KR19980028597A - Semiconductor devices - Google Patents
Semiconductor devices Download PDFInfo
- Publication number
- KR19980028597A KR19980028597A KR1019960047720A KR19960047720A KR19980028597A KR 19980028597 A KR19980028597 A KR 19980028597A KR 1019960047720 A KR1019960047720 A KR 1019960047720A KR 19960047720 A KR19960047720 A KR 19960047720A KR 19980028597 A KR19980028597 A KR 19980028597A
- Authority
- KR
- South Korea
- Prior art keywords
- gold
- alloy layer
- semiconductor device
- semiconductor chip
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
본 발명은 반도체 장치에 관한 것으로서, 금-티타늄 합금층, 금-티타늄 합금층 위에 형성되어 있는 금-주석 합금층, 금-주석 합금층 위에 형성되어 있는 반도체칩으로 이루어져 있다. 이 반도체칩을 리드 프레임과 연결시키는 다이 접착이 용이한 반도체 장치에 관한 것이다.The present invention relates to a semiconductor device, and comprises a gold-titanium alloy layer, a gold-tin alloy layer formed on a gold-titanium alloy layer, and a semiconductor chip formed on a gold-tin alloy layer. The present invention relates to a semiconductor device that is easily adhered to a die for connecting the semiconductor chip to a lead frame.
Description
본 발명은 반도체 장치에 관한 것으로서, 특히 갈륨비소 기판 위에 회로를 설계한 반도체칩의 다이 접착이 용이한 반도체 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which die bonding of a semiconductor chip having a circuit designed on a gallium arsenide substrate is easy.
반도체 조립에서 다이 접착(die attach)은 반도체칩을 리드 프레임에 접착하는 것으로서 은-에폭시(Ag-epoxy)를 이용한 본딩 방식을 주로 사용한다. 또는 리본 솔더(ribbon solder)를 이용하기도 한다.In the semiconductor assembly, die attach is a bonding method using silver-epoxy, which bonds a semiconductor chip to a lead frame. Alternatively, ribbon solder may be used.
도1은 종래의 반도체 장치를 나타낸 단면도이다.1 is a cross-sectional view showing a conventional semiconductor device.
즉, 종래의 다이 접착 장치를 도1을 참고로 하여 설명하면 다음과 같다. 먼저, 리드 프레임과 반도체칩을 접착시킨다. 반도체칩으로 실리콘 또는 갈륨-비소 기판을 사용하는데 갈륨-비소 기판을 사용한 반도체칩은 금-티타늄 합금층이 도포되어 있다. 리드 프레임과 반도체칩이 에폭시에 의해 접착되면 에폭시 자체가 가지고 있는 저항 성분으로 인하여 반도체칩 특성이 나빠지기 쉽다. 따라서 수율이 낮아지며 작업의 번거로움이 뒤따르는 문제점이 있다.That is, a conventional die bonding apparatus will be described with reference to FIG. 1 as follows. First, the lead frame and the semiconductor chip are bonded together. Silicon or gallium arsenide substrates are used as semiconductor chips, and semiconductor chips using gallium arsenide substrates are coated with a gold-titanium alloy layer. When the lead frame and the semiconductor chip are bonded by epoxy, the characteristics of the semiconductor chip tend to be deteriorated due to the resistance component of the epoxy itself. Therefore, there is a problem that the yield is low and the hassle of working.
그러므로 본 발명에 따른 반도체 장치는 다이 접착시에 발생하는 문제점 방지하는 반도체 장치를 제공하고자 한다.Therefore, the semiconductor device according to the present invention is to provide a semiconductor device that prevents the problems caused during die bonding.
도1은 종래의 반도체 장치를 나타낸 단면도이고,1 is a cross-sectional view showing a conventional semiconductor device,
도2는 본 발명의 실시예에 따른 반도체 장치를 나타낸 단면도이다.2 is a cross-sectional view illustrating a semiconductor device in accordance with an embodiment of the present invention.
이러한 과제를 달성하기 위한 본 발명에 따른 반도체 장치는,The semiconductor device according to the present invention for achieving such a problem,
금-티타늄 합금층,Gold-titanium alloy layer,
상기 금-티타늄 합금층 위에 형성되어 있는 금-주석 합금층,A gold-tin alloy layer formed on the gold-titanium alloy layer,
상기 금-주석 합금층 위에 형성되어 있는 반도체칩을 포함하고 있다.The semiconductor chip is formed on the gold-tin alloy layer.
여기서, 반도체칩은 갈륨-비소를 기판으로 사용한 반도체 소자로서 구동FET 또는 파워FET 등을 말한다.Here, the semiconductor chip is a semiconductor element using gallium arsenide as a substrate, and refers to a driving FET or a power FET.
여기서, 반도체칩은 약 320℃ 정도의 온도에서 소자 특성이 나빠지는데 금-주석 합금층은 공융점(eutectic point)이 290℃이므로 다이 접착시 반도체칩은 온도에 의한 악영향을 받지 않는다.Here, the semiconductor chip is deteriorated in the device characteristics at a temperature of about 320 ℃ but the eutectic point (eutectic point) of the gold-tin alloy layer (290 ℃) semiconductor chip is not adversely affected by the temperature during die bonding.
또한 이러한 반도체 장치는 에폭시 등을 사용하지 않고도 리드 프레임을 반도체칩에 접착시킬 수 있다.In addition, such a semiconductor device can adhere a lead frame to a semiconductor chip without using an epoxy or the like.
그러면 본 발명에 따른 반도체 장치의 실시예를 본 발명이 속하는 분야에서 통상의 지식을 가진자가 용이하게 실시할 수 있을 정도로 상세히 설명한다.An embodiment of a semiconductor device according to the present invention will now be described in detail so that a person skilled in the art can easily implement the present invention.
도2는 본 발명의 실시예에 따른 반도체 장치를 나타낸 단면도이다.2 is a cross-sectional view illustrating a semiconductor device in accordance with an embodiment of the present invention.
도2에 도시한 바와 같이, 본 발명의 실시예에 따른 반도체 장치는 다음과 같이 이루어진다.As shown in Fig. 2, the semiconductor device according to the embodiment of the present invention is made as follows.
금과 티타늄으로 이루어진 금-티타늄 합금층(100), 금-티타늄 합금층(100) 위에 형성되어 있는 금-주석 합금층(200), 금-주석 합금층(200) 위에 형성되어 있는 반도체칩(300)으로 이루어진다.Gold-Titanium alloy layer 100 made of gold and titanium, gold-tin alloy layer 200 formed on the gold-titanium alloy layer 100, semiconductor chip formed on the gold-tin alloy layer 200 ( 300).
이러한 반도체 장치는 리드 프레임 위에 반도체 칩 접합 장치가 놓여지며 직접 접착 방식에 의해 다이 접착이 이루어진다.In such a semiconductor device, a semiconductor chip bonding apparatus is placed on a lead frame, and die bonding is performed by a direct bonding method.
여기서, 반도체칩(300)은 갈륨-비소를 기판으로 사용한 반도체 소자로서 예를들면 구동FET 또는 파워FET 등을 말하며, 이 반도체칩(300)은 약 300℃ 이상Here, the semiconductor chip 300 is a semiconductor element using gallium arsenide as a substrate, for example, a driving FET or a power FET, and the semiconductor chip 300 is about 300 ° C. or more.
의 온도에서 소자 특성이 나빠진다.The device characteristics deteriorate at the temperature of.
한편 금-주석 합금층은 금속 접착제로서 그 두께는 17000Å 내지 23000Å이고 금과 주석의 구성비는 80 대 20인 것이 바람직하다. 이 금-주석 합금층의 공융점은 대략 290℃이다.On the other hand, the gold-tin alloy layer is a metal adhesive, the thickness is 17000 kPa to 23000 kPa, and the composition ratio of gold and tin is preferably 80 to 20. The eutectic point of this gold-tin alloy layer is about 290 degreeC.
그러므로 이상에서 언급한 반도체 장치는 반도체칩에 악영향을 주는 온도보다 낮은 온도에서 다이 접착을 접합할 수 있다.Therefore, the above-mentioned semiconductor device can bond die bonding at a temperature lower than the temperature which adversely affects the semiconductor chip.
또한 이러한 반도체 장치는 에폭시 등을 사용하지 않고도 리드 프레임을 반도체칩에 접착시킬 수 있는 장점이 있다.In addition, such a semiconductor device has an advantage in that the lead frame can be adhered to a semiconductor chip without using an epoxy or the like.
따라서 본 발명에 따른 반도체 장치는 다이 접착시 에폭시 공정없이 다이 접착을 할 수 있는 장점이 있다.Therefore, the semiconductor device according to the present invention has an advantage in that die bonding can be performed without epoxy process.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960047720A KR100200364B1 (en) | 1996-10-23 | 1996-10-23 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960047720A KR100200364B1 (en) | 1996-10-23 | 1996-10-23 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980028597A true KR19980028597A (en) | 1998-07-15 |
| KR100200364B1 KR100200364B1 (en) | 1999-06-15 |
Family
ID=19478568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960047720A KR100200364B1 (en) | 1996-10-23 | 1996-10-23 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100200364B1 (en) |
-
1996
- 1996-10-23 KR KR1019960047720A patent/KR100200364B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100200364B1 (en) | 1999-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5888847A (en) | Technique for mounting a semiconductor die | |
| KR100724030B1 (en) | Semiconductor module | |
| WO2003083545A3 (en) | Assembly of active optical devices on a substrate | |
| US20080135990A1 (en) | Stress-improved flip-chip semiconductor device having half-etched leadframe | |
| US5789820A (en) | Method for manufacturing heat radiating resin-molded semiconductor device | |
| IE830707L (en) | Semiconductor device | |
| JPH02278740A (en) | Packaging of semiconductor device | |
| JPH01241828A (en) | Semiconductor package | |
| KR100200364B1 (en) | Semiconductor device | |
| JPH0555635A (en) | Flip chip connection structure of electronic part | |
| JPH08115928A (en) | Semiconductor device, and its manufacture | |
| US7579680B2 (en) | Packaging system for semiconductor devices | |
| KR100385870B1 (en) | Semiconductor device and a method for assembling the same | |
| JPS6262545A (en) | Chip carrier and manufacture thereof | |
| US5706577A (en) | No fixture method to cure die attach for bonding IC dies to substrates | |
| US20030071347A1 (en) | Semiconductor chip packaging device and method of manufacturing the same | |
| JPS63293963A (en) | Resin-sealed semiconductor device | |
| JPH0529484A (en) | Ic chip mounting structure | |
| KR100201379B1 (en) | Attaching method of semiconductor chip using a solder ball and structure of the same | |
| KR19990044862A (en) | Heat transfer enhancer attachment method and device | |
| JPS61251045A (en) | Die-bonding for semiconductor chip | |
| JPH03262137A (en) | Manufacture of semiconductor integrated circuit device | |
| JPH07249718A (en) | Semiconductor device | |
| KR100696190B1 (en) | Flip chip bonding method | |
| Collier | Chip attach for silicon hybrid multi-chip modules |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| N231 | Notification of change of applicant | ||
| FPAY | Annual fee payment |
Payment date: 20120227 Year of fee payment: 14 |
|
| FPAY | Annual fee payment |
Payment date: 20130125 Year of fee payment: 15 |
|
| LAPS | Lapse due to unpaid annual fee |