KR19990017976A - Transverse electric field liquid crystal display device - Google Patents
Transverse electric field liquid crystal display device Download PDFInfo
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- KR19990017976A KR19990017976A KR1019970041067A KR19970041067A KR19990017976A KR 19990017976 A KR19990017976 A KR 19990017976A KR 1019970041067 A KR1019970041067 A KR 1019970041067A KR 19970041067 A KR19970041067 A KR 19970041067A KR 19990017976 A KR19990017976 A KR 19990017976A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Abstract
본 발명의 횡전계방식 액정표시장치는 보호막과 게이트절연막이 벤조사이클로부텐(BenzoCycloButene)으로 이루어져 있다. BCB의 게이트절연막 위에는 절연특성을 향상시키기 위해 무기절연막이 적층되어 있으며, 보호막은 박막트랜지스터의 반도체층 위와 화소영역의 게이트절연층 위에만 도포되어 있고 데이터전극 위에는 거의 도포되어 있지 않다.In the transverse electric field type liquid crystal display device of the present invention, the protective film and the gate insulating film are made of BenzoCycloButene. An inorganic insulating film is laminated on the BCB gate insulating film in order to improve the insulating property. The protective film is applied only on the semiconductor layer of the thin film transistor and the gate insulating layer of the pixel region, and is rarely applied on the data electrode.
Description
본 발명은 액정표시장치에 관한 것으로, 특히 화질이 향상되고 제조비용이 절감된 횡전계방식 액정표시장치에 관한 것이다.The present invention relates to a liquid crystal display device, and more particularly, to a transverse electric field type liquid crystal display device having improved image quality and reduced manufacturing cost.
최근, 휴대용 텔레비젼이나 노트북 컴퓨터에 많이 사용되는 박막트랜지스터 액정표시장치(TFT LCD)에서 대면적화가 강력하게 요구되고 있지만, 상기한 TFT LCD에는 시야각에 따라 콘트라스트비(contrast ratio)가 변하는 문제가 있었다. 이러한 문제를 해결하기 위해, 광보상판이 장착된 트위스트네마틱(twisted nematic) 액정표시장치, 멀티도메인(multi-domain) 액정표시장치 등과 같은 여러가지 액정표시장치가 제안되고 있지만, 이러한 여러가지 액정표시장치로는 시야각에 따라 콘트라스트비가 저하되고 색상이 변하는 문제를 해결하기 힘든 실정이다.Recently, a large area has been strongly demanded in thin film transistor liquid crystal displays (TFT LCDs), which are widely used in portable televisions and notebook computers. However, the above-described TFT LCDs have a problem in that contrast ratio is changed depending on the viewing angle. In order to solve this problem, various liquid crystal display devices such as a twisted nematic liquid crystal display device equipped with an optical compensation plate and a multi-domain liquid crystal display device have been proposed. It is difficult to solve the problem that the contrast ratio decreases and the color changes depending on the viewing angle.
광시야각을 실현하기 위해 제안되는 다른 방식의 액정표시장치인 횡전계방식(in plane switching mode)의 액정표시장치가 JAPAN DISPLAY 92 P547, 일본특허 특개평 7-36058, 일본특허 특개평 7-225538, ASIA DISPALY 95 P107 등에 제안되고 있다.Another type of liquid crystal display device that is proposed to realize a wide viewing angle is a liquid crystal display device of the in plane switching mode (JAPAN DISPLAY 92 P547, Japanese Patent Laid-Open No. 7-36058, Japanese Patent Laid-Open No. 7-225538, It is proposed to ASIA DISPALY 95 P107.
