CN113611213B - Flip chip film and display device - Google Patents
Flip chip film and display device Download PDFInfo
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- CN113611213B CN113611213B CN202110874120.4A CN202110874120A CN113611213B CN 113611213 B CN113611213 B CN 113611213B CN 202110874120 A CN202110874120 A CN 202110874120A CN 113611213 B CN113611213 B CN 113611213B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
The application discloses a flip chip film and a display device, wherein the flip chip film comprises a flexible substrate, a driving chip, a plurality of input signal lines and a plurality of output signal lines, any one of the output signal lines comprises a first output line and a second output line which are not directly connected, the first output line is connected with the driving chip, and the second output line extends along the extending direction of the first output line towards the direction far away from the driving chip; the flip chip film comprises a plurality of resistors, the resistors are in one-to-one correspondence with the output signal lines, one end of each resistor is connected with the first output line, and the other end of each resistor is connected with the corresponding second output line. Through the design, the load of the circuit corresponding to each output line number line is improved, so that redundant current in the circuit is consumed by the resistor, the current carrying of the driving chip is greatly reduced, and the high-temperature problem of the driving chip caused by large current is avoided.
Description
Technical Field
The application relates to the technical field of display, in particular to a flip chip film and a display device.
Background
With the continuous development of integrated circuit technology, electronic products are gradually developed toward miniaturization and high reliability. Since the packaging of integrated circuits (integrated circuit, IC) directly affects the performance of ICs, the requirements for integrated circuit packaging are increasing as the IC die size is gradually shrinking and the degree of integration is continually increasing. The IC (driver Chip) for driving the display panel needs high-density packaging technology, and Chip On Film (COF) packaging is a commonly used packaging form at present. Since the flip chip film package directly adheres the driving chip to the flexible film (e.g., flexible circuit board, etc.), the frame area of the display panel is not required to be occupied, and thus, the narrow frame structure is easier to realize.
As the refresh rate and resolution of the display screen are higher and higher, the power consumption of the display screen is increased, so that the temperature of the driving chip on the display screen is increased, and the temperature of the driving chip must be reduced in order to ensure that the chip can normally operate; therefore, designing a flip-chip film that avoids the high temperature problem is an important research topic in the industry at present.
Disclosure of Invention
The object of the present application is to provide a flip chip film and a display device which do not generate high temperature.
The application discloses a flip chip film, which comprises a flexible substrate, a driving chip, a plurality of input signal lines and a plurality of output signal lines, wherein the input signal lines, the output signal lines and the driving chip are arranged on the flexible substrate, one end of the driving chip is connected with the input signal lines to receive signals, the other end of the driving chip is connected with the output signal lines to output signals; any one of the output signal lines comprises a first output line and a second output line which are not directly connected, wherein the first output line is connected with the driving chip, and the second output line extends along the extending direction of the first output line in a direction away from the driving chip; the flip chip film comprises a plurality of resistors, the resistors are in one-to-one correspondence with the output signal lines, one end of each resistor is connected with the first output line, and the other end of each resistor is connected with the corresponding second output line.
Optionally, the resistor is a wire winding resistor.
Optionally, the winding resistor and the output signal line are formed by the same process.
Optionally, adjacent winding resistors are arranged in a staggered manner.
Optionally, the resistor is a chip resistor.
Optionally, the plurality of chip resistors are divided into a first chip set and a second chip set, and the first chip set and the second chip set both comprise a plurality of chip resistors; the flexible substrate comprises a substrate front surface and a substrate back surface which are oppositely arranged, the first patch group and the output signal line are arranged on the substrate front surface, and the second patch group is arranged on the substrate back surface; one end of any one chip resistor in the first chip set is connected with the first output line, and the other end of the chip resistor is connected with the corresponding second output line; one end of any one chip resistor in the second chip set penetrates through the flexible substrate through a metal wire and is connected with the first output line, and the other end of any one chip resistor in the second chip set penetrates through the flexible substrate through the metal wire and is connected with the second output line; any one chip resistor in the first chip set is located between two adjacent chip resistors in the second chip set.
Optionally, two adjacent chip resistors in the first chip set are arranged in a staggered manner, and two adjacent chip resistors in the second chip set are arranged in a staggered manner.
Optionally, the plurality of output signal lines are sequentially arranged at intervals along the width direction of the flip-chip film, and the resistance value of the resistor corresponding to the output signal line gradually decreases from the middle of the flip-chip film to two sides of the flip-chip film in the width direction of the flip-chip film.
Optionally, the resistor corresponding to each output signal line is formed by connecting at least two sub-resistors in series.
The application also discloses a display device, which comprises the flip chip film, a display panel and a control circuit board; one end of the flip chip film is connected with the control circuit board, the other end of the flip chip film is connected with the display panel, a driving chip in the flip chip film receives a voltage signal in the control circuit board through an input signal wire, converts the voltage signal into a driving signal, and inputs the driving signal into the display panel through an output signal wire so as to drive the display panel.
According to the high-temperature-resistant flip chip, each first output line and each second output line are connected through the resistor, each output signal line in the flip chip film is connected with the resistor, the load of the corresponding circuit of each output line is improved, redundant current in the circuit is consumed by the resistor, the current carrying of each output signal line in the flip chip film is reduced, the current carrying of the driving chip is greatly reduced, and the high-temperature problem caused by large current of the driving chip is avoided.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:
fig. 1 is a schematic view of a display device according to a first embodiment of the present application;
FIG. 2 is a schematic plan view of a first flip chip film according to a first embodiment of the present application;
FIG. 3 is a schematic plan view of a second flip chip film according to the first embodiment of the present application;
fig. 4 is a schematic plan view of a third flip chip film according to the first embodiment of the present application;
FIG. 5 is a schematic plan view of a first flip chip film according to a second embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view of a flip chip film according to a second embodiment of the present application;
fig. 7 is a schematic plan view of a second flip chip film according to a second embodiment of the present application.
100, a display device; 200. a flip chip film; 210. a flexible substrate; 211. a front surface of the substrate; 212. the back surface of the substrate; 220. a driving chip; 230. an input signal line; 240. an output signal line; 241. a first output line; 242. a second output line; 250. a resistor; 251. a winding resistor; 252. a chip resistor; 253. a sub-resistor; 260. a first patch group; 270. a second patch group; 300. a display panel; 400. and a control circuit board.
Detailed Description
It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
In addition, terms of the azimuth or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on the azimuth or relative positional relationship shown in the drawings, are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
The present application is described in detail below with reference to the attached drawings and alternative embodiments.
Embodiment one:
fig. 1 shows a schematic diagram of a display device according to a first embodiment of the present application, as shown in fig. 1, the display device 100 includes a flip chip film 200, a display panel 300 and a control circuit board 400, one end of the flip chip film 200 is connected to the control circuit board 400, the other end is connected to the display panel 300, a driving chip 220 in the flip chip film 200 receives a voltage signal in the control circuit board 400 through an input signal line 230, converts the voltage signal into a driving signal, and inputs the driving signal into the display panel 300 through an output signal line 240 to drive the display panel 300. The driving Chip 220 (IC) in the flip Chip Film 200 (Chip On Film, COF) may be a Gate driving Chip (Gate IC) or a Source driving Chip (Source IC), and the control circuit board 400 is a printed circuit board (Printed Circuit Board, PCB).
As shown in fig. 2, the flip-chip film 200 includes a flexible substrate 210, a driving chip 220, a plurality of input signal lines 230 and a plurality of output signal lines 240, wherein the plurality of input signal lines 230, the plurality of output signal lines 240 and the driving chip 220 are disposed on the flexible substrate 210, one end of the driving chip 220 is connected with the plurality of input signal lines 230, receives signals, and the other end is connected with the plurality of output signal lines 240, and outputs signals; any one of the output signal lines 240 includes a first output line 241 and a second output line 242 which are not directly connected, the first output line 241 is connected to the driving chip 220, and the second output line 242 extends along the extending direction of the first output line 241 in a direction away from the driving chip 220; the flip chip film 200 includes a plurality of resistors 250, the plurality of resistors 250 are in one-to-one correspondence with the plurality of output signal lines 240, and one end of each resistor 250 is connected to the first output line 241, and the other end is connected to the corresponding second output line 242.
