KR100347190B1 - Adhesive layer composition and hot stamping foil using it - Google Patents

Abstract

The present invention relates to an adhesive layer composition and a hot stamping foil using the same, wherein the adhesive layer composition of the present invention includes 5 to 50 parts by weight of an inorganic filler with respect to 100 parts by weight of a mixture of propylene chloride and acrylic resin, and 90 to 90 parts by weight of the mixture. Transferable at 100 ° C. and excellent in adhesive strength and blocking resistance, the production of a hot stamping foil using the adhesive layer composition enables the multilayer film to be transferred to paper at low temperatures, thereby increasing the productivity of the hot stamping foil.

Description

Adhesive layer composition and hot stamping foil using same

The present invention relates to an adhesive layer composition and a hot stamping foil using the same, and specifically, to an inorganic filler added to a mixture of a propylene chloride resin and an acrylic resin, an adhesive layer composition having excellent adhesion and blocking resistance while having a low transfer temperature and the same It relates to a hot stamping foil used.

In general, the stamping foil has a structure in which a film (mainly a heat resistant polyester film) serves as a carrier and a release layer, a coloring layer, a deposition layer, and an adhesive layer are multi-layered coated. It can be transcribed into paper with letters or patterns.

Therefore, the adhesive layer, which is one of the constituent layers of the stamping foil, requires excellent adhesion to adherends, such as oriented polypropylene (OPP) or polyvinyl chloride (PVC) laminated paper, in addition to ordinary paper, and is also wound with a film. It should have blocking resistance to prevent transfer from to back (opposite side). However, it is not easy to control the adhesion and blocking resistance required for the adhesive layer as the opposite property, and in particular, in the prior art, the transfer temperature is high, which lowers the productivity of the transfer company, or induces blocking when the transfer temperature is lowered.

Accordingly, the present inventors have intensively studied, and found that the above problems can be solved by adding an inorganic filler to a mixture of propylene chloride and acrylic resin, thereby completing the present invention.

It is an object of the present invention to provide an adhesive layer composition having a low transfer temperature and excellent adhesion and blocking resistance and a hot stamping foil using the same.

In order to achieve the above object, the present invention provides a hot stamping foil having a mixture of a propylene chloride resin and an acrylic resin, and an adhesive layer composition comprising 5 to 50 parts by weight of an inorganic filler with respect to 100 parts by weight of the mixture, and an adhesive layer made from the adhesive layer composition. to provide.

Hereinafter, the present invention will be described in more detail.

According to the present invention, a mixture of propylene chloride and acrylic resin is used as a main component of the adhesive layer, and in the present invention, S (S) -609 (Noah Chemical Products) is used.

According to the present invention, the inorganic filler is used to lower the transfer temperature and improve the blocking resistance, respectively. As the inorganic filler, silicon dioxide having an average particle size of 1.0 mu can be used. In particular, in the present invention, Nipsil E220A (Nippon Silica) is used. The inorganic filler is used in an amount of 5 to 50 parts by weight based on 100 parts by weight of the mixture of propylene chloride and acrylic resin. If it is less than 5 parts by weight, blocking occurs, and when it exceeds 50 parts by weight, the adhesive strength is reduced.

In addition, since the shape of the surface of the adhesive layer varies depending on the solvent, the solvent is also considered to be deeply related to blocking properties, and in the present invention, toluene / methanol / methylethylketone is used in a ratio of 50/3/47, without being limited thereto. In some cases, the ratio can be changed.

The adhesive layer composition as described above is applicable to any multilayer film in which the adhesive layer is used, and is particularly suitable for use as the adhesive layer of the hot stamping foil. The adhesive layer composition of the present invention is preferably applied so that the effective ingredient is 0.8 to 1.2g / m ² after drying at the time of application, when less than 0.8g / m ² , the blocking resistance is increased but the adhesive strength is reduced, 1.2g / m ² In the case of exceeding the adhesive strength increases, but the blocking resistance decreases and the manufacturing cost increases. In addition, the drying is preferably carried out for 3 to 10 seconds at 100 to 140 ℃ is a condition that allows evaporation of the solvent used, drying at a high temperature over 140 ℃ to increase the blocking properties.

According to the present invention, it is possible to prepare an adhesive layer composition transferable at 90 to 100 ° C. and excellent adhesion and blocking resistance, and a hot stamping foil using the same, and to increase productivity by transferring a multilayer film to paper at low temperatures. .

Hereinafter, the present invention will be described in more detail based on the following examples. However, the following examples are not intended to limit the present invention, but are not limited thereto. Various performance evaluations of the films prepared in Examples and Comparative Examples of the present invention were performed by the following methods.

(1) Transfer temperature

The film which has an adhesive layer was laminated on paper, and the temperature which adheres was measured.

(2) adhesion

After crosshatching the surface transferred to paper at the minimum transfer temperature (net width of 1 × 1 mm), the degree of peeling off with a cello tape was measured.

○: Good adhesion, not more than 90% of the transfer surface

(Triangle | delta): 50-90% of an adhesive force and a transfer surface do not fall.

×: poor adhesion, not more than 50% of the transfer surface

(3) Blocking resistance

Transfer the finished product coated with the adhesive layer to the back while unwinding after standing for 24 hours in a constant temperature and humidity chamber maintained at 60 ° C and 75% relative humidity in a rolled state (stacked multiple sheets of film under pressure and tension). The condition was visually observed.

○: Good blocking resistance, back transfer within 10% occurs

(Triangle | delta): Blocking resistance Normally, about 10-50% of back transcription generate | occur | produces.

×: bad blocking resistance, more than 50% of back transfer occurs

Example 1

After coating and drying a protective layer (mixture of acrylic resin and wax) on 19 μl of polyester film, 10 kg of a mixture of propylene chloride and acrylic resin, 1 kg of inorganic filler and solvent (toluene / methanol / methylethylketone = 45/2) / 42) 89kg was mixed and applied so that the dry coating amount was 0.8 to 1.2 g / m ² . Drying was carried out at 120 ° C. for 5 seconds. The results of evaluating the physical properties of the finally prepared film are shown in Table 1 below.

Examples 2-5 and Comparative Examples 1 and 2

A polyester film coated with a protective layer and an adhesive layer was prepared in the same manner as in Example 1 while varying the amount of each component used as shown in Table 1 below. The physical property evaluation results of the film are shown in Table 1 below.

TABLE 1

division Mixture Of Propylene Chloride And Acrylic Resin Inorganic fillers toluene Methanol Methyl ethyl ketone Property evaluation Transfer temperature Adhesion Blocking resistance kg kg kg kg kg ℃ - - Example One 10 One 45 2 42 90 ○ ○ 2 10 2 44 2 42 90 ○ ○ 3 10 3 44 2 41 100 ○ ○ 4 10 4 43 2 41 100 ○ ○ 5 10 5 43 2 40 100 ○ ○ Comparative example One 10 - 45 2 43 90 ○ △ 2 10 6 42 2 40 110 △ ○ Mixture of propylene chloride and acrylic resin: S-609 (Noah Chemicals) Inorganic filler: Nipsil E 220 A (Nippon silica)

As can be seen from Table 1, the Example has an excellent adhesion and blocking resistance while having a transfer temperature of 90 to 100 ℃, Comparative Example 1 lacks the blocking resistance because the inorganic filler is not used, Comparative Example 2 The excessive use of inorganic fillers results in high transfer temperatures and poor adhesion.

The adhesive layer composition according to the present invention is transferable at 90 to 100 ° C. and has excellent adhesion and blocking resistance, so that the hot stamping foil using the same can transfer the multilayer film to paper even at low temperature, thereby increasing productivity.

Claims (3)

An adhesive layer composition comprising 5 to 50 parts by weight of an inorganic filler with respect to a mixture of propylene chloride and acrylic resin and 100 parts by weight of the mixture, wherein the mixture of propylene chloride and acrylic resin is S (Noah Chemical). An adhesive layer composition, characterized in that. The adhesive layer composition according to claim 1, wherein the inorganic filler is Nipsil E220A (Nippon Silica). A hot stamping foil comprising a polyester film, a release layer, a coloring layer, a deposition layer, and an adhesive layer, wherein the hot stamping foil comprises an adhesive layer containing 0.8 to 1.2 g / m 2 of an active ingredient of the adhesive layer composition of claim 1. .