KR102909392B1 - 검사 장치 및 검사 방법 - Google Patents

검사 장치 및 검사 방법

Info

Publication number
KR102909392B1
KR102909392B1 KR1020247012521A KR20247012521A KR102909392B1 KR 102909392 B1 KR102909392 B1 KR 102909392B1 KR 1020247012521 A KR1020247012521 A KR 1020247012521A KR 20247012521 A KR20247012521 A KR 20247012521A KR 102909392 B1 KR102909392 B1 KR 102909392B1
Authority
KR
South Korea
Prior art keywords
target
probe
electrode
acquiring
mounting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247012521A
Other languages
English (en)
Korean (ko)
Other versions
KR20240068698A (ko
Inventor
겐타로 고니시
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240068698A publication Critical patent/KR20240068698A/ko
Application granted granted Critical
Publication of KR102909392B1 publication Critical patent/KR102909392B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020247012521A 2021-09-28 2022-09-14 검사 장치 및 검사 방법 Active KR102909392B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-158082 2021-09-28
JP2021158082A JP7737852B2 (ja) 2021-09-28 2021-09-28 検査装置及び検査方法
PCT/JP2022/034418 WO2023053968A1 (ja) 2021-09-28 2022-09-14 検査装置及び検査方法

Publications (2)

Publication Number Publication Date
KR20240068698A KR20240068698A (ko) 2024-05-17
KR102909392B1 true KR102909392B1 (ko) 2026-01-07

Family

ID=85779983

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247012521A Active KR102909392B1 (ko) 2021-09-28 2022-09-14 검사 장치 및 검사 방법

Country Status (4)

Country Link
JP (1) JP7737852B2 (https=)
KR (1) KR102909392B1 (https=)
CN (1) CN117981064A (https=)
WO (1) WO2023053968A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250370036A1 (en) * 2024-05-30 2025-12-04 Ateco Inc. Method of loading semiconductor device with fine bumps into insert

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004156984A (ja) 2002-11-06 2004-06-03 Tokyo Electron Ltd プローブピンの接触位置の採取方法、プローブピンの接触位置の補正方法及びプローブ装置間の接触誤差の解消方法
JP2012204695A (ja) 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
KR101865887B1 (ko) 2014-09-30 2018-06-08 도쿄엘렉트론가부시키가이샤 위치 정밀도 검사 방법, 위치 정밀도 검사 장치 및 위치 검사 유닛

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198662A (ja) * 1991-08-01 1993-08-06 Tokyo Electron Yamanashi Kk プローブ装置及び同装置におけるアライメント方法
JP5432551B2 (ja) 2009-03-13 2014-03-05 株式会社テクノホロン プローブ方法及びプローブ装置
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
JP7018784B2 (ja) 2018-02-23 2022-02-14 東京エレクトロン株式会社 コンタクト精度保証方法および検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004156984A (ja) 2002-11-06 2004-06-03 Tokyo Electron Ltd プローブピンの接触位置の採取方法、プローブピンの接触位置の補正方法及びプローブ装置間の接触誤差の解消方法
JP2012204695A (ja) 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
KR101865887B1 (ko) 2014-09-30 2018-06-08 도쿄엘렉트론가부시키가이샤 위치 정밀도 검사 방법, 위치 정밀도 검사 장치 및 위치 검사 유닛

Also Published As

Publication number Publication date
JP2023048650A (ja) 2023-04-07
CN117981064A (zh) 2024-05-03
JP7737852B2 (ja) 2025-09-11
WO2023053968A1 (ja) 2023-04-06
KR20240068698A (ko) 2024-05-17

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