KR19980039352A - Wafer mounting detector for semiconductor manufacturing process - Google Patents

Abstract

The present invention is a semiconductor manufacturing process for enabling accurate detection by placing an integrated sensor of the light emitting unit and the light receiving unit integrally above the passage through which the wafer to be inspected passes as a means for detecting whether the wafer is mounted in the semiconductor manufacturing process. It relates to a wafer mounting detection device.

Wafer mounting detection device for a semiconductor manufacturing process according to the present invention, the light emitting device and the light receiving device is integrally mounted on the bottom surface of the upper plate (2) of the '-' shaped holder (1) In addition, the wafer is passed directly below the integrated sensors 8 so that a signal output from the integrated sensor 8 is transmitted to the amplifier 7 and the reader 9 so that the light emitting element and the light receiver are received. It is easy to assemble and maintain by not aligning the elements, and it is possible to prevent the possibility of wafer misdetection due to contamination of the transparent glass 6 due to dust, etc., and to exhibit uniform inspection performance. There is.

Description

Wafer mounting detector for semiconductor manufacturing process

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensing device for a semiconductor manufacturing process for sensing whether or not a wafer to be subjected to a process required for semiconductor manufacturing is applied in manufacturing a semiconductor. More specifically, the present invention relates to a sensing device for mounting a wafer. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer mounting detection device for a semiconductor manufacturing process which enables accurate detection by placing an integrated sensor in which a light emitting unit and a light receiving unit are integrated directly above a passage through which a wafer to be inspected passes.

In order to manufacture a semiconductor device, various processes such as oxidation, masking, photoresist coating, etching, diffusion, and lamination, and cleaning, drying, and inspection performed before and after these processes are performed on the wafer as the material. It should be applied accordingly with various devices and instruments.

In the semiconductor manufacturing process, in particular, as the density increases, the contamination of the wafer itself must be thoroughly prevented. In most cases, the wafers during the process application are preferably loaded and unloaded automatically. To keep the process running, it is necessary to monitor whether the wafers are loaded and unloaded correctly.

1 schematically shows a configuration of a wafer mounting detection apparatus for a conventional semiconductor manufacturing process, which mounts a plurality of light emitting devices 4 on the bottom surface of the top plate 2 of the 'c' shaped holder 1, A plurality of light receiving elements 5 are mounted on the surface of the lower plate 3 of the fixing stand 1 so as to be arranged in a line with respect to the light emitting elements 4, and the light emitting elements 4 and the light receiving element 5 are provided. It is configured to allow the wafer to pass on the transparent glass 6 by fixing the transparent glass 6 therebetween. When the wafer to be processed on the transparent glass 6 passes, the light emitting element 4 Since the light emitted from the light beams is reflected by the wafer and the light does not reach the light receiving elements 5, it does not generate an electric output signal by the light from the light receiving elements 5, and conversely, the light transmitting glass 6) be managed up When the wafer to be passed does not pass, the light emitted from the light emitting elements 4 reaches the light receiving elements 5 through the light transmitting glass 6, thereby causing electricity by the light from the light receiving elements 5. It generates an output signal.

The electrical output signal generated by the light receiving elements 5 is transmitted to an amplifier 7 via an signal cable and amplified, and finally transferred to a control system for monitoring and subsequent loading / unloading of wafers. The overall process is automatically controlled by determining whether or not to start the treatment process.

The photoelectric sensor is mainly used as the light emitting elements 4 and the light receiving elements 5 in the wafer mounting detection apparatus for the conventional semiconductor manufacturing process, and the electrical output signals output from the light receiving elements 5 are the same. The cable was transferred to an amplifier 7 such as 3MD of the United States Banner (Banner) and amplified in the amplifier (7).

However, in the wafer mounting detection apparatus for the conventional semiconductor manufacturing process, since the light emitting elements 4 and the light receiving elements 5 are mounted separately from each other, these light emitting elements 4 and the light receiving elements 5 are accurately aligned. If the arrangement is misaligned, the sensitivity of the light-receiving elements 5 is lowered, so that it is impossible to accurately detect whether or not the wafer is mounted. In particular, the light-emitting elements 4 and the light-receiving elements 5 have a problem. When the distance between them slightly away, there is a problem that the sensitivity of the light receiving elements 5 is lowered as well as it is difficult to accurately arrange the light emitting elements 4 and the light receiving elements 5.

Furthermore, dust or foreign substances generated in the facilities are adsorbed on the surface of the light transmitting glass 6 positioned between the light emitting elements 4 and the light receiving elements 5 so that the light transmittance of the light transmitting glass 6 itself is reduced. If there was also a problem that the sensitivity of the light receiving element (5) is lowered.

In particular, since the distance between the light emitting elements 4 and the light receiving elements 5 becomes approximately 180 millimeters, the light sensitivity of the light emitting element 4 is reduced, and the alignment of the light emitting element 4 and the light receiving elements 5 is achieved. There was a problem that became more difficult.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer mounting detection apparatus for a semiconductor manufacturing process that does not require separate alignment between devices using an integrated sensor integrating a light emitting device and a light receiving device.

Another object of the present invention is to provide a wafer mounting detection device for a semiconductor manufacturing process that can be directly reflected from the surface of the wafer to be detected to detect whether the wafer is mounted.

1 is a schematic view showing a conventional wafer mounting detection apparatus for a semiconductor manufacturing process.

Figure 2 is a schematic diagram showing a wafer mounting detection apparatus for a semiconductor manufacturing process according to the present invention.

* Explanation of symbols for main parts of the drawings

1: holder 2: top plate

3: lower plate 4: light emitting element

5 light receiving element 6 light emitting glass

7: amplifier 8: integrated sensor

9: reader

Wafer mounting detection apparatus for a semiconductor manufacturing process according to the present invention for achieving the above object, a plurality of integrated sensors in which the light emitting element and the light receiving element is integrated on the bottom surface of the 'b' shaped fixing plate, the integrated The wafer is passed directly below the sensors, and the signal output from the integrated sensor is connected to the amplifier and the reader.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 2, the wafer mounting detecting apparatus for a semiconductor manufacturing process according to the present invention includes a plurality of integrated types in which a light emitting device and a light receiving device are integrated on a bottom surface of the top plate 2 of the 'b' shaped holder 1. The sensors 8 are mounted and a wafer is passed directly below the integrated sensor 8 so that a signal output from the integrated sensor 8 is transmitted to the amplifier 7 and the reader 9. .

In the above, the stator 1 may be formed by deforming the 'c' shaped stator 1 used in the wafer mounting detection apparatus for a conventional semiconductor manufacturing process so that only the upper plate 2 on which the light emitting device 4 is fixed remains. Can be.

The integrated sensor 8 is an integrated light emitting device and a light receiving device used in a conventional transmissive wafer mounting detection device, and is fixed in such a manner that the light emitting device and the light receiving device are arranged side by side in one plastic case. Those skilled in the art can be easily understood, as well as those that are mass-produced and commercially supplied by leading manufacturers can be purchased and used.

In the above, the amplifier 7 may be used that is compatible with the conventional amplifier 7 in the output signal processing, and those known to be commercially available to those skilled in the art can be used. It can be understood.

In addition, the reader 9 may be a commercially available reader 9 such as W / J 999 (W / J 999), and such a reader 9 may also be used by those skilled in the art. It is to be understood that known ones can be used so that they can be purchased and used commercially.

In the configuration as described above, the light emitted from the integrated sensor 8 is reflected from the surface of the wafer and re-inputted into the integrated sensor 8 when there is a wafer passing directly below the integrated sensor 8, and accordingly the input The light is output by the integrated sensor 8 as an output signal. The output signal is input to the amplifier 7 and the reader 9 via a conventional cable, amplified and subsequently signal processed according to the configuration of the system other than the sensing means described above to automatically load and unload the wafer. In addition, the wafer loading status can be continuously monitored and monitored to maintain normal system operation.

Therefore, according to the present invention, the light emitting device 4 and the light receiving device 5 are not aligned with each other, thereby making it easy to assemble and maintain.

In addition, according to the present invention, since there is no use of a separate fixed floodlight glass 6, it is possible to fundamentally prevent the occurrence of a misdetection of the wafer due to contamination of the floodlight glass 6 due to dust deposited on the vertically descending surface. It has an effect.

In addition, according to the present invention, it is possible to exert a uniform inspection performance by allowing a constant sensitivity to be maintained at all times without the need for a separate sensitivity adjustment by detecting whether the wafer is mounted by the direct reflection on the surface of the wafer. .

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (1)

In the wafer mounting detection device for a semiconductor manufacturing process, a plurality of integrated sensors in which a light emitting element and a light receiving element are integrated are mounted on a bottom surface of a top plate of a 'b' shaped holder, and a wafer passes under the integrated sensors. And a signal output from the integrated sensor is connected to be transmitted to an amplifier and a reader.