KR102765100B1 - 3차원 정보의 결정 - Google Patents
3차원 정보의 결정 Download PDFInfo
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- KR102765100B1 KR102765100B1 KR1020210034550A KR20210034550A KR102765100B1 KR 102765100 B1 KR102765100 B1 KR 102765100B1 KR 1020210034550 A KR1020210034550 A KR 1020210034550A KR 20210034550 A KR20210034550 A KR 20210034550A KR 102765100 B1 KR102765100 B1 KR 102765100B1
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/97—Determining parameters from multiple pictures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three-dimensional [3D] modelling for computer graphics
- G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0012—Biomedical image inspection
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
- G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
- G06V10/7747—Organisation of the process, e.g. bagging or boosting
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/64—Three-dimensional [3D] objects
- G06V20/653—Three-dimensional [3D] objects by matching three-dimensional models, e.g. conformal mapping of Riemann surfaces
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/12—Acquisition of 3D measurements of objects
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Software Systems (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Multimedia (AREA)
- Quality & Reliability (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Evolutionary Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- General Engineering & Computer Science (AREA)
- Databases & Information Systems (AREA)
- Computing Systems (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Computer Graphics (AREA)
- Geometry (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/821,831 | 2020-03-17 | ||
| US16/821,831 US11321835B2 (en) | 2020-03-17 | 2020-03-17 | Determining three dimensional information |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210117195A KR20210117195A (ko) | 2021-09-28 |
| KR102765100B1 true KR102765100B1 (ko) | 2025-02-11 |
Family
ID=77677735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210034550A Active KR102765100B1 (ko) | 2020-03-17 | 2021-03-17 | 3차원 정보의 결정 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11321835B2 (https=) |
| JP (1) | JP7648410B2 (https=) |
| KR (1) | KR102765100B1 (https=) |
| CN (1) | CN113405493B (https=) |
| TW (1) | TWI859429B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11288174B2 (en) | 2020-02-19 | 2022-03-29 | Applied Materials Israel Ltd. | Testing a code using real time analysis |
| US11443420B2 (en) * | 2020-12-28 | 2022-09-13 | Applied Materials Israel Ltd. | Generating a metrology recipe usable for examination of a semiconductor specimen |
| US12480898B2 (en) | 2022-09-01 | 2025-11-25 | Applied Materials Israel Ltd. | Z-profiling of wafers based on X-ray measurements |
| JP7754058B2 (ja) * | 2022-11-11 | 2025-10-15 | トヨタ自動車株式会社 | 情報処理装置、情報処理方法、及び情報処理プログラム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011027461A (ja) | 2009-07-22 | 2011-02-10 | Renesas Electronics Corp | パターン形状計測方法、半導体装置の製造方法、およびプロセス制御システム |
| US20190310554A1 (en) | 2016-12-16 | 2019-10-10 | Asml Netherlands B.V. | Method and apparatus for image analysis |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3490490B2 (ja) * | 1994-01-28 | 2004-01-26 | 株式会社東芝 | パターン画像処理装置及び画像処理方法 |
| US6246787B1 (en) * | 1996-05-31 | 2001-06-12 | Texas Instruments Incorporated | System and method for knowledgebase generation and management |
| JP3961657B2 (ja) * | 1998-03-03 | 2007-08-22 | 株式会社東芝 | パターン寸法測定方法 |
| US6670610B2 (en) | 2001-11-26 | 2003-12-30 | Applied Materials, Inc. | System and method for directing a miller |
| WO2005008223A2 (en) * | 2003-07-18 | 2005-01-27 | Applied Materials Israel, Ltd. | Methods for defect detection and process monitoring based on sem images |
| KR101128558B1 (ko) * | 2003-10-08 | 2012-03-26 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 측정 시스템 및 방법 |
| US8392418B2 (en) * | 2009-06-25 | 2013-03-05 | University Of Tennessee Research Foundation | Method and apparatus for predicting object properties and events using similarity-based information retrieval and model |
| US8098926B2 (en) * | 2007-01-10 | 2012-01-17 | Applied Materials Israel, Ltd. | Method and system for evaluating an evaluated pattern of a mask |
| US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
| US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
| US8709269B2 (en) | 2007-08-22 | 2014-04-29 | Applied Materials Israel, Ltd. | Method and system for imaging a cross section of a specimen |
| KR101286240B1 (ko) * | 2007-10-23 | 2013-07-15 | 삼성전자주식회사 | 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법 |
| US20090296073A1 (en) | 2008-05-28 | 2009-12-03 | Lam Research Corporation | Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope |
| JP5479782B2 (ja) * | 2009-06-02 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法 |
| MX2014003968A (es) * | 2011-10-14 | 2014-08-27 | Ingrain Inc | Metodo de imagen doble y sistema para generar una imagen multidimensional de una muestra. |
| US8838422B2 (en) * | 2011-12-11 | 2014-09-16 | Tokyo Electron Limited | Process control using ray tracing-based libraries and machine learning systems |
| WO2019006222A1 (en) * | 2017-06-30 | 2019-01-03 | Kla-Tencor Corporation | SYSTEMS AND METHODS FOR PREDICTING DEFECTS AND CRITICAL DIMENSION USING DEEP LEARNING IN A SEMICONDUCTOR MANUFACTURING PROCESS |
| EP3451061A1 (en) * | 2017-09-04 | 2019-03-06 | ASML Netherlands B.V. | Method for monitoring a manufacturing process |
| JP7187099B2 (ja) * | 2017-09-15 | 2022-12-12 | サウジ アラビアン オイル カンパニー | ニューラルネットワークを用いて炭化水素貯留層の石油物理特性を推測すること |
| JP6937254B2 (ja) * | 2018-02-08 | 2021-09-22 | 株式会社日立ハイテク | 検査システム、画像処理装置、および検査方法 |
| WO2019198143A1 (ja) * | 2018-04-10 | 2019-10-17 | 株式会社日立製作所 | 加工レシピ生成装置 |
| TWI694537B (zh) * | 2018-07-08 | 2020-05-21 | 香港商康代影像技術方案香港有限公司 | 用於失準補償之系統及方法 |
| US10811219B2 (en) | 2018-08-07 | 2020-10-20 | Applied Materials Israel Ltd. | Method for evaluating a region of an object |
| US20200027021A1 (en) * | 2019-09-27 | 2020-01-23 | Kumara Sastry | Reinforcement learning for multi-domain problems |
-
2020
- 2020-03-17 US US16/821,831 patent/US11321835B2/en active Active
-
2021
- 2021-03-15 TW TW110109090A patent/TWI859429B/zh active
- 2021-03-17 KR KR1020210034550A patent/KR102765100B1/ko active Active
- 2021-03-17 JP JP2021043156A patent/JP7648410B2/ja active Active
- 2021-03-17 CN CN202110287046.6A patent/CN113405493B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011027461A (ja) | 2009-07-22 | 2011-02-10 | Renesas Electronics Corp | パターン形状計測方法、半導体装置の製造方法、およびプロセス制御システム |
| US20190310554A1 (en) | 2016-12-16 | 2019-10-10 | Asml Netherlands B.V. | Method and apparatus for image analysis |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113405493A (zh) | 2021-09-17 |
| US20210295499A1 (en) | 2021-09-23 |
| US11321835B2 (en) | 2022-05-03 |
| TWI859429B (zh) | 2024-10-21 |
| KR20210117195A (ko) | 2021-09-28 |
| CN113405493B (zh) | 2023-10-24 |
| JP7648410B2 (ja) | 2025-03-18 |
| TW202207160A (zh) | 2022-02-16 |
| JP2021166284A (ja) | 2021-10-14 |
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