The impedance of the display panel is related to the film thickness of the metal in the process, the display panel can determine the film thickness according to the process, the effect and the like, once the film thickness is fixed, the impedance is basically fixed, if the film thickness is larger, the load (panel Loading) of the display panel is larger, thus the temperature of the flip chip film 200 is higher, and if the film thickness of the metal is changed, other process problems or uneven display screen (mura) problems may be caused. In this embodiment, the load of the display panel is reduced by adding the resistor 250 to the output channel of the flip-chip film 200, so that the temperature of the flip-chip film 200 is reduced, and the process and the display picture of the display panel are not affected; and each first output line 241 and each second output line 242 are connected through a resistor 250, so that each output signal line 240 in the flip-chip film 200 is connected with one resistor 250, the load of a circuit corresponding to each output line is improved, and redundant current in the circuit is consumed by the resistor 250, so that the current carrying of each output signal line 240 in the flip-chip film 200 is reduced, the current carrying of the driving chip 220 is greatly reduced, and the problem of high temperature caused by large current of the driving chip 220 is avoided.
At present, the heat generating problem in the flip chip film 200 is mostly solved by adopting a simple heat dissipation paste attaching method, but the heat dissipation method can increase the cost by about 20%, and a special process is needed, and meanwhile, the heat dissipation paste attaching method can cause various problems such as warping or glue overflow. The embodiment is based on the improvement of the internal circuit structure in the flip-chip film 200, and the load of the output signal line 240 in the flip-chip film 200 is increased to avoid the heat generation of the driving chip 220 in the flip-chip film 200, so as to solve the heat generation problem of the flip-chip film 200 at the source; for the scheme that the chip heating problem is solved through the mode of attaching the heat dissipation paste after the chip heating, the embodiment avoids the problems of circuit loss, poor chip working efficiency and the like caused by the chip heating, and also avoids the various problems of warping or glue overflow and the like caused by the heat dissipation paste.
In this embodiment, the resistor 250 is a winding resistor 251. Because a resistor 250 needs to be connected to each output signal line 240, the embodiment uses the characteristics of small size and low cost of the winding resistor 251 to connect the winding resistor 251 with the first output line 241 and the second output line 242, so as to avoid the contact short circuit of the winding resistor 251 in two adjacent output signal lines 240. Specifically, the winding resistor 251 and the output signal lines 240 may be formed by the same process, that is, when the output signal lines 240 are manufactured, each output signal line 240 is designed to have straight ends and a pattern with other curves of S-shaped curves in the middle part; the straight line portions at both ends of the output signal line 240, i.e., the first output line 241 and the second output line 242, and the curved line portion in the middle of the output signal line 240, i.e., the winding resistor 251. Because the winding resistor 251 increases the length of the output signal line 240, the longer the output signal line 240 is, the larger the resistance of the output signal line 240 is due to the winding resistor 251, and the current consumption in the circuit is increased, so that the high temperature caused by the heating of the driving chip 220 is avoided.
As shown in fig. 3, the adjacent winding resistors 251 are arranged in a staggered manner. When the resistance of the winding resistor 251 needs to be increased to further increase the consumption of current in the circuit, one method increases the length of the winding resistor 251 in the direction of the output signal line 240 by increasing the winding number of the winding resistor 251; another method is to increase the width of the winding resistors 251, but this compresses the space between the adjacent winding resistors 251 so that the adjacent winding resistors 251 are easily in contact with and short-circuited, so that the adjacent winding resistors 251 are arranged in a staggered manner, so that the adjacent winding resistors 251 are not in the same straight line, and the short-circuited problem caused by increasing the width of the winding resistors 251 is avoided. It should be noted that fig. 3 only provides a staggered arrangement mode of the winding resistors 251, and the winding resistors 251 may be arranged in other staggered modes, which are not listed herein. Of course, the effect of increasing the resistance of the winding resistor 251 can be achieved by selecting a high-resistance material to manufacture the winding resistor 251, and the winding resistor 251 and the output signal line 240 are not formed by the same process; when the first output line 241 and the second output line 242 are manufactured, the winding resistor 251 is bonded or welded between the first output line 241 and the second output line 242.
Because the driving chip 220 in the flip chip film 200 is connected with the fan-out wiring in the display panel, driving signals are transmitted to the display panel, one end of the fan-out wiring is connected with the data line or the scanning line in the display panel, the other end of the fan-out wiring is connected with the output signal line 240 in the flip chip film 200, the output signal line 240 is densely distributed, and the data line or the scanning line is more scattered; therefore, the width of one end of the fan-out area connected with the display panel is larger, and the width of one end connected with the flip film 200 is smaller, so that the fan-out wires from the middle to the two sides in the fan-out area are longer and longer, the longer the fan-out wires are, the larger the resistance of the fan-out wires is, and therefore the uneven resistance of the wires in the fan-out area is.
Based on this, as shown in fig. 4, the wiring resistance 251 in each of the flip-chip films 200 is set to be different in resistance, specifically, in the flip-chip film 200, the plurality of output signal lines 240 are sequentially arranged at intervals along the width direction of the flip-chip film 200, and in the width direction of the flip-chip film 200, that is, the arrangement direction of the output signal lines 240; the resistance value of the resistor 250 corresponding to the output signal line 240 gradually decreases from the middle of the flip-chip film 200 to the two sides of the flip-chip film 200. At this time, the sum of the resistance values of the corresponding resistor 250 and the corresponding fan-out trace of each output signal line 240 is approximately equal, so that the driving signal received by the display panel is ensured not to generate large fluctuation, and the stability of the display picture is improved. Further, the resistance of the wire-wound resistor 251 may be gradually reduced by gradually reducing the number of turns of the wire-wound resistor 251 from the middle of the flip-chip film 200 to both sides of the flip-chip film 200. Of course, the resistance value of the winding resistor 251 may also be changed by changing the number or the size of the sub-resistors by making the winding resistor 251 corresponding to each of the output signal lines 240 into a resistor 250 formed by connecting a plurality of sub-resistors in series.
Embodiment two:
fig. 5 shows a schematic plan view of a flip chip film 200 according to a second embodiment of the present application, which is different from the first embodiment, in that the resistor 250 in this embodiment is a chip resistor 252, so that when the flip chip film 200 is manufactured in a preliminary process, a suitable resistor 250 can be selected according to the heating condition of the driving chip 220 and the type of the display panel, thereby improving the application range of the flip chip film 200.
As shown in fig. 5 and fig. 6, the number of chip resistors 252 in each flip-chip film 200 is equal to the number of output signal lines 240, and all the chip resistors 252 in each flip-chip film 200 are divided into a first chip set 260 and a second chip set 270, where each of the first chip set 260 and the second chip set 270 includes a plurality of chip resistors 252; the flexible substrate 210 includes a substrate front surface 211 and a substrate back surface 212 that are disposed opposite to each other, the first patch group 260 and the output signal line 240 are disposed on the substrate front surface 211, and the second patch group 270 is disposed on the substrate back surface 212; one end of any chip resistor 252 in the first chip set 260 is connected to the first output line 241, and the other end is connected to the corresponding second output line 242; one end of any chip resistor 252 in the second chip set 270 penetrates through the flexible substrate 210 through a metal wire, and is connected to the first output line 241, and the other end penetrates through the flexible substrate 210 through a metal wire, and is connected to the second output line 242; any one chip resistor 252 in the first chip set 260 is located between two adjacent chip resistors 252 in the second chip set 270.
