KR102749767B1 - 약한 라벨링을 사용한 반도체 시편들에서의 결함들의 검출 - Google Patents
약한 라벨링을 사용한 반도체 시편들에서의 결함들의 검출 Download PDFInfo
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- KR102749767B1 KR102749767B1 KR1020210049665A KR20210049665A KR102749767B1 KR 102749767 B1 KR102749767 B1 KR 102749767B1 KR 1020210049665 A KR1020210049665 A KR 1020210049665A KR 20210049665 A KR20210049665 A KR 20210049665A KR 102749767 B1 KR102749767 B1 KR 102749767B1
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/892,139 US11379972B2 (en) | 2020-06-03 | 2020-06-03 | Detecting defects in semiconductor specimens using weak labeling |
| US16/892,139 | 2020-06-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210150970A KR20210150970A (ko) | 2021-12-13 |
| KR102749767B1 true KR102749767B1 (ko) | 2025-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210049665A Active KR102749767B1 (ko) | 2020-06-03 | 2021-04-16 | 약한 라벨링을 사용한 반도체 시편들에서의 결함들의 검출 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11379972B2 (enExample) |
| JP (1) | JP7633094B2 (enExample) |
| KR (1) | KR102749767B1 (enExample) |
| CN (2) | CN113763312B (enExample) |
| TW (1) | TWI864281B (enExample) |
Families Citing this family (19)
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| US11816411B2 (en) * | 2020-01-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for semiconductor wafer defect review |
| US11379972B2 (en) * | 2020-06-03 | 2022-07-05 | Applied Materials Israel Ltd. | Detecting defects in semiconductor specimens using weak labeling |
| US11493901B2 (en) * | 2020-09-24 | 2022-11-08 | International Business Machines Corporation | Detection of defect in edge device manufacturing by artificial intelligence |
| US20220101114A1 (en) * | 2020-09-27 | 2022-03-31 | Kla Corporation | Interpretable deep learning-based defect detection and classification |
| US20230401821A1 (en) * | 2020-11-09 | 2023-12-14 | Canon U.S.A., Inc. | Using activation maps to detect best areas of an image for prediction of noise levels |
| US12462074B2 (en) * | 2021-01-22 | 2025-11-04 | Nvidia Corporation | Object simulation using real-world environments |
| US12430563B2 (en) * | 2021-07-29 | 2025-09-30 | GE Precision Healthcare LLC | Learning-based clean data selection |
| CN115706819B (zh) * | 2021-08-17 | 2024-12-31 | 鸿富锦精密工业(深圳)有限公司 | 网页视频播放方法、装置、电子设备及存储介质 |
| TWI767828B (zh) * | 2021-08-27 | 2022-06-11 | 開必拓數據股份有限公司 | 應用於具有卷對卷機構的設備的馬達控制系統 |
| US20240013365A9 (en) * | 2021-10-04 | 2024-01-11 | Kla Corporation | Unsupervised or self-supervised deep learning for semiconductor-based applications |
| TWI823159B (zh) * | 2021-10-20 | 2023-11-21 | 開必拓數據股份有限公司 | 具人機互動功能的瑕疵檢測系統 |
| US11789069B2 (en) * | 2021-12-03 | 2023-10-17 | International Business Machines Corporation | Mixed high-resolution and low-resolution inspection for tamper detection |
| CN115061427B (zh) * | 2022-06-28 | 2023-04-14 | 浙江同发塑机有限公司 | 吹塑机的料层均匀性控制系统及其控制方法 |
| KR20240028665A (ko) * | 2022-08-25 | 2024-03-05 | 한국전자통신연구원 | 딥러닝 서비스를 제공하기 위한 신경망 모델 배포 방법 및 장치 |
| KR20240096217A (ko) * | 2022-12-19 | 2024-06-26 | 삼성전자주식회사 | 제조 공정의 이상 여부를 판단하는 방법 및 장치 |
| CN116046810B (zh) * | 2023-04-03 | 2023-06-23 | 云南通衢工程检测有限公司 | 基于rpc盖板破坏荷载的无损检测方法 |
| WO2025011912A1 (en) * | 2023-07-13 | 2025-01-16 | Asml Netherlands B.V. | Systems and methods for defect inspection in charged-particle systems |
| KR102740270B1 (ko) * | 2023-10-19 | 2024-12-10 | 주식회사 에이아이비즈 | 웨이퍼맵의 패턴을 분류하기 위한 모델을 학습시키는 방법, 장치 및 프로그램 |
| US20250253121A1 (en) * | 2024-02-07 | 2025-08-07 | Kla Corporation | Systems and methods of sem inspection using selective scan approach |
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| US20160300338A1 (en) | 2015-04-13 | 2016-10-13 | Anchor Semiconductor Inc. | Pattern weakness and strength detection and tracking during a semiconductor device fabrication process |
| US20200105500A1 (en) | 2018-09-28 | 2020-04-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Machine learning on wafer defect review |
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| US11379972B2 (en) * | 2020-06-03 | 2022-07-05 | Applied Materials Israel Ltd. | Detecting defects in semiconductor specimens using weak labeling |
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2020
- 2020-06-03 US US16/892,139 patent/US11379972B2/en active Active
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2021
- 2021-04-16 KR KR1020210049665A patent/KR102749767B1/ko active Active
- 2021-04-26 CN CN202110455269.9A patent/CN113763312B/zh active Active
- 2021-04-26 CN CN202410416642.3A patent/CN118297906B/zh active Active
- 2021-04-26 TW TW110114852A patent/TWI864281B/zh active
- 2021-06-03 JP JP2021093501A patent/JP7633094B2/ja active Active
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2022
- 2022-05-23 US US17/751,507 patent/US11790515B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160300338A1 (en) | 2015-04-13 | 2016-10-13 | Anchor Semiconductor Inc. | Pattern weakness and strength detection and tracking during a semiconductor device fabrication process |
| US20200105500A1 (en) | 2018-09-28 | 2020-04-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Machine learning on wafer defect review |
Non-Patent Citations (2)
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| A.Oberai 등, 'Smart E-Beam for Defect Identification& Analysis in the Nanoscale Technology Nodes: Technical Perspectives', MDPI electronics, 2017 |
| K.Imoto 등, "A CNN-Based Transfer Learning Method for Defect Classification in Semiconductor Manufacturing," IEEE Transactions on Semiconductor Manufacturing, 32(4), pp.455-459, 2019 |
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| Publication number | Publication date |
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| KR20210150970A (ko) | 2021-12-13 |
| CN113763312B (zh) | 2024-04-19 |
| TW202147163A (zh) | 2021-12-16 |
| JP2021190716A (ja) | 2021-12-13 |
| CN118297906B (zh) | 2025-07-29 |
| US11379972B2 (en) | 2022-07-05 |
| US20210383530A1 (en) | 2021-12-09 |
| CN113763312A (zh) | 2021-12-07 |
| JP7633094B2 (ja) | 2025-02-19 |
| TWI864281B (zh) | 2024-12-01 |
| CN118297906A (zh) | 2024-07-05 |
| US20220301151A1 (en) | 2022-09-22 |
| US11790515B2 (en) | 2023-10-17 |
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