KR19980033867A - Semiconductor devices - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor device having improved connection between a cell region and a pad portion. In the semiconductor device according to the present invention, a first conductive film formed in a peripheral region in which semiconductor devices are not formed is electrically connected to a portion of the cell region, and the first conductive film and the pad portion are electrically connected to a second conductive film. Has a configuration. By such a device, short circuits with other pads can be prevented when the cell region and the pad are connected, and the area of the chip can be efficiently used by utilizing the peripheral region where the semiconductor element is not formed.

Description

A device of semiconductor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device having improved connection portions between a cell region and a pad portion.

Due to the rapid development of integration technology, semiconductor devices are gradually miniaturized. Therefore, development of a chip that performs a maximum function with a small area is actively progressing. In the manufacturing process of a semiconductor device, one of methods for reducing the area of a chip is to reduce the area of the pad for connection and to reduce the size of the cell area.

FIG. 1A illustrates a connection between a cell region 10 and a pad portion 30 of a conventional semiconductor device, and shows that a short circuit occurs between other pads when the cell region 10 and the pad are connected to each other.

Referring to FIG. 1A, reference numeral 10 is a cell region in which a semiconductor element is formed, 20 is a peripheral region in which only a guard ring is formed without a semiconductor element is formed, and 30 is a semiconductor element formed in the cell region 10. Is a pad portion having a pad for electrically connecting the external to the outside, 40 is a connection region necessary for electrical connection, and 50 is a first metal wiring used for connection between the cell region 10 and the pad portion 30. It is shown.

FIG. 1B is an enlarged view for explaining that a short circuit occurs during connection between the cell region 10 and the pad portion 30. FIG. 1B illustrates that a short circuit occurs between adjacent pads when a minimum separation distance required for connection is secured. .

Referring to FIG. 1B, a spacing distance of at least 20 μm is required between pads in order to prevent short circuits between adjacent pads when the cell region 10 and the pad unit 30 are connected to each other. In order to secure such a separation distance, attention should be paid to the arrangement of the pads 30 and the formation of the metal lines 50.

However, according to the conventional semiconductor device, although the area of the cell region is greatly reduced with the integration of semiconductor elements, the pad connection technique for connecting to the outside does not reach the reduction of the area of the cell region at the state of the art. Therefore, there is a problem that it is difficult to match the electrical connection between the cell region 10 and the pad 30 to 1: 1 without increasing the area of the chip. Therefore, when the cell area 10 and the pad 30 are relatively smaller than the size of the pad 30, the pads 30 are arranged at least required distances from each other. In the case of ball bonding, the necessary connection area 40 is not secured, thereby causing a problem of electrically shorting with the adjacent pads.

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above problems, and an object thereof is to provide a semiconductor device capable of preventing a short circuit between adjacent pads during electrical connection of a cell region and a pad portion.

1 is a view schematically showing a connection between a cell region and a pad portion of a conventional semiconductor device;

2 is a view schematically illustrating a connection between a cell region and a pad portion of a semiconductor device according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: cell area 20: peripheral area

30: pad portion 40: connection area

50: first metal wiring 60: second metal wiring

(Configuration)

According to a feature of the present invention for achieving the above object, in a semiconductor device having a cell region in which semiconductor elements are formed and a pad portion for electrical connection with the cell region, the semiconductor device is a semiconductor element. The first conductive film formed in the peripheral region where the holes are not formed is electrically connected to a portion of the cell region, and the first conductive film and the pad portion are electrically connected by the second conductive film.

In a preferred embodiment of this feature, the first conductive film is composed of a second metal wiring.

In a preferred embodiment of this feature, the second conductive film is composed of a first metal wiring.

(Action)

Such a device can facilitate the electrical connection between the cell region and the pad by using a peripheral region in which no semiconductor element is formed, and can also solve the problem of shorting with other pads at the time of connection.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 2A to 2B.

Referring to FIG. 2A, a novel semiconductor device according to a preferred embodiment of the present invention forms a conductive film in a peripheral region in which a semiconductor element is not formed, electrically connects the conductive film to a portion of the cell region, and connects the conductive film. It is configured by connecting with a pad for external connection. Such a device enables electrical connection between the cell area and the pad without increasing the overall chip area.

In Figs. 2A to 2B, the same reference numerals are given to components that perform the same functions as the components shown in Figs. 1A to 1B.

FIG. 2A is a diagram schematically illustrating a configuration of a semiconductor device according to an exemplary embodiment of the present invention, and illustrates a connection between a cell region 10 and a pad unit 30 using a peripheral region 20.

Referring to FIG. 2A, the second metal wiring 60 is formed in the peripheral region 20 where the semiconductor device is not formed, and a portion of the cell region 10 is electrically connected to the second metal wiring 60. Let's do it. Subsequently, the second metal wire 60 and the pad part 30 are electrically connected by using the first metal wire 50. In this case, since the peripheral region 20 is located at the edge of the chip, the semiconductor element is not formed, and is formed as P ⁺ or N ⁺ to serve as a guard ring, and thus is not related to the function of the semiconductor chip. to be.

FIG. 2B is a partially enlarged view of the semiconductor device of FIG. 2A and illustrates that the cell region 10 and the pad unit 30 are connected without increasing the total area of the chip.

Referring to FIG. 2B, the connection area 40 required for the external connection with the pad can be sufficiently secured to solve the problem of shorting with the adjacent pads, as well as the cell region 10 and the pads. The connection between the units 30 can also be easily performed.

In the conventional semiconductor device, there is a problem in that a short circuit with a neighboring pad occurs during electrical connection between the cell region where the semiconductor element is formed and the pad for connection with the outside.

According to the present invention for solving such a problem, a conductive film is formed in a peripheral region where a semiconductor element is not formed, and the cell region and the pad are electrically connected using the conductive film.

Therefore, the electrical connection between the cell area and the pad can be easily performed without increasing the area of the semiconductor chip, and the area of the semiconductor chip can be efficiently used by using the peripheral area where the circuit is not formed. .

Claims (3)

In a semiconductor device having a cell region 10 in which semiconductor elements are formed and a pad portion 30 for electrical connection with the cell region 10, In the semiconductor device, the first conductive film 60 formed in the peripheral region 20 in which the semiconductor elements are not formed is electrically connected to a portion of the cell region 10, and is formed by the second conductive film 50. And the pad portion (30) is electrically connected to the first conductive film (60). The method of claim 1, The first conductive film (60) is a semiconductor device, characterized in that composed of a second metal wiring. The method of claim 1, The second conductive film (50) is a semiconductor device, characterized in that composed of a first metal wiring.