KR19980034198A - Solder Alloys for Soldering - Google Patents
Solder Alloys for Soldering Download PDFInfo
- Publication number
- KR19980034198A KR19980034198A KR1019960052163A KR19960052163A KR19980034198A KR 19980034198 A KR19980034198 A KR 19980034198A KR 1019960052163 A KR1019960052163 A KR 1019960052163A KR 19960052163 A KR19960052163 A KR 19960052163A KR 19980034198 A KR19980034198 A KR 19980034198A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- solder
- soldering
- solder alloy
- lead
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
납땜용 솔더 합금이 개시된다. 개시된 솔더 합금은 주석 50 내지 80 중량%, 안티몬 0.05 내지 10 중량%, 은 0.0001 내지 5 중량%, 인 0.0001 내지 0.5 중량% 및 납이 잔부(殘部)이고 불가피한 불순물이 첨가되어 이루어지며, 각 구성 성분과 첨가되는 함유량의 수치 한정으로 인하여 지니는 특성에 의해 납땜부의 피로특성이 저하되는 것을 억제하여 납땜 품질을 향상시키고, 솔더링시 금속산화물 발생이 억제되므로 솔더 손실의 최소화에 의한 원가절감 효과를 얻을 수 있다.A solder alloy for soldering is disclosed. The disclosed solder alloy is composed of 50 to 80% by weight of tin, 0.05 to 10% by weight of antimony, 0.0001 to 5% by weight of silver, 0.0001 to 0.5% by weight of phosphorus and the balance of lead and the addition of unavoidable impurities. Due to the limited value of the added content, the fatigue property of the soldered portion is suppressed from being lowered by the characteristics of the added content, and the soldering quality is improved, and the generation of metal oxides during the soldering is suppressed, thereby reducing the cost by minimizing the solder loss. .
Description
본 발명은 인쇄회로기판(PCB)에 칩 등의 전자부품을 실장하기 위해 사용되는 납땜용 솔더 합금(solder alloy)에 관한 것으로서, 특히 납땜부의 피로 강도를 향상시킨 납땜용 솔더 합금에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to solder alloys used for mounting electronic components such as chips on printed circuit boards (PCBs), and more particularly to solder solder alloys having improved fatigue strength of soldered sections.
주지된 바와 같이 솔더링(soldering)은 납땜을 이용한 접합기술로서, 특히 인쇄회로기판(PCB)에 반도체 칩, 저항 칩 등의 소형 전자부품을 실장하기 위해 주로 이용되고 있다. 이러한 납땜을 이용한 접합기술은 최근 전자제품의 소형경량화, 고기능화에 따라 부품장착의 고밀도화가 요구되므로 한층 더 고도화된 수준이 요구되고 있다. 즉, 부품장착의 고밀도화로 인하여 인쇄회로기판(PCB)과 실장 부품 및 솔더 등이 온도변화나 열팽창 차이, 진동 등에 의한 반복응력의 영향을 보다 더 많이 받게 되므로, 납땜접합부에 있어서 솔더 합금 조직이 조대화되어 피로파괴 등에 의한 균열이 발생된다. 이러한 납땜부의 균열은 예컨대, 인쇄회로기판에 실장된 부품의 단선불량과 같은 치명적인 결함 발생의 요인으로 작용된다.As is well known, soldering is a bonding technique using soldering, and is mainly used for mounting small electronic components such as semiconductor chips and resistance chips on a printed circuit board (PCB). Joining technology using such a solder is required to be more advanced because of the high density of component mounting in accordance with the recent miniaturization and high functionality of electronic products. In other words, due to the higher density of component mounting, PCBs, mounting components, and solder are more affected by repeated stress due to temperature change, thermal expansion difference, vibration, etc. The cracking occurs due to fatigue. Such cracks in the soldering part act as a cause of fatal defects such as disconnection failure of components mounted on a printed circuit board.
한편, 종래에는 인쇄회로기판에 전자부품을 장착하기 위한 솔더링 재료로서 주석(Sn)과 납(Pb)으로 이루어진 2원계 공정합금을 사용하였다. 이러한 종래의 솔더 합금은 얼마전까지 그다지 큰 문제점이 없는 좋은 접합재료로 각광 받아 왔다.Meanwhile, in the related art, a binary process alloy made of tin (Sn) and lead (Pb) has been used as a soldering material for mounting an electronic component on a printed circuit board. This conventional solder alloy has been spotlighted as a good bonding material without a big problem until recently.