도 1은 종래의 횡전계방식 액정표시장치를 나타내는 도면이다. 상기한 종래의 횡전계방식 액정표시장치는 도 1(a)에 나타낸 바와 같이, 제1기판(10) 위에 배열되어 화소영역을 정의하는 게이트배선(1) 및 데이터배선(2)과, 상기한 게이트배선(1)과 평행하게 화소내에 배열된 공통배선(3)과, 상기한 게이트배선(1)과 데이터배선(2)의 교차점에 배치된 박막트랜지스터와, 상기한 화소내에 데이터배선(2)과 대략 평행하게 배열된 데이터전극(8) 및 공통전극(9)으로 구성된다. 도 1(b)에 나타낸 바와 같이, 박막트랜지스터는 제1기판(10) 위에 형성되어 게이트배선(1)과 접속되는 게이트전극(5)과, 상기한 게이트전극(5) 위에 적층된 게이트절연막(12)과, 상기한 게이트절연막(12) 위에 형성된 반도체층(15)과, 상기한 반도체층(15) 위에 형성되어 데이터배선(2)과 데이터전극(8)에 각각 접속되는 소스전극(6) 및 드레인전극(7)으로 구성된다. 화소내의 공통전극(9)은 제1기판(10) 위에 형성되어 공통배선(3)에 접속되며 데이터전극(8)은 게이트절연막(12) 위에 형성되어 박막트랜지스터의 드레인전극(7)에 접속된다. 보호막(20)은 박막트랜지스터의 반도체층(15) 위에만 형성되어 있으며, 제1기판(10) 전체에 걸쳐서 제1배향막(23a)이 도포되어 있다.1 is a view showing a conventional transverse electric field type liquid crystal display device. In the conventional transverse electric field type liquid crystal display device, as shown in FIG. 1A, the gate line 1 and the data line 2 are arranged on the first substrate 10 to define a pixel area. The common wiring 3 arranged in the pixel in parallel with the gate wiring 1, the thin film transistor arranged at the intersection of the gate wiring 1 and the data wiring 2, and the data wiring 2 in the pixel. And a data electrode 8 and a common electrode 9 arranged in substantially parallel with each other. As shown in FIG. 1B, the TFT may include a gate electrode 5 formed on the first substrate 10 and connected to the gate wiring 1, and a gate insulating layer stacked on the gate electrode 5. 12, the semiconductor layer 15 formed on the gate insulating film 12, and the source electrode 6 formed on the semiconductor layer 15 and connected to the data wiring 2 and the data electrode 8, respectively. And a drain electrode 7. The common electrode 9 in the pixel is formed on the first substrate 10 and connected to the common wiring 3, and the data electrode 8 is formed on the gate insulating film 12 and connected to the drain electrode 7 of the thin film transistor. . The passivation layer 20 is formed only on the semiconductor layer 15 of the thin film transistor, and the first alignment layer 23a is coated over the entire first substrate 10.
제2기판(11)에는 박막트랜지스터, 게이트배선(1), 데이터배선(2), 공통배선(3) 근처로 빛이 새는 것을 방지하는 차광층(28)이 형성되어 있으며, 그 위에 컬러필터층(29) 및 제2배향막(23b)이 형성되어 있다. 또한, 상기한 제1기판(10) 및 제2기판(11) 사이에는 액정층(30)이 형성되어 있다.The second substrate 11 is formed with a light blocking layer 28 that prevents light leakage near the thin film transistor, the gate wiring 1, the data wiring 2, and the common wiring 3. 29) and the second alignment film 23b are formed. In addition, a liquid crystal layer 30 is formed between the first substrate 10 and the second substrate 11.
상기한 바와 같이 구성된 횡전계방식 액정표시장치에 있어서, 외부구동회로로부터 전압이 인가되면, 데이터전극(8)과 공통전극(9) 사이에 기판(10, 11)과 평행한 횡전계가 발생한다. 따라서, 액정층(30) 내에 배향된 액정분자가 상기한 횡전계를 따라 회전하게 되며, 그 결과 액정층(30)을 통과하는 빛의 양을 제어하게 된다.In the transverse electric field type liquid crystal display device configured as described above, when a voltage is applied from an external driving circuit, a transverse electric field parallel to the substrates 10 and 11 is generated between the data electrode 8 and the common electrode 9. . Accordingly, the liquid crystal molecules oriented in the liquid crystal layer 30 rotate along the above-described transverse electric field, thereby controlling the amount of light passing through the liquid crystal layer 30.
일반적인 횡전계방식 액정표시장치에서는 보호막(20)이 제1기판(10)에 걸쳐서 적층되어 있기 때문에, 상기한 보호막(20)이 캐패시터 역할을 하여 데이터전극(8)과 공통전극(9) 사이의 횡전계의 세기가 감소하게 된다. 따라서, 도면에 나타낸 바와 같이, 박막트랜지스터 위에만 보호막(20)을 형성하여 반도체층(15)을 보호하는 경우에는 전극(8, 9) 사이의 횡전계의 세기가 감소하지 않기 때문에 구동전압을 낮출 수 있게 된다. 그러나, 상기한 보호막(20)의 두께는 약 3000Å이기 때문에, 제1배향막(23a)을 도포했을 때 배향막(23a)에 단차가 발생하게 된다. 이러한 단차는 상기한 배향막(23a)을 러빙과 기계적인 방법으로 배향할 때, 배향막(23a)에 배향방향이 결정되지 않는 영역이 발생하게 되어 전경(disclination)이 생기는 원인이 된다.In a typical transverse electric field type liquid crystal display device, since the passivation layer 20 is stacked over the first substrate 10, the passivation layer 20 acts as a capacitor to form a gap between the data electrode 8 and the common electrode 9. The strength of the transverse electric field is reduced. Therefore, as shown in the drawing, when the protective film 20 is formed only on the thin film transistor to protect the semiconductor layer 15, the strength of the transverse electric field between the electrodes 8 and 9 does not decrease, thereby lowering the driving voltage. It becomes possible. However, since the thickness of the said protective film 20 is about 3000 micrometers, when the 1st orientation film 23a is apply | coated, a step | step will generate | occur | produce in the orientation film 23a. When the alignment layer 23a is oriented by rubbing and a mechanical method, such a step may cause a region in which the alignment direction is not determined in the alignment layer 23a, resulting in a disclination.
보호막(20)과 게이트절연막(12)은 일반적으로 SiOx나 SiNx와 같은 무기물로 이루어져 있다. 따라서, 상기한 보호막(20)과 게이트절연막(12)은 에칭선택비가 동일하거나 비슷하기 때문에, 박막트랜지스터를 제외한 영역의 보호막(20)을 에칭할 때에 게이트절연막(12)도 에칭되는 일이 자주 발생하게 되어 화면에 얼룩이 생기게 된다.The passivation layer 20 and the gate insulating layer 12 are generally made of an inorganic material such as SiOx or SiNx. Therefore, since the protective film 20 and the gate insulating film 12 have the same or similar etching selectivity, the gate insulating film 12 is also often etched when the protective film 20 in the region excluding the thin film transistor is etched. This will stain your screen.
또한, 상기한 보호막(20)의 오픈시 패드(pad)를 오픈하기 위해, 게이트절연막(12)을 오버에칭해야만 하지만, 이러한 게이트절연막(12)의 에칭은 게이트절연막 자체에 결함을 가져온다. 더욱이, 상기한 게이트절연막의 결함은 게이트금속에 영향을 미치게 된다. 예를 들면, 게이트전극으로 Cr을 사용하는 경우에 상기한 게이트절연막의 결함에 의해 게이트전극에 수분이 침투하여 게이트전극(혹은, 게이트배선)에 단선이 발생한다.In addition, in order to open the pad when the protective film 20 is opened, the gate insulating film 12 must be overetched, but the etching of the gate insulating film 12 causes a defect in the gate insulating film itself. Moreover, the above defects of the gate insulating film affect the gate metal. For example, when Cr is used as the gate electrode, moisture penetrates into the gate electrode due to the defect of the gate insulating film described above, and disconnection occurs in the gate electrode (or gate wiring).
더욱이, 약 4000Å의 두께로 제1기판 위에 형성된 게이트절연막이 공통전극 위에도 적층되기 때문에, 전극(8, 9) 사이의 전계의 세기가 약화되어 구동전압이 증가하게 된다.Furthermore, since the gate insulating film formed on the first substrate with a thickness of about 4000 kV is also stacked on the common electrode, the strength of the electric field between the electrodes 8 and 9 is weakened, thereby increasing the driving voltage.
본 발명은 상기한 점을 감안하여 이루어진 것으로, 보호막을 유기절연막인 벤조사이클로부텐(BenzoCycloButene)으로 형성하여 제조공정이 간단하고 화질이 향상된 횡전계방식 액정표시장치를 제공하는 것을 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object of the present invention is to provide a transverse electric field type liquid crystal display device having a simple manufacturing process and improving image quality by forming a protective film with benzocyclobutene, which is an organic insulating film.
본 발명의 다른 목적은, 보호막과 게이트절연막을 BCB로 형성하여 전극 사이의 횡전계의 세기를 크게 함으로써, 구동전력을 절감할 수 있는 횡전계방식 액정표시장치를 제공하는 것이다.It is another object of the present invention to provide a transverse electric field type liquid crystal display device which can reduce driving power by forming a protective film and a gate insulating film of BCB to increase the strength of the transverse electric field between electrodes.
