KR19990025036U - Heat Sink for Electronic Components for Printed Circuit Board - Google Patents

Abstract

Coupling means for coupling the base for supporting an electronic component connected to the circuit pattern portion of the printed circuit board with a printed circuit board having a plurality of heat dissipation fins, a plurality of fin members provided to be upright on the printed circuit board, Disclosed is a heat dissipation plate of an electronic component for mounting a printed circuit board having a plurality of hollow boss members having an elastic piece provided at an end portion and having an elastic piece recessed in a hollow portion to enable a detachable complementary to the pin member.

Description

Heat Sink for Electronic Components for Printed Circuit Board

The present invention relates to a heat sink of an electronic component called a heat sink, and more particularly, to a heat sink for heat dissipation of a semiconductor component mounted on a printed circuit board, such as a transistor or an integrated circuit.

In general, an electronic component such as a semiconductor chip such as a transistor TR or an integrated circuit IC is mounted on a printed circuit board PCB on which an electronic circuit is printed to form a circuit driver. For example, an electronic product such as a television set in which a printed circuit board (PCB) is embedded minimizes the air vents formed in the cabinet to prevent the leakage of electromagnetic waves or driving noise from the circuit driver, and to prevent foreign substances from entering the exterior. The trend is to seal. The encapsulation of such an electronic cabinet may adversely affect the heat dissipation efficiency of, for example, the driving portion of the circuit driving unit, thereby lowering the function and life of the embedded electronic component. As a countermeasure, electronic components such as transistors (TRs) and integrated circuits (ICs), which generate a lot of driving heat, are coupled to a heat sink called a heat sink and installed on a printed circuit board.

As shown in FIGS. 1 and 2, a heat sink 10 of a conventional electronic component for mounting a printed circuit board includes a base 11 to which electronic components 1 such as a transistor and an integrated circuit are coupled, and the base 11. A plurality of heat dissipation fins 12 branched from the fin member and fin members provided at an end of the base 11 to support the base 11 to the printed circuit board 100 to which the electronic component 1 is connected. 13) is configured to include.

The base 11 is usually manufactured by extruding a billet manufactured by dissolving an aluminum ingot, and the electronic component 1 has coupling holes h formed in the body and the base 11, respectively. Are coupled to each other by tightening the screw s). The pin member 13 is a supporter that serves as a soldering terminal for supporting the base 11 to the printed circuit board 100, and is usually plated with tin (Sn) or the like so that soldering is performed well. It is fixed in the upright state to the base 11 by caulking or the like.

According to the conventional electronic component heat dissipation plate having the above configuration, the base pin (1a) of the electronic component (1) is connected to the circuit pattern (p) of the printed circuit board 100 by the soldering portion (c1) 11) is installed to be fixed to the printed circuit board 100. Conventionally, in order to fix the base 11 to the printed circuit board 100, the pin member 13 is inserted into the coupling hole h3 formed in the printed circuit board 100 and soldered by the soldering part c2. There is a problem that the assembly workability is poor because it forms. In addition, there is a problem that adversely affect the printed circuit board and the electronic components mounted thereon due to the influence of heat in the soldering process. In addition, the conventional heat dissipation plate has a problem in that it is not easy to separate from the printed circuit board at the time of disposal or replacement due to the end of life of an electronic product, a printed circuit board, or an electronic component.

The technical problem to be achieved by the present invention was devised to improve the problems of the conventional electronic component heat dissipation plate as described above, the heat dissipation plate of the electronic component to improve the assembly and recyclability by improving the structure to easily detachable to the printed circuit board The purpose is to provide.

1 is a schematic perspective view showing a heat sink of a conventional electronic component for mounting a printed circuit board,

FIG. 2 is a schematic cross-sectional view showing a structure in which an electronic component heat sink shown in FIG. 1 is installed on a printed circuit board;

3 is a schematic perspective view showing a heat sink of an electronic component for mounting a printed circuit board according to the present invention;

4 is a schematic perspective view showing an extract of the boss member coupled to the supporter of the heat sink shown in FIG.

<Description of the symbols for the main parts of the drawings>

21 ... Bass

22L ... Lead Heat Sink

22R ... Hollow Heat Dissipation Fin

30.Hollow boss member

32.elastic

200 ... Printed Circuit Board (PCB)

201 ... pin member

In order to achieve the above object, a heat dissipation plate of an electronic component for mounting a printed circuit board according to the present invention includes a base for supporting an electronic component connected to a printed circuit board, a heat dissipation fin formed to branch from the base, and the base. In the heat dissipation plate of the electronic component including a coupling means for coupling to the printed circuit board, the coupling means is a plurality of pin members provided on the printed circuit board, and the end of the base to enable the complementary detachment to the pin member It characterized in that it comprises a plurality of hollow boss member provided in.

According to the present invention, the plurality of heat dissipation fins are provided in a state in which the lead-type heat dissipation fins and the hollow heat dissipation fins having one side opened are mixed, and the opening ends of the hollow heat dissipation fins are compressed to restrain the outer circumferential surface of the boss member. desirable.

The boss member has an opening in which a part of the outer circumferential surface of the body is opened, and a pair of elastic pieces cut in such a manner as to be elastically biased by recessing the inner circumferential surface of the body to correspond to the inside of the hollow portion. Preferably, the hollow portion of the boss member is recessed and cut in such a manner that the hollow portion of the boss member is gradually reduced to the base side to compress and restrain the outer circumferential surface thereof.

Hereinafter, a heat sink of an electronic component according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 3, the heat sink 20 of the electronic component according to the present invention includes a base 21 to which electronic components 2 such as a transistor and an integrated circuit are coupled as shown, and branches from the base 21. A plurality of heat dissipation fins 22 and 22R, and a plurality of fin members 201 installed to stand upright on the printed circuit board 200 as a supporter for supporting the base 21 on the printed circuit board 200. It is configured to include a plurality of hollow boss member 30 provided at the end of the base 21 to enable the detachable action complementary to the pin member 201. Reference numeral 202 denotes an insertion hole into which the lead pin 2a of the electronic component 2 is inserted. The lead pin 2a of the electronic component 2 is inserted into the insertion hole 202 and soldered to the printed circuit board. It is connected to a circuit pattern.

According to a feature of the present invention, the base 21 is usually produced by extruding a billet (billet) produced by dissolving aluminum ingot (ingot), the plurality of heat radiation fins are lead-type heat radiation fins (22L) as shown And a hollow heat dissipation fin 22R having an opening at one side thereof is molded in a mixed state. The hollow heat dissipation fin 22R has the boss member 30 inserted into the hollow portion, and then the end portion is compressed to constrain the outer circumferential surface of the boss member 30. The opening of the hollow heat dissipation fin 22R is intended to induce easy deformation during outer surface compression.

The hollow boss member 30 has an opening 31 in which one side of the outer peripheral surface of the body is opened, as shown in FIG. It has a pair of elastic pieces 32. The pair of elastic pieces 32 are recessed so that the hollow portion is gradually reduced as the pin member 201 enters the hollow portion of the boss member 30 to compress the outer circumferential surface of the pin member 201.

The pin member 201 is fixed to the printed circuit board 200 in an upright state by, for example, caulking or riveting as a supporter for supporting the base 21.

According to the electronic component heat sink according to the present invention having the configuration as described above, in order to connect the lead pin 2a of the electronic component 2 to the circuit pattern portion (not shown) of the printed circuit board 200, The pin member 201 and the boss member 30 are complementarily coupled to fix the base 21 to the printed circuit board 200. That is, when the base member 21 is gradually lowered with respect to the printed circuit board 200 while the pin member 201 and the boss member 30 are positioned to correspond to each other, the pin member 201 It is inserted into the hollow part of the boss member 30. When the insertion of the pin member 201 proceeds, the pair of elastic pieces 32 is gradually pressed down on the opposite sides of the outer peripheral surface of the pin member 201. At this time, if the base 21 is lowered by applying a force greater than the pressure applied to the outer circumferential surface of the pin member 201, the end of the pin member 201 reaches the upper end of the hollow part of the boss member 30. The mutual coupling is completed. As such, when the pin member 201 is completely coupled to the hollow portion of the boss member 30, the pair of elastic pieces 32 are press-constrained to restrain the outer circumferential surface of the pin member 201 so that the boss member ( Since the pin member 201 can be easily prevented from being separated from the hollow portion 30, the base 22 is supported in a stable state on the printed circuit board 200.

When the heat sink according to the present invention needs to be separated from the printed circuit board 200, for example, at the time of replacement or disposal of the electronic component 2 or disposal at the end of the life of the electronic product, the 1 When the pair of elastic pieces 32 apply a force greater than the pressure applied to the outer circumferential surface of the pin member 201 to pull up the base 21, the pin member 201 is a hollow portion of the boss member 30. Easily Depart from That is, the heat dissipation plate 20 according to the present invention can be detachably attached to the printed circuit board by the one-touch type by the complementary action of the boss member 30 and the fin member 201, so that the assembly workability can be greatly improved. . Therefore, the heat dissipation plate according to the present invention can be recycled to its original state as compared with the existing heat dissipation plate fixed to the printed circuit board by soldering.

As described above, according to the electronic component heat dissipation plate according to the present invention, since it can be easily attached to or detached from the printed circuit board by a so-called one-touch type, the assembly workability is greatly improved and at the same time, the electronic product, the printed circuit board or the electronic component It is highly recyclable because it can be easily collected during exchange and repair.

Claims (4)

A heat dissipation plate of an electronic component, comprising: a base for supporting an electronic component connected to a printed circuit board; a plurality of heat dissipation fins formed to branch from the base; and coupling means for coupling the base to the printed circuit board. The coupling means, A plurality of pin members provided on the printed circuit board, and a plurality of hollow boss member provided at the end of the base to enable the detachable complementary to the pin member of the electronic component for mounting a printed circuit board Heat sink. The method of claim 1, The plurality of heat dissipation fins are provided in a state where a lead-type heat dissipation fin 22L and a hollow heat dissipation fin 22R having one side opened are mixed, and the opening end of the hollow heat dissipation fin is compressed to restrain the outer circumferential surface of the boss member. A heat sink of an electronic component for mounting a printed circuit board, characterized in that. The method of claim 1, The boss member has a pair of elastic pieces cut in such a way that the parts of the outer circumferential surface of the body are recessed to correspond to each other inside the hollow portion and are elastically biased, and the elastic pieces are configured to compress and restrain the outer circumferential surface of the member. Heat sink of electronic parts for printed circuit board mounting. The method of claim 3, The pair of elastic pieces is a heat sink of the electronic component for mounting a printed circuit board, characterized in that the hollow portion of the boss member is cut in such a way to gradually shrink.