KR19990015209A - Semiconductor device transfer / insertion system and semiconductor device transfer / insertion method through the same - Google Patents

Abstract

The present invention relates to a semiconductor device inserting / inserting system and a method of inserting and inserting a semiconductor device through the same. By separating and forming each other, first, the operator can quickly detect the state of the device without having to look around the system as a whole. Second, even if some of the transfer devices are abnormal, the other transfer devices can perform certain operations irrespective of this. Can last.

Description

Semiconductor device transfer / insertion system and semiconductor device transfer / insertion method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transfer / insertion system, and more particularly, to a semiconductor device transfer / insertion system and a semiconductor device transfer / insertion system through which the system management can be easily achieved and the overall test time can be reduced It is about a method.

As is generally known, most semiconductor devices in which the assembly process is completed are most likely to have defects in 1000 hours, and the possibility of such defects is unlikely after 1000 hours.

As a result, in a conventional semiconductor process, a DC test apparatus and a burn-in test apparatus are used to quickly identify a device that may cause a defect within 1000 hours. Burn-in boards are designed to suit the characteristics of each device, and after the devices are mounted, various devices such as various signals, stress voltages, and high temperatures are applied to these devices to rapidly screen initial defective devices.

At this time, the semiconductor device which has finished the burn-in test described above should be separated from the burn-in board with good or bad and transferred to a predetermined tray, and a new semiconductor device which has completed the DC test should be mounted on the burn-in board from which the semiconductor device has been removed. This work is properly done through a semiconductor device insertion / insertion system having a particular configuration.

1 is a cross-sectional view schematically showing the main portion of a conventional semiconductor device tooth insertion system for performing this function.

As shown, various test processing apparatuses 10 are installed on the upper portion of the main body 1.

Such test processing apparatuses 10 include a DC test socket part 12 for DC-testing a semiconductor device, and a semiconductor device that is installed at a predetermined distance from the DC test socket part 12 and burned-in and tested for a bad or bad shot. And a shooting table 13.

On the other hand, the lower part 1 of the main body is provided with a burn-in test board transfer unit 20 for moving the burn-in test board 22 in the X-Y direction.

Here, the through hole 2 having a predetermined size is formed in the main body 1, and the through hole 2 is a semiconductor device between the test processing apparatuses 10 on the main body 1 and the burn-in test board 22. Provide a transfer path.

On the other hand, the upper part of the test processing device 10 is provided with a plurality of transfer devices 15 for transferring the device, these transfer devices 15 are supported on one same drive shaft 16, the same at the same time Is driven in the direction.

2 is a conceptual diagram schematically showing a configuration of such a conventional semiconductor device insertion / insertion system.

As shown in the drawing, the test processing devices 10 on the main body 1 are vertically intersected and formed with respect to the detachment / insertion direction of the burn-in test board 22, and the upper and lower ends of the main body 1 are provided with a semiconductor device. The semiconductor device loading tray 11 for loading into the test processing apparatuses 10 and the semiconductor device unloading tray 14 for unloading the semiconductor device from the test processing apparatuses 10 are disposed. In addition, a sorting unit 17 having a tray (not shown) for a DC test failure device and a tray (not shown) for a burn-in test failure device is disposed on side surfaces of the test processing apparatuses 10 described above.

At this time, the worker frequently moves to the front and left and right sides of the system to detect the transfer state of the semiconductor device from time to time.

However, there are some significant problems with conventional semiconductor device insertion / insertion systems that perform this function.

First, as described above, the conventional test apparatuses cross and form vertically with respect to the detachment and insertion direction of the burn-in test board, and the trays for loading and unloading the semiconductor device into these test apparatuses are provided at the upper and lower ends of the main body. Since the operator is required to move and observe the entire system from time to time in order to detect the state of the semiconductor device, there is a serious problem that the operator's work line is lengthened and the overall work efficiency is drastically reduced.

Second, as described above, the conventional conveying devices are driven simultaneously in the same direction by one drive shaft, and when a part of the conveying device needs to stop its operation, a plurality of other devices are also At the same time, by stopping the operation, there is a serious problem that the overall test time increases, and as a result, the productivity of the system is drastically reduced.

Accordingly, an object of the present invention is to form an arrangement of test devices horizontally with respect to the detachment and insertion direction of the burn-in test board to secure a predetermined free space on the main body, and to provide a semiconductor device on one surface of the free space thus secured. By providing trays that can be loaded and unloaded, there is provided a semiconductor device transfer / insertion system and a method of semiconductor device transfer / insertion through which the operator can quickly detect the state of the device without having to look around the system as a whole. .