상기한 목적을 달성하기 위해, 본 발명에 따른 횡전계방식 액정표시장치는 제1기판 및 제2기판과, 상기한 제1기판 위에 종횡으로 배열된 게이트배선 및 데이터배선과, 상기한 게이트배선과 데이터배선의 교차부분에 배치된 박막트랜지스터와, 상기한 게이터배선과 평행하게 배열된 데이터전극 및 공통전극과, 상기한 박막트랜지스터 위에 도포된 BCB로 이루어진 보호막과, 상기한 제1기판 전체에 걸쳐서 도포된 제1배향막과, 제2기판에 형성된 블랙매트릭스와, 상기한 제2기판 전체에 걸쳐서 형성된 컬러필터층과, 상기한 컬러필터층 위에 도포된 제2배향막과, 상기한 제1기판과 제2기판 사이에 형성된 액정층으로 구성된다.In order to achieve the above object, a transverse electric field type liquid crystal display device according to the present invention comprises a first substrate and a second substrate, a gate wiring and a data wiring arranged vertically and horizontally on the first substrate, the gate wiring and A thin film transistor disposed at an intersection of the data wiring lines, a data electrode and a common electrode arranged in parallel with the gator wirings, a protective film made of BCB coated on the thin film transistors, and the entire first substrate. The first alignment film, the black matrix formed on the second substrate, the color filter layer formed over the entire second substrate, the second alignment film coated on the color filter layer, and the first substrate and the second substrate. It consists of a liquid crystal layer formed in.
박막트랜지스터는 제1기판 위에 형성된 게이트전극과, 상기한 게이트전극 위에 형성된 적어도 한층의 게이트절연막과, 상기한 게이트절연막 위에 형성된 반도체층과, 상기한 반도체층 위에 형성된 소스전극 및 드레인전극으로 구성된다.The thin film transistor includes a gate electrode formed on the first substrate, at least one gate insulating film formed on the gate electrode, a semiconductor layer formed on the gate insulating film, and a source electrode and a drain electrode formed on the semiconductor layer.
BCB로 이루어진 제1게이트절연막과 SiOx나 SiNx 등의 무기물로 이루어진 제2게이트절연막으로 구성된 게이트절연막은 BCB막이 평탄하게 도포되기 때문에, 전체 게이트절연막의 표면이 평탄하게 되어 공통전극 위의 두께가 제1기판 위의 두께 보다 작게 된다.In the gate insulating film composed of the first gate insulating film made of BCB and the second gate insulating film made of inorganic materials such as SiOx and SiNx, the BCB film is evenly coated, so that the surface of the entire gate insulating film is flat and the thickness on the common electrode is first. It becomes smaller than the thickness on the substrate.
BCB로 이루어진 보호막은 스핀코팅에 의해 도포되기 때문에, 데이터전극과 거의 동일한 두께로 형성된다. 따라서, 상기한 보호막이 박막트랜지스터와 게이트절연막 위에만 도포되고 데이터전극 위에는 도포되지 않는다. 그러므로, 전극 사이의 횡전계의 세기가 증가하여 구동전압을 절감할 수 있게 된다.Since the protective film made of BCB is applied by spin coating, it is formed to have almost the same thickness as the data electrode. Therefore, the above protective film is applied only on the thin film transistor and the gate insulating film, but not on the data electrode. Therefore, the strength of the transverse electric field between the electrodes is increased to reduce the driving voltage.
상기한 바와 같이, 보호막과 게이트절연막을 모두 BCB로 형성할 수도 있으며, 보호막 또는 게이트절연막 중 하나를 BCB로 도포한 후 다른 것은 무기막으로 형성할 수도 있다.As described above, both the protective film and the gate insulating film may be formed of BCB, and either the protective film or the gate insulating film may be coated with BCB, and the other may be formed of the inorganic film.
도 1(a)는, 종래 횡전계방식 액정표시장치의 평면도.1A is a plan view of a conventional transverse electric field type liquid crystal display device.
도 1(b)는, 도 1(a)의 A-A'선 단면도.(B) is sectional drawing A-A 'of FIG. 1 (a).
도 2는, 본 발명의 제1실시예에 따른 횡전계방식 액정표시장치의 단면도.2 is a cross-sectional view of a transverse electric field type liquid crystal display device according to a first embodiment of the present invention.
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
105 : 게이트전극 106 : 소스전극105: gate electrode 106: source electrode
107 : 드레인전극 108 : 데이터전극107: drain electrode 108: data electrode
109 : 공통전극 110 : 제1기판109: common electrode 110: first substrate
111 : 제2기판 112, 113 : 게이트절연막111: second substrate 112, 113: gate insulating film
115 : 반도체층 120 : 보호막115: semiconductor layer 120: protective film
123 : 배향막 128 : 블랙매트릭스123: alignment layer 128: black matrix
129 : 컬러필터층 130 : 액정층129: color filter layer 130: liquid crystal layer
이하, 첨부한 도면을 참조하여 본 발명에 따른 횡전계방식 액정표시장치를 상세히 설명한다.Hereinafter, a transverse electric field type liquid crystal display device according to the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 제1실시예에 따른 횡전계방식 액정표시장치의 단면도이다. 본 발명의 횡전계방식 액정표시장치의 평면도는 도 1과 동일하기 때문에, 평면도에 대한 설명은 생략하고 도 2를 참조하여 본 발명을 설명한다.2 is a cross-sectional view of a transverse electric field type liquid crystal display device according to a first embodiment of the present invention. Since the plan view of the transverse electric field type liquid crystal display device of the present invention is the same as that of FIG. 1, the description of the plan view will be omitted and the present invention will be described with reference to FIG. 2.
도면에 나타낸 바와 같이, 제1기판(110) 위에는 게이트전극(105)과 공통전극(109)이 형성되어 있고, 그 위에 제1게이트절연막(113)과 제2게이트절연막(112)이 형성되어 있다. 게이트전극(105)과 공통전극(109)은 스퍼터링방법에 의해 적층된 Al, Mo, Ta 또는 Al합금 등과 같은 약 3000Å의 금속박막을 에칭하여 형성하며, 제1게이트절연막(113)은 벤조사이클로부텐(BenzoCycloButene)을 스핀코팅(spin coating)방법으로 도포하여 형성한다. 또한, 제2게이트절연막(112)는 SiNx나 SiOx 등과 같은 무기물을 CVD(Chemical Vapor Deposition)방법에 의해 적층하여 형성한다. 유기물인 BCB는 스핀코팅에 의해 약 2500Å의 두께로 게이트전극(105)과 공통전극(109) 보다 두껍게 도포되기 때문에, 게이트전극(105)과 공통전극(109)의 단차에도 불구하고 그 표면이 평탄하게 형성된다. 따라서, 그 위에 절연성이 좋은 무기물로 이루어진 제2게이트절연막(112)을 형성하면, 상기한 제2게이트절연막(112)의 표면도 평탄하게 형성된다. 게이트절연막(112, 113)이 평탄하게 형성된다는 것은 도면에 나타낸 바와 같이, 공통전극(109) 위의 게이트절연막(112, 113)이 제1기판(110) 위의 절연막(112, 113) 보다 얇게 형성된다는 것을 의미한다. 따라서, 전압인가시 상기한 절연막(112, 113)에 의해 전계의 세기가 약해지는 것이 방지된다.As shown in the drawing, the gate electrode 105 and the common electrode 109 are formed on the first substrate 110, and the first gate insulating film 113 and the second gate insulating film 112 are formed thereon. . The gate electrode 105 and the common electrode 109 are formed by etching a metal thin film of about 3000 kV, such as Al, Mo, Ta, or Al alloy, which are stacked by a sputtering method, and the first gate insulating film 113 is formed of benzocyclobutene. (BenzoCycloButene) is formed by applying a spin coating method (spin coating). In addition, the second gate insulating layer 112 is formed by stacking an inorganic material such as SiNx, SiOx, or the like by a CVD (Chemical Vapor Deposition) method. Since BCB, which is an organic material, is thicker than the gate electrode 105 and the common electrode 109 with a thickness of about 2500 kV by spin coating, the surface is flat despite the step difference between the gate electrode 105 and the common electrode 109. Is formed. Therefore, when the second gate insulating film 112 made of an inorganic material having good insulation is formed thereon, the surface of the second gate insulating film 112 is also formed flat. As shown in the drawing, the gate insulating films 112 and 113 are formed flat, so that the gate insulating films 112 and 113 on the common electrode 109 are thinner than the insulating films 112 and 113 on the first substrate 110. It means that it is formed. Therefore, the weakness of the electric field is prevented by the insulating films 112 and 113 described above when voltage is applied.
제2게이트절연막(112) 위에는 반도체층(115)이 형성되어 있다. 반도체층(115)은 채널층(channel layer)으로서, 비정질실리콘(a-Si)을 CVD방법으로 적층하고 에칭하여 형성한다. 도면에는 나타내지 않았지만, 상기한 반도체층(115) 위에는 n+a-Si으로 이루어진 오믹콘택층이 형성되어 있다. 오믹콘택층과 제2게이트절연막(112) 위에는 소스전극(106), 드레인전극(107) 및 데이터전극(108)이 형성되어 있다. 소스전극(106), 드레인전극(107) 및 데이터전극(108)은 스퍼터링방법에 의해 적층된 Al, Cr, Ti, Al합금과 같은 약 1000Å의 금속박막을 에칭하여 형성한다. 또한, 도면에는 나타내지 않았지만, 상기한 소스전극(106), 드레인전극(107) 및 데이터전극(108)의 형성과 동시에 데이터배선이 형성된다.The semiconductor layer 115 is formed on the second gate insulating layer 112. The semiconductor layer 115 is a channel layer, and is formed by laminating and etching amorphous silicon (a-Si) by a CVD method. Although not shown, an ohmic contact layer made of n + a-Si is formed on the semiconductor layer 115. The source electrode 106, the drain electrode 107, and the data electrode 108 are formed on the ohmic contact layer and the second gate insulating layer 112. The source electrode 106, the drain electrode 107, and the data electrode 108 are formed by etching a metal thin film of about 1000 mW, such as Al, Cr, Ti, and Al alloy, which are stacked by a sputtering method. Although not shown in the figure, data wirings are formed simultaneously with the formation of the source electrode 106, the drain electrode 107, and the data electrode 108.
