * | 2002-06-26 | 2008-10-01 | 엘지디스플레이 주식회사 | Liquid crystal dispaly apparatus of line on glass type |
| US7477230B2 (en) | 2004-03-15 | 2009-01-13 | Sharp Kabushiki Kaisha | Display device and glass substrate therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100560977B1 (en) | 2006-06-21 |
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