It is another object of the present invention to separate and form the drive shaft of some of the above-mentioned transfer apparatuses with the drive shaft of the other transfer apparatus, thereby eliminating the collective drive system of the transfer apparatus, thereby causing an abnormality in some apparatus Nevertheless, other apparatuses provide a semiconductor device insertion / insertion system and a method of inserting and / or inserting a semiconductor device through which a predetermined operation can be continued.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a sectional view schematically showing the main part of a conventional semiconductor device tooth insertion system.

2 is a conceptual diagram schematically showing a configuration of a conventional semiconductor device tooth / insert system;

3 is a conceptual diagram schematically showing a configuration of a semiconductor device tooth insertion / insertion system according to the present invention;

4 is a cross-sectional view schematically showing the main part of a semiconductor device tooth insertion system according to the present invention;

5 is a plan view of FIG. 4.

6 is a flowchart sequentially illustrating a semiconductor device insertion / insertion method according to the present invention.

The present invention for achieving the above object is a plurality of test processing apparatus which is installed in a line on the upper surface of the main body and the main body and testing the semiconductor device supplied to the main body and then separating the semiconductor device into a predetermined type And a burn-in test board which transfers the semiconductor device to the burn-in chamber while being removed and inserted into the lower surface of the main body, wherein the test processing apparatus comprises: an exit direction of the burn-in test board; It is characterized in that it is installed in the same direction as the insertion direction.

Preferably, the adjacent portions of the test processing apparatus further includes a plurality of transfer devices driven by a predetermined drive shaft to transfer the semiconductor device to each device, wherein the transfer devices are driven by individual drive shafts. do.

Preferably, the transfer apparatuses are disposed in the vicinity of the test processing apparatuses while being supported on a predetermined first driving shaft to transfer the semiconductor device from each of the test processing apparatuses and the burn-in test board. and; And second transfer parts disposed at both side ends of the first driving parts while being supported by a second driving shaft separated from the first driving shaft to load or unload the semiconductor device into the main body.

Preferably, the second transfer unit comprises: a first turntable for loading the semiconductor device into the main body so that the semiconductor device can be subjected to the test through the test processing apparatuses and the burn-in test board; And a second turntable for unloading the semiconductor device on which the test is completed through the test processing devices and the burn-in test board from the main body.

Preferably, the first turntable and the second turntable are driven by a CAM.

Preferably, the main body is characterized in that the observation hole for observing the burn-in test board is formed.

In addition, the present invention for achieving the above object comprises a first step of determining whether the semiconductor device is in a dual state after loading the semiconductor device on a first turntable; A second step of, if the semiconductor device is in a dual state, after rotating the first turntable, transferring the semiconductor device to a DC test socket to perform a DC test; A third step of burn-in testing the semiconductor device which has been judged good quality through the DC test through a burn-in test board, and then transferring the semiconductor device to a second turntable; A fourth step of determining the burn-in test result and unloading the semiconductor device to the outside by first rotating the second turntable when the semiconductor device is a good semiconductor device; And determining a result of the burn-in test, and if the semiconductor device is not a good semiconductor device, a fifth step of rotating the second turntable to transfer the semiconductor device to a tray for a burn-in test failure device. do.

Accordingly, in the present invention, the device test time can be reduced, and the work efficiency of the worker can be significantly improved.

Hereinafter, a semiconductor device transfer / insertion system and a semiconductor device transfer / insertion method through the same will be described in detail with reference to the accompanying drawings.

3 is a conceptual diagram schematically showing a semiconductor device insertion / insertion system according to the present invention.

As shown, the test processing apparatuses 10 according to the present invention are installed in the same direction as the detachment direction and the insertion direction of the burn-in test board 22.

In this case, according to a feature of the present invention, a part of the main body 1 is provided with an observation hole A for observing the burn-in test board 22 which is separated and inserted into the lower end of the main body 1, and further, a test processing apparatus. The loading and unloading trays 11 and 14 which are in the same direction as the installation direction of the test processing apparatuses 10 are installed on the side portions of the parts 10.

In the case of the present invention as described above, the operator properly observes the progress of the semiconductor device proceeding from the lower end of the main body 1 through the above-described observation hole A, and the loading and left and right sides of the main body are installed. The unloading trays 11 and 14 enable proper observation and operation of semiconductor device insertion / insertion operations while maintaining a short working line.

In the related art, since the test processing apparatuses 10 intersect and form perpendicularly to the detachment / insertion direction of the burn-in test board 22, it is not possible to provide a constant free space in the main body 1, and thus, the main body 1 It was not possible to batch-load and unload the loading and unloading trays 11 and 14 on the front left and right sides of the vehicle. As a result, the worker had to detect the process progress status of the semiconductor device advancing in the main body 1, moving forward and backward, left and right around an apparatus.

However, in the case of the present invention, the test processing apparatuses 10 are formed in the same direction as the detachment / insertion direction of the burn-in test board 22 as described above, thereby ensuring a certain clearance in the main body 1, Accordingly, the observation hole A may be disposed on the side of the main body 1, and the loading and unloading trays 11 and 14 may be disposed on the front left and right sides of the main body 1. As a result, the operator can properly detect and operate the process progress status of the semiconductor device through the above-described observation holes A and the trays 11 and 14 while moving a small distance.

In particular, in a state in which the semiconductor device tooth insertion system is configured in the form of the present invention described above, when the layout of each tooth insertion system cell arranged in the production line is taken in a lattice as shown in FIG. The abnormality of each system cell having a lattice layout can be properly detected within a short time.

At this time, according to a feature of the present invention, adjacent to the test processing device 10 further includes a plurality of transfer devices driven by a predetermined drive shaft to transfer the semiconductor device to each device, some of these transfer devices Is driven by an individual drive shaft. Figure 4 schematically shows the shape of the transfer device of the present invention, Figure 5 schematically shows a second transfer portion of the present invention to be described later.

4 and 5, the transfer apparatuses of the present invention are disposed adjacent to the test processing apparatuses 10 while being supported by the first drive shaft 102 to test processing apparatuses 10 and burn-in test. The first transfer units 103 for transferring semiconductor devices from each of the boards 22 and the second drive shafts 100a and 101a separated from the first drive shafts 102 are supported by the first drive units 103. And second transfer parts 100 and 101 disposed at both side ends to load or unload the semiconductor device into the main body 1.

In this case, the second transfer units 100 and 101 may load the semiconductor device into the main body 1 so that the semiconductor device may be tested through the test processing apparatuses 10 and the burn-in test board 22. And a second turntable 101b for unloading the semiconductor device, which has been tested through the test processing apparatuses 10 and the burn-in test board 22, from the main body 1.

In the case of the present invention, the first conveying devices 103 and the second conveying devices (100, 101) are driven by a separate drive shaft, so that even if any part of the conveying device is abnormal, other conveying devices are not affected The operation can continue.

At this time, according to the feature of the present invention, the first turntable 100b and the second turntable 101b are driven by the CAM.

Typically, the CAM is known as a device that provides good rotational motion, so that the first turntable 100b and the second turntable 101b of the present invention can be connected to such a CAM, so that an appropriate rotational motion can be obtained.

Meanwhile, FIG. 6 sequentially illustrates a semiconductor device insertion / insertion method through the semiconductor device insertion / insertion system of the present invention.

As shown in the drawing, in the method of inserting / inserting a semiconductor device of the present invention, a first step of determining whether a loaded semiconductor device is in a dual state after loading the semiconductor device into the loading tray 11 of the first turntable 100b (S10). And, if the semiconductor device is in the dual state, the second step S20 of rotating the first turntable 100b and then transferring the semiconductor device to the DC test socket part 12 to proceed with the DC test; After the burn-in test of the semiconductor device having a good quality determination through the DC test through the burn-in test board 22, a third step S30 of transferring the unloading tray 14 of the second turntable 101b and Determining the burn-in test result, and if the semiconductor device is a good semiconductor device, a fourth step S40 of unloading the semiconductor device to the outside by rotating the second turntable 101b for the first time, and the burn-in test result Determining that the semiconductor device is not a good semiconductor device, a second step (S50) of rotating the second turntable 101b to transfer the semiconductor device to the burn-in test failure device tray.

Hereinafter, the semiconductor device transfer / insertion method of the present invention will be described in detail.

First, when the semiconductor device to be tested is loaded into the loading tray 11 of the first turntable 100b in the first step S10 of the present invention, the first turntable 100b is based on a preset program. In operation S11 and S12, it is determined whether the loaded semiconductor device is in a dual state.

As a result of this determination, when the loaded semiconductor device is not in a dual state, for example, when there is only one semiconductor device mounted in the loading tray 11, the first turntable 100b stops the operation, and the other semiconductor device is Wait for mounting on the loading tray 11.

However, as a result of this determination, when the loaded semiconductor device is in the dual state, the first turntable 100b is driven to proceed to the second step S20 of the present invention.

In this case, as described above, since the first transfer apparatuses 103 of the present invention are driven through a separate drive shaft different from the first turntable 100b, the first transfer apparatuses 103 may be driven by the first turntable 100b. Even if you stop the operation, you can maintain your own movement without any effect.

Meanwhile, in the second step S20 of the present invention, the first turntable 100b is rotated at a predetermined angle through the above-described CAM while the semiconductor device is mounted on the loading tray 11 to thereby adjoin the main body 1. (S21)

At this time, the first transfer device 103 handles the semiconductor device and transfers it to the DC part socket part 12. In this state, the above-described semiconductor device is tested for DC characteristics (S22).

Subsequently, in the third step S30 of the present invention, the semiconductor device having the defective result as a result of the DC test is transferred to the tray for the defective DC test device by the first transfer device 103 (S34).

However, as a result of this DC test, the semiconductor device having good quality judgment is transferred to the burn-in test board 22 after passing through the through hole 2 by the first transfer device 103. In this state, the semiconductor device is tested for burn-in characteristics through a burn-in chamber (not shown) (S32).

Subsequently, the first transfer device 103 transfers the burn-in tested semiconductor device to the unloading tray 14 of the second turntable 101b. (S33)

Subsequently, a fourth step S40 of the present invention proceeds.

First, the second turntable 101b determines the quantity or defect of the semiconductor device transferred through the data input from the controller (not shown) of the burn-in chamber described above (S41).

As a result of this determination, when the transferred semiconductor device is determined to be a good device, the second turntable 101b rotates to the unloading area B through the above-described CAM to unload the semiconductor device after the test is completed to the outside. Thereby, the good semiconductor device which passed the burn-in test is suitably separated. (S42, S43)

However, if it is determined that the transferred semiconductor device is a defective device, as a fifth step of the present invention, the second turntable 101b is rotated to the discharge area C through the above-described CAM and the test is finished. The used semiconductor device is transferred to a burn-in test failure device tray (not shown). As a result, the defective semiconductor device that failed in the burn-in test is properly separated and discarded.

As described above, in the present invention, the arrangement of the test apparatuses is formed in the same direction as the detachment / insertion direction of the burn-in test board, thereby achieving convenient system management.

In addition, in the present invention, by separately forming the drive shaft of the transfer apparatus, it is possible to exclude the interference between each transfer apparatus, as a result, it is possible to improve the overall semiconductor device test time.

This invention is not limited to only the above-described semiconductor device tooth insertion / insertion system, but has a useful effect throughout all semiconductor installations using conventional transfer devices.

And while certain embodiments of the invention have been described and illustrated, it will be apparent that the invention may be embodied in various modifications by those skilled in the art.

Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

As described in detail above, in the semiconductor device insertion / insertion system and the semiconductor device insertion / insertion method thereof according to the present invention, the arrangement of test devices is arranged horizontally with respect to the detachment / insertion direction of the burn-in test board, By separating and forming the drive shafts of the conveying devices, first, the operator can quickly detect the state of the device without having to look around the system as a whole. Second, even if some of the conveying devices fail, the other conveying devices are independent of this. The predetermined operation can be continued.

Claims (7)

A plurality of test processing apparatuses arranged in a line on an upper surface of the main body and testing the semiconductor devices supplied to the main body, and then separating the semiconductor device into a predetermined type; 12. A semiconductor device insertion / insertion system comprising a burn-in test board inserted and transferring the semiconductor device to a burn-in chamber, And the test processing apparatuses are installed in the same direction as the detachment direction and the insertion direction of the burn-in test board. The apparatus of claim 1, further comprising a plurality of transfer devices driven by a predetermined drive shaft to transfer the semiconductor device to each device, wherein the transfer devices are driven by individual drive shafts. A semiconductor device tooth / insert system, characterized in that. 3. The apparatus of claim 2, wherein the transfer devices are disposed adjacent to the test processing devices while being supported on a predetermined first drive shaft to transfer the semiconductor device from each of the test processing devices and the burn-in test board. 1 transfer section; And second transfer parts disposed at both side ends of the first driving parts while being supported by a second driving shaft separated from the first driving shaft to load or unload the semiconductor device into the main body. This / insert system. 4. The apparatus of claim 3, wherein the second transfer parts comprise: a first turntable for loading the semiconductor device into the main body so that the semiconductor device can be subjected to the test through the test processing apparatuses and the burn-in test board; And a second turntable for unloading the tested semiconductor device from the main body through the test processing apparatuses and the burn-in test board. 5. The semiconductor device insert / insert system of claim 4, wherein the first turntable and the second turntable are driven by a CAM. The semiconductor device tooth insertion / insertion system according to claim 1, wherein an observation hole for observing the burn-in test board is formed in the main body. Determining whether the semiconductor device is in a dual state after loading the semiconductor device to a first turntable; A second step of, if the semiconductor device is in a dual state, after rotating the first turntable, transferring the semiconductor device to a DC test socket to perform a DC test; A third step of burn-in testing the semiconductor device, which has been judged good quality through the DC test, through a burn-in test board, and then shooting through a shooting table and transferring the semiconductor device to a second turntable; A fourth step of determining the burn-in test result and unloading the semiconductor device by rotating the second turntable first if the semiconductor device is a good semiconductor device; And determining a result of the burn-in test, and if the semiconductor device is not a good semiconductor device, a fifth step of rotating the second turntable to transfer the semiconductor device to a tray for a burn-in test failure device. Semiconductor device transfer / insertion method