반도체층(115)과 제2게이트절연막(112) 위에는 보호막(120)이 도포되어 있다. 보호막(120)은 BCB를 스핀코팅하여 도포하는 것으로, 소스전극(106), 드레인전극(107) 및 데이터전극(108)과 거의 동일한 두께인 약 1000Å의 두께로 형성된다. 따라서, 상기한 보호막(120)이 반도체층(115) 위와 제2게이트절연막(112) 위에만 형성되고 데이터전극(108) 위에는 형성되지 않는다. 그 결과, 데이터전극(108)에 전압이 인가되면 데이터전극(108) 위에 보호막이 적층되어 있던 종래의 액정표시장치에 비해 더 강한 세기의 전계가 인가된다. 그러므로, 액정분자가 구동속도가 향상되어 구동전압을 절감할 수 있게 된다. 제조공정에 있어서도, 화소영역의 보호막을 에칭할 필요가 없기 때문에, 종래에 구동전압을 절감하기 위해 화소영역의 보호막을 에칭하는 것에 비해 공정이 간단하게 되어 제조비용이 대폭 절감된다. 또한, 종래에 보호막(120)의 에칭시 게이트절연막(112)의 일부분이 에칭되어 화면에 얼룩이 발생하는 것이 방지되기 때문에, 좋은 화질을 구현할 수 있게 된다. 이때, 상기한 보호막(120)을 1000Å 보다 더욱 얇게 하는 것도 물론 가능하며, 반도체층(115) 위에만 도포하는 것도 가능하다.The passivation layer 120 is coated on the semiconductor layer 115 and the second gate insulating layer 112. The passivation layer 120 is coated by BCB by spin coating, and is formed to a thickness of about 1000 mW, which is almost the same as that of the source electrode 106, the drain electrode 107, and the data electrode 108. Therefore, the passivation layer 120 is formed only on the semiconductor layer 115 and the second gate insulating layer 112, but not on the data electrode 108. As a result, when a voltage is applied to the data electrode 108, an electric field having a stronger intensity is applied as compared with the conventional liquid crystal display in which a protective film is stacked on the data electrode 108. Therefore, the liquid crystal molecules can improve the driving speed, thereby reducing the driving voltage. Also in the manufacturing process, it is not necessary to etch the protective film of the pixel region, so that the process is simpler compared to the etching of the protective film of the pixel region in order to reduce the driving voltage conventionally, and the manufacturing cost is greatly reduced. In addition, since a portion of the gate insulating film 112 is conventionally etched when the protective film 120 is etched to prevent staining on the screen, it is possible to implement good image quality. At this time, the protective film 120 can be made thinner than 1000 kPa, and can be applied only on the semiconductor layer 115.
도면에는 나타내지 않았지만, 보호막(120)의 도포 후에 제1게이트절연막(113), 제2게이트절연막(112) 및 보호막(120)을 한꺼번에 에칭하여 패드영역을 오픈한다. 이러한 패드오픈공정은 종래의 횡전계방식 액정표시장치에서 게이트절연막을 에칭한 후 다시 보호막을 오픈하는 것에 비해 제조공정이 줄어 들기 때문에 제조비용이 대폭 감소할 뿐만 아니라 수율이 향상된다.Although not shown in the drawing, the pad region is opened by etching the first gate insulating film 113, the second gate insulating film 112, and the protective film 120 at the same time after the protective film 120 is applied. In the pad opening process, the manufacturing process is reduced compared to opening the protective layer after etching the gate insulating layer in the conventional transverse type liquid crystal display, and thus the manufacturing cost is greatly reduced and the yield is improved.