그러나, 최근 전기전자제품의 박형화 및 소형화 추세에 따라 부품장착의 고밀도화가 필수적으로 진행되고 있으며, 이러한 부품장착의 고밀도화는 예컨대, 인쇄회로기판의 프린트 패턴 및 납땜부의 랜드를 협소한 상태로 하게 되므로, 이러한 상태에서 상기한 기존의 솔더 합금을 사용하게 되면 납땜부의 납의 양이 감소되어 접합강도의 저하 및 피로 파괴 등이 발생하는 문제점이 있다.However, with the recent trend toward thinning and miniaturization of electrical and electronic products, the densification of component mounting is inevitably progressed, and such densification of component mounting causes, for example, the printed pattern of the printed circuit board and the land of the soldered portion to be narrow. In this state, when the conventional solder alloy is used, the amount of lead in the soldering portion is reduced, resulting in a decrease in joint strength and fatigue breakdown.
본 발명이 이루고자 하는 기술적 과제는 상기한 바와 같은 종래의 솔더 합금이 가지는 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 납땜부의 강도와 피로 특성을 향상시킨 납땜용 솔더 합금을 제공하는 것이다. 그리고, 상기 본 발명에 의한 솔더 합금의 분말이 함유된 크림 솔더와, 성형 솔더 및 수지가 개재된 와이어 솔더를 제공함에 그 다른 목적이 있다.The technical problem to be achieved by the present invention is to solve the problems of the conventional solder alloy as described above, the object of the present invention is to provide a solder alloy for soldering to improve the strength and fatigue characteristics of the soldering portion. Another object of the present invention is to provide a cream solder containing the powder of the solder alloy according to the present invention, and a wire solder with a molded solder and a resin interposed therebetween.
상기한 목적을 달성하기 위하여 본 발명에 의한 솔더 합금은, 주석 50 내지 80 중량%, 안티몬 0.05 내지 10 중량%, 은 0.0001 내지 5 중량%, 인 0.0001 내지 0.5 중량% 및 납이 잔부(殘部)이고 불가피한 불순물이 첨가되어 이루어진 것을 특징으로 한다.In order to achieve the above object, the solder alloy according to the present invention is 50 to 80% by weight of tin, 0.05 to 10% by weight of antimony, 0.0001 to 5% by weight of silver, 0.0001 to 0.5% by weight of phosphorus and the balance of lead. It is characterized in that the inevitable impurities are added.
상기 본 발명에 의한 솔더 합금에 있어서, 상기 납의 일부는 상기 솔더 합금 전체 중량의 0.01 내지 1중량%의 구리, 0.01 내지 5중량%의 비스무스, 0.01 내지 5중량%의 니켈, 0.001 내지 0.5중량%의 게르마늄, 0.001 내지 1중량%의 텔루륨, 0.001 내지 1중량%의 갈륨 및 0.001 내지 1중량%의 인듐 중에서 선택된 1종 이상이 치환되어 첨가될 수 있다. 그리고, 상기 본 발명에 의한 솔더 합금은 그 분말이 함유된 크림 솔더와, 성형 솔더 및 수지가 개재된 와이어 솔더로 사용될 수 있다.In the solder alloy according to the present invention, a part of the lead is 0.01 to 1% by weight of copper, 0.01 to 5% by weight of bismuth, 0.01 to 5% by weight of nickel, and 0.001 to 0.5% by weight of the total weight of the solder alloy. One or more selected from germanium, 0.001 to 1 wt% tellurium, 0.001 to 1 wt% gallium, and 0.001 to 1 wt% indium may be substituted and added. The solder alloy according to the present invention may be used as a cream solder containing the powder, a wire solder with a molding solder and a resin interposed therebetween.
이하, 본 발명에 의한 납땜용 솔더 합금을 상세히 설명한다. 먼저, 본 발명의 솔더 합금에 첨가되는 각 성분 원소들의 작용 특성 및 그 첨가량의 수치 한정에 대한 이유에 대해 살펴보면 다음과 같다.Hereinafter, the solder alloy for soldering according to the present invention will be described in detail. First, the operation characteristics of the respective element elements added to the solder alloy of the present invention and the reasons for the numerical limitation of the amount added are as follows.
주석(Sn)은 솔더 합금의 제조비용에 큰 영향을 미치는 원소로서, 그 함량이 너무 많거나 적으면 솔더 합금의 융점이 높아져 납땜시 납땜품질이 저하되어 부품의 내구성에 악영향을 미치는 특성을 가진다. 이러한 특성을 감안하여 본 발명에 의한 솔더 합금에서는 그 함량의 적정범위가 50 내지 80중량%로 한정되었다.Tin (Sn) is an element that has a great influence on the manufacturing cost of the solder alloy. If the content is too high or too small, the melting point of the solder alloy is increased, and soldering quality is degraded, thereby adversely affecting the durability of the component. In view of these characteristics, the solder alloy according to the present invention was limited to an appropriate range of 50 to 80% by weight.
안티몬(Sb)은 솔더의 강도를 증가시키기 위한 목적으로 첨가되며, 그 첨가량이 증가하게 되면 솔더의 유동성이 저하되어 납 퍼짐성과 젖음성이 저하된다. 특히 첨가량이 10중량%를 넘게되면 용융 솔더의 표면이 불용성 상태로 되어 납땜품질이 저하되고, 브릿지(Bridge) 등의 불량이 유발된다. 이러한 특성을 가지는 안티몬은 그 첨가량이 0.05중량% 이하가 첨가될 경우에는 사실상 안티몬을 첨가하여 얻을 수 있는 특성 효과를 기대할 수 없기 때문에, 본 발명에 의한 솔더 합금에서는 안티몬 함량의 적정범위가 0.05 내지 10중량%로 한정되었다.Antimony (Sb) is added for the purpose of increasing the strength of the solder, and when the amount is increased, the flowability of the solder is lowered, lead spreading and wettability is lowered. In particular, when the added amount is more than 10% by weight, the surface of the molten solder becomes insoluble and the soldering quality is lowered, resulting in a defect such as a bridge. When antimony having such a property is added in an amount of 0.05 wt% or less, virtually no antimony can be obtained by adding antimony. Therefore, in the solder alloy according to the present invention, an appropriate range of antimony content is 0.05 to 10. Limited to weight percent.
은(Ag)의 경우 솔더의 강도를 증가시킴과 동시에 연성을 높이기 위한 목적으로 첨가되지만, 고가이므로 그 특성의 영향을 미치게 하는데 지장이 없는한 소량을 첨가하는 것이 바람직하다. 따라서, 본 발명에 의한 솔더 합금에서는 은 함량의 적정범위가 0.0001 내지 5중량%로 한정되었다.Silver (Ag) is added for the purpose of increasing the strength of the solder and at the same time increasing the ductility, but since it is expensive, it is preferable to add a small amount as long as it does not affect the properties. Therefore, in the solder alloy according to the present invention, the appropriate range of silver content is limited to 0.0001 to 5% by weight.
인(P)은 미소량을 첨가하게 되는 경우에 있어서도 솔더의 특성에 큰 영향을 미치는 합금 원소로서, 솔더의 강도를 증가시키고 산화물의 반응을 억제하여 납땜부의 열응력 및 진동 등에 견딜 수 있는 내스트레스성을 향상시킨다. 이러한 특성을 가지는 인은 첨가량이 0.0001중량% 이하일 경우에는 솔더 합금에 그 특성의 영향을 거의 미치지 못하게 된다. 그리고, 0.5 중량% 이상이 첨가되는 경우에도 마찬가지이며, 오히려 솔더의 유동성이 저하되는 등의 악영향을 미치게 되므로 본 발명에 의한 솔더 합금에서는 인의 적정 함량범위가 0.0001 내지 0.5중량%로 한정되었다.Phosphorus (P) is an alloying element that has a great influence on the properties of the solder even when a small amount is added. The phosphorus (P) increases the strength of the solder and suppresses the reaction of the oxide to resist thermal stress and vibration of the soldered portion. Improve sex. Phosphorus having such properties hardly affects the properties of the solder alloy when the added amount is 0.0001% by weight or less. In addition, the same applies to the addition of 0.5% by weight or more, but rather adversely affects the flowability of the solder, etc. In the solder alloy according to the present invention, the proper content range of phosphorus is limited to 0.0001 to 0.5% by weight.
이상에서와 같이 본 발명의 솔더 합금에 첨가되는 각 성분원소들의 함유량에 대한 수치의 한정은 이하에서 기재하는 솔더 합금의 주요 특성을 고려하여 설정된 것으로서, 그 특성에 대해 살펴보면 다음과 같다.As described above, the limitation of the numerical value of the content of each component element added to the solder alloy of the present invention is set in consideration of the main characteristics of the solder alloy described below, and the characteristics thereof are as follows.
첫째로, 솔더 합금은 솔더링시 산화되는 양이 적을수록 좋다. 그 이유는 용융솔더의 주석, 납 등의 금속원소가 대기중의 산소와 반응함으로써 금속산화물을 형성하여 산화되는데, 이러한 금속산화물은 예컨대, 솔더링시 인쇄회로기판과 부품의 접합력을 저하시킨다. 또한, 산화반응에 의한 금속산화물의 생성은 솔더의 손실을 초래하게 될 뿐만 아니라, 솔더링 이후에도 기계적, 열적 스트레스에 의해 납땜부에 쉽게 크랙이 발생하게 되는 요인이 된다.First, the lower the amount of oxidized during soldering the solder alloy is better. The reason for this is that metal elements such as tin and lead in the molten solder react with oxygen in the atmosphere to form metal oxides, which are oxidized. Such metal oxides reduce the bonding strength between the printed circuit board and the component during soldering. In addition, the generation of metal oxides by the oxidation reaction not only causes loss of solder, but also causes cracking easily in the soldering part due to mechanical and thermal stress after soldering.
둘째로, 솔더 합금은 납땜 품질을 높이기 위해 적절한 융점 및 응고점을 가져야 한다. 그 이유는 융점이 너무 높으면 솔더링시 높은 납땜온도가 필요하고, 그 높은 온도로 인하여 접합 부품 등의 내구성에 치명적인 영향을 미치게 된다. 반면에, 융점이 너무 낮으면 제품 사용중에 납땜부 주위로 전달되는 열에 의해 솔더가 연화되어 접합특성이 저하된다. 또한, 솔더 합금의 액상선과 고상선의 온도차이가 너무 크면 솔더링후 냉각과정에서 납땜부가 불완전한 상태로 냉각되어 신뢰성이 저하된다.Secondly, the solder alloy must have a suitable melting point and freezing point to improve solder quality. The reason is that if the melting point is too high, a high soldering temperature is required for soldering, and the high temperature has a fatal effect on the durability of the joined part. On the other hand, if the melting point is too low, the solder softens due to heat transferred around the soldering portion during the use of the product, thereby degrading the bonding property. In addition, if the temperature difference between the liquidus and the solidus of the solder alloy is too large, the soldering portion is cooled in an incomplete state during the cooling process after soldering, thereby lowering reliability.
셋째로, 솔더 합금은 용융상태에서의 퍼짐성이 좋아야 한다. 그 이유는 실제로 솔더링에 소요되는 시간은 수초정도의 짧은 시간이므로 솔더가 쉽고 빠르게 퍼져야만 인쇄회로기판에 부품이 견고하게 접합되기 때문이다.Third, the solder alloy should have good spreadability in the molten state. The reason is that the time required for soldering is actually a short time of several seconds, so that the components are firmly bonded to the printed circuit board only when the solder spreads easily and quickly.
하기 표 1은 상기한 바와 같은 솔더 합금의 특성을 알아보기 위하여 본 발명에 따른 솔더 합금과 기존의 솔더 합금을 비교하여 시험한 결과를 나타내 보인 것이다.Table 1 shows the results of the test by comparing the solder alloy according to the present invention and the conventional solder alloy in order to find out the properties of the solder alloy as described above.
하기 표 1에 기재된 비교예 1은 현재 인쇄회로기판의 부품 납땜용으로 통상 사용되고 있는 Sn63%-Pb37% 공정솔더를 이용한 것이고, 실시예 1 내지 실시예 9는 본 발명에 따른 솔더 합금으로서 불활성 분위기에서 본 발명의 청구범위에 기재된 각 구성 성분 및 수치 한정된 범위 이내의 조성을 갖도록 제조된 것이다.Comparative Example 1 described in Table 1 below uses Sn63% -Pb37% process solder currently used for soldering parts of printed circuit boards. Examples 1 to 9 are solder alloys according to the present invention in an inert atmosphere. It is prepared to have a composition within each component and numerically defined range described in the claims of the present invention.
산화량 시험은 비교예 1과 실시예 1 내지 실시예 9의 솔더 합금을 동일한 크기의 용기와 교반기를 이용하여 시험하였으며, 그 상대적인 발생량을 측정하여 수득한 결과를 표 1에 나타낸 것이다. 그리고, 퍼짐성 시험은 동판을 이용하여 약 245 °C 에서 행하였으며, 납땜강도는 9 PIN의 커넥터를 사용하여 납땜후 10mm/sec 속도로 납땜강도를 측정하여 수득한 결과를 표 1에 나타내었다.In the oxidation amount test, the solder alloys of Comparative Example 1 and Examples 1 to 9 were tested using a container and a stirrer of the same size, and the results obtained by measuring their relative amounts are shown in Table 1. And, the spreadability test was performed at about 245 ° C using a copper plate, the soldering strength is shown in Table 1 by measuring the soldering strength at a rate of 10mm / sec after soldering using a 9 PIN connector.
상기 표 1에서 알 수 있듯이 본 발명에 의한 솔더 합금은 기존의 솔더 합금과 동일한 수준의 퍼짐성을 유지하면서, 산화량의 발생이 적은 동시에 납땜강도 및 크리프 수명이 보다 더 우수한 특성을 가진다.As can be seen in Table 1, the solder alloy according to the present invention maintains the same level of spreadability as that of the conventional solder alloy, while having less generation of oxidation amount and having better solder strength and creep life.
본 발명에 의한 솔더 합금 및 그 분말이 함유된 크림 솔더와 성형 솔더 및 수지가 개재된 와이어 솔더는 납땜부의 피로특성이 저하되는 것을 억제하여 납땜 부품의 내구성을 향상시키고, 솔더링시 금속산화물 발생이 억제되므로 솔더 손실의 최소화에 의한 원가절감 효과를 얻을 수 있다.The solder alloy according to the present invention and the cream solder containing the powder and the wire solder with the molded solder and the resin are suppressed from deterioration of the fatigue characteristics of the soldered portion to improve the durability of the soldered part and suppress the generation of metal oxides during soldering. Therefore, cost reduction effect by minimizing solder loss can be obtained.
Claims (6)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960052163A KR100200638B1 (en) | 1996-11-05 | 1996-11-05 | Soldering flux composition |
| US08/961,021 US6033488A (en) | 1996-11-05 | 1997-10-30 | Solder alloy |
| GB9723049A GB2319039B (en) | 1996-11-05 | 1997-10-31 | Solder alloy |
| JP30318597A JP3199674B2 (en) | 1996-11-05 | 1997-11-05 | Solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960052163A KR100200638B1 (en) | 1996-11-05 | 1996-11-05 | Soldering flux composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980034198A true KR19980034198A (en) | 1998-08-05 |
| KR100200638B1 KR100200638B1 (en) | 1999-06-15 |
Family
ID=19480861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960052163A KR100200638B1 (en) | 1996-11-05 | 1996-11-05 | Soldering flux composition |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100200638B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101142815B1 (en) * | 2008-02-22 | 2012-05-08 | 하리마 카세이 가부시키가이샤 | Solder bonding structure and soldering flux |
-
1996
- 1996-11-05 KR KR1019960052163A patent/KR100200638B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101142815B1 (en) * | 2008-02-22 | 2012-05-08 | 하리마 카세이 가부시키가이샤 | Solder bonding structure and soldering flux |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100200638B1 (en) | 1999-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1889684B1 (en) | Lead-free solder alloy | |
| US7682468B2 (en) | Lead-free solder alloy | |
| JP3199674B2 (en) | Solder alloy | |
| US6139979A (en) | Lead-free solder and soldered article | |
| US8216395B2 (en) | Lead-free solder alloy | |
| EP1088615B1 (en) | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same | |
| EP0476734B1 (en) | Dispersion strengthened lead-tin alloy solder | |
| KR102240216B1 (en) | Method for soldering surface-mount component and surface-mount component | |
| US20090129970A1 (en) | Pb free solder alloy | |
| EP0629465A1 (en) | Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium | |
| US20040241039A1 (en) | High temperature lead-free solder compositions | |
| KR19980086730A (en) | Solder Materials and Electronic Components Using the Same | |
| KR100200638B1 (en) | Soldering flux composition | |
| KR100230269B1 (en) | Solder alloy | |
| JP2910527B2 (en) | High temperature solder | |
| JP2001244622A (en) | Electronic circuit device | |
| KR100904652B1 (en) | Pb free solder Composition for wave and deeping, electronic equipment and PCB with the same | |
| KR100460957B1 (en) | Soldering flux for Pb-free alloy solder | |
| KR100453074B1 (en) | solder alloy | |
| KR100454486B1 (en) | A electronic equipment and PCB with a solder alloy | |
| JPH10109187A (en) | Solder alloy for fitting electronic parts | |
| JP2003080364A (en) | Assembling inspection method of electronic parts and electronic circuit board and electronic appliance manufactured by using the same method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20080228 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |