JPH062262Y2 - Substrate cooling device - Google Patents
Substrate cooling deviceInfo
- Publication number
- JPH062262Y2 JPH062262Y2 JP1986139555U JP13955586U JPH062262Y2 JP H062262 Y2 JPH062262 Y2 JP H062262Y2 JP 1986139555 U JP1986139555 U JP 1986139555U JP 13955586 U JP13955586 U JP 13955586U JP H062262 Y2 JPH062262 Y2 JP H062262Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling plate
- discharge tank
- substrate
- constant temperature
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半導体基板やガラス基板等の処理工程におい
て用いられる基板の冷却装置に関するものであり、例え
ば基板を洗浄した後基板表面の水分を完全に除去するた
めに基板を加熱した後に、これを常温まで冷却するのに
使用する冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a cooling device for a substrate used in a process of processing a semiconductor substrate, a glass substrate, or the like. For example, after cleaning the substrate, moisture on the substrate surface is removed. The present invention relates to a cooling device used to cool a substrate to room temperature after heating the substrate for complete removal.
通常、基板の乾燥工程では基板は２００℃以上に加熱さ
れる。一方、基板の各処理工程を連続して行う場合、各
工程での処理時間がほぼ同一の時間となるようにするの
が望ましく、加熱後に自然に放熱させたのでは時間を要
するので、通常は強制的に２０秒以内で常温まで冷却す
るようにしている。そしてこの種の冷却装置としては、
従来より例えば第５図に示すものが本出願人により提案
されている（特開昭５９−４８９２５号公報）。Usually, the substrate is heated to 200 ° C. or higher in the substrate drying process. On the other hand, when the substrate processing steps are continuously performed, it is desirable that the processing time in each step be substantially the same, and it takes time if heat is naturally dissipated after heating. It is forced to cool to room temperature within 20 seconds. And for this type of cooling device,
Conventionally, for example, the one shown in FIG. 5 has been proposed by the applicant (Japanese Patent Laid-Open No. 59-48925).
それは基板を上面に接触載置して冷却する冷却板１０２
と冷却板１０２内に冷媒を流通させるべく貫設した複数
の冷媒流通孔１０３と、冷媒流通孔１０３が直列をなす
ようにこれらの流通孔１０３を接続する連結管１０４
と、これらの冷媒流路の入口側へ電磁開閉弁１０６を介
して接続された図外の熱交換式冷却源と、冷却板１０２
に埋設した温度センサ１０７と、温度センサ１０７から
の検知温度に基づいて電磁開閉弁１０６を開閉制御する
制御装置１０８とを備えて成り、温度センサ１０７の検
知温度により冷媒の流量を制御するように構成したもの
である。It is a cooling plate 102 that cools the substrate by placing it on the upper surface in contact therewith.
And a plurality of refrigerant circulation holes 103 penetratingly provided to circulate the refrigerant in the cooling plate 102, and a connecting pipe 104 connecting these circulation holes 103 so that the refrigerant circulation holes 103 are in series.
And a heat exchange type cooling source (not shown) connected to the inlet side of these refrigerant channels via the electromagnetic opening / closing valve 106, and the cooling plate 102.
And a control device 108 for controlling the opening / closing of the electromagnetic opening / closing valve 106 based on the temperature detected by the temperature sensor 107, and the flow rate of the refrigerant is controlled by the temperature detected by the temperature sensor 107. It is composed.
しかるに上記従来例によれば、冷却板１０２に埋設した
温度センサ１０７の検知温度に基づいて冷媒の流路を制
御するものであるため、第４図の破線のカーブＧ１で示
すように設定温度Ｔ０に対して過不足が生じることにな
る。その上冷却板１０２内に複数の冷媒流通孔１０３を
貫設して冷媒を流通させるものであるため、冷却板１０
２の温度分布が十分に均一とならない。However, according to the above-mentioned conventional example, since the flow path of the refrigerant is controlled based on the temperature detected by the temperature sensor 107 embedded in the cooling plate 102, the set temperature is set as shown by a broken line G 1 in FIG. There will be an excess or deficiency with respect to T 0 . Moreover, since a plurality of refrigerant circulation holes 103 are provided in the cooling plate 102 to circulate the refrigerant, the cooling plate 10
The temperature distribution of 2 is not sufficiently uniform.
本考案は従来技術のこのような欠点を解消することによ
り、基板の品質をより一層向上させることを目的とす
る。The present invention aims to further improve the quality of the substrate by eliminating such drawbacks of the prior art.
上記問題点を解決するために、本考案が採用した手段
は、 基板を上面に接触載置して冷却する冷却板と、冷却板の
下面に設けられ恒温液を冷却板の下面側に沿って放流す
る放流タンクと、放流タンクの入口と出口に接続された
熱交換式循環手段とを備え、 基板を冷却すべき設定温度と等しい温度の恒温液を熱交
換式循環手段により連続して放流タンクに供給するよう
に恒温液循環閉ループを形成し、 上記放流タンク内の入口側に、当該入口を囲ってこの入
口から流入した恒温液を冷却板下面側に沿って放射方向
へ拡散するように多数のオリフィスを有する整流部材を
設け、 上記放流タンクの出口管の内端部開口を傾斜状に形成す
るとともに、その出口管を放流タンク内に突入して設
け、当該内端部開口を冷却板の下面側に近接させて配置
した ことを要旨とするものである。In order to solve the above-mentioned problems, the means adopted by the present invention are: a cooling plate for placing a substrate on the upper surface to cool it, and a constant temperature liquid provided on the lower surface of the cooling plate along the lower surface side of the cooling plate. Equipped with a discharge tank for discharging and a heat exchange type circulation means connected to the inlet and outlet of the discharge tank, and a constant temperature liquid having a temperature equal to the set temperature for cooling the substrate is continuously discharged by the heat exchange type circulation means. A constant temperature liquid circulation closed loop is formed so that the constant temperature liquid is supplied to the inlet side of the discharge tank, and a large number of constant temperature liquids surrounding the inlet and flowing from this inlet are diffused in the radial direction along the lower surface of the cooling plate. A rectifying member having an orifice is provided, the inner end opening of the outlet pipe of the discharge tank is formed in an inclined shape, and the outlet pipe is provided so as to project into the discharge tank, and the inner end opening of the cooling plate is provided. Place it close to the bottom side That is the summary.
恒温液は放流タンク内を冷却板の下面に沿って流れ、冷
却板全体をほぼ均一に冷却する。The constant temperature liquid flows in the discharge tank along the lower surface of the cooling plate and cools the entire cooling plate almost uniformly.
即ち、恒温液の循環閉ループを形成する熱交換式循環手
段は、基板を冷却すべき設定温度と等しい温度の恒温液
を断続することなく連続して放流タンクに供給する。こ
れにより、冷却板全体が均一に、過不足なく設定温度に
安定して維持され、図４の実線のカーブＧ2で示すよう
に、基板は冷却板によって均一に冷却されて上記設定温
度Ｔ0になる。That is, the heat exchange type circulation means forming a circulation closed loop of the constant temperature liquid continuously supplies the constant temperature liquid having a temperature equal to the set temperature for cooling the substrate to the discharge tank without interruption. Thus, the entire cooling plate uniform, is maintained without excess or deficiency stably the set temperature, as indicated by the solid line curve G 2 in FIG. 4, the substrate is uniformly cooled by the cooling plate above the set temperature T 0 become.
このとき、上記放流タンク内の入口から流入した恒温液
は、当該入口に設けられた多数のオリフィスを有する整
流部材によって放射方向へ拡散され、放流タンク内の全
域にわたって流れ、冷却板全体を均一に冷却する。At this time, the constant temperature liquid that has flowed in from the inlet in the discharge tank is diffused in the radial direction by the rectifying member having a large number of orifices provided in the inlet, flows over the entire area in the discharge tank, and uniformly flows through the entire cooling plate. Cooling.
一方、放流タンク内の全域にわたって流れた恒温液は、
上記放流タンク内に突入する出口管内端部の開口に集中
し、この開口から流下する。この出口管の内端部開口は
傾斜状に形成され、かつ、冷却板の下面側に近接されて
おり、放流タンク内に空気溜りができるのを防止する。On the other hand, the constant temperature liquid that has flowed all over the discharge tank is
It concentrates in the opening at the inner end of the outlet pipe that projects into the discharge tank, and flows down from this opening. The inner end opening of the outlet pipe is formed in an inclined shape and is close to the lower surface side of the cooling plate to prevent air accumulation in the discharge tank.
