KR19990061375A - Adhesive composition and hot stamping foil made therefrom - Google Patents

Abstract

The present invention relates to a bonding composition comprising a mixture of a propylene chloride resin and an acrylic resin, 5 to 40 parts by weight of a vinyl acetate resin per 100 parts by weight of the mixture, and 5 to 50 parts by weight of an inorganic filler, and a hot stamping foil will be. Since the adhesive composition of the present invention can be transferred at a low temperature of 80 to 90 ° C, the productivity of the transfer process can be increased, and excellent adhesion and blocking properties can be obtained.

Description

Adhesive composition and hot stamping foil made therefrom

Plain paper is often coated with polypropylene (OPP) and polyvinyl chloride (PVC) rather than plain paper.

A typical stamping foil is a film (mainly a polyester film having good heat resistance) serving as a carrier and has a multilayer coating such as a release layer, a colored layer, a vapor deposition layer, and an adhesive layer. The multilayered film is transferred to paper using heat and pressure to produce paper with characters or patterns. The adhesive layer used for such a multilayer film should have high adhesion to the adherend such as OPP, PVC, and ordinary paper, and should be able to adhere at a low temperature as possible. In the case of being wound in a film, (Ie, have a blocking property).

It is important to properly control the adhesive strength and blocking resistance, which are the most important characteristics of the adhesive composition constituting the adhesive layer, as they are contradictory.

The adhesive compositions reported so far have a problem in that the productivity of the transcription company is low due to the high transcription temperature and the blocking problem occurs when the transcription temperature is lowered.

Accordingly, an object of the present invention is to provide a bonding composition which is capable of transferring at a low temperature, and is excellent in both adhesive strength and blocking resistance.

Another object of the present invention is to provide a hot stamping foil comprising the adhesive composition as an adhesive layer.

In order to achieve the above object, the present invention provides an adhesive composition comprising a mixture of propylene chloride resin and acrylic resin, 5 to 40 parts by weight of a vinyl acetate resin per 100 parts by weight of the mixture, and 5 to 50 parts by weight of an inorganic filler.

Hereinafter, the present invention will be described in detail.

In the present invention, a mixture of propylene chloride resin and acrylic resin is used as a main component of the adhesive composition, and the weight ratio of the propylene chloride resin to the acrylic resin in the mixture is 10:90 to 90:10, preferably 40:60. As the mixture, S-609 (NOAH Chemicals, Korea) is most preferably used.

The vinyl acetate resin is added to the composition for the purpose of lowering the transfer temperature, and is used in an amount of 5 to 40 parts by weight, more preferably 20 to 30 parts by weight, per 100 parts by weight of the mixture of the propylene chloride resin and the acrylic resin. When the amount of the vinyl acetate resin is less than 5 parts by weight, the transfer temperature is increased and the productivity of the transfer process is decreased. When the amount of the vinyl acetate resin is more than 40 parts by weight, the blocking resistance is decreased. As the vinyl acetate resin, it is preferable to use a modified vinyl acetate resin having a viscosity at 25 DEG C of 500 to 30,000 cps, and it is most preferable to use Copnyl PH-50 (Nippon Synthetic Chemical) having a viscosity at 25 DEG C of 12000 cps.

The inorganic filler is added for the purpose of increasing the blocking resistance and is used in an amount of 5 to 50 parts by weight based on 100 parts by weight of the mixture of the propylene chloride resin and the acrylic resin. When the amount of the inorganic filler is less than 5 parts by weight, blocking occurs. When the amount of the inorganic filler is more than 50 parts by weight, the adhesive strength is decreased. As the inorganic filler, those having a small particle size such as SiO ₂ , TiO ₂ and organic clay can be used, and those having a particle size of 0.1 to 0.5 μm can be used, and Nipsil E220A (particle size: 1.0 μ, manufactured by Nippon Silica) .

Since the shape of the surface of the adhesive layer varies depending on the choice of the solvent for dissolving the adhesive layer composition, the selection of the solvent also has a strong blocking effect. Since the solvent makes the dry surface of the resin slightly rough, it is preferable to use a solvent such as toluene, methanol, methyl ethyl ketone, n-hexane, ethyl acetate or a mixed solvent thereof to increase the blocking resistance. It is most preferable to use toluene / methanol / methyl ethyl ketone in a ratio of 50/3/47 (v / v / v), but the mixing ratio thereof can be appropriately changed as needed.

The application amount of the adhesive layer made of the adhesive composition of the present invention is 0.8 to 1.2 g / m ² , preferably 1.0 g / m ² . ^. When the coating amount is less than 0.8 g / m ² , the blocking resistance is increased but the adhesive force is decreased. When the coating amount is more than 1.2 g / m ² , the adhesive strength is increased but the blocking resistance is decreased and the manufacturing cost is increased.

The drying of the adhesive composition is preferably carried out at 100 to 140 캜 for 3 to 10 seconds as a condition capable of evaporating the solvent. If the drying temperature is lower than 100 ° C, drying is not likely to occur. If the drying temperature is higher than 140 ° C, the blocking will increase.

The adhesive composition of the present invention can be applied to any multilayer film in which an adhesive layer can be used. Also, since the composition of the present invention can be transferred at a low temperature of 80 to 90 ° C, productivity in the transfer process can be improved, and adhesion and blocking resistance are excellent.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.

The physical properties of the adhesive layer in Examples and Comparative Examples were measured as follows.

≪ Property evaluation method &

① Transfer temperature

The adhesive composition was laminated to paper to measure the temperature at which it was bonded.

② Adhesion

The surface transferred to the paper at the lowest transfer temperature was transversely crossed with a net width of 1 x 1 mm, and the degree of peeling and peeling off with a cell tape was measured. The results were as follows.

Good: Good adhesion, less than 90% of the transfer surface

?: Middle of adhesion force, 90 to 50% of the transfer surface is not falling

X: poor adhesion, less than 50% of the transfer surface

③ My blocking ability

The finished product coated with the adhesive layer is allowed to stand for 24 hours in a thermo-hygrostat maintained at 60 ° C and 70% relative humidity in a wound state (in a state in which a plurality of films are stacked and pressure and tension are applied) Were visually observed and the results were expressed as follows.

○: Good blocking resistance, less than 10% of backside transfer occurred

?: Anti-blocking property Normally, about 10 to 50% of the backside transfer occurs

×: poor blocking property, more than 50% of backside transfer occurred

≪ Examples 1 to 4 and Comparative Examples 1 and 2 >

In this Example, the adhesive composition having various compositions was applied to the adhesive layer of the protective film, and the physical properties thereof were measured.

A protective layer (a mixture of acrylic resin and wax) was coated on 19 占 of the polyester film and dried, and then various adhesive compositions having the composition shown in Table 1 were prepared and coated thereon. The application amount of the adhesive composition was 1.0 g / m ² , and the adhesive layer was dried at 120 ° C for 5 seconds. The produced film was evaluated according to the above evaluation method, and the results are shown in Table 2 below.

Composition of adhesive composition (unit: kg) Constituent Comparative Example 1 Example 1 Example 2 Example 3 Example 4 Comparative Example 2 Mixture of Propylene Chloride Resin and Acrylic Resin (S-609) 10 10 10 10 10 10 Vinyl acetate resin (Copnyl PH-50) 0 0.5 1.5 3 4 5 Inorganic filler (Nipsil E220A) 2 0.5 1.5 3 5 2 toluene 44 44 43 41 40.5 41 Methanol 2 2 2 2 2 2 Methyl ethyl ketone 42 43 42 41 38.5 40 Total amount 100 100 100 100 100 100

Evaluation results of physical properties of adhesive layer Properties Comparative Example 1 Example 1 Example 2 Example 3 Example 4 Comparative Example 2 Transfer temperature (캜) 100 90 90 80 80 70 My blocking ability ○ ○ ○ ○ ○ △ Adhesion ○ ○ ○ ○ ○ ○

As can be seen from the results of Table 2, the adhesive layer of Comparative Example 1 had a high transfer temperature, the adhesive layer of Comparative Example 2 had poor blocking resistance, and the adhesive layers of Examples 1 to 4 had a low transfer temperature Both blocking resistance and adhesive strength were good.

Since the adhesive composition of the present invention can be transferred at a low temperature of 80 to 90 ° C, the productivity of the transfer process can be increased, and excellent adhesion and blocking properties can be obtained.

Claims (8)

A mixture of a propylene chloride resin and an acrylic resin, 5 to 40 parts by weight of a vinyl acetate resin per 100 parts by weight of the mixture, and 5 to 50 parts by weight of an inorganic filler. The method according to claim 1, Wherein the mixing ratio of the propylene chloride resin to the acrylic resin is 10:90 to 90:10 (w / w). The method according to claim 1, Wherein the mixture of the propylene chloride resin and the acrylic resin is S-609 (manufactured by NOAH Chemical Co., Ltd.). The method according to claim 1, Wherein the vinyl acetate resin is a modified vinyl acetate resin having a viscosity at 25 DEG C of 500 to 30,000 cps. The method according to claim 1, Wherein the vinyl acetate resin is Copnyl PH-50 (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.). The method according to claim 1, Wherein the inorganic filler is SiO ₂ , TiO ₂ or organic clay having a particle size of 0.1 to 0.5 μm. The method according to claim 1, Wherein the inorganic filler is Nipsil E220A (manufactured by Nippon Silica Japan). A hot stamping foil comprising the adhesive composition of claim 1 as an adhesive layer.