KR19990069736A - Spacer manufacturing method of field effect electron emission device - Google Patents

Abstract

A field effect electron emission device is disclosed. According to an aspect of the present invention, there is provided a method of manufacturing a spacer for a field effect electron emission device, the method comprising: (a) forming a spacer bar on a glass substrate; (C) removing the support plate; and (D) attaching a positive electrode plate on the spacer bar. In addition, the (a) step may include (a-1) forming a metal layer on the glass substrate; and (a-2) printing and baking the solder paste formed to be adhered to the metal layer; and ( A-3) applying and patterning photoresist on the solder paste; and (A-4) attaching a supporting plate to the rear surface of the glass substrate; and (A-5) removing the exposed glass substrate region. Forming a spacer bar and removing the photoresist on the spacer bar.

Description

Spacer manufacturing method of field effect electron emission device

The present invention relates to a method for manufacturing a spacer of a field effect electron emitting device, and more particularly, to a method for manufacturing a spacer for a field effect electron emitting device, which is formed by forming a metal layer on a glass substrate.

The field effect electron emission device employs a microtip that emits electrons in a vacuum under a high electric field, and has been applied to various industrial devices and flat panel display devices that use electrons.

Especially in the field of flat panel display devices, an electron emission display device using an electric field effect has attracted much attention as a next generation display device following the liquid crystal display device and the plasma display device.

Currently, high vacuum packaging technology has been actively researched and developed for the practical use of field effect electron emission flat panel display devices, but research and development of sufficiently stable processes and materials have not been made as a review stage of various processes and materials.

1 is a schematic cross-sectional view of a conventional field effect electron emitting device.

As shown in the drawing, the field effect electron emission device 10 is provided with a positive electrode plate 11 and a negative electrode plate 12 which are arranged to be spaced apart from each other by a spacer 13. In addition, a plurality of micro tips 14 are formed at a predetermined distance on the negative electrode plate 12. These micro tips 14 are provided in the through holes 16 surrounded by the insulating layer 15 formed on the negative electrode plate 12. The gates 17 are stacked on the insulating layer 15. The fluorescent film 18 is formed on the positive electrode plate 11. The spacer 13 serves only as a support for maintaining a gap between the positive electrode plate 11 and the negative electrode plate 12. Reference numerals 11a and 12a denote positive and negative electrodes, respectively.

Thus, the conventional spacer 13 installed to serve only as a support was made by screen printing a glass paste several times using a mask 19, as shown in FIG.

However, according to the conventional method of manufacturing a spacer by screen printing, the screen printing and curing process is performed seven times in order to make the height of the spacer 13, which is the retention gap distance between the positive electrode plate 11 and the negative electrode plate 12, required to be about 200 µm. It takes a lot of time because it should be repeated repeatedly. In addition, during curing, the glass paste flows down, or due to an alignment error during the repeating process, the aspect ratio (height / width) that is the ratio of the occupied width to the height of the support 13 of the spacer 13 to its height is set to 1 or more. It is very difficult to enlarge.

The present invention was devised to improve the above problems, and can reduce the time required for the manufacturing process, increase the aspect ratio of the manufactured spacer, and easily control the height of the spacer. An object of the present invention is to provide a spacer manufacturing method.

1 is a schematic cross-sectional view of a conventional field effect electron emission device,

2 is a cross-sectional view showing a part of a manufacturing process of the conventional spacer manufacturing method of the field effect electron emission device of FIG.

3 to 8 are diagrams showing step by step in order to explain a method of manufacturing a spacer of a field effect electron emission device according to the present invention.

3 is a cross-sectional view after patterning a metal layer on a glass substrate,

FIG. 4 is a cross-sectional view after printing a solder paste on the metal layer of FIG. 3 and applying and patterning a photoresist. FIG.

5 is a cross-sectional view of the support plate is bonded to the back of the glass substrate,

6 is a cross-sectional view of a spacer bar formed by removing an exposed area of a glass substrate;

7 is a cross-sectional view of removing the support plate after bonding the spacer bar to the negative electrode plate,

8 is a cross-sectional view showing a field effect electron emission device according to the present invention.

<Description of Symbols for Major Parts of Drawings>

10, 40 ... field effect electron emission device

11, 41 ... anode plate 12, 42 ... cathode plate

13 ... spacer 14, 44 ... microtip

15, 45 ... Insulation layer 16, 46 ... Through hole

17,47 ... gate 18, 48 ... fluorescent film

19 ... mask 31 ... glass substrate

32 ... metal layer 33 ... solder paste

34 Photoresist 35 Support plate

43 ... spacer bar

In order to achieve the above object, a method of manufacturing a spacer for a field effect electron emission device according to the present invention includes the steps of: (a) forming a spacer bar on a glass substrate; and (b) compressing a spacer bar on a support plate at high temperature to form a negative electrode plate as the solder paste. And (c) removing the support plate; and (d) attaching a positive electrode plate on the spacer bar. In addition, the (a) step may include (a-1) forming a metal layer on the glass substrate; and (a-2) printing and baking the solder paste formed to be adhered to the metal layer; and ( A-3) applying and patterning photoresist on the solder paste; and (A-4) attaching a supporting plate to the rear surface of the glass substrate; and (A-5) removing the exposed glass substrate region. Forming a spacer bar and removing the photoresist on the spacer bar.