つまり、循環供給される恒温液中に気泡などが含まれて
いる場合において、当該気泡は上記放流タンク内で浮上
して、冷却板の下面近傍に集まろうとするが、熱交換式
循環手段によって強制的に供給される恒温液は、当該気
泡をも取り込んで上記内端部開口に集中させて、この開
口から流下する。従って、放流タンク内に気泡が蓄積さ
れて空気溜りができるおそれはない。That is, when the constant temperature liquid that is circulated and supplied contains bubbles and the like, the bubbles float in the discharge tank and try to collect near the lower surface of the cooling plate. The constant temperature liquid that is forcibly supplied also takes in the bubbles, concentrates them in the inner end opening, and flows down from this opening. Therefore, there is no possibility that air bubbles may be accumulated in the discharge tank to accumulate air.
これにより、空気溜りの影響で冷却板の冷却効果が減殺
されることもなく、冷却板全体を一層均一に冷却する。As a result, the cooling effect of the cooling plate is not diminished by the influence of the air pool, and the entire cooling plate is cooled more uniformly.
以下、本考案に係る冷却装置の実施例を図面に基づいて
説明する。An embodiment of a cooling device according to the present invention will be described below with reference to the drawings.
第１図は冷却装置の縦断面図、第２図はその底面図、第
３図は同平面図である。1 is a longitudinal sectional view of the cooling device, FIG. 2 is a bottom view thereof, and FIG. 3 is a plan view thereof.
この冷却装置は基板１を載置吸着して冷却する冷却板２
と、この冷却板２の下面に固定ボルト７で固定された放
流タンク８と放流タンク８の入口１０と出口１２とに循
環閉ループ１６を形成するように接続した熱交換式循環
手段１７とを備えて成る。This cooling device has a cooling plate 2 for mounting and adsorbing a substrate 1 for cooling.
And a heat exchange type circulation means 17 connected so as to form a closed circulation loop 16 at the inlet 10 and the outlet 12 of the discharge tank 8 fixed to the lower surface of the cooling plate 2 with fixing bolts 7. Consists of
冷却板２は、その上面に基板１を搬送する一対の搬送ベ
ルト３・３が没入する切り溝４・４と、基板１を吸着す
る多数の吸着孔５とを有し、加熱乾燥された基板１を搬
送ベルト３・３で搬入してその上面に吸着し、所定の常
温例えば２３±０．２℃に冷却するようになっている。
基板１を吸着保持した状態では搬送ベルト３・３はこれ
ら搬送ベルト３・３を巻回支持しているプーリ（図示せ
ず）を降下させることにより切り溝４・４内に没入す
る。The cooling plate 2 has, on its upper surface, a kerf 4, 4 into which a pair of conveyor belts 3, 3 for conveying the substrate 1 are inserted, and a large number of adsorption holes 5 for adsorbing the substrate 1, and the substrate is heated and dried. 1 is carried in by the conveyor belt 3.3, adsorbed on the upper surface thereof, and cooled to a predetermined normal temperature, for example, 23 ± 0.2 ° C.
In the state where the substrate 1 is sucked and held, the conveyor belts 3 and 3 are retracted into the cut grooves 4 and 4 by lowering the pulley (not shown) that supports the conveyor belts 3 and 3 around them.
放流タンク８は冷却板２の下面に密接して設けられ、一
定温度に制御された恒温水を冷却板２の下面側に沿って
放流するように構成されている。The discharge tank 8 is provided in close contact with the lower surface of the cooling plate 2, and is configured to discharge the constant temperature water controlled to a constant temperature along the lower surface side of the cooling plate 2.
即ち、放流タンク８内の入口１０側には、その入口１０
を囲うように多数のオリフィス１１ａを有する整流部材
１１を設け、入口１０から流入した恒温水を整流部材１
１により放射方向へ拡散せしめ、放流タンク８内の全域
に亘って放流するようになっている。なお、オリフィス
１１ａの形状は、整流部材１１の内側に空気溜りが出来
ないように縦長のスリット状にするのが望ましく、また
なるべく乱流を生じさせないように、オリフィスの全開
口面積をそれぞれ入口及び出口の流路面積とほぼ同一に
するのが望ましい。That is, on the inlet 10 side in the discharge tank 8, the inlet 10
A rectifying member 11 having a large number of orifices 11a is provided so as to surround the rectifying member, and the constant temperature water flowing from the inlet 10 is rectified by the rectifying member 1
1, it is diffused in the radial direction and is discharged over the entire area of the discharge tank 8. The shape of the orifice 11a is preferably a vertically long slit shape so that no air can be accumulated inside the rectifying member 11, and the total opening area of the orifice is set so as to prevent turbulence as much as possible. It is desirable that the flow passage area of the outlet be substantially the same.
