CN113405493B - 确定三维信息 - Google Patents

确定三维信息 Download PDF

Info

Publication number
CN113405493B
CN113405493B CN202110287046.6A CN202110287046A CN113405493B CN 113405493 B CN113405493 B CN 113405493B CN 202110287046 A CN202110287046 A CN 202110287046A CN 113405493 B CN113405493 B CN 113405493B
Authority
CN
China
Prior art keywords
substrate
information
substrates
different
structural element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110287046.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN113405493A (zh
Inventor
A·黎凡特
R·比斯特里泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Israel Ltd
Original Assignee
Applied Materials Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Israel Ltd filed Critical Applied Materials Israel Ltd
Publication of CN113405493A publication Critical patent/CN113405493A/zh
Application granted granted Critical
Publication of CN113405493B publication Critical patent/CN113405493B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/97—Determining parameters from multiple pictures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three-dimensional [3D] modelling for computer graphics
    • G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
    • G06V10/7747—Organisation of the process, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/64—Three-dimensional [3D] objects
    • G06V20/653—Three-dimensional [3D] objects by matching three-dimensional models, e.g. conformal mapping of Riemann surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/12—Acquisition of 3D measurements of objects

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Multimedia (AREA)
  • General Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Medical Informatics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Databases & Information Systems (AREA)
  • Computing Systems (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Geometry (AREA)
  • Computer Graphics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Electromagnetism (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN202110287046.6A 2020-03-17 2021-03-17 确定三维信息 Active CN113405493B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/821,831 US11321835B2 (en) 2020-03-17 2020-03-17 Determining three dimensional information
US16/821,831 2020-03-17

Publications (2)

Publication Number Publication Date
CN113405493A CN113405493A (zh) 2021-09-17
CN113405493B true CN113405493B (zh) 2023-10-24

Family

ID=77677735

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110287046.6A Active CN113405493B (zh) 2020-03-17 2021-03-17 确定三维信息

Country Status (5)

Country Link
US (1) US11321835B2 (https=)
JP (1) JP7648410B2 (https=)
KR (1) KR102765100B1 (https=)
CN (1) CN113405493B (https=)
TW (1) TWI859429B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11288174B2 (en) 2020-02-19 2022-03-29 Applied Materials Israel Ltd. Testing a code using real time analysis
US11443420B2 (en) * 2020-12-28 2022-09-13 Applied Materials Israel Ltd. Generating a metrology recipe usable for examination of a semiconductor specimen
US12480898B2 (en) 2022-09-01 2025-11-25 Applied Materials Israel Ltd. Z-profiling of wafers based on X-ray measurements
JP7754058B2 (ja) * 2022-11-11 2025-10-15 トヨタ自動車株式会社 情報処理装置、情報処理方法、及び情報処理プログラム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019006222A1 (en) * 2017-06-30 2019-01-03 Kla-Tencor Corporation SYSTEMS AND METHODS FOR PREDICTING DEFECTS AND CRITICAL DIMENSION USING DEEP LEARNING IN A SEMICONDUCTOR MANUFACTURING PROCESS
CN110322412A (zh) * 2018-07-08 2019-10-11 康代影像科技(苏州)有限公司 用于失准补偿的方法、检验系统及非暂态计算机可读介质

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3490490B2 (ja) * 1994-01-28 2004-01-26 株式会社東芝 パターン画像処理装置及び画像処理方法
US6246787B1 (en) * 1996-05-31 2001-06-12 Texas Instruments Incorporated System and method for knowledgebase generation and management
JP3961657B2 (ja) * 1998-03-03 2007-08-22 株式会社東芝 パターン寸法測定方法
US6670610B2 (en) 2001-11-26 2003-12-30 Applied Materials, Inc. System and method for directing a miller
WO2005008223A2 (en) * 2003-07-18 2005-01-27 Applied Materials Israel, Ltd. Methods for defect detection and process monitoring based on sem images
WO2005036464A2 (en) * 2003-10-08 2005-04-21 Applied Materials Israel, Ltd. A measurement system and a method
US8098926B2 (en) * 2007-01-10 2012-01-17 Applied Materials Israel, Ltd. Method and system for evaluating an evaluated pattern of a mask
US7667858B2 (en) * 2007-01-12 2010-02-23 Tokyo Electron Limited Automated process control using optical metrology and a correlation between profile models and key profile shape variables
US7511835B2 (en) * 2007-04-12 2009-03-31 Tokyo Electron Limited Optical metrology using a support vector machine with simulated diffraction signal inputs
US8709269B2 (en) 2007-08-22 2014-04-29 Applied Materials Israel, Ltd. Method and system for imaging a cross section of a specimen
KR101286240B1 (ko) * 2007-10-23 2013-07-15 삼성전자주식회사 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법
US20090296073A1 (en) 2008-05-28 2009-12-03 Lam Research Corporation Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope
JP5479782B2 (ja) * 2009-06-02 2014-04-23 株式会社日立ハイテクノロジーズ 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法
US8375032B2 (en) * 2009-06-25 2013-02-12 University Of Tennessee Research Foundation Method and apparatus for predicting object properties and events using similarity-based information retrieval and modeling
JP2011027461A (ja) * 2009-07-22 2011-02-10 Renesas Electronics Corp パターン形状計測方法、半導体装置の製造方法、およびプロセス制御システム
BR112014009093B1 (pt) * 2011-10-14 2021-08-17 Ingrain, Inc Método para gerar uma imagem multidimensional de uma amostra, método de criar um volume tridimensional, método para gerar uma imagem digital tridimensional de uma amostra, e, sistema para gerar imagens digitais tridimensionais de uma amostra
US8838422B2 (en) * 2011-12-11 2014-09-16 Tokyo Electron Limited Process control using ray tracing-based libraries and machine learning systems
EP3336608A1 (en) * 2016-12-16 2018-06-20 ASML Netherlands B.V. Method and apparatus for image analysis
EP3451061A1 (en) * 2017-09-04 2019-03-06 ASML Netherlands B.V. Method for monitoring a manufacturing process
EP3682376A1 (en) * 2017-09-15 2020-07-22 Saudi Arabian Oil Company Inferring petrophysical properties of hydrocarbon reservoirs using a neural network
JP6937254B2 (ja) * 2018-02-08 2021-09-22 株式会社日立ハイテク 検査システム、画像処理装置、および検査方法
JP6995191B2 (ja) 2018-04-10 2022-01-14 株式会社日立製作所 加工レシピ生成装置
US10811219B2 (en) 2018-08-07 2020-10-20 Applied Materials Israel Ltd. Method for evaluating a region of an object
US20200027021A1 (en) * 2019-09-27 2020-01-23 Kumara Sastry Reinforcement learning for multi-domain problems

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019006222A1 (en) * 2017-06-30 2019-01-03 Kla-Tencor Corporation SYSTEMS AND METHODS FOR PREDICTING DEFECTS AND CRITICAL DIMENSION USING DEEP LEARNING IN A SEMICONDUCTOR MANUFACTURING PROCESS
CN110322412A (zh) * 2018-07-08 2019-10-11 康代影像科技(苏州)有限公司 用于失准补偿的方法、检验系统及非暂态计算机可读介质

Also Published As

Publication number Publication date
KR102765100B1 (ko) 2025-02-11
TWI859429B (zh) 2024-10-21
US20210295499A1 (en) 2021-09-23
US11321835B2 (en) 2022-05-03
KR20210117195A (ko) 2021-09-28
CN113405493A (zh) 2021-09-17
JP2021166284A (ja) 2021-10-14
TW202207160A (zh) 2022-02-16
JP7648410B2 (ja) 2025-03-18

Similar Documents

Publication Publication Date Title
CN113405493B (zh) 确定三维信息
US10133838B2 (en) Guided defect detection of integrated circuits
US10628935B2 (en) Method and system for identifying defects of integrated circuits
US20140193065A1 (en) Detecting Defects on a Wafer Using Template Image Matching
US10922809B2 (en) Method for detecting voids and an inspection system
TW201710697A (zh) 在邏輯晶片中基於電壓對比之錯誤及缺陷推導
US9880550B2 (en) Updating of a recipe for evaluating a manufacturing stage of an electrical circuit
KR20250069824A (ko) 반도체 시편에서의 어레이의 식별
CN113538328B (zh) 覆盖监测
US12361526B2 (en) Reconstruction of a distorted image of an array of structural elements of a specimen
KR20190110478A (ko) 공간 밀도 분석에 기초한 반도체 웨이퍼의 유도식 검사
CN112184717B (zh) 用于质检的自动化分割方法
CN120936953A (zh) 高效的动态采样计划生成和精确的探针管芯损失预测方法
KR20170066988A (ko) 반도체 소자의 3d 프로파일링 시스템 및 이의 동작 방법
US20240312179A1 (en) Adaptive concept generation based on image context
US9383196B2 (en) System, method and computed readable medium for evaluating a parameter of a feature having nano-metric dimensions
US10095826B2 (en) Feed-forward for silicon inspections (DFM2CFM : design to silicon) and feed-back for weakpoint predictor decks (CFM2DFM : silicon to design) guided by marker classification, sampling, and higher dimensional analysis
Shin et al. A Novel CNN-Based Redundancy Analysis Using Parallel Solution Decision
US20250209647A1 (en) K-distance tree metrology
CN117310452B (zh) 电磁信号泄露的确定方法、装置、计算机设备和存储介质
US12347083B2 (en) Area selection in charged particle microscope imaging
US20220114721A1 (en) Measuring a pattern
KR20250076440A (ko) 기계 학습 알고리즘을 사용한 결함 검출
TWI785065B (zh) 基於妨害地圖之寬帶電漿檢查

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant