KR102828754B1 - 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 - Google Patents
감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 Download PDFInfo
- Publication number
- KR102828754B1 KR102828754B1 KR1020237034538A KR20237034538A KR102828754B1 KR 102828754 B1 KR102828754 B1 KR 102828754B1 KR 1020237034538 A KR1020237034538 A KR 1020237034538A KR 20237034538 A KR20237034538 A KR 20237034538A KR 102828754 B1 KR102828754 B1 KR 102828754B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- single bond
- formula
- substituent
- preferable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
- C08F220/382—Esters containing sulfur and containing oxygen, e.g. 2-sulfoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
- C08F220/385—Esters containing sulfur and containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-069063 | 2021-04-15 | ||
| JP2021069063 | 2021-04-15 | ||
| PCT/JP2022/017242 WO2022220189A1 (ja) | 2021-04-15 | 2022-04-07 | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230158012A KR20230158012A (ko) | 2023-11-17 |
| KR102828754B1 true KR102828754B1 (ko) | 2025-07-03 |
Family
ID=83640034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237034538A Active KR102828754B1 (ko) | 2021-04-15 | 2022-04-07 | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022220189A1 (https=) |
| KR (1) | KR102828754B1 (https=) |
| TW (1) | TW202302669A (https=) |
| WO (1) | WO2022220189A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102748487B1 (ko) * | 2023-01-05 | 2025-01-03 | 유한회사 디씨티머티리얼 | 포토레지스트 패턴 개선용 조성물 및 이를 이용한 포토레지스트 패턴 형성 방법 |
| CN117720483A (zh) * | 2023-11-08 | 2024-03-19 | 湖北三峡实验室 | 一类含芳香性三氟甲肟基磺酸酯结构的光产酸剂及其制备方法和应用 |
| WO2025173494A1 (ja) * | 2024-02-15 | 2025-08-21 | Jsr株式会社 | 感放射線性組成物、パターン形成方法及び感放射線性酸発生剤 |
| WO2025205173A1 (ja) * | 2024-03-28 | 2025-10-02 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、及び電子デバイスの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011186341A (ja) * | 2010-03-10 | 2011-09-22 | Fujifilm Corp | 感活性光線性又は感放射線性樹脂組成物、該組成物を用いてなるレジスト膜、及び該組成物を用いたパターン形成方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4145017B2 (ja) * | 2001-02-08 | 2008-09-03 | 富士フイルム株式会社 | 感放射線性レジスト組成物 |
| KR100796585B1 (ko) * | 2001-02-08 | 2008-01-21 | 후지필름 가부시키가이샤 | 감방사선성 레지스트 조성물 |
| KR101324202B1 (ko) | 2006-10-25 | 2013-11-06 | 주식회사 동진쎄미켐 | 술포닐기를 포함하는 포토레지스트 모노머, 폴리머 및 이를포함하는 포토레지스트 조성물 |
| TWI696891B (zh) * | 2015-12-09 | 2020-06-21 | 日商住友化學股份有限公司 | 光阻組成物及光阻圖案之製造方法 |
| KR102243197B1 (ko) * | 2016-09-26 | 2021-04-22 | 후지필름 가부시키가이샤 | 레지스트 조성물, 패턴 형성 방법 및 전자 디바이스의 제조 방법 |
-
2022
- 2022-04-07 JP JP2023514628A patent/JPWO2022220189A1/ja active Pending
- 2022-04-07 KR KR1020237034538A patent/KR102828754B1/ko active Active
- 2022-04-07 WO PCT/JP2022/017242 patent/WO2022220189A1/ja not_active Ceased
- 2022-04-14 TW TW111114320A patent/TW202302669A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011186341A (ja) * | 2010-03-10 | 2011-09-22 | Fujifilm Corp | 感活性光線性又は感放射線性樹脂組成物、該組成物を用いてなるレジスト膜、及び該組成物を用いたパターン形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022220189A1 (https=) | 2022-10-20 |
| KR20230158012A (ko) | 2023-11-17 |
| WO2022220189A1 (ja) | 2022-10-20 |
| TW202302669A (zh) | 2023-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102741856B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 | |
| KR102772041B1 (ko) | 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| KR102826221B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 | |
| KR102878549B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성 수지 조성물의 제조 방법, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 수지, 및 수지의 제조 방법 | |
| KR102828754B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 | |
| KR102937062B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 화합물 | |
| KR102871089B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| KR102824343B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법 | |
| KR102890029B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 화합물 | |
| KR102888182B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 화합물 | |
| EP4372018A1 (en) | Active light-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for producing electronic device | |
| WO2023054127A1 (ja) | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法及び電子デバイスの製造方法 | |
| KR20240019274A (ko) | 패턴 형성 방법, 전자 디바이스의 제조 방법, 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막 | |
| KR102818947B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| JP7434592B2 (ja) | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 | |
| KR102937068B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법 및 전자 디바이스의 제조 방법 | |
| JP2023035836A (ja) | 感活性光線性又は感放射線性樹脂組成物の製造方法、パターン形成方法、電子デバイスの製造方法、及びオニウム塩の製造方法 | |
| KR102905565B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| KR20240123382A (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법 및 전자 디바이스의 제조 방법 | |
| JP7853983B2 (ja) | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、及び電子デバイスの製造方法 | |
| KR102905567B1 (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 화합물 | |
| KR20240042197A (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| KR20240136432A (ko) | 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법 | |
| WO2023157635A1 (ja) | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、電子デバイスの製造方法、及び化合物 | |
| CN116897320A (zh) | 感光化射线性或感放射线性树脂组合物、抗蚀剂膜、图案形成方法、电子器件的制造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20231010 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20240927 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20250521 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20250630 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20250701 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |