KR19980062975U - Tube heater - Google Patents
Tube heater Download PDFInfo
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- KR19980062975U KR19980062975U KR2019970007402U KR19970007402U KR19980062975U KR 19980062975 U KR19980062975 U KR 19980062975U KR 2019970007402 U KR2019970007402 U KR 2019970007402U KR 19970007402 U KR19970007402 U KR 19970007402U KR 19980062975 U KR19980062975 U KR 19980062975U
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- Prior art keywords
- processing liquid
- tube
- rotating plate
- groove
- processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 고안은 튜브 내부에 흐르는 처리액의 온도를 일정하게 유지시키어 주는 튜브 가열장치에 관한 것으로, 상단과 하단이 튜브에 연결설치되어 내부에 처리액이 흐르며, 하부에 홈이 형성되는 몸체와, 몸체 내부에 설치되며, 하부에 형성된 돌기가 상기 홈에 삽입되어 처리액이 표면을 따라 흐르면서 회전되는 회전판과, 몸체 가장 자리에 설치되어 처리액을 가열시키는 가열부로 구비되어서, 몸체 내로 유입된 처리액이 회전판 표면을 따라 흐르면서 회전판이 회전됨에 따라 처리액의 유속이 제어된 것이 특징이다.The present invention relates to a tube heating device that maintains a constant temperature of the processing liquid flowing in the tube, the upper and lower ends are connected to the tube and the processing liquid flows inside, the body is formed in the lower groove, the body It is installed inside, the projection formed in the lower portion is inserted into the groove is rotated while rotating the processing liquid flows along the surface, and is provided with a heating unit installed in the edge of the body to heat the processing liquid, the processing liquid introduced into the body The flow rate of the processing liquid is controlled as the rotating plate rotates while flowing along the surface of the rotating plate.
Description
본 고안은 반도체 제조 장비인 웹스테이션에 사용되는 튜브 가열장치에 관한 것으로, 특히 웨이퍼를 세정하는 처리조 내로 처리액 공급시에 처리액의 원활한 순환공급 및 적정온도유지에 적당한 튜브 가열장치에 관한 것이다.The present invention relates to a tube heating apparatus used for a web station, a semiconductor manufacturing equipment, and more particularly, to a tube heating apparatus suitable for smooth circulation of a processing liquid and proper temperature maintenance when the processing liquid is supplied into a processing tank for cleaning a wafer. .
일반적으로, 웹스테이션은 처리조 내로 공급된 처리액이 유지되어 웨이퍼와 웨이퍼 사이로 공급되면서 세정공정이 진행을 진행시킨 후, 처리조 밖으로 배출되며, 배출된 처리액은 튜브를 통하여 처리조 내로 재공급된다.In general, the web station maintains the processing liquid supplied into the processing tank and is supplied between the wafer and the wafer, and the cleaning process proceeds, and then is discharged out of the processing tank, and the discharged processing liquid is supplied back into the processing tank through the tube. do.
이때, 튜브 내로 흐르는 처리액은 처리조 내에서 공정이 진행될 시 보다 그 온도가 크게 하강되므로 별도의 가열장치를 통하여 일정온도를 유지시켜 주어야 한다.At this time, the treatment liquid flowing into the tube has to be maintained at a constant temperature through a separate heating device because the temperature is significantly lower than when the process proceeds in the treatment tank.
도 1A는 일반적인 웹스테이션에서의 처리액의 순환흐름을 보인 도면이고, 도 1B는 종래기술에 따른 튜브 가열장치의 단면도다.1A is a view showing a circulating flow of a processing liquid in a general web station, and FIG. 1B is a sectional view of a tube heating apparatus according to the prior art.
이하, 첨부된 도면을 참조하여 설명하겠다.Hereinafter, with reference to the accompanying drawings will be described.
종래의 튜브 가열장치(a)는 도 1A와 도 1B와 같이, 상단 및 하단에 각각의 튜브(11-1)(11-2)가 연결설치된 처리액공급구(15) 및 처리액배출구(13)를 가지며 내부에 처리액이 흐르는 몸체(10)와, 몸체(10)내에 설치되어 처리액공급구(15)를 통해 공급되는 처리액이 표면을 따라 흐르도록 하는 흐름조절판(17)과, 몸체(10) 가장자리에 설치되어 처리액을 가열시키는 가열부(19)와, 몸체(10) 내의 처리액 온도를 감지하여 처리액이 적정온도로 유지되도록 가열부(19)를 제어하는 온도감지센서(21)로 구성된다.Conventional tube heating apparatus (a) is a processing liquid supply port 15 and the processing liquid discharge port 13, each tube 11-1, 11-2 is installed at the top and bottom, as shown in Figure 1A and 1B And a flow control plate 17 installed in the body 10 to allow the processing liquid supplied through the processing liquid supply port 15 to flow along the surface thereof. (10) a heating unit 19 installed at an edge to heat the processing liquid, and a temperature sensing sensor for controlling the heating unit 19 to sense the processing liquid temperature in the body 10 to maintain the processing liquid at an appropriate temperature ( 21).
상기에서, 흐름조절판(17)은 석영재질로 형성된다.In the above, the flow control plate 17 is formed of a quartz material.
도 1A를 참조하여 종래의 튜브 가열장치(a)를 갖는 웹스테이션 내에서 처리액이 가열 및 순환되는 과정을 살펴보면 다음과 같다.Referring to Figure 1A looks at the process of the process liquid is heated and circulated in the web station having a conventional tube heater (a) as follows.
처리조(20)의 하부를 통해 공급되는 처리액, 즉, 순수(DeIonzied Water)에 의해 희석된 H3PO4등의 세정용액을 150℃ 정도로 유지되도록 가열하면서 웨이퍼를 세정하는 공정이 진행된다. 이 때, 처리조(20) 상부에 설치된 순수공급관(도면에 도시되지 않음)을 통해 증발된 양만큼의 순수를 별도로 공급하여 준다.The process of cleaning the wafer while heating the cleaning solution such as H 3 PO 4 diluted with pure water (DeIonzied Water) to be maintained at about 150 ° C. is performed. At this time, through the pure water supply pipe (not shown in the figure) installed in the upper portion of the treatment tank 20 is supplied separately the amount of pure water.
이어서, 세정공정시 웨이퍼로부터 떨어진 반응 부산물 등의 이물질이 혼합된 처리액은 처리조(20)의 하부를 통해 연속해서 공급되는 처리액에 의해 오버플로워링(overflowing)된다. 그리고, 오버플로워링된 이물질이 혼합된 처리액은 튜브(11)를 통해 일방향으로 흐르면서 펌프(23)에 의해 펌핑되고 필터(25)에서 이물질이 필터링된다.Subsequently, the processing liquid mixed with foreign substances such as reaction by-products separated from the wafer during the cleaning process is overflowed by the processing liquid continuously supplied through the lower part of the processing tank 20. In addition, the treatment liquid mixed with the overflowed foreign matter is pumped by the pump 23 while flowing in one direction through the tube 11, and the foreign matter is filtered in the filter 25.
그리고, 튜브를 통해 흐르는 처리액의 손실된 열을 보상하기 위하여 처리액은 튜브가열장치(a)에서 일정온도로 가열된 후 처리조(20) 내로 재순환된다.Then, in order to compensate for the lost heat of the processing liquid flowing through the tube, the processing liquid is heated to a predetermined temperature in the tube heating apparatus (a) and then recycled into the processing tank 20.
이때, 튜브 가열장치(a)는 웹스테이션 내에서 공간 확보를 위해 수직으로 설치된다.At this time, the tube heater (a) is installed vertically to secure space in the web station.
튜브 가열장치(a)는 처리액이 튜브(11-2)로부터 처리액공급구(15)를 통하여 몸체(10) 내부로 공급시키며, 몸체(10) 내부로 공급된 처리액은 흐름조절판(17) 표면을 따라 흐르면서 처리액배출구(13)를 통해 상단에 연결된 튜브(11-1)내로 배출되도록 한다.Tube heating apparatus (a) is a processing liquid is supplied from the tube (11-2) through the processing liquid supply port 15 into the body 10, the processing liquid supplied into the body 10 is the flow control plate (17) Flow along the surface to be discharged into the tube (11-1) connected to the top through the treatment liquid outlet (13).
이때, 흐름조절판(17)은 처리액공급구(15)를 통해 유입되는 처리액이 처리액배출구(13)를 통해 보다 원활하게 배출되도록 처리액에 미치는 저항을 감소시키어 흐름속도 즉, 유속을 빠르게 한다.At this time, the flow control plate 17 reduces the resistance to the processing liquid so that the processing liquid introduced through the processing liquid supply port 15 is discharged more smoothly through the processing liquid discharge port 13, so that the flow rate, that is, the flow rate is increased. do.
그리고 몸체(10) 외부에는 가열부(19)가 설치되어져서 몸체(10) 내에 흐르는 처리액의 온도를 일정온도로 가열시키는 데, 이 가열부(19)는 온도감지센서(21)에 의해 제어되면서 처리액을 적정온도 범위까지만 상승시킨다.In addition, a heating unit 19 is installed outside the body 10 to heat the temperature of the processing liquid flowing in the body 10 to a predetermined temperature, which is controlled by the temperature sensor 21. While raising the treatment liquid only to the optimum temperature range.
이어서 처리액배출구(13)를 통해 상단의 튜브(11-1)로 유출된 처리액은 처리조(20) 내로 재순환된다.Subsequently, the processing liquid flowing out of the upper tube 11-1 through the processing liquid discharge port 13 is recycled into the processing tank 20.
그러나, 종래의 튜브 가열장치는 처리액을 처리조 내로 재순환 공급할 시, 단지 펌프의 펌핑력에만 영향을 의존하기 때문에 펌프 자체에 많은 무리가 따른다.However, the conventional tube heating apparatus has a great deal of pressure on the pump itself since it relies on only the pumping force of the pump when recirculating and supplying the treatment liquid into the treatment tank.
따라서 이를 보완하기 위해 처리조 밖으로 유출된 처리액을 흐름조절판 표면을 따라 흘려주지만 처리액 유속에 그다지 도움이 되지 못한다.Therefore, in order to compensate for this, the treatment liquid flowing out of the treatment tank flows along the surface of the flow control plate, but it does not help the treatment liquid flow rate very much.
또한, 공정 특성 상, 처리조 내의 처리액은 150℃ 이상의 온도를 유지하여야 하지만, 처리조 내로 공급하기 전에 처리액의 온도가 하강되어 그에 따른 열손실 및 처리액의 적정온도를 유지하기가 어려운 문제점이 발생된다.In addition, due to process characteristics, the treatment liquid in the treatment tank must maintain a temperature of 150 ° C. or higher, but the temperature of the treatment liquid is lowered before supplying it into the treatment tank, which makes it difficult to maintain the heat loss and the proper temperature of the treatment liquid. Is generated.
본 고안은 이러한 문제점을 해결하고자 안출된 것으로, 펌프의 무리를 주지 않으면서도 처리액의 유속을 빠르게 하여 열손실을 보상함으로써 처리액의 원활한 순환공급 및 처리액의 적정온도가 유지가능한 튜브 가열장치를 목적으로 한다.The present invention was devised to solve such a problem, and a tube heating apparatus capable of smoothly supplying the circulating fluid and maintaining the proper temperature of the treated liquid by compensating for the heat loss by accelerating the flow rate of the treated liquid without giving a pump. The purpose.
상기의 목적을 달성하고자, 본 고안은 튜브 내부로 흐르는 처리액의 온도를 일정하게 유지시키어 주는 튜브 가열장치에 관한 것으로, 상단과 하단이 튜브에 연결설치되어 내부에 처리액이 흐르며, 하부에 홈이 형성되는 몸체와, 몸체 내부에 설치되며, 하부에 형성된 돌기가 상기 홈에 삽입되어 처리액이 표면을 따라 흐르면서 회전되는 회전판과, 몸체 가장자리에 설치되어 처리액을 가열시키는 가열부로 구비되어서, 몸체 내로 유입된 처리액이 회전판 표면을 따라 흐르면서 회전판이 회전됨에 따라 처리액의 유속이 제어된 것이 특징이다.In order to achieve the above object, the present invention relates to a tube heating apparatus that maintains a constant temperature of the processing liquid flowing into the tube, the upper and lower ends are connected to the tube, the processing liquid flows inside, the groove at the bottom The body is formed, and the inside of the body, the projection formed in the lower portion is inserted into the groove is provided with a rotating plate rotated while the processing liquid flows along the surface, and the heating portion is installed on the body edge to heat the processing liquid, The flow rate of the processing liquid is controlled as the rotating plate rotates while the processing liquid introduced into the plate flows along the surface of the rotating plate.
이하, 첨부된 도면을 참조하여 본 고안의 튜브 가열장치를 설명하겠다.Hereinafter, with reference to the accompanying drawings will be described a tube heating apparatus of the present invention.
도 1A는 일반적인 웹스테이션에서의 처리액의 순환흐름도이고,Figure 1A is a flow chart of the processing liquid in a typical web station,
도 1B는 종래기술에 따른 튜브 가열장치의 단면도이다.1B is a sectional view of a tube heating apparatus according to the prior art.
도 2A는 본 고안의 튜브 가열장치를 갖는 웹스테이션에서의 처리액의 순환흐름도이고,Figure 2A is a flow chart of the processing liquid in the web station having a tube heating apparatus of the present invention,
도 2B는 본 고안에 따른 튜브 가열장치의 단면도이고,2B is a cross-sectional view of the tube heating apparatus according to the present invention,
도 2C는 도 2B의 부분확대도이다.2C is an enlarged partial view of FIG. 2B.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10, 110 : 몸체11, 11-1, 11-2, 111, 111-1, 111-2 : 튜브10, 110: body 11, 11-1, 11-2, 111, 111-1, 111-2: tube
20, 120 : 처리조13, 113 : 처리액공급구20, 120: treatment tank 13, 113: treatment liquid supply port
15, 115 : 처리액배출구17 : 흐름조절판15, 115: treatment liquid outlet 17: flow control plate
117 : 회전판23, 123 : 펌프117: rotating plate 23, 123: pump
25, 125 : 필터130 : 순수공급관25, 125: filter 130: pure water supply pipe
132 : 돌기134 : 홈132: protrusion 134: groove
도 2A는 일반적인 웹스테이션에서의 처리액의 순환흐름도이고, 도 2B는 종래기술에 따른 튜브 가열장치의 단면도이고, 도 2C는 도 2B의 부분확대도이다.FIG. 2A is a flow chart of the processing liquid in a typical web station, FIG. 2B is a sectional view of a tube heating apparatus according to the prior art, and FIG. 2C is a partially enlarged view of FIG. 2B.
본 고안의 튜브 가열장치는, 도 2A 내지 도 2C에 도시된 바와 같이, 상단 및 하단에 각각의 튜브(111-1)(111-2)에 연결설치된 처리액공급구(115) 및 처리액배출구(113)를 갖고, 하부에 홈(134)이 형성된 몸체(110)와, 몸체(110) 내부에 설치되며, 하부에 형성된 돌기(132)가 홈(134)에 삽입되어 처리액공급구(115)를 통해 처리액이 표면을 따라 흐르면서 회전되는 회전판(117)과, 몸체(110) 가장자리에 설치되어 처리액을 가열시키는 가열부(119)와, 몸체(110) 내의 처리액 온도를 감지하여 적정온도를 유지시키도록 가열부(119)를 제어하는 온도감지센서(121)로 구성된다.Tube heating apparatus of the present invention, as shown in Figures 2A to 2C, the processing liquid supply port 115 and the processing liquid discharge port is connected to the upper and lower ends of each tube (111-1) (111-2) It has a 113, the body 110, the groove 134 is formed at the bottom, and the body 110 is installed inside, the projection 132 formed at the bottom is inserted into the groove 134, the processing liquid supply port 115 Rotating plate 117 is rotated while the processing liquid flows along the surface through), the heating unit 119 is installed at the edge of the body 110 and heats the processing liquid, and senses the temperature of the processing liquid in the body 110. It is composed of a temperature sensor 121 to control the heating unit 119 to maintain the temperature.
이와같이 구성된 본 고안의 튜브 가열장치를 이용하여 웹스테이션 내에서 처리액이 가열 및 순환되는 과정을 살펴보면 다음과 같다.Looking at the process of the process liquid is heated and circulated in the web station using the tube heater of the present invention configured as described above are as follows.
도 2A와 같이, 순수에 의해 희석된 H3PO4등의 세정용액인 처리액을 처리조(120) 하부를 통해 공급시키며, 이때 처리액을 150℃ 정도의 일정온도를 유지하여 웨이퍼 세정공정을 진행시킨다.As shown in Figure 2A, sikimyeo supplying a processing liquid cleaning solution such as H 3 PO 4 is diluted by the pure water through a lower part of the processing tank (120), wherein the processing solution to maintain a constant temperature of about 150 ℃ the wafer cleaning process Proceed.
그리고 공정 진행 중에 증발된 순수 양 만큼 H3PO4용액을 별도의 순수공급관을 통해(도면에 도시하지 않음) 보충하여 준다.The H 3 PO 4 solution is replenished by a separate pure water supply pipe (not shown) as much as the amount of pure water evaporated during the process.
이어서 세정공정시 웨이퍼로부터 떨어진 반응 부산물 등의 이물질이 혼합된 처리액은 처리조(120)의 하부를 통해 연속해서 공급되는 처리액에 의해 오버플로워링된다. 그리고, 오버플로워링된 이물질이 혼합된 처리액은 튜브(111)를 통해 일방향으로 흐르면서 펌프(123)에 의해 펌핑되고 필터(125)에서 이물질이 필터링된다.Subsequently, the processing liquid mixed with foreign substances such as reaction by-products separated from the wafer during the cleaning process is overflowed by the processing liquid continuously supplied through the lower part of the processing tank 120. In addition, the treatment liquid in which the overflowed foreign matter is mixed is pumped by the pump 123 while flowing in one direction through the tube 111, and the foreign matter is filtered in the filter 125.
그리고, 튜브를 통해 흐르는 처리액의 손실된 열을 보상하기 위하여 처리액은 튜브 가열장치(b)에서 일정온도로 가열된 후 처리조(120) 내로 재순환된다.Then, in order to compensate for the lost heat of the processing liquid flowing through the tube, the processing liquid is heated to a predetermined temperature in the tube heating apparatus (b) and then recycled into the processing tank 120.
이때, 튜브 가열장치(b)는 웹스테이션 내에서 공간 확보를 위해 수직으로 설치된다.At this time, the tube heater (b) is installed vertically to secure space in the web station.
튜브 가열장치(b)는 처리액이 튜브(111-2)로부터 처리액공급구(115)를 통하여 몸체(110) 내부로 공급시키며, 몸체(110) 내부로 공급된 처리액은 회전판(117) 표면을 따라 흐르면서 처리액배출구(113)를 통해 상단에 연결된 튜브(111-1)내로 배출되도록 한다. 그리회 회전판(117)은 도 2B를 참조하면, 꽈배출형상으로 형성한다.Tube heating apparatus (b) is a processing liquid is supplied into the body 110 through the processing liquid supply port 115 from the tube 111-2, the processing liquid supplied into the body 110 is the rotating plate 117 While flowing along the surface to be discharged into the tube (111-1) connected to the top through the treatment liquid discharge port 113. Referring to Fig. 2B, the grey-rotating plate 117 is formed into a fin discharge shape.
이때, 회전판(117)은 석영재질로, 처리액공급구(115)를 통해 유입되는 일정압력을 갖는 처리액과의 마찰력으로 인하여 회전되며, 회전판(117)이 회전됨에 따라 돌기(132)가 홈(134) 내에서 회전된다.At this time, the rotating plate 117 is made of quartz, and is rotated due to the frictional force with the processing liquid having a predetermined pressure flowing through the processing liquid supply port 115, and the protrusion 132 is grooved as the rotating plate 117 is rotated. It is rotated within 134.
이때, 돌기(132)와 홈(134)을 테프론재질로 형성된다.At this time, the protrusion 132 and the groove 134 is formed of a Teflon material.
