KR19980040721A - Method for manufacturing mold for glass molding and apparatus for manufacturing same - Google Patents

Abstract

The present invention relates to a method for forming a pole of a glass molding die, and a glass die casting mold facilitates the discharge of air and gas generated during mold coating on the surface of a mold by solution agitation and solution agitation in a plating solution. Since no pinhole is formed on the electrodeposited plating surface, the plating quality, corrosion resistance, and releasability are excellent, and thermal conductivity is also good. In addition, when the mold is worn out, it is possible to solve the problem of making and using a new mold, which reduces mold material cost and mold processing cost, and prevents environmental pollution by eliminating waste water generated during plating by eliminating plating every time the mold is repaired. Since there is no plating process, the mold repair time is shortened by 55%, which makes the mold supply and demand smooth.

Description

Method for manufacturing mold for glass molding and apparatus for manufacturing same

[Industrial use]

The present invention relates to a mold for glass molding, and more particularly, a pinhole, etc. does not occur, and thus, high precision and continuous use are possible, and a method for manufacturing a mold for glass molding which can recycle the mold when worn or damaged and its manufacture Description of the device.

[Private Technology]

In general, in order to mold glass products that require very high precision, such as CRT, glass molding molds must also have very precise surfaces.

The glass molding mold that has been used to manufacture conventional CRTs is nickel-tungsten in order to protect the releasability, corrosiveness and surface after machining of SUS420J2 casting, etc. after removing the mold, removing the oxide film, peeling the metal, grinding the mold, and forming the roughness. Or it manufactures by surface-treating by the process of chromium plating, plated-layer polishing, primary stipple formation, and secondary stipple formation. At this time, the plating thickness of the mold is several μm, and once the CRT molding is performed, the plating is peeled off and plated again to reuse the mold.

However, a mold for manufacturing a glass molding, such as the conventional CRT, as described above, has a problem in that plating defects due to pinholes occur frequently during surface treatment, thereby failing to meet the precision required by glass products such as CRT. The reason why pinholes are generated in this way is because the bottom surface of the mold structure is wide, and when plating with a plating solution, bubbles are generated on the surface by bubbles generated by hydrogen gas to generate pinholes. In order to suppress the occurrence of such bubbles, a technique using air agitation or mechanical agitation of reciprocating motion has been developed, but there is a problem that it is difficult to completely eliminate pinhole generation due to the wide bottom surface. In this case, when plating failure occurs due to the pinhole generation or when the mold is used once, the plating layer is peeled off, newly plated, and the surface treatment is used for forming the CRT. However, when the mold of the plating layer is peeled off and the plating is performed again, a lot of waste water is generated, and the time required is 6 hours to 8 hours on average. And when the mold is damaged during the handling of the mold is conventionally manufacturing a new mold.

On the other hand, in the case of manufacturing a mold using the electroforming method (ie, casting method using the principle of electroplating), various shapes of molds can be manufactured. It is also widely used for making crafts. As such an example, Korean Patent Publication No. 95-007171 describes a method using a pole casting method in the method of manufacturing a porous master mold used as a vacuum molding die. In this method, a small amount of anti-pitcher is added to the electrolyte, and the initial voltage is 0.5 A / dm ² , whereby H ₂ gas is attached to the silver diameter innumerably to form a non-conductive pinhole in the mold, and then gradually the voltage is 1-20 A /. After increasing the pressure to dm ² , the electrolyte was circulated through the flow at a flow rate of 5-30 l / min to obtain a Ni porous electroforming mold of about 2 mm, and then immersed in soluble resin to block the pinhole to maintain the non-conductive layer. By re-incorporating the porous pole mold, the coating layer is grown to form a metal pole layer of about 4 mm thick plate, and then the resin is dissolved and removed to manufacture the pole pole whose plate is porous. When the porous master mold is manufactured using the electroforming mold method as described above, a mold having a porosity can be manufactured by providing an appropriate pinhole, and a thick thick plate can be obtained while obtaining good electrodeposition.

The inventors of the present invention can manufacture a precise glass molding mold when the above-described electrophoretic method is used in the manufacture of the glass molding mold while researching to solve the problems of the conventional manufacturing method of the glass molding mold as described above. With this in mind, the present invention has been completed. However, there is a problem that a lot of pinholes occur when using the above-mentioned pole method.

The present invention has been made to solve the problems of the prior art as described above, the first object of the present invention is to achieve a uniform electrodeposition without the occurrence of pinholes and to provide a method and apparatus for manufacturing a mold for glass molding with excellent precision. It is. It is a second object of the present invention to provide a method and apparatus for manufacturing a mold for glass molding which can be plated and can be used continuously until these plates are worn. A third object of the present invention is to provide a method and apparatus for manufacturing a mold for glass molding, which can be easily recycled when a plating failure occurs or a mold is damaged. A fourth object of the present invention is to provide a manufacturing method and a manufacturing apparatus for a glass molding mold with less generation of waste water during the manufacture of the glass molding mold. In another aspect, the present invention is to provide a method and apparatus for manufacturing a mold for glass molding in which the separation of the plating layer does not occur during glass molding.

1 is a schematic diagram showing an electroplating bath apparatus of the present invention.

Explanation of symbols on the main parts of the drawings

1. rotating device 2. anode 3. blow system

4. Filtration / Overflow System 5. Plating Bath 6. Regulator

In order to achieve the object of the present invention as described above, the present invention, in the production of a mold for glass molding by electroforming a mold casting, electroplating 220 to 280 hours while rotating the mold to plate 4 to 6mm thickness It provides a method for producing a glass molding die, characterized in that. In this case, the rotation is preferably 3-6 cycles / hr.

In the present invention described above, it is preferable to press the electroplating solution around the die casting during electroforming and electrocast while stirring the solution.

In the present invention, the plating solution for electroforming includes 1 l of pure water, 40-60 g / l of nickel sulfamate, and 4-6 ml / l of anti-pitching agent which is a surfactant, and the pH is preferably 2-4. .

In the present invention described above, it is preferable that the lower end of the surface of the mold casting is blasted with A1203 # 40-180 mesh to form a roughness.

In another aspect, the present invention provides a plating bath for storing the electroplating solution in which an anode is installed, a rotating device installed on an upper portion of the plating bath to support a mold casting to be rotated in the plating bath, and the plating. A filtration / overflow apparatus for filtering and pressurizing the electroplating solution overflowing the partition wall installed in the bath to inject the lower portion of the plating bath, and injecting the plating solution into the plating bath to stir the electroplating solution itself. It provides a blow molding system and an electroforming apparatus for glass forming comprising a rotary device, an anode-plated plating bath, a filtration / overflow system, and a control device for electrically connecting the blow system to control their operation. .

Hereinafter, the present invention will be described in detail.

Representative Example

(Electric pole plating tank device)

The electroforming plating apparatus for glass molding according to the present invention can manufacture a mold having excellent pin precision without pinholes by removing the bubbles generated on the surface of the mold by stirring the solution at the same time as the rotation of the mold in the plating solution as shown in FIG. It is a pole plating device. The electroplating apparatus of FIG. 1 is provided with a plating bath 5 for storing an electroplating solution in which an anode 2 is installed, and an upper portion of the plating bath 5 to plate a mold. Filtration / injection into the lower part of the plating bath (5) by filtering and pressurizing the electroplating liquid overflowed over the partition installed in the rotating device (1) and the plating bath (5) to support rotation within the plating bath (5). Blowing system (3) for injecting a plating liquid into the overflow device (4) and the plating bath (5) to agitate the electroplating liquid itself, and the plating apparatus (1) and the anode (2) are installed. It consists of a bath (5), a filtration / overflow system (4) and an adjusting device (6) which electrically connects the blow system to regulate their operation.

(Way)

The electroplating bath apparatus of the present invention as described above, after first depositing a nickel metal having a thickness of several μm using a primary plating solution whose main component is nickel hydrochloride on a basic surface of a metal such as SUS420J2 metal under ultra-voltage conditions. The primary plated mold is rotated in an electroplating solution containing nickel sulfamate, boric acid, and anti-pitcher as a main component, and the electroplating solution is pressed into the plating tank through the blow system 3 to surround the mold. By stirring the plating solution, the bubbles generated on the surface of the mold are removed to form a uniform electrodeposition of several mm on the mold. In this case, the electroplating solution is filtered and circulated using the overflow, and the bottom part of the SUS420J2 base surface is blasted with A1203 # 40-180 mesh to solve the problem that the plating layer is separated by electrodeposition due to the release of the SUS420J2 base surface. The process of forming a roughness can be performed.

The following describes preferred examples and comparative examples to aid the understanding of the present invention. However, the following examples are merely provided to more easily understand the present invention, and the present invention is not limited to the following examples.

EXAMPLE

Example 1

Under the high voltage condition, the primary surface of SUS420J2 metal was firstly plated by depositing a nickel metal having a thickness of 3 μm using a primary plating solution whose main component was nickel hydrochloride, and then using the electroplating bath apparatus of FIG. The temperature of the nickel electroplating solution of one composition is 40-55 ° C, the mold is rotated at 4 cycles / hr in the electroplating bath, the plating solution is pressed in the amount of 150 l / min, and the circulation flow is overflowed at a flow rate of 1-5 l / sec. Ni electrodeposited film is formed on the basic surface of SUS420J2 with super voltage 0.5A / dm ² , and the electrode is grown for 240 hours while increasing the voltage to 2.5A / dm ² . It was able to obtain the good adhesion and good quality state (analytical method, visual observation) during machining and molding.

Nickel Electroplating Solution

1 liter of pure water;

Nickel sulfamate 450-600 g / l;

Boric acid 40-60 g / l;

Pit inhibitor (surfactant) 4-6 ml / l.

Example 2

The same process as in Example 1 was performed except that the plating solution was not press-fitted in Example 1 above.

Comparative Example 1

In Example 1 described above, except that the mold was not rotated in the electroplating bath, the same process as in Example 1 was performed. As a result, the plating thickness was 2-3 mm, the variation of the plating thickness was severe, and the plating layer was not uniform.

Comparative Example 2

In Example 1, the die was subjected to the same method as in Example 1, except that the SUS420J2 base surface was periodically replaced up and down during the plating process in order to equalize the thickness of the plating layer. As a result, the thickness variation after plating was somewhat resolved, but there was a time left in the air during the up and down replacement of the plated material to make the plating thickness uniform, so that the oxide film and the oxide film were formed on the surface of the plating, but the plating continued. There was a problem that the plating layer is separated by the generated heat and stress.

Comparative Example 3

According to a known method for producing a mold for glass molding, the mold casting was washed after the jig assembly, washed with ultrasonic waves, washed with water, etched with acid, and washed with water. After the Ni-strike was performed, water was rinsed and etched with acid, followed by nickel tungsten plating having a thickness of 7 to 20 µm, followed by washing with water, and then the jig was released.

Comparative Example 4

The mold casting was washed with water, etched with acid, and washed with water according to a known method for producing a mold for glass molding. And after setting the anode and washing with water, 20 to 40㎛ thickness of chromium was carried out, the anode was released and washed with water.

The result of comparing the pinhole incidence rate, wastewater generation amount, separation of the back plated layer, the number of times the mold can be used, and the mold repair time of the glass forming molds manufactured according to the above-described Examples and Comparative Examples are as follows. As can be seen from the results below, according to the present invention, no or no pinhole was generated, the mold was reusable, and the repair time of the mold was also very short.

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Pinhole occurrence rate radish 3% 10 to 12% 5% 8% Mold reuse 40 times 1 time Wastewater Generation 20ℓ / ea 20ℓ / ea 20ℓ / ea 20ℓ / ea 400ℓ / ea Mold repair time 137min 325min Plated layer separation Good Good Good detach radish

The glass tube CRT for molding of the present invention is easy to discharge the air and gas generated during the mold coating process on the surface of the mold by rotating the mold in the electroplating solution, so that the pinhole does not occur on the plated surface, so the plating quality is improved. There is an effect of providing a glass molding die having excellent corrosion resistance, good releasability and good thermal conductivity. In addition, when the mold is worn out, the conventional problem of making and using a new mold can be solved, thereby reducing mold material cost and mold processing cost, and eliminating plating every time the mold is repaired, thereby reducing wastewater generated during plating to prevent environmental pollution. On the other hand, the mold repair time is reduced because there is no peeling process during mold repair.

That is, the electroforming method treatment of the present invention provides a mold having a surface of a nickel nonferrous metal electrodeposition layer of uniform thickness with pinholes removed, thereby enabling precise and beautiful transfer of molded products. In the case of the mold of the present invention, if the surface is damaged, the master mold can be recycled only by electro-deposition of the nickel layer by the method of forming the pole.

In addition, this device has a uniform Ni electrodeposition layer of about 5mm thickness of 98% or more nickel metal on the basic surface of the metal by the second plating after the first plating, unlike the plating in the unit of μm in general plating surface treatment when forming the pole. The quality of mold plating is excellent even under the conditions of working in the plating bath for a long time to form a mold.

Claims (8)

A method for manufacturing a glass molding die, wherein the die casting is electroformed to manufacture a glass molding die, and the die is electroplated for 220 to 280 hours while being plated to a thickness of 4 to 6 mm. The method according to claim 1, wherein the electroplating solution is pressed into the die casting during electroforming and electroforming while stirring the solution. The method of claim 1, wherein the rotation is performed at 3-6 cycles / hr. The method according to claim 1, wherein the electroplating solution is pressed into the die casting during electroforming and electroforming while stirring the solution. The method of claim 1, wherein the plating solution for electroforming comprises 1 L of pure water, 40-60 g / L of nickel sulfamate, and 4-6 ml / L of a pit inhibitor, which is a surfactant. The method according to claim 4, wherein the pH of the plating solution for electroforming is 2 to 4. The method of claim 1, wherein the lower surface of the die casting is formed by blasting with A1203 # 40-180 mesh to form a roughness. A plating bath for storing the electroplating solution in which an anode is installed; A rotating device installed on an upper portion of the plating bath to support the mold casting to be rotatable in the plating bath; A filtration / overflow device for filtering and pressurizing the electroplating solution overflowing the partition wall installed in the plating bath to inject the lower portion of the plating bath; A blow system for injecting a plating solution into the plating bath to stir the whole plating solution itself; A regulating device for electrically connecting the rotating device, the plating bath equipped with an anode, the filtration / overflow system and the blow system to control their operation; Electroforming device for glass molding comprising.