KR19990003574A - Liquid Crystal Display Module and Manufacturing Method Thereof - Google Patents

Abstract

The present invention relates to a liquid crystal display module that can shorten the working time and improve the yield.

The present invention includes an upper and lower substrate, a liquid crystal panel including a driving pin for driving the conductive wire of the lower substrate, a printed circuit board for supplying an electrical signal to the liquid crystal panel, the driving pin of the liquid crystal panel and A taper package which electrically bonds a printed circuit board and has a drive IC (tape carrer package), a dispensing unit formed on a portion where the TCP and the driving pin are bonded, and a portion formed on an upper portion of the liquid crystal panel of the TCP. And a cushioning material, wherein the cushioning material is made of the same material as the dispensing unit.

Description

Liquid Crystal Display Module and Manufacturing Method Thereof

TECHNICAL FIELD The present invention relates to a liquid crystal display module, and more particularly, to a liquid crystal display module capable of shortening working time and improving yield.

Generally, a voltage is applied to a liquid crystal display module in which a lower substrate in which pixels are arranged in a matrix, an upper substrate in which a color filter is formed, and a liquid crystal panel having a liquid crystal interposed therebetween, and one of the pixel arrays in the matrix And a drive IC for supplying a signal for driving the liquid crystal. The drive IC and the liquid crystal panel are connected and bonded. The module mounting is referred to as forming a device by integrating a drive IC, a control circuit for controlling a liquid crystal panel and a drive IC, a bus line or a backlight.

The most important technology among these module mounting technologies is the technology of joining a liquid crystal panel and a drive IC. Here, the technology for bonding the liquid crystal panel and the drive IC includes a technology using a tape carrier package (TCP), tape automated bonding (TAB), chip glass (COG), and the like.

Here, a conventional method of bonding a liquid crystal panel and a drive IC using TCP will be described.

Referring to FIG. 1, a TFT (thin film transistor) (not shown) and a lower substrate 1a in which pixel electrodes are arranged in a matrix form and an upper substrate 1b in which a color filter is formed are disposed between liquid crystals. The liquid crystal panel 1 bonded together is prepared. Here, as is known, the upper substrate 1b has a smaller size than the lower substrate 1a, and the individual gate lines and the data lines formed on the lower substrate 1a are driven at the edges of the lower substrate 1a. Drive pins (not shown) for exposing are exposed.

On the other hand, at a position spaced apart from the liquid crystal panel 1 by a predetermined distance, a printed circuit board (PCB, 2a) for applying an electrical signal to a gate line, and data for applying an electrical signal to a data line PCB 2b is provided.

The driving pins of the PCBs 2a and 2b and the lower substrate 1a are connected by the TCP 3. The TCP (3) is equipped with a drive IC (3a), the TCP (3) is provided with a plurality of leads (not shown) on both sides, one pin is bonded to the drive pin of the liquid crystal panel (1) The other pin is bonded to the PCBs 2a and 2b. Here, the driving pins of the liquid crystal panel 1 and the leads of the TCP 3 are electrically bonded by, for example, an anisotropic conductive film (ACF), which is an anisotropic conductive film, and the PCBs (2a, b) and the TCP (3). The lead of is bonded by soldering.

Here, a short process is prevented from occurring in a subsequent process on a portion where the driving pin of the liquid crystal panel 1 and the lead of the TCP 3 are in contact with each other, and the reliability of the liquid crystal module, that is, the lead of the liquid crystal panel and the liquid crystal panel In order to prevent deterioration of contact characteristics with the driving pin of (1), silicon dispensing is formed on the portion where the driving pin of the liquid crystal panel 1 and the lead of the TCP 3 are in contact with each other. This silicon dispensing 4 is discharged in place by a predetermined amount through the nozzle of the apparatus in which the liquid silicon is contained, and then hardened for a predetermined time and formed.

In addition, in order to maintain a predetermined gap between the bezel, that is, the portion used as a cap of the liquid crystal module and the TCP 3, on the lower substrate la of the liquid crystal panel 1 of the TCP 3. A buffer member 5 is formed on the laid portion and the edge portion of the lower substrate la. At this time, as a buffer material, the silicone rubber in which the adhesive agent was formed in both surfaces is used, and this buffer material is a part which a worker puts on the lower board | substrate 1a of the liquid crystal panel 1 of TCP3 by hand, and a lower board | substrate ( It forms on the edge part of 1a).

FIG. 2 is a cross-sectional view of FIG. 1 taken along the line II-II ', wherein the liquid crystal panel 1 and the gate PCB 2a are connected by a TCP 3 equipped with a drive IC 3a, and the liquid crystal exposed. Silicon dispensing 4 is formed on the lower substrate 1a of the panel 1. In the upper portion of the TCP 3 on the lower substrate 1a, that is, the portion mounted on the lower substrate 1a, a buffer 5 made of silicon rubber is formed.

However, according to the prior art as described above, the technique of bonding the drive IC and the liquid crystal panel has the following problems due to the formation of the buffer material.

First, since the cushioning material is made of silicone rubber, since a separate forming process is performed, there is a problem in that the working time is long.

Secondly, the cushioning material is provided with an adhesive up and down like a double-sided tape, and is placed on the lower substrate 1a of the liquid crystal panel 1 of the TCP 3 and on the edge portion of the lower substrate 1a. By bonding by the manual work of the process person, a problem occurs that static electricity is generated.

Third, there is also a problem that the defective rate is high and the yield is lowered by forming the buffer material by manual work of a person.

Accordingly, an object of the present invention is to form a buffer material made of a silicon dispensing material, to reduce the process step, while forming by the equipment, such as silicon dispensing, a liquid crystal display module and a manufacturing that can prevent the decrease in static electricity and yield It is an object to provide a method.

1 is a plan view of a liquid crystal display module according to the prior art,

FIG. 2 is a cross-sectional view taken along line II-II ′ of FIG. 1;

3 is a plan view of a liquid crystal display module according to the present invention;

FIG. 4 is a cross-sectional view of FIG. 3 taken along the line IV-IV '.

* Explanation of symbols for main parts of the drawings

1: liquid crystal panel 2: printed circuit board

3: TCP 4: Dispensing

5, 50: cushioning material

In order to achieve the above object of the present invention, the present invention, the liquid crystal panel comprising an upper and lower substrate, including a driving pin for driving the conductive wire of the lower substrate, for supplying an electrical signal to the liquid crystal panel A printed circuit board, a drive pin of the liquid crystal panel and a printed circuit board electrically bonded to each other, a TCP (tape carrer package) equipped with a drive IC, a dispensing unit formed on the portion bonded to the ICP and the drive pin, the TCP A buffer material is formed on a portion placed on the upper portion of the liquid crystal panel, wherein the buffer material is characterized in that the same material as the dispensing unit.

Here, the dispensing unit and the buffer material are made of a silicon material.

In another aspect, the present invention, the liquid crystal panel and the printed circuit board for supplying an electrical signal to the liquid crystal panel is electrically connected to each other by TCP, forming a dispensing unit in the connection portion between the TCP and the liquid crystal panel, the liquid crystal panel of the TCP A method of manufacturing a liquid crystal display module for forming a buffer material on an upper portion of the liquid crystal display module, wherein the dispensing part and the buffer material are formed by curing a liquid silicone material for a predetermined time in the same equipment.

According to the present invention, in order to maintain a predetermined gap between the TCP and the liquid crystal display module cap, the buffer material is formed of the same material as that of silicon dispensing, and the process steps are reduced while forming by means of equipment such as silicon dispensing. Prevents static electricity and yield deterioration,

EXAMPLE

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a plan view of the liquid crystal display module according to the present invention, and FIG. 4 is a cross-sectional view taken along the line IV-IV 'of FIG. 3. For reference, in describing the configuration of the present embodiment, the same reference numerals are given to the same parts as those of the conventional technology described at the beginning of the specification.

First, referring to FIG. 3, as described in the related art, a lower substrate 1a including a plurality of gate lines, data lines, TFTs, and pixel electrodes, and an upper substrate 1b including a color filter are included. The liquid crystal panel 1 is prepared, and driving pins (not shown) for driving a plurality of gate lines and data lines are provided at the edges of the lower substrate of the liquid crystal panel 1, and these driving pins It is exposed to the outside.

On the other hand, at a position spaced apart from the liquid crystal panel 1 by a predetermined distance, a gate PCB 2a for applying an electrical signal to the gate line and a data PCB 2b for applying an electrical signal to the data line are provided.

The driving pins of the PCBs 2a and 2b and the lower substrate 1a are mounted with a drive IC 3a and connected by TCP 3 with leads on both sides thereof. Here, one pin of the TCP (3) is bonded to the driving pin of the liquid crystal panel 1, the other pin is bonded to the PCB (2a, 2b). Here, the driving pins of the liquid crystal panel 1 and the leads of the TCP 3 are electrically bonded by, for example, ACF, which is an anisotropic conductive film, and the leads of the PCBs 2a and 2b and the TCP 3 are soldered. Is bonded.

Here, the short circuit is prevented from occurring in a later step on the part where the driving pin of the liquid crystal panel 1 and the lead of the TCP 3 are in contact with each other, and the reliability of the liquid crystal module, that is, the lead of the TCP 3 and the liquid crystal panel ( In order to prevent deterioration of contact characteristics with the driving pin of 1), silicon dispensing 4 is formed on the upper portion of the liquid crystal panel 1 to which the driving pin and the lead of the TCP 3 are bonded.

In addition, in order to maintain a predetermined gap between the bezel, that is, the cap used for the liquid crystal module and the TCP 3, the lower substrate 1a of the liquid crystal panel 1 of the TCP 3 is maintained. The buffer material 5 is formed on the part placed and the edge part of the lower board | substrate 1a. In this case, the buffer material 5 according to the embodiment of the present invention is formed of the same material as the silicon dispensing 4.

FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3, wherein the liquid crystal panel 1 and the gate PCB 2a including the lower substrate 1a and the upper substrate 1b are spaced apart by a predetermined interval. The liquid crystal panel 1 and the gate PCB 2a are connected by a TCP 3 equipped with a drive IC 3a. Preferably, the TCP 3 is connected to the driving pins of the lower substrate 1a and the gate PCB 2a. In addition, a short prevention silicon dispensing 4 is formed on the exposed portion of the lower substrate 1a. This silicon dispensing 4 hardens liquid silicone and is formed.

Thereafter, the buffer material 50 according to the present invention is formed in the same manner as the method of forming the silicon dispensing 4 on the portion of the TCP 3 on the lower substrate 1a. Here, the silicon used as the buffer material 50 may have a different silicon concentration than the silicon dispensing 4. At this time, the equipment for discharging the shock absorbing material 50 and the silicon dispensing (4), it is necessary to discharge the two liquid silicon of different concentration, it is provided with at least one nozzle. Since the buffer material 50 and the silicon dispensing 4 are formed in the same equipment, the process time is reduced, and the buffer material 50 is formed in the same equipment, thereby minimizing static electricity and defective rate by manual labor.

As described in detail above, according to the present invention, there is an advantage of reducing the manufacturing process time by forming a buffer that serves as a buffer between TCP and the cap of the liquid crystal display module with the same equipment and the same material as silicon dispensing. .

In addition, since the cushioning material is formed by the equipment, it prevents the static electricity by manual operation, while preventing the yield decrease according to the defective rate.

In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

Claims (5)

A liquid crystal panel including upper and lower substrates, including a driving pin for driving the conductive wire of the lower substrate, a printed circuit board for supplying an electrical signal to the liquid crystal panel, driving pins of the liquid crystal panel, and a printed circuit board And a dispensing unit formed on the T.C.P, the T.C.P and the driving pin bonded to each other, wherein the T.C.P and the driving pin are bonded to each other. And a cushioning material formed on the placed portion, wherein the buffering material is made of the same material as the dispensing unit. The liquid crystal display module of claim 1, wherein the dispensing unit and the buffer material are made of a silicon material. The liquid crystal display module according to claim 1 or 2, wherein the dispensing unit and the buffer material are silicon materials having different concentrations. A liquid crystal panel and a printed circuit board for supplying an electrical signal to the liquid crystal panel are electrically connected by T.C.P, and a dispensing unit is formed at a portion where the T.C.P and the liquid crystal panel are connected. A manufacturing method of a liquid crystal display module for forming a buffer material in an upper portion of a liquid crystal panel among C, wherein the dispensing part and the buffer material are continuously formed in the same equipment, and the dispensing part and the buffer material are liquid silicone. A method of manufacturing a liquid crystal display module, wherein the material is cured for a predetermined time. The method of claim 4, wherein the silicon forming the dispensing unit and the silicon forming the buffer material have different concentrations.