Compared with the wire winding resistor 251, the volume of the chip resistor 252 is slightly larger, so as to avoid the contact short circuit of the chip resistors 252 connected to the adjacent output signal wires 240, or the chip resistors 252 are difficult to mount by abutting each other, in this embodiment, all the chip resistors 252 in one flip chip film 200 are uniformly arranged on the front and back sides of the flip chip film 200, so that half of the chip resistors 252 are mounted on the front and back sides of the flip chip film 200, and the mounting space of the chip resistors 252 is greatly increased. Moreover, any one chip resistor 252 in the first chip resistor group 260 is located between two adjacent chip resistors 252 in the second chip resistor group 270, that is, the chip resistor 252 and the corresponding output signal line 240 are in the same line, and on each surface of the flip-chip film 200, the chip resistor 252 corresponding to the output signal line 240 between the adjacent chip resistors 252 is located on the other surface of the flip-chip film 200, so that the chip resistors 252 on each surface of the flip-chip film 200 are uniformly spaced, and alignment and installation of the chip resistors 252 are facilitated.
Further, two adjacent chip resistors 252 in the first chip set 260 are arranged in a staggered manner, and two adjacent chip resistors 252 in the second chip set 270 are arranged in a staggered manner. In the embodiment, not only the front and back sides of the flip-chip film 200 are realized by the chip resistors 252 on one flip-chip film 200, but also the chip resistors 252 on each side of the flip-chip film 200 are arranged in a staggered manner, so that the distance between two adjacent chip resistors 252 on the front or back sides of the flip-chip film 200 is further increased; thus, when the chip resistor 252 with a larger resistance value is selected, even if the chip resistor 252 with a larger resistance value has a larger volume, a larger accommodating space is provided in the flip-chip film 200, and the chip resistor 252 will not be in contact with the adjacent chip resistor 252.
The fan-out wires from the middle to the two sides in the fan-out area are longer, so that the longer the fan-out wires are, the larger the resistance of the fan-out wires is, and the problem of uneven resistance of the wires in the fan-out area exists. Therefore, in the present embodiment, the chip resistors 252 in each flip chip film 200 are set to have different resistance values, so that the sum of the resistance values of the corresponding resistor 250 and the corresponding fan-out trace of each output signal line 240 is approximately equal, thereby ensuring that the driving signal received by the display panel will not generate large fluctuation, and improving the stability of the display picture. As shown in fig. 7, the chip resistor 252 corresponding to each output signal line 240 is formed by connecting at least two sub resistors 253 in series; from the middle of the flip-chip film 200 to the two sides of the flip-chip film 200, the number of the sub-resistors 253 in the chip resistor 252 is gradually reduced or the resistance of the sub-resistors 253 is gradually reduced.
Because the specifications of resistors 250 in the market are unified, the larger the resistance value of the resistor 250 is, the larger the resistance value of the resistor 250 with one magnitude is, and the larger the resistance value difference between the two resistors 250 is, so that it is difficult to find a plurality of resistors 250 with gradually slightly changed resistance values, therefore, in the embodiment, the patch resistor 252 corresponding to one output signal line 240 is made into a plurality of sub-resistors 253, when the resistance values of the required patch resistors 252 are relatively close, if a single resistor 250 with a close resistance value cannot be found, a plurality of resistors 250 can be selected to be connected in series to form the required resistor 250, and thus the use requirement is better satisfied. Of course, the plurality of sub resistors 253 may be connected in parallel to form the chip resistor 252, or the plurality of resistors 250 may be connected in series and in parallel to form the chip resistor 252, as required.
It should be noted that the inventive concept of the present application may form a very large number of embodiments, but the application documents are limited in size and cannot be listed one by one, so that the above-described embodiments or technical features may be arbitrarily combined to form new embodiments without conflict, and the original technical effects will be enhanced after the embodiments or technical features are combined
The technical scheme of the application can be widely applied to various display panels, such as TN (Twisted Nematic) display panels, IPS (In-Plane Switching) display panels, VA (Vertical Alignment) display panels, MVA (Multi-Domain Vertical Alignment) display panels, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panels, can be also applied to the scheme.
The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.
Claims (5)
1. The flip chip film comprises a flexible substrate, a driving chip, a plurality of input signal lines and a plurality of output signal lines, wherein the input signal lines, the output signal lines and the driving chip are arranged on the flexible substrate, one end of the driving chip is connected with the input signal lines and receives signals, the other end of the driving chip is connected with the output signal lines and outputs signals,
any one of the output signal lines comprises a first output line and a second output line which are not directly connected, wherein the first output line is connected with the driving chip, and the second output line extends along the extending direction of the first output line in a direction away from the driving chip;
the flip chip film comprises a plurality of resistors, the plurality of resistors are in one-to-one correspondence with the plurality of output signal lines, one end of each resistor is connected with the first output line, and the other end of each resistor is connected with the corresponding second output line;
each output signal line in the flip chip film is connected with one resistor, and adjacent resistors are arranged in a staggered mode;
the resistors are chip resistors, and each chip resistor corresponding to each output signal line comprises a plurality of serially connected sub resistors.
2. The flip chip film of claim 1, wherein the plurality of chip resistors are divided into a first chip set and a second chip set, each of the first chip set and the second chip set comprising a plurality of chip resistors;
the flexible substrate comprises a substrate front surface and a substrate back surface which are oppositely arranged, the first patch group and the output signal line are arranged on the substrate front surface, and the second patch group is arranged on the substrate back surface;
one end of any one chip resistor in the first chip set is connected with the first output line, and the other end of the chip resistor is connected with the corresponding second output line;
one end of any one chip resistor in the second chip set penetrates through the flexible substrate through a metal wire and is connected with the first output line, and the other end of any one chip resistor in the second chip set penetrates through the flexible substrate through the metal wire and is connected with the second output line;
any one chip resistor in the first chip set is located between two adjacent chip resistors in the second chip set.
3. The flip chip film of claim 2, wherein adjacent two chip resistors in the first chip set are offset, and adjacent two chip resistors in the second chip set are offset.
4. The flip chip film according to any one of claims 1 to 3, wherein the plurality of output signal lines are sequentially arranged at intervals in a width direction of the flip chip film, and a resistance value of a resistance corresponding to the output signal line gradually decreases from a middle of the flip chip film to both sides of the flip chip film in the width direction of the flip chip film.
5. A display device comprising the flip chip film of any one of claims 1-4, and a display panel and a control circuit board;
one end of the flip chip film is connected with the control circuit board, the other end of the flip chip film is connected with the display panel, a driving chip in the flip chip film receives a voltage signal in the control circuit board through an input signal wire, converts the voltage signal into a driving signal, and inputs the driving signal into the display panel through an output signal wire so as to drive the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110874120.4A CN113611213B (en) | 2021-07-30 | 2021-07-30 | Flip chip film and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110874120.4A CN113611213B (en) | 2021-07-30 | 2021-07-30 | Flip chip film and display device |
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| CN113611213A CN113611213A (en) | 2021-11-05 |
| CN113611213B true CN113611213B (en) | 2023-07-18 |
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| CN114822401B (en) * | 2022-06-30 | 2022-09-27 | 惠科股份有限公司 | Display device, source electrode chip on film and driving method |
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| CN203150545U (en) * | 2013-03-07 | 2013-08-21 | 京东方科技集团股份有限公司 | Array substrate, display panel and display apparatus |
| CN108803177A (en) * | 2018-07-20 | 2018-11-13 | 京东方科技集团股份有限公司 | Array substrate, display panel and its detection method |
| CN210325151U (en) * | 2019-06-11 | 2020-04-14 | 重庆惠科金渝光电科技有限公司 | Display panel's drive module and display device |
| CN210323694U (en) * | 2019-06-11 | 2020-04-14 | 重庆惠科金渝光电科技有限公司 | Display panel's drive module and display device |
| CN210323697U (en) * | 2019-06-11 | 2020-04-14 | 重庆惠科金渝光电科技有限公司 | Display panel, chip on film and display device |
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