Preferably, in the step (A-5), the exposed glass substrate is removed by at least one of a hydrogen fluoride-based etching solution and a sand blasting method to form the spacer bar, and the metal layer is formed of chromium or copper thin film. In addition, the support plate is characterized in that it is formed of a nickel-plated silicon wafer or ceramic substrate.

Hereinafter, a method of manufacturing a spacer of a field effect electron emission device according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals refer to like elements.

As shown in FIG. 3, first, the (a) step is to form a spacer bar to be described later on a glass plate 31, and in (a-1), a glass provided to form a spacer A metal thin film of chromium (Cr) or nickel (Ni) is deposited on the substrate 31. Next, a photoresist mask having a predetermined thickness is formed on the metal thin film using a photoresist as a photoresist. The deposition metal thin film using the mask is etched to form a metal layer 32 having an opening having a predetermined size.

As shown in FIG. 4, in step (A-2), a solder paste, which is an adhesive material, is attached to a surface of the metal layer 32 so that the metal layer 32 and the metal layer 32 can be adhered to each other. : 33) is printed and baked, and in step (A-3), the photoresist 34 is applied and patterned on the solder paste 33.

Subsequently, in step (A-4), as shown in FIG. 5, the supporting plate 35 is adhered to the back surface of the glass substrate 31 formed by the process as described above by using an adhesive. Let's do it. Here, the material of the support plate 35 is preferably a silicon wafer plated with nickel (Ni) or a ceramic substrate.

Next, as shown in FIG. 6, in step (a-5), the spacer bar 43 is formed by etching the glass substrate 31 formed and exposed by the method as described above using the photolithography method. do. At this time, preferably, the exposed glass substrate 31 is removed using a hydrogen fluoride (HF) -based etching solution or sand blustering method to remove the photoresist 34. When the predetermined portion of the glass substrate 34 is removed, the spacer bar 43 is formed on the support plate 35. Next, the photoresist 34 on the spacer bar 43 is removed.

Next, as shown in FIG. 7, in the step (b), the spacer bar 43 attached on the support plate 35 is attached to the gate 47 on the negative electrode plate 42 so as to be attached by the solder paste 33. Bond by hot compression with alignment. By the high temperature compression, the solder of the solder paste 33 is melted, and the spacer bar 43 is firmly bonded. Then, in step (c), the support plate 35 is removed.

Finally, as shown in FIG. 8, in step (d), the positive electrode plate 41 including the fluorescent film 48 is attached onto the spacer bar 43 of the field effect electron emission device 40 thus attached. As a result, the positive electrode plate 41 and the negative electrode plate 42 whose inner spaces are sealed are mutually supported at a predetermined distance from each other by the spacer bar 43. A plurality of micro tips 44 are formed at a predetermined distance on the cathode (not shown) formed on the cathode plate 42, and the micro tips 44 are formed by the insulating layer 45 formed on the cathode (not shown). It is installed in the enclosed through hole 46. The gates 47 are stacked on the insulating layer 45, and the fluorescent layers 48 are formed on the anode formed on the anode plate 41.

The field effect electron emission device can maintain a high vacuum level of about 10 ^-7 torr, thereby increasing the average free stroke of the emission electrons and preventing physicochemical contamination or damage of the tip. In addition, when the screen area is increased, bending occurs under such high vacuum, so that the spacer having a predetermined distance can be positioned, and the height of the spacer is easily provided.

As described above, according to the method for manufacturing a spacer of the field effect electron emission device according to the present invention, the time required for manufacturing the spacer can be shortened, unnecessary space on the negative electrode plate occupied by the spacer can be minimized, and alignment of the spacers is easy. And accuracy can be improved. In addition, the aspect ratio can be increased to 1 or more, and there is an advantage in that the position of the spacer can be easily adjusted.

Claims (5)

(A) forming a spacer bar on the glass substrate; (B) hot compressing the spacer bar on the support plate and attaching the spacer bar to the negative electrode plate with the solder paste; (C) removing the support plate; (D) attaching a positive electrode plate on the spacer bar; Method of manufacturing a spacer of a field effect electron emission device comprising a. The method of claim 1, Step (a), (A-1) forming a metal layer on the glass substrate; (A-2) printing and baking the solder paste formed to be adhered to the metal layer; (A-3) patterning by applying photoresist on the solder paste; (A-4) attaching a support plate to the back of the glass substrate; (A-5) removing the exposed glass substrate region to form a spacer bar, and removing the photoresist on the spacer bar. The method of claim 2, In the step (a-5), The exposed glass substrate is removed by at least one of a hydrogen fluoride-based etching solution and sand blasting method to form the spacer bar, characterized in that the spacer effect of the field effect electron emission device. The method of claim 2, The metal layer is a spacer manufacturing method of a field effect electron emission device, characterized in that formed of at least one of chromium, copper thin film. The method of claim 2, The support plate is a spacer manufacturing method of a field effect electron emission device, characterized in that formed of at least one of a nickel-plated silicon wafer, a ceramic substrate.