따라서 회전되는 회전판(117) 표면을 따라 흐르는 처리액이 여러 갈래로 갈라지면서 회전되면서 상방향인 처리액배출구(113)를 통해 보다 원활하게 배출되며, 여기에서 회전판(117)은 처리액의 흐름속도 즉, 유속을 빠르게 하는 역할을 한다.Therefore, the processing liquid flowing along the surface of the rotating plate 117 is divided into several branches and is rotated more smoothly through the processing liquid discharge port 113 upward, where the rotating plate 117 is a flow rate of the processing liquid. That is, it plays a role of speeding up the flow rate.
또한, 홈(134)이 형성된 몸체(110) 하부 표면은 다수개의 홀(135)을 형성하여 처리액의 공급을 수월하게 한다.In addition, the lower surface of the body 110 in which the groove 134 is formed forms a plurality of holes 135 to facilitate the supply of the treatment liquid.
그리고 몸체(110) 외부에서 가열부(119)가 설치되어져서 몸체(110) 내에 흐르는 처리액의 온도를 일정온도로 가열시키는데, 이 가열부(119)는 온도감지센서(121)에 의해 제어되면서 처리액을 적정온도 범위까지만 상승시킨다.And the heating unit 119 is installed outside the body 110 to heat the temperature of the processing liquid flowing in the body 110 to a constant temperature, the heating unit 119 is controlled by the temperature sensor 121 The treatment liquid is raised only to the optimum temperature range.
이어서 처리액배출구(113)를 통해 상단의 튜브(111-1)로 유출된 처리액은 처리조(120) 내로 재순환된다.Subsequently, the processing liquid flowing out to the upper tube 111-1 through the processing liquid discharge port 113 is recycled into the processing tank 120.
그리고 몸체(110) 일측에는 순수공급관(130)을 연결설치하여 필터링된 처리액을 본 고안의 가열장치 내에서 가열할 시, 증발된 순수 양 만큼 보충하여 준다.And one side of the body 110 is connected to the pure water supply pipe 130, when the filtered treatment liquid is heated in the heating apparatus of the present invention, it is replenished by the amount of evaporated pure water.
상기에서 살펴본 바와 같이, 단순히 펌프의 펌핑만으로 처리액을 이송시키기 때문에 펌프에 무리를 주고, 또한 원활한 순환이 어려워 처리조 내로 유입되는 처리액의 온도가 떨어지게 되어 열손실을 발생시키는 종래의 장치와는 달리, 본 고안의 튜브 가열장치에서는 회전판을 이용하여 처리액의 유속을 빠르게 하여 처리조 내로 처리액을 재순환시킴으로써 가열된 처리액의 온도 하강을 막아 적정온도 유지가 가능하다.As described above, it is difficult to smoothly circulate the pump because the treatment liquid is simply transferred by pumping the pump, and the temperature of the treatment liquid flowing into the treatment tank is lowered, which causes heat loss. Alternatively, in the tube heating apparatus of the present invention, it is possible to maintain the proper temperature by preventing the temperature drop of the heated treatment liquid by recycling the treatment liquid into the treatment tank by increasing the flow rate of the treatment liquid by using the rotating plate.
또한, 회전판을 이용하여 처리액의 유속을 빠르게 함으로써 장치에 무리를 주지 않게 되며, 처리액의 필터링되는 횟수를 증가시킬 수 있어 파티클을 최소화 할 수 있다.In addition, by using a rotating plate to increase the flow rate of the processing liquid does not impair the apparatus, it is possible to increase the number of times the processing liquid is filtered to minimize the particles.
그리고 본 고안의 가열장치에 순수공급관을 연결설치함으로써, 처리조 내로 균일한 농도의 처리액을 공급할 수 있다.And by connecting the pure water supply pipe to the heating apparatus of the present invention, it is possible to supply a treatment liquid of uniform concentration into the treatment tank.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970007402U KR200159379Y1 (en) | 1997-04-10 | 1997-04-10 | Tube heating apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970007402U KR200159379Y1 (en) | 1997-04-10 | 1997-04-10 | Tube heating apparatus |
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| Publication Number | Publication Date |
|---|---|
| KR19980062975U true KR19980062975U (en) | 1998-11-16 |
| KR200159379Y1 KR200159379Y1 (en) | 1999-10-15 |
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| KR2019970007402U KR200159379Y1 (en) | 1997-04-10 | 1997-04-10 | Tube heating apparatus |
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| KR (1) | KR200159379Y1 (en) |
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