제1배향막(123a)은 제1기판(110) 전체에 걸쳐서 도포되어 있다. 배향막으로는 일반적으로 폴리이미드(polyimide) 혹은 PVCN(polyvinylcinnamate)계 물질이나 폴리실록산(polysiloxane)계 물질과 같은 광반응성 물질을 사용한다. 폴리이미드를 배향막으로 사용하는 경우에는 배향막에 배향방향을 결정하기 위해 기계적인 러빙방법을 사용한다. 본 발명과 같이 BCB를 보호막(120)으로 사용하는 경우에는 배향막에 단차가 발생하지 않기 때문에, 러빙공정으로 배향방향을 결정하는 경우에도 미배향영역이 발생하지 않기 때문에 화면에 전경이 생기는 것이 방지된다.The first alignment layer 123a is applied over the entire first substrate 110. As the alignment layer, a photoreactive material such as polyimide or polyvinylcinnamate (PVCN) -based material or polysiloxane-based material is generally used. When polyimide is used as the alignment film, a mechanical rubbing method is used to determine the orientation direction on the alignment film. When the BCB is used as the protective film 120 as in the present invention, no step occurs in the alignment film, and thus, even when the orientation direction is determined by the rubbing process, the unoriented area is not generated, thereby preventing the foreground from appearing on the screen. .
배향막(123a)으로 광반응성 물질을 사용하는 경우에는 배향막에 자외선과 같은 광을 조사하여 배향방향을 결정한다. 배향막에 결정되는 배향방향은 조사되는 광의 편광방향과 같이 광의 고유한 성질에 따라 배향방향이 달라지기 때문에, 기계적인 러빙을 사용했을 때 배향막에 먼지나 정전기가 생기는 문제를 해결할 수 있게 된다.In the case where a photoreactive material is used as the alignment layer 123a, the alignment layer is determined by irradiating light such as ultraviolet rays onto the alignment layer. Since the orientation direction determined by the alignment film varies depending on the intrinsic properties of the light, such as the polarization direction of the irradiated light, it is possible to solve the problem of dust or static electricity generated in the alignment film when mechanical rubbing is used.
제2기판(111)에는 게이트배선, 데이터배선, 공통배선 및 박막트랜지스터 근처로 빛이 새는 것을 방지하기 위한 블랙매트릭스(128)가 형성되어 있으며, 그 위에 컬러필터층(129)이 형성되어 있다. 블랙매트릭스(128)는 스퍼터링방법에 의해 적층된 Cr박막이나 CrOx박막을 에칭하여 형성한다. 컬러필터층(129)에는 R, G, B층이 화소마다 반복 형성되어 있다. 컬러필터층(129) 위에는 폴리이미드나 광반응성 물질로 이루어진 제2배향막(123b)이 도포된 후 러빙이나 광의 조사에 의해 배향방향이 결정된다. 또한, 제1기판(110)과 제2기판(111) 사이에는 진공상태에서 액정이 주입되어 액정층(130)이 형성된다.A black matrix 128 is formed on the second substrate 111 to prevent light leakage near the gate wiring, the data wiring, the common wiring, and the thin film transistor, and the color filter layer 129 is formed thereon. The black matrix 128 is formed by etching a Cr thin film or a CrOx thin film deposited by a sputtering method. In the color filter layer 129, R, G, and B layers are repeatedly formed for each pixel. After the second alignment layer 123b made of polyimide or a photoreactive material is coated on the color filter layer 129, the orientation direction is determined by rubbing or irradiation of light. In addition, a liquid crystal is injected in a vacuum state between the first substrate 110 and the second substrate 111 to form the liquid crystal layer 130.
상기한 바와 같이 본 발명의 횡전계방식 액정표시장치에서는 보호막(120)이 반도체층(115)과 화소영역의 제2게이트절연막(112) 위에만 도포되어 있기 때문에, 액정패널 전체에 걸쳐서 거의 평탄한 표면을 이루게 된다. 또한, 데이터전극(108) 위에는 보호막(120)이 도포되어 있지 않기 때문에 구동전압을 대폭 절감할 수 있게 된다.As described above, in the transverse electric field type liquid crystal display device of the present invention, since the protective film 120 is applied only on the semiconductor layer 115 and the second gate insulating film 112 in the pixel region, the surface is almost flat throughout the liquid crystal panel. Will be achieved. In addition, since the passivation layer 120 is not coated on the data electrode 108, the driving voltage can be significantly reduced.
상기한 설명에서는 보호막(120)이 반도체층(115)과 화소영역의 제2게이트절연막(112) 위에 도포되어 있지만, 반도체층(115) 위에만 도포하는 것도 가능하다. 또한, 게이트절연막(112, 113)을 BCB와 무기절연막의 이중의 층으로 형성하고 보호막(120)을 BCB를 도포하여 형성했지만, 게이트절연막을 무기절연막으로 이루어진 단일의 층으로 형성하고 보호막(120)을 BCB로 형성하는 것도 가능하며, 게이트절연막을 BCB로 이루어진 단일의 층으로 형성하고 보호막을 무기절연막으로 형성하는 것도 물론 가능하다.In the above description, the protective film 120 is coated on the semiconductor layer 115 and the second gate insulating film 112 in the pixel region, but it is also possible to apply the protective film 120 only on the semiconductor layer 115. In addition, although the gate insulating films 112 and 113 are formed of a double layer of BCB and an inorganic insulating film and the protective film 120 is formed by applying BCB, the gate insulating film is formed of a single layer made of an inorganic insulating film and the protective film 120 is formed. May be formed of BCB, and of course, the gate insulating film may be formed of a single layer made of BCB, and the protective film may be formed of an inorganic insulating film.
본 발명의 횡전계방식 액정표시장치는 제1게이트절연막이 BCB로 이루어져 있고 그 위에 무기물로 이루어진 제1게이트절연막이 적층되어 있기 때문에, 게이트절연막의 표면이 평탄하게 된다. 따라서, 공통전극 위의 게이트절연막의 두께가 종래에 비해 훨씬 작아진다. 그러므로, 절연막에 의해 전계의 세기가 감소하지 않기 때문에 구동전압을 절감할 수 있게 된다. 또한, 데이터전극 위에도 보호막이 도포되어 있지 않기 때문에, 구동전압이 더욱 절감된다.In the transverse electric field liquid crystal display device of the present invention, since the first gate insulating film is made of BCB and the first gate insulating film made of inorganic material is stacked thereon, the surface of the gate insulating film is flat. Therefore, the thickness of the gate insulating film on the common electrode is much smaller than in the prior art. Therefore, the driving voltage can be reduced because the intensity of the electric field is not reduced by the insulating film. In addition, since the protective film is not coated on the data electrodes, the driving voltage is further reduced.
보호막은 데이터전극과 거의 동일한 두께로 도포되어 화소영역에서 그 표면이 평탄하게 되어 배향막을 러빙할 때, 미배향영역이 발생하지 않게 되어 화질이 향상된다.The protective film is applied to a thickness substantially the same as that of the data electrode, so that its surface is flat in the pixel area, so that unaligned areas do not occur when rubbing the alignment film, thereby improving image quality.
제조공정에 있어서도, 패드영역의 보호막과 게이트절연막을 한꺼번에 에칭하여 패드를 오픈시키기 때문에 제조공정이 간단하게 된다. 또한, 화소영역의 보호막을 에칭할 필요가 없기 때문에, 보호막의 에칭시 게이트절연막이 에칭되지 않게 되어 화질이 더욱 향상된다.Also in the manufacturing process, the pad and the gate insulating film are etched at the same time to open the pad, thereby simplifying the manufacturing process. In addition, since it is not necessary to etch the protective film of the pixel region, the gate insulating film is not etched when the protective film is etched, so that the image quality is further improved.
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KR100456495B1 (en) * | 2000-12-18 | 2004-11-10 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100460472B1 (en) * | 2001-02-28 | 2004-12-08 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display |
KR100467920B1 (en) * | 2001-01-29 | 2005-01-24 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100490042B1 (en) * | 1997-10-09 | 2005-09-15 | 삼성전자주식회사 | Thin Film Transistor Board for Liquid Crystal Display and Manufacturing Method |
KR100590919B1 (en) * | 1999-06-29 | 2006-06-19 | 비오이 하이디스 테크놀로지 주식회사 | Method for manufacturing the same |
KR100620322B1 (en) * | 2000-07-10 | 2006-09-13 | 엘지.필립스 엘시디 주식회사 | IPS mode Liquid crystal display device and method for fabricating the same |
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JP2940354B2 (en) * | 1992-09-18 | 1999-08-25 | 株式会社日立製作所 | Liquid crystal display |
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KR100490042B1 (en) * | 1997-10-09 | 2005-09-15 | 삼성전자주식회사 | Thin Film Transistor Board for Liquid Crystal Display and Manufacturing Method |
KR100590919B1 (en) * | 1999-06-29 | 2006-06-19 | 비오이 하이디스 테크놀로지 주식회사 | Method for manufacturing the same |
KR100620322B1 (en) * | 2000-07-10 | 2006-09-13 | 엘지.필립스 엘시디 주식회사 | IPS mode Liquid crystal display device and method for fabricating the same |
KR100456495B1 (en) * | 2000-12-18 | 2004-11-10 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100467920B1 (en) * | 2001-01-29 | 2005-01-24 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100460472B1 (en) * | 2001-02-28 | 2004-12-08 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display |
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