KR19990002509U - IC socket structure - Google Patents

Abstract

The present invention relates to an IC socket structure, wherein the fitting grooves are formed to fit a plurality of contacts, respectively, and are integrally formed by vertically extending inwardly from the bottom surface of the one side beam and the other beam, and parallelly spaced apart from each other. In the IC socket structure comprising a bottom beam, and a body portion consisting of a guide side plate extending in a direction facing each other from each side of the upper end of the one side beam and the other side beam to induce the IC seating, wherein the body portion, Since the IC is provided with a guide surface formed by cutting at a predetermined angle on the upper edge surface of the guide side plate so as to be guided and seated without jamming the plurality of contacts inserted into the fitting grooves of the one side beam and the other side beam. When the surface is in contact with the guide surface is naturally inserted to perform the testing function of the IC There is an excellent effect that significantly lowers the defective rate that can be generated in the productivity.

Description

IC socket structure

The present invention relates to the structure of the IC socket, and in particular, the upper edge of the guide side plate so that the IC can be accurately seated in the contacts fitted in the plurality of fitting grooves formed in one beam and the other beam disposed in both rows of the IC socket body portion, respectively It is related with the structure of the IC socket cut inclinedly.

An IC socket that is generally used will be described with reference to FIG. 1 as follows.

Fig. 1 is an exploded perspective view including an IC representing an IC socket according to the prior art, in which reference numeral 100 designates an IC socket and 200 designates an IC.

As shown in FIG. 1, the general IC socket 100 includes a body portion 10 in which fitting grooves 11a and 12a into which a plurality of contacts 30a and 30b are fitted, and the fitting groove ( 11a) and a cover 20 coupled to the upper portion of the body portion 10 to protect the plurality of contacts 30a and 30b fitted to the 12a and 12a, and the contact of the IC socket 100 The IC 200 is seated at 30a) and 30b to undergo a predetermined testing process.

At this time, the body portion 10 of the IC socket 100 on which the IC 200 is seated and tested is formed with a plurality of fitting grooves 11a so that the first group (approximately 22) of the contacts 30a are fitted. One side beam 11 and the other side beam 12 in which a plurality of fitting grooves 12a are formed so as to be spaced apart in parallel to the one side beam 11 to fit the second group (the other 22) contacts 30b; The bottom beam 13 which is vertically extended inwardly from the bottom of the one side beam 11 and the other side beam 12 and integrally formed, and the direction facing each other from each side of the upper end of the one side beam 11 and the other side beam 12. Extends to the guide side plate 14 to induce the seating of the IC 200.

Referring to the assembly operation of the IC socket 100 according to the prior art made of the above configuration.

First, a first group including 22 contacts 30a and 30b in a plurality of fitting grooves 11a and 12a formed on one beam 11 and the other beam 12 of the body part 10, respectively. And a second group of contacts 30a and 30b, and then mount an adapter (not shown) on the bottom beam 13 of the body portion 10. Then, the cover 20 is coupled to the upper portion of the body portion 10 to complete the assembly.

On the other hand, the plurality of ICs 200 transferred by a conveyor are sequentially transported by a vacuum adsorber and placed on the IC socket 100, where the IC 200 is preferably an IC socket ( Only a precise fit of the contact 30a, 30b of the 100 can achieve a predetermined testing process.

However, the IC socket according to the prior art guides the IC socket body in the process of seating each corner portion of the IC when the plurality of ICs transferred by the conveyor are sequentially transferred onto the IC socket using a vacuum adsorber. Since the side plate is frequently caught, there is a big disadvantage that the IC is seated in the contact of the IC socket with a predetermined inclination, and thus the test of the normal IC cannot be achieved.

Accordingly, the present invention has been made to solve the above problems, the purpose of which is that the IC is correctly seated in a contact fitted in a plurality of fitting grooves each formed in one beam and the other beam disposed in both columns of the IC socket body portion It is to provide an IC socket structure that can reduce the defect rate of the testing of the IC by cutting the upper edge of the guide side plate inclined so that it can be made.

1 is an exploded perspective view including an IC representing an IC socket according to the prior art

Figure 2 is a perspective view of the body portion and the cover of the combination of the IC socket according to the present invention

Explanation of symbols on the main parts of the drawings

10 body portion 11: one side beam

11a, 12a: fitting groove 12: the other side beam

13: bottom beam 14: guide side plate

14a: guide surface 20: cover

30a, 30b: Contact 100: IC socket

200: IC

The IC socket structure according to the present invention for achieving the above object is a vertical groove in the vertical direction from the bottom of the one side beam and the other beam, and the one side beam and the other side of the beam is formed in each of the fitting groove is formed so that a plurality of contacts are fitted; An IC socket structure comprising a bottom portion beam which is integrally formed and integrally formed, and a body portion configured to extend in a direction facing each other from each side surface of the upper end portion of the one side beam and the other side beam to guide the IC to be seated. The part is provided with a guide surface formed by cutting at a predetermined angle on the upper edge surface of the guide side plate so that the IC is guided and seated without jamming a plurality of contacts inserted into the fitting grooves of the one side beam and the other side beam.

Hereinafter, a preferred embodiment of the IC socket structure according to the present invention will be described with reference to FIG. 2.

2 is a perspective view of the body portion and the cover of the IC socket according to the present invention are combined.

As shown in FIG. 2, the IC socket structure according to the present invention includes a body portion 10 having a plurality of fitting grooves 11a and 12a into which a plurality of contacts 30a and 30b are fitted, and the fitting groove. The cover 20 is coupled to the body portion 10 so as to protect the plurality of contacts 30a and 30b fitted to the 11a and 12a.

At this time, the body portion 10 of the IC socket 100, the one side beam 11 is formed with a plurality of fitting grooves (11a) and the one side beam 11 so that the contact 30a of the first group can be fitted The other side beam 12 having a plurality of fitting grooves 12a formed so that the second group of contacts 30b are spaced in parallel to each other and the bottom surface of the one side beam 11 and the other side beam 12. A guide side plate extending in a direction facing each other from each side of an upper surface of the bottom beam 13 which is vertically extended and integrally formed, and upper ends of the one side beam 11 and the other side beam 12 ( 14).

At this time, the body portion 10, the IC 200 is a plurality of contacts (30a), (30b) fitted in the fitting groove (11a), (12a) of the one side beam 11 and the other side beam 12. Guide surface (14a) is formed to be cut at a predetermined angle on the upper edge surface of the guide side plate 14 to be guided and seated without being caught.

According to the IC socket 100 according to the present invention, a plurality of ICs 200 transferred by a conveyor may be sequentially transferred onto the IC socket 100 using a vacuum adsorber (not shown). When the IC socket 100 is in surface contact with the guide surface 14a cut to the upper edge of the guide side plate 14, it is naturally seated on the contacts 30a and 30b to perform a predetermined testing process. You can do it.

As described above, according to the IC socket structure according to the present invention, the upper side of the guide side plate so that the IC can be accurately seated in the contacts fitted in the plurality of fitting grooves formed in the one beam and the other beam disposed in both rows of the IC socket body portion, respectively By cutting the edges inclinedly, when the IC is seated, the surface contact with the guide surface naturally fits into the contact, thereby significantly lowering the defective rate that may occur in performing the IC's testing function. It has an excellent effect.

Claims (1)

Fitting grooves are formed to fit a plurality of contacts, respectively, and one side beam and the other beam spaced apart from each other in parallel with each other; In the IC socket structure comprising a body portion consisting of a guide side plate extending in a direction facing each other from each side of the upper end to induce the seating of the IC, The body portion is formed with a guide surface formed by cutting at a predetermined angle on the upper edge surface of the guide side plate so that the IC is guided and seated without jamming a plurality of contacts inserted into the fitting grooves of the one side beam and the other side beam. IC socket structure characterized.