KR19980032667U - Heat sink mounting structure - Google Patents
Heat sink mounting structure Download PDFInfo
- Publication number
- KR19980032667U KR19980032667U KR2019960045552U KR19960045552U KR19980032667U KR 19980032667 U KR19980032667 U KR 19980032667U KR 2019960045552 U KR2019960045552 U KR 2019960045552U KR 19960045552 U KR19960045552 U KR 19960045552U KR 19980032667 U KR19980032667 U KR 19980032667U
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- mounting structure
- soldering pin
- soldering
- heat
- Prior art date
Links
- 238000005476 soldering Methods 0.000 claims abstract description 30
- 238000010411 cooking Methods 0.000 claims abstract description 8
- 230000007547 defect Effects 0.000 abstract description 4
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 2
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 고안은 전자 부품이나 소자의 열을 흡수하여 외부로 열을 방산시키는 히트싱크가 솔더링 핀에 장착되는 히트싱크 장착구조에 관한 것이다.The present invention relates to a heat sink mounting structure in which a heat sink that absorbs heat from an electronic component or device and dissipates heat to the outside is mounted on a soldering pin.
상기 히트싱크 장착구조는 히트싱크(20)에 솔더링 핀(22)이 안착된 후, 상기 솔더링 핀(22)의 양측면과 히트싱크(20)의 장착부(24) 사이에 쿠킹 금형(28)이 끼워져 상기 솔더링 핀(22)의 양측면이 압착 고정되는 것을 특징으로 한다.In the heat sink mounting structure, after the soldering fins 22 are seated on the heat sinks 20, a cooking die 28 is inserted between both sides of the soldering fins 22 and the mounting portions 24 of the heat sinks 20. Both sides of the soldering pin 22 is characterized in that the pressing fixed.
이것에 의해, 조립시 발생하는 불량을 방지하여 생산성이 향상되는 효과가 있다.Thereby, there exists an effect which prevents the defect which arises at the time of assembly, and improves productivity.
Description
본 고안은 전자 부품이나 소자의 열을 흡수하여 외부로 열을 방산시키는 히트싱크가 솔더링 핀에 장착되는 히트싱크 장착구조에 관한 것이며, 보다 상세히는 솔더링 핀의 양측면과 히트싱크의 장착부 사이에 쿠킹 금형이 끼워져 솔더링 핀을 압착 고정하는 히트싱크 장착구조에 관한 것이다.The present invention relates to a heat sink mounting structure in which a heat sink that absorbs heat from an electronic component or device and dissipates heat to the outside is mounted on a soldering pin. This insert relates to a heat sink mounting structure for crimping and fixing a soldering pin.
종래의 경우를 도 1을 참조하여 설명하면, 도 1은 종래의 히트싱크가 솔더링 핀에 장착되는 상태를 도시한 분해 사시도로서, 종래의 히트싱크 장착구조는 PCB(1)의 구멍(2)에 솔더링 핀(5)이 끼워진 후 솔더링(SOLDERING)되고, 상기 솔더링 핀(5)에 히트싱크(10)의 장착부(11)가 억지끼워맞춤 방법으로 끼워진다.1 is an exploded perspective view illustrating a state in which a conventional heat sink is mounted on a soldering pin, and the conventional heat sink mounting structure is formed in the hole 2 of the PCB 1. After the soldering pin 5 is inserted, it is soldered (SOLDERING), the mounting portion 11 of the heat sink 10 is fitted to the soldering pin 5 by an interference fit method.
상기 솔더링 핀(5)은 PCB(1)의 구멍(2)에 끼워진 후 솔더링되는 하부(6)와, 히트싱크(10)의 장착부(11)에 끼워지는 바디부(7)로 구성되며, 상기 바디부(7)에는 널링(8; KNURLING)이 형성되어 히트싱크(10)가 미끄러져 빠지는 것을 방지한다.The soldering pin 5 is composed of a lower portion 6 which is inserted into the hole 2 of the PCB 1 and soldered thereon, and a body portion 7 that is fitted to the mounting portion 11 of the heat sink 10. The body portion 7 is provided with a knurling 8 (KNURLING) to prevent the heat sink 10 from slipping out.
그러나, 상기와 같은 히트싱크 장착 구조는 솔더링 핀에 히트싱크가 억지끼워맞춤 형식으로 장착되어 조립 생산시 불량이 많은 문제점이 있었다.However, the heat sink mounting structure as described above has a problem in that the heat sink is mounted on the soldering pin in a fitting fashion so that there are many defects in assembly production.
따라서, 본 고안은 상술한 종래의 문제점을 극복하기 위한 것으로서, 본 고안의 목적은 솔더링 핀의 양측면과 장착부 사이에 쿠킹 장치가 끼워져 솔더링 핀을 압착 고정함으로서, 조립 생산시 발생하는 불량을 방지할 수 있는 히트싱크 장착구조를 제공하는데 있다.Accordingly, the present invention is to overcome the above-described problems, the object of the present invention is to insert a cooking device between the both sides and the mounting portion of the soldering pin to press-fix and fix the soldering pin, it is possible to prevent defects occurring during assembly production To provide a heat sink mounting structure.
상기 본 고안의 목적을 달성하기 위한 히트싱크 장착구조의 일예로서, 히트싱크에 솔더링 핀이 안착된 후, 상기 솔더링 핀의 양측면과 히트싱크의 장착부 사이에 쿠킹 금형이 끼워져 상기 솔더링 핀의 양측면이 압착 고정되는 것을 특징으로 한다.As an example of a heat sink mounting structure for achieving the object of the present invention, after the soldering pin is seated on the heat sink, the cooking mold is sandwiched between the both sides of the soldering pin and the mounting portion of the heat sink to crimp both sides of the soldering pin. It is characterized in that it is fixed.
이러한 구성에 의해, 조립후 히트싱크가 변형되거나 파손되지 않는다.By this configuration, the heat sink is not deformed or broken after assembly.
도 1은 종래의 히트싱크가 솔더링 핀에 장착되는 상태를 도시한 분해 사시도1 is an exploded perspective view showing a state in which a conventional heat sink is mounted on a soldering pin
도 2는 본 고안에 따른 히트싱크가 솔더링 핀에 장착된 상태를 도시한 정면도Figure 2 is a front view showing a state in which the heat sink according to the present invention is mounted on the soldering pin
〈도면의 주요 부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
1 : PCB 2 : 구멍1: PCB 2: Hole
5, 22 : 솔더링 핀 6 : 하부5, 22: soldering pin 6: lower part
7 : 바디부 8 : 널링7: body part 8: knurling
10, 20 : 히트싱크 11, 24 : 장착부10, 20: heat sink 11, 24: mounting portion
28 : 쿠킹 금형28: cooking mold
이하, 본 고안의 실시예를 도 2를 참조하여 상세히 설명하면, 도 2는 본 고안에 따른 히트싱크가 솔더링 핀에 장착된 상태를 도시한 정면도로서, 본 고안에 따른 히트싱크 장착구조는 히트싱크(20)에 솔더링 핀(22)이 안착되고, 상기 솔더링 핀(22)의 양측면과 히트싱크(20)의 장착부(24) 사이에 쿠킹 금형(28)이 끼워져 솔더링 핀(22)의 양측면이 압착고정된다.Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. 2, FIG. 2 is a front view showing a state in which a heat sink according to the present invention is mounted on a soldering pin, and the heat sink mounting structure according to the present invention is a heat sink. A soldering pin 22 is seated on the 20, and a cooking die 28 is sandwiched between both sides of the soldering pin 22 and the mounting portion 24 of the heat sink 20, thereby compressing both sides of the soldering pin 22. It is fixed.
따라서, 본 고안에 따른 히트싱크 장착구조는 쿠킹 금형(28)이 솔더링 핀(22)의 양측면을 압착하기 때문에 조립후 히트싱크(20)가 변형되거나 파손되지 않는다.Therefore, the heat sink mounting structure according to the present invention does not deform or break the heat sink 20 after assembly because the cooking die 28 compresses both sides of the soldering pin 22.
상술한 바와 같이 본 고안에 따른 히트싱크 장착구조는 솔더링 핀이 히트싱크의 장착부에 장착된 후, 솔더링 핀의 양측면과 장착부 사이에 쿠킹 장치가 끼워져 솔더링 핀을 고정하기 때문에 조립시 발생하는 불량을 방지하여 생산성이 향상되는 효과가 있다.As described above, the heat sink mounting structure according to the present invention prevents defects caused during assembly since the soldering pin is mounted to the mounting portion of the heat sink, and a cooking device is inserted between both sides of the soldering pin and the mounting portion to fix the soldering pin. The productivity is improved.
이상에서 설명한 것은 본 고안에 따른 히트싱크 장착구조를 실시하기 위한 하나의 실시예에 불과한 것으로서, 본 고안은 상기한 실시예에 한정되지 않고, 이하의 실용신안등록청구의 범위에서 청구하는 본 고안의 요지를 벗어남이 없이 당해 고안이 속하는 분야에서 통상의 지식을 가진자라면 누구든지 다양한 변경 실시가 가능할 것이다.What has been described above is just one embodiment for implementing a heat sink mounting structure according to the present invention, the present invention is not limited to the above-described embodiment, of the present invention claimed in the following utility model registration claims Various modifications can be made by those skilled in the art without departing from the gist of the present invention.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960045552U KR19980032667U (en) | 1996-12-04 | 1996-12-04 | Heat sink mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960045552U KR19980032667U (en) | 1996-12-04 | 1996-12-04 | Heat sink mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980032667U true KR19980032667U (en) | 1998-09-05 |
Family
ID=53987208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960045552U KR19980032667U (en) | 1996-12-04 | 1996-12-04 | Heat sink mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19980032667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100439531B1 (en) * | 2001-11-30 | 2004-07-12 | 주식회사 에이팩 | Heat dissipation means of an electronic machine |
-
1996
- 1996-12-04 KR KR2019960045552U patent/KR19980032667U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100439531B1 (en) * | 2001-11-30 | 2004-07-12 | 주식회사 에이팩 | Heat dissipation means of an electronic machine |
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| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |