KR19980043750A - Door opening prevention device of semiconductor manufacturing equipment - Google Patents

Abstract

The present invention relates to a door opening preventing device which detects that a door is opened or opened during a process to suspend a process and issues an alarm to prevent wafer defects.

The present invention relates to a door opening preventing device of a semiconductor manufacturing apparatus having at least one door configured on an outer surface of a case of a facility in which a process chamber in which a specific process is performed, the sensing means installed on the door and detecting the opening of the door; A first switching means switched according to an application state of the sensing signal of the sensing means, a second switching means switched according to an application state of the process command signal, and outputs the process command signal according to whether the process is performed 2 is provided with a control means for controlling the operation of the process chamber by determining the door open during the process according to the switching state of the switching means.

Therefore, according to the present invention, when the door is opened while the process is in progress, the execution of the process is automatically stopped, thereby preventing the generation of defective wafers, thereby improving the yield and maximizing the operation rate of the equipment.

Description

Door opening prevention device of semiconductor manufacturing equipment

The present invention relates to a door opening preventing device of a semiconductor manufacturing equipment, and more particularly, door opening to detect a door being opened or opened during a process to suspend a process and stop an occurrence of a wafer defect by detecting an alarm. It relates to a prevention device.

In general, a wafer for manufacturing a semiconductor device is repeatedly subjected to processes such as cleaning, diffusion, photoresist coating, exposure, development, etching, and ion implantation, and equipment for performing the corresponding process is used for each of these processes.

Among the facilities for performing each of these processes, semiconductor device manufacturing equipment that requires high temperature, high vacuum, constant humidity, and contamination level below a predetermined level for the process, may cause defects on the wafer even if the internal state is slightly changed. Can be.

In particular, the stepper for performing the exposure process is very sensitive to the result of the process depending on the temperature, humidity and particles inside, so that even if the temperature inside the equipment changes only a little, the focus defect on the wafer is immediately generated. If any of these occur, particles are brought into contact with the wafer, causing short on the chip pattern of the wafer.

As described above, changes in temperature, humidity, and pollution levels in the facility during the process have a direct effect on the process yield.

On the other hand, each facility used to manufacture a semiconductor device has a considerable number of doors for each facility.

As an example, the stepper is shown in Figs.

Fig. 1 is a front view showing a state where a door is disposed on the front of a conventional stepper, Fig. 2 is a rear view, and Fig. 3 is a side view.

As can be seen from Figs. 1 to 3, the stepper has a considerable number of doors 2, 4 and 6 arranged on the front, back and side. However, each of these doors 10 is not provided with a sensor for detecting the opening.

Therefore, after checking the inside of the stepper, if the operator does not accidentally close the door or if the door opens due to a defect, the exposure process was performed as it is. Then, during the process, outside air or particles are introduced into the equipment, vortex phenomena of air are generated inside, the internal temperature is changed, and the particles are generated in a greater amount. Since the exposure process was performed as it is in the above state, a considerable amount of defective wafers were generated.

In particular, the ordinary semiconductor manufacturing equipment has a lot of doors on the side or the rear, it is difficult for the operator to find the opening during the operation.

As a result, since the semiconductor manufacturing process was performed without checking the door correctly, there was a problem that the yield is lowered.

SUMMARY OF THE INVENTION An object of the present invention is to provide a door opening preventing device of a semiconductor manufacturing apparatus for detecting a door opening while a process is in progress, and stopping a process progress and an alarm operation to prevent wafer defects.

1 is a front view showing a state where a door is disposed on the front of a conventional stepper.

Fig. 2 is a rear view showing a state where a door is arranged on the back of a conventional stepper.

3 is a side view showing a state where a door is disposed on a side of a conventional stepper.

4 is a circuit diagram showing an embodiment of a door opening preventing device of a semiconductor manufacturing apparatus according to the present invention.

※ Explanation of symbols for main parts of drawing

2, 4, 6, 10, 12: doors 14, 16, 18: sensors

20, 26: relay 22: process chamber

24: control unit

To prevent the opening of the door of the semiconductor manufacturing equipment according to the present invention for achieving the above object, at least one door is formed on the outer surface of the case of the equipment containing the process chamber in which a specific process is performed. A sensing means installed in the door to detect an opening of the door, first switching means switched according to an application state of a sensing signal of the sensing means, second switching means and process switched according to an application state of a process command signal; And a control means for outputting the process command signal according to the progress and controlling the operation of the process chamber by determining the door opening during the process according to the switching state of the first and second switching means.

In addition, the sensing means may be configured to each sensor is installed in the one or more doors and the sensors are connected in series, the sensor of the magnetic sensor for switching on or off according to the opening and closing of the door, micro switch or optical sensor It is preferable that it is comprised by either.

The first switching means is interlocked with a switch of the first transistor and the first transistor switched according to an application state of the sensing signal according to the opening and closing of a door, and the interlocking switching signal is changed according to the switching state of the second switching means. And a first relay applied to the control means, wherein the second switching means is interlocked with the switching of the second transistor and the second transistor switched according to the process command signal of the control means, and transmits an interlocked switching signal to the first. The second relay may be applied to the control means according to the switching state of the switching means.

Preferably, the first and second switching means and the control means form a closed loop.

In addition, when the switching state of the first and second switching means is a switching state according to the opening of the door during the process may be further configured to the alarm means for applying a control signal from the control means to perform an alarm operation, the alarm means It may be configured as a light emitting alarm device, a sounding alarm device or a monitoring means for process control in the process chamber.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As an embodiment of the present invention an apparatus for detecting the opening and closing of the door of the stepper is illustrated in FIG. 4, in the embodiment according to the present invention, the sensors 14, 16 and 18 are respectively installed at specific positions of the sliding doors 10 and 12 installed at the front, the back or the side of the stepper, 14, 16, and 18 are connected in series so that the constant voltage Vcc is applied through each of the sensors 14, 16, 18 and the resistor R1.

The sensors 14, 16, and 18 may be arbitrarily selected and configured among the magnetic sensor, the micro switch, or the optical sensor according to the manufacturer's intention.

In addition, a base of the transistor Q1 is connected to a resistor R2 connected in parallel to the resistor R1, the transistor Q1 is connected to a driving terminal of the relay 20, and a driving terminal of the relay 20 is connected to the driving terminal of the relay 20. Diode D1 for preventing overload is connected in parallel.

On the other hand, the control unit 24 for controlling the process chamber 22 performing the exposure process is connected to output a process command signal to the base of the transistor Q2 through the resistor R3, the transistor Q1 is a relay ( 26 is connected to the drive terminal of the relay 26, the diode D2 for preventing overload in parallel to the drive terminal of the relay 26 is connected in parallel.

In addition, the relays 20 and 26 and the control unit 24 form a closed loop. When any one of the relay 20 or the relay 26 is turned off, the closed loop is shorted and the control unit 24 is in a low state. The switching signal is configured to be applied.

Therefore, when the operator performs the process after controlling the control unit 24 to set the process conditions for performing the exposure process in the process chamber 22, the control unit 24 sets the process command signal through the resistor R3 at a high level. Will output Transistor Q2 is then turned on and conductive so relay 26 is turned on.

The process command signal is output low when the process chamber 22 is not in the process and the relay 26 is turned off. However, in this state, the control unit 24 does not determine the error operation.

That is, the controller 24 checks whether the closed loop including the relay 20 and the relay 22 is shorted in the process state of the process chamber 22 outputting the process command signal high.

When the doors 10 and 12 are all normally closed, the transistor Q1 is turned on by applying a high level voltage to the resistor R2, and thus the relay 20 remains turned on. Therefore, the controller 24 recognizes that the doors 10 and 12 are closed because the relays 20 and 26 are both turned on in the state where the process command signal is output at the high level.

Since the doors 10 and 12 are closed, the exposure process in this state can be performed in accordance with the environment normally set in the process chamber 22.

However, if either one of the doors 10, 12 is open, a low level voltage is applied to the base of the transistor Q1 through the resistor R2, and then the transistor Q1 is turned off to relay 20 Is also turned off. Then, the control unit 24 checks the short circuit of the closed circuit according to the turn-off of the relay 20 to stop the process of the process chamber 22.

If the control unit 24 is further configured with an alarm means such as a light emitting alarm device, a sounding alarm device or a monitoring device, the alarm operation may be performed through them. The operator can then immediately determine the situation, take action and resume the process.

Therefore, if the doors installed on each side of the facility are opened during the process, the process progress is automatically stopped immediately, so that no defective wafer is generated. And, as soon as action is taken, the utilization of the plant can be improved.

Therefore, according to the present invention, if the door is opened while the process is in progress, the execution of the process is automatically stopped, thereby preventing the generation of defective wafers, thereby improving the yield.

In addition, an immediate action may be taken according to the door opening, thereby improving the management of the facility and maximizing the operation rate.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (12)

In the door opening preventing device of the semiconductor manufacturing equipment, wherein at least one door is formed on the outer surface of the case of the equipment containing the process chamber in which a specific process is performed Sensing means installed in the door to detect the opening of the door; First switching means switched according to an application state of a sensing signal of the sensing means; Second switching means switched according to an application state of the process command signal; And A control means for outputting the process command signal according to process progress and controlling the operation of the process chamber by determining a door opening during the process according to the switching states of the first and second switching means; Door opening preventing device of a semiconductor manufacturing equipment characterized in that it comprises a. The method of claim 1, Wherein the sensing means is installed in each of the at least one door sensor and the sensors are door opening preventing device of the semiconductor manufacturing equipment, characterized in that configured in series. The method of claim 2, The sensor is a door opening preventing device of the semiconductor manufacturing equipment, characterized in that the magnetic sensor is turned on and off in accordance with the opening and closing of the door. The method of claim 2, The sensor is a door opening preventing device of the semiconductor manufacturing equipment, characterized in that the micro switch is turned on and off in accordance with the opening and closing of the door. The method of claim 2, The sensor is a door opening preventing device of the semiconductor manufacturing equipment, characterized in that the optical sensor which is turned on and off in accordance with the opening and closing of the door. The method of claim 1, wherein the first switching means; A first transistor switched according to an application state of the sensing signal according to opening and closing of a door; And A first relay interlocked with a switch of the first transistor and applying an interlocking switching signal to the control means according to the switching state of the second switching means; Door opening preventing device of the semiconductor manufacturing equipment characterized in that it comprises a. The method of claim 1, wherein the second switching means; A second transistor switched according to a process command signal of the control means; And A second relay interlocked with the switching of the second transistor and applying an interlocked switching signal to the control means according to the switching state of the first switching means; Door opening preventing device of the semiconductor manufacturing equipment characterized in that it comprises a. The method of claim 1, And said first and second switching means and said control means form a closed loop. The method of claim 1, And the alarm means for performing an alarm operation by applying a control signal from the control means when the switching state of the first and second switching means is a switching state according to the opening of the door during the process. Opening prevention device. The method of claim 1, And said alarm means is a light emitting alarm device. The method of claim 1, The alarm means is a door opening preventing device of the semiconductor manufacturing equipment, characterized in that the pronunciation alarm device. The method of claim 1, And said alarm means is a monitoring means for process control in said process chamber.