一方、放流タンク８の出口１２は出口管１３の内端部の
開口１４を傾斜状に形成するとともに、この出口管１３
を下方より放流タンク８内に突入して設け、傾斜状の内
端部開口１４を冷却板２の下面側に近接させて配置し、
放流タンク内に前述した空気溜りができないようにして
ある。On the other hand, the outlet 12 of the discharge tank 8 forms an opening 14 at the inner end of the outlet pipe 13 in an inclined shape, and
Is provided so as to project into the discharge tank 8 from below, and the inclined inner end opening 14 is arranged close to the lower surface side of the cooling plate 2.
The above-mentioned air pool cannot be formed in the discharge tank.
なお符号１５は冷却板２に埋設した温度確認用のセンサ
であり、恒温水の制御とは無関係である。Reference numeral 15 is a temperature confirmation sensor embedded in the cooling plate 2 and has no relation to the control of constant temperature water.
熱交換式循環手段１７は放流タンク８からの恒温水を所
定温度、例えば２３±０．２℃に維持する熱交換器１８
と、その恒温水を放流タンク８内に圧送して循環させる
圧送ポンプ２０とを備えている。The heat exchange type circulation means 17 is a heat exchanger 18 for maintaining the constant temperature water from the discharge tank 8 at a predetermined temperature, for example 23 ± 0.2 ° C.
And a pump 20 for pumping the constant temperature water into the discharge tank 8 for circulation.
次にこの装置における作用について説明する。Next, the operation of this device will be described.
熱交換式循環手段１７によって基板１を冷却すべき設定
温度と等しい所定温度に制御された恒温水は、放流タン
ク８を含む循環閉ループ１６を断続することなく連続し
て還流する。The constant temperature water controlled to a predetermined temperature equal to the set temperature for cooling the substrate 1 by the heat exchange type circulation means 17 continuously recirculates without circulating the closed circulation loop 16 including the discharge tank 8.
放流タンク８内の入口１０から流入した恒温水は、この
入口に設けられた多数のオリフィス１１ａを有する整流
部材１１によって放射方向へ拡散され、放流タンク８内
の全域にわたって流れ、冷却板２全体を均一に冷却す
る。The constant temperature water flowing from the inlet 10 in the discharge tank 8 is diffused in the radial direction by the rectifying member 11 having a large number of orifices 11 a provided in the inlet, flows over the entire area in the discharge tank 8, and flows through the entire cooling plate 2. Cool evenly.
一方、放流タンク８内の全域にわたって流れた恒温水
は、上記放流タンク８内に突入する出口管１３の内端部
開口１４に集中し、この開口１４から流下する。この出
口管１３の内端部開口１４は傾斜状に形成され、かつ、
冷却板２の下面側に近接されており、放流タンク８内に
前述した空気溜りができるのを防止する。これにより冷
却板２は温度ムラを生ずることなく全体がほぼ均一に冷
却され、所定の常温に維持されている。On the other hand, the constant temperature water that has flowed all over the discharge tank 8 concentrates on the inner end opening 14 of the outlet pipe 13 that projects into the discharge tank 8 and flows down from this opening 14. The inner end opening 14 of the outlet pipe 13 is formed in an inclined shape, and
It is close to the lower surface side of the cooling plate 2 and prevents the above-mentioned air accumulation in the discharge tank 8. As a result, the entire cooling plate 2 is cooled substantially uniformly without causing temperature unevenness and is maintained at a predetermined room temperature.
そこへ基板１が搬送ベルト３・３によって搬入され、冷
却板２の上面に吸着載置される。およそ２０秒で基板１
は冷却板と同等の設定温度Ｔ０（２３±０．２℃）にな
る。次いで吸着を解除し、搬送ベルト３・３を切り溝４
・４内から出るよう上昇させることにより基板を押し上
げ、搬送ベルト３・３で次の工程へ搬出する。以下同様
にして次々と基板の冷却が行われる。The substrate 1 is carried therein by the conveyor belts 3, 3 and placed on the upper surface of the cooling plate 2 by suction. Substrate 1 in about 20 seconds
Becomes a set temperature T 0 (23 ± 0.2 ° C.) equivalent to that of the cooling plate. Next, the suction is released, and the conveyor belts 3 and 3 are cut into grooves 4.
・ The substrate is pushed up by raising it so that it comes out from inside, and is conveyed to the next step by the conveyor belts 3 ・ 3. Subsequent cooling of the substrates is performed in the same manner.
なお、基板１の熱量を所定の時間内で吸収放熱させるべ
く、冷却板２の熱容量は十分大きくしてある。The heat capacity of the cooling plate 2 is sufficiently large so that the heat quantity of the substrate 1 is absorbed and radiated within a predetermined time.
また、熱交換器１８の前または後に、放流タンク８より
も大容量の恒温タンクを付設して、恒温水の温度をより
いっそう一定に保つようにしてもよい。Further, a constant temperature tank having a larger capacity than the discharge tank 8 may be attached before or after the heat exchanger 18 to keep the temperature of the constant temperature water more constant.
なお、上記実施例では恒温水の温度を２３±０．２℃と
したが、これは基板を冷却する設定温度が２３℃のため
かかる温度としたのであって、基板を冷却する設定温度
が１０℃であるならば恒温液の温度を１０±０．２℃と
し、あるいは設定温度が４０℃であるならば恒温液の温
度を４０±０．２℃とするように、基板の設定温度に応
じて、それと同じ温度にすればよい。恒温液の許容温度
幅も、前記のように±０．２℃とするに限らず、必要に
応じて、もっと厳密にあるいは、もう少し幅を許すよう
にしてもよいことは当然である。さらに、本考案におけ
る恒温液は上記実施例のように水を使用するものに限定
せず、例えば塩化カルシウム溶液のように水よりも熱容
量の大きな液体を使用してもよい。Although the temperature of the constant temperature water is set to 23 ± 0.2 ° C. in the above embodiment, this is because the set temperature for cooling the substrate is 23 ° C., and the set temperature for cooling the substrate is 10 ° C. If the temperature of the constant temperature liquid is 10 ± 0.2 ° C., or if the set temperature is 40 ° C., the temperature of the constant temperature liquid is 40 ± 0.2 ° C. according to the set temperature of the substrate. Then, the temperature should be the same as that. The permissible temperature range of the constant temperature liquid is not limited to ± 0.2 ° C. as described above, and it is of course possible to allow a more strict or a slightly wider range as necessary. Further, the constant temperature liquid in the present invention is not limited to the one using water as in the above embodiment, and a liquid having a larger heat capacity than water, such as a calcium chloride solution, may be used.
本考案では、基板を冷却すべき設定温度と等しい温度の
恒温液を断続することなく連続して放流タンクに供給す
ることにより、冷却板全体を均一に、過不足なく設定温
度に安定して維持することができる。In the present invention, a constant temperature liquid having a temperature equal to the set temperature for cooling the substrate is continuously supplied to the discharge tank without interruption, so that the entire cooling plate is uniformly maintained at the set temperature without excess or deficiency. can do.
このとき、上記放流タンク内の入口から流入した恒温液
は、前記整流部材によって放射方向へ拡散され、放流タ
ンク内の全域にわたって流れるので、冷却板全体を均一
に冷却することができる。At this time, the constant temperature liquid flowing from the inlet of the discharge tank is diffused in the radial direction by the rectifying member and flows over the entire area of the discharge tank, so that the entire cooling plate can be uniformly cooled.
しかも、放流タンク内の全域にわたって流れた恒温液
は、恒温液中に含まれる気泡をも取り込んで前記出口管
の内端部開口から流下するので、冷却板の下面側に気泡
が蓄積されて空気溜りができるおそれはない。従って、
空気溜りの影響で冷却板の冷却効果が減殺されることも
なく、冷却板全体を一層均一に冷却することができる。Moreover, the constant temperature liquid that has flowed all over the discharge tank also takes in the bubbles contained in the constant temperature liquid and flows down from the inner end opening of the outlet pipe, so that the bubbles are accumulated on the lower surface side of the cooling plate and the air is accumulated. There is no risk of accumulation. Therefore,
The cooling effect of the cooling plate is not diminished by the influence of the air pool, and the entire cooling plate can be cooled more uniformly.
以上により、基板をムラなく均一に冷却することがで
き、後工程における基板の塗膜形成等に好結果を与え、
基板の品質を一層向上させることができる。By the above, the substrate can be uniformly cooled without unevenness, which gives a favorable result to the coating film formation of the substrate in the subsequent step,
The quality of the substrate can be further improved.
第１図は本考案に係る冷却装置の縦断面図、第２図はそ
の底面図、第３図は同じく平面図、第４図は基板の冷却
効果を示すグラフ、第５図は従来例に係る冷却装置の平
面図である。 １…基板、２…冷却板、８…放流タンク、１０…入口、
１１…整流部材、１１ａ…オリフィス、１２…出口、１
３…出口管、１４…出口管の内端部開口、１６…循環閉
ループ、１７…熱交換式循環手段。FIG. 1 is a longitudinal sectional view of a cooling device according to the present invention, FIG. 2 is a bottom view thereof, FIG. 3 is a plan view of the same, FIG. 4 is a graph showing a cooling effect of a substrate, and FIG. It is a top view of such a cooling device. 1 ... Substrate, 2 ... Cooling plate, 8 ... Discharge tank, 10 ... Inlet,
11 ... Straightening member, 11a ... Orifice, 12 ... Exit, 1
3 ... Exit pipe, 14 ... Opening of inner end of exit pipe, 16 ... Circulation closed loop, 17 ... Heat exchange type circulation means.
Claims (1)
と、冷却板の下面に設けられ恒温液を冷却板の下面側に
沿って放流する放流タンクと、放流タンクの入口と出口
に接続された熱交換式循環手段とを備え、 基板を冷却すべき設定温度と等しい温度の恒温液を熱交
換式循環手段により連続して放流タンクに供給するよう
に恒温液循環閉ループを形成し、 上記放流タンク内の入口側に、当該入口を囲ってこの入
口から流入した恒温液を冷却板下面側に沿って放射方向
へ拡散するように多数のオリフィスを有する整流部材を
設け、 上記放流タンクの出口管の内端部開口を傾斜状に形成す
るとともに、その出口管を放流タンク内に突入して設
け、当該内端部開口を冷却板の下面側に近接させて配置
したことを特徴とする基板の冷却装置。1. A cooling plate for placing a substrate in contact with an upper surface for cooling, a discharge tank provided on the lower surface of the cooling plate for discharging a constant temperature liquid along the lower surface side of the cooling plate, and an inlet and an outlet of the discharge tank. And a heat exchange type circulation means connected to the heat exchange type circulation means, and a constant temperature liquid circulation closed loop is formed so that the constant temperature liquid having a temperature equal to the set temperature for cooling the substrate is continuously supplied to the discharge tank by the heat exchange type circulation means. A rectifying member having a plurality of orifices is provided on the inlet side of the discharge tank so as to surround the inlet and diffuse the constant temperature liquid flowing from the inlet along the lower surface of the cooling plate in the radial direction. The inner end opening of the outlet pipe is formed in an inclined shape, the outlet pipe is provided so as to project into the discharge tank, and the inner end opening is arranged close to the lower surface side of the cooling plate. Substrate cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986139555U JPH062262Y2 (en) | 1986-09-10 | 1986-09-10 | Substrate cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986139555U JPH062262Y2 (en) | 1986-09-10 | 1986-09-10 | Substrate cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6346840U JPS6346840U (en) | 1988-03-30 |
| JPH062262Y2 true JPH062262Y2 (en) | 1994-01-19 |
Family
ID=31045572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986139555U Expired - Lifetime JPH062262Y2 (en) | 1986-09-10 | 1986-09-10 | Substrate cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062262Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58176936A (en) * | 1982-04-09 | 1983-10-17 | Fujitsu Ltd | Substrate cooling method |
| JPS59149630U (en) * | 1983-03-25 | 1984-10-06 | 株式会社日立製作所 | wafer processing electrode |
-
1986
- 1986-09-10 JP JP1986139555U patent/JPH062262Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6346840U (en) | 1988